CN211090185U - Water-saving cleaning system for electroplating of PCB (printed circuit board) - Google Patents
Water-saving cleaning system for electroplating of PCB (printed circuit board) Download PDFInfo
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- CN211090185U CN211090185U CN201922330720.5U CN201922330720U CN211090185U CN 211090185 U CN211090185 U CN 211090185U CN 201922330720 U CN201922330720 U CN 201922330720U CN 211090185 U CN211090185 U CN 211090185U
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Abstract
The utility model belongs to the technical field of the PCB circuit board washs, especially, relate to a PCB circuit board electroplates water conservation cleaning system, including coating bath, accumulator, washing tank, mount, telescopic link and be used for the holder of centre gripping PCB circuit board, the coating bath the accumulator with the washing tank set up in the mount below, the mount is provided with the slide rail, telescopic link slidable mounting in the slide rail, the holder install in the tip of telescopic link, the accumulator is provided with and can sprays abluent sprayer to the PCB circuit board. Compared with the prior art, the utility model discloses a set up the PCB circuit board after the spray thrower sprays the washing to electroplating, replace directly carry out the washing mode of soaking the formula at the accumulator to the PCB circuit board, effectively reduce and take out the recovery liquid of accumulator, reduce the waste of taking out liquid, retrieve for subsequent recovery liquid and provide the assurance.
Description
Technical Field
The utility model belongs to the technical field of the PCB circuit board washs, especially, relate to a water conservation cleaning system is electroplated to PCB circuit board.
Background
The circuit board is a common article in daily life, and various electronic devices, such as electronic watches, calculators, computers and communication electronic devices, are small in size, and the PCB circuit board is used as long as the circuit board is provided with electronic components such as integrated circuits and the like. In the process of producing PCB circuit boards in electronic factories, the plated PCB circuit boards generally need to be cleaned. In the existing PCB circuit board electroplating cleaning technology, a used recovery tank is actually a cleaning tank which does not participate in countercurrent, pure water is usually stored in advance, and when the concentration of the recovery tank reaches a certain degree (usually, people rely on experience), the recovery liquid of the recovery tank is directly poured into a plating tank; and secondly, although the recovery tank does not participate in the counter-current cleaning, the concentration of the liquid carried out in the subsequent cleaning link is gradually increased along with the increase of the concentration of the plating solution in the recovery tank, so that the loss of the liquid carried out is caused.
Therefore, it is necessary to provide a water-saving cleaning system for electroplating of a PCB to reduce waste of the taken-out liquid and save cleaning water.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a: aiming at the defects of the prior art, the PCB electroplating water-saving cleaning system is provided, the waste of the liquid brought out is reduced, and the cleaning water is saved.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the utility model provides a PCB circuit board is electroplated and is economized on water cleaning system, includes coating bath, accumulator, washing tank, mount, telescopic link and is used for the holder of centre gripping PCB circuit board, the coating bath the accumulator with the washing tank set up in the mount below, the mount is provided with the slide rail, telescopic link slidable mounting in the slide rail, the holder install in the tip of telescopic link, the accumulator is provided with and can sprays abluent spray thrower to the PCB circuit board.
As an improvement of the PCB circuit board electroplating water-saving cleaning system, the PCB circuit board electroplating water-saving cleaning system further comprises a concentration tank, one end of the concentration tank is connected with the coating bath through a pipeline, and the other end of the concentration tank is connected with the recovery tank through a pipeline.
As an improvement of the PCB circuit board electroplating water-saving cleaning system, a water pump which can pump the recovery liquid of the recovery tank to the concentration tank is arranged in the concentration tank.
As an improvement of the PCB circuit board electroplating water-saving cleaning system, the concentration tank is a heating concentration tank.
As an improvement of the PCB circuit board electroplating water-saving cleaning system, the interior of the cleaning tank is divided into a first cleaning tank, a second cleaning tank and a third cleaning tank.
As an improvement of the PCB circuit board electroplating water-saving cleaning system, the first cleaning tank, the second cleaning tank and the third cleaning tank are all provided with a stirrer.
As an improvement of the PCB circuit board electroplating water-saving cleaning system, the PCB circuit board electroplating water-saving cleaning system further comprises a P L C controller used for controlling each part.
The beneficial effects of the utility model reside in that: the utility model provides a PCB circuit board is electroplated and is economized on water cleaning system, including coating bath, accumulator, washing tank, mount, telescopic link and be used for the holder of centre gripping PCB circuit board, the coating bath the accumulator with the washing tank set up in the mount below, the mount is provided with the slide rail, telescopic link slidable mounting in the slide rail, the holder install in the tip of telescopic link, the accumulator is provided with and can sprays abluent spray thrower to the PCB circuit board. Compared with the prior art, the utility model discloses a set up the PCB circuit board after the spray thrower sprays the washing to electroplating, replace directly carry out the washing mode of soaking the formula at the accumulator to the PCB circuit board, effectively reduce and take out the recovery liquid of accumulator, reduce the waste of taking out liquid, retrieve for subsequent recovery liquid and provide the assurance.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Wherein: 1-a fixed frame, 2-a telescopic rod, 3-a clamping piece, 4-a plating tank, 5-a recovery tank, 6-a cleaning tank, 7-a sprayer, 8-a concentration tank, 9-a water pump, 10-a stirrer, 61-a first cleaning tank, 62-a second cleaning tank and 63-a third cleaning tank.
Detailed Description
As used in the specification and in the claims, certain terms are used to refer to particular components. As one skilled in the art will appreciate, manufacturers may refer to a component by different names. This specification and claims do not intend to distinguish between components that differ in name but not function. In the following description and in the claims, the terms "include" and "comprise" are used in an open-ended fashion, and thus should be interpreted to mean "include, but not limited to. "substantially" means within an acceptable error range, within which a person skilled in the art can solve the technical problem to substantially achieve the technical result.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", horizontal "and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The present invention will be described in further detail with reference to the accompanying drawings, which are not intended to limit the present invention.
As shown in figure 1, a PCB circuit board electroplates water conservation cleaning system, including coating bath 4, accumulator 5, washing tank 6, mount 1, telescopic link 2 and be used for centre gripping PCB circuit board holder 3, coating bath 4, accumulator 5 and washing tank 6 set up in mount 1 below, and mount 1 is provided with the slide rail, and telescopic link 2 slidable mounting is in the slide rail, and holder 3 is installed in the tip of telescopic link 2, and accumulator 5 is provided with can spray abluent shower 7 to the PCB circuit board. The specific installation position of the shower unit 7 is not limited, and the shower unit may be installed on any one side wall of the recovery tank 5 as long as the shower cleaning function is realized. The spraying mode is high-temperature spraying. In addition, there is no direct connection among the plating tank 4, the recycling tank 5 and the cleaning tank 6, because different solutions are contained in the plating tank 4, the recycling tank 5 and the cleaning tank 6.
Further, PCB circuit board electroplating water conservation cleaning system still includes concentrated tank 8, and 8 one end in concentrated tank is passed through the pipeline and is connected with coating bath 4, and 8 other ends in concentrated tank pass through the pipeline and are connected with accumulator 5.
Further, a water pump 9 capable of pumping the recovered liquid in the recovery tank 5 to the concentration tank 8 is provided in the concentration tank 8. The position of the water pump 9 is not limited, and may be located at any position in the concentration tank 8 as long as it can pump the collected liquid in the collection tank 5 to the concentration tank 8.
Further, the concentration tank 8 is a heating concentration tank. And concentrating and recovering the recovered solution in a heating mode.
Further, the inside of the cleaning tank 6 is divided into a first cleaning tank 61, a second cleaning tank 62, and a third cleaning tank 63. The water flow direction in the first cleaning tank 61, the second cleaning tank 62 and the third cleaning tank 63 is opposite to the running direction of the PCB, namely, the PCB is cleaned by adopting a counter-current cleaning mode.
Further, the first cleaning tank 61, the second cleaning tank 62, and the third cleaning tank 63 are provided therein with the agitator 10. The agitator 10 agitates the water in the cleaning tank 6, improving the cleaning effect and saving the cleaning water.
Furthermore, the PCB electroplating water-saving cleaning system also comprises a P L C controller for controlling all the parts, wherein the P L C controller can control the reciprocating movement (including the moving distance) of the telescopic rod 2 on the sliding rail, the extension and contraction (including the extension and contraction length) of the telescopic rod 2 and the operation (including a plurality of parameters such as time and speed) of the parts such as the sprayer 7, the water pump 9 and the stirrer 10, and the like, and the labor is saved by controlling the P L C control system, and meanwhile, the operation is more accurate and rapid, and the time is saved.
The utility model discloses a working process is:
1) clamping a PCB circuit board to be electroplated on the clamping piece 3, controlling the telescopic rod 2 to slide to the upper part of the plating tank 4 along the slide rail by the P L C controller, and then controlling the telescopic rod 2 to extend downwards by the P L C controller, so that the clamped PCB circuit board is stretched into the plating tank 4 by the clamping piece 3 at the end part and is immersed into plating solution, and electroplating operation is completed;
2) after the set time is reached, the P L C controller controls the telescopic rod 2 to contract upwards, the PCB circuit board which is electroplated is moved out of the plating tank 4, then the P L C controller controls the telescopic rod 2 to move to the position of the recovery tank 5 along the slide rail and controls the telescopic rod 2 to extend downwards, so that the PCB circuit board clamped by the clamping piece 3 is positioned in the recovery tank 5, the electroplated PCB circuit board is sprayed and cleaned under the action of the sprayer 7, and an immersion type cleaning mode for the PCB circuit board in the recovery tank 5 is replaced, so that the carrying-out of the recovery liquid in the recovery tank 5 is effectively reduced, the waste of the carried-out liquid is reduced, and the follow-up recovery liquid recovery is guaranteed;
3) under the control of a P L C controller, the telescopic rod 2 is upwards contracted and slides along the slide rail to the position of the cleaning tank 6, then the telescopic rod 2 extends downwards to enable the PCB which is sprayed and cleaned to extend into the cleaning tank 6, countercurrent cleaning is carried out in the first cleaning tank 61, the second cleaning tank 62 and the third cleaning tank 63, meanwhile, the stirrer 10 stirs water in the cleaning tank 6, the cleaning effect is improved, and cleaning water is saved;
4) under the control of the P L C controller, the water pump 9 in the concentration tank 8 pumps the recovery liquid in the recovery tank 5 to the concentration tank 8, and the recovery liquid is concentrated and recovered in the concentration tank 8 in a heating mode and finally returned to the plating tank 4 to ensure the quality of the plating solution in the plating tank 4 and further ensure the electroplating quality of the PCB.
While the foregoing description shows and describes several preferred embodiments of the invention, it is to be understood, as noted above, that the invention is not limited to the forms disclosed herein, but is not intended to be exhaustive of other embodiments, and is capable of use in various other combinations, modifications, and environments and is capable of changes within the scope of the inventive concept as expressed above, or as otherwise known in the relevant art. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (7)
1. The utility model provides a PCB circuit board is electroplated and is economized on water cleaning system which characterized in that: including coating bath, accumulator, washing tank, mount, telescopic link and be used for the holder of centre gripping PCB circuit board, the coating bath the accumulator with the washing tank set up in the mount below, the mount is provided with the slide rail, telescopic link slidable mounting in the slide rail, the holder install in the tip of telescopic link, the accumulator is provided with can spray abluent spray thrower to the PCB circuit board.
2. The PCB circuit board electroplating water-saving cleaning system according to claim 1, characterized in that: still include the concentrator tank, concentrator tank one end pass through the pipeline with the coating bath is connected, the other end of concentrator tank pass through the pipeline with the accumulator tank is connected.
3. The PCB circuit board electroplating water-saving cleaning system according to claim 2, characterized in that: and a water pump capable of pumping the recovery liquid of the recovery tank to the concentration tank is arranged in the concentration tank.
4. The PCB circuit board electroplating water-saving cleaning system according to claim 2, characterized in that: the concentration tank is a heating concentration tank.
5. The PCB circuit board electroplating water-saving cleaning system according to claim 1, characterized in that: the washing tank is internally divided into a first washing tank, a second washing tank and a third washing tank.
6. The PCB circuit board electroplating water-saving cleaning system according to claim 5, wherein: stirrers are arranged in the first cleaning tank, the second cleaning tank and the third cleaning tank.
7. A PCB circuit board electroplating water-saving cleaning system according to any one of claims 1 to 6, characterized by further comprising a P L C controller for controlling each component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922330720.5U CN211090185U (en) | 2019-12-23 | 2019-12-23 | Water-saving cleaning system for electroplating of PCB (printed circuit board) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922330720.5U CN211090185U (en) | 2019-12-23 | 2019-12-23 | Water-saving cleaning system for electroplating of PCB (printed circuit board) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211090185U true CN211090185U (en) | 2020-07-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922330720.5U Active CN211090185U (en) | 2019-12-23 | 2019-12-23 | Water-saving cleaning system for electroplating of PCB (printed circuit board) |
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| CN (1) | CN211090185U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111893551A (en) * | 2020-08-11 | 2020-11-06 | 新阳硅密（上海）半导体技术有限公司 | Online recovery method of electroplating solution |
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2019
- 2019-12-23 CN CN201922330720.5U patent/CN211090185U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111893551A (en) * | 2020-08-11 | 2020-11-06 | 新阳硅密（上海）半导体技术有限公司 | Online recovery method of electroplating solution |
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