CN110402036A - A kind of the welding resistance method and welding devices of 5G high frequency circuit board - Google Patents
A kind of the welding resistance method and welding devices of 5G high frequency circuit board Download PDFInfo
- Publication number
- CN110402036A CN110402036A CN201910503598.9A CN201910503598A CN110402036A CN 110402036 A CN110402036 A CN 110402036A CN 201910503598 A CN201910503598 A CN 201910503598A CN 110402036 A CN110402036 A CN 110402036A
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- high frequency
- ceramic wafer
- plate
- ptfe
- circuit board
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Ceramic Products (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention provides the welding resistance method and welding devices of a kind of 5G high frequency circuit board, and the surface of PTFE high frequency plate or ceramic wafer is equipped with copper-clad surface, and welding resistance method is the following steps are included: S1. pre-treatment step；S2. sided corona treatment step；S3. print steps；S4. exposure development step；S5. baking procedure；Welding devices include corona spraying connecting line equipment, exposure development equipment and roasting plant.The welding resistance method and welding devices of 5G high frequency circuit board of the invention are combined using sided corona treatment with spraying ink, avoid occurring the phenomenon that dregs of fat and plate face dew copper in the plate face of high frequency circuit board, the quality for substantially increasing wiring board, the printing high frequency plate producing adhesive force and having good uniformity；And ink is saved, manufacturing cost is reduced；It uses pure water cleaning instead in pretreatment procedure, does not need not only to be printed hastily in specific time in this way, also avoid the problem of causing to get rid of oil because not carrying out time control or influencing product electric signal, reduce the rate of washing of returning of high frequency plate, improve production efficiency.
Description
Technical field
The present invention relates to a kind of welding resistance method of high frequency circuit board welding technique field more particularly to 5G high frequency circuit board and
Welding devices.
Background technique
Existing high frequency circuit board welding resistance method are as follows: pre-treatment (PTFE plate: microetch or super roughening, ceramic wafer: microetch or acid
Wash) → silk-screen (needing completion in specific time) → exposure → development → baking；
Pre-treatment step:
The pre-treatment of A.PTFE plate forbids nog plate and sandblasting by the way of chemical cleaning (microetch or super roughening)；
B. ceramic wafer can be using two kinds of operation modes of mechanical polish-brush and chemical cleaning (microetch or pickling), preferential selectionization
Learn cleaning way, special circumstances can be used mechanical polish-brush when not can be carried out chemical cleaning, but polishing scratch control 0.6-1.0mm with
It is interior, it avoided plate number too many, and influenced the planarization of copper face.
Print steps:
A. after pre-treatment, in the not tangible shaping area of hand, gloves is worn and also cannot；
B. the preferable ink of adhesive force is used, it is pre-baked again after standing 30 minutes after printing.Heavy tin product is needed using PSR-
4000SN10 ink；
C. anti-welding printing is primary using 36T printing, and line top and substrate ink thickness control 10-40um, and the weldering of line angle steric hindrance is thick
Degree >=5um.
PTFE wiring board pretreatment procedure in printing process is not handled properly at present, not specific after microetch or super roughening
Printing is completed in time to be easy for getting rid of oil, and the big of electric signal can be all being influenced after Chemical treatment according to verifying PTFE material
It is small.Ceramic wafer completes printing not in specific time after microetch or pickling and is also easy to get rid of oil, influences the size of electric signal.Cause
PTFE wiring board and ceramic wafer, which return, washes rate height, and production efficiency is low；In addition PTFE wiring board or ceramic wafer need to be within effective times
Silk-screen printing is done, the problem of ink unevenness is also still remained.
Summary of the invention
The present invention provides the welding resistance method and welding resistance dress of a kind of 5G high frequency circuit board in view of the above shortcomings of the prior art
It sets, reduces influence of the pretreatment procedure to electric signal transmission, so that 5G high frequency circuit board does not get rid of oil and ink has good uniformity.
The present invention in order to solve the above problem used by technical solution are as follows:
One aspect of the present invention provides a kind of welding resistance method of 5G high frequency circuit board, and the 5G high frequency circuit board is PTFE high frequency
The surface of plate or ceramic wafer, PTFE high frequency plate or ceramic wafer is equipped with copper-clad surface, comprising the following steps: S1. pre-treatment step: right
PTFE high frequency plate or ceramic wafer are cleaned twice using pure water；
S2. sided corona treatment sided corona treatment step: is carried out to the copper-clad surface of PTFE high frequency plate or ceramic wafer；
S3. print steps: ink layer is sprayed on the copper-clad surface of PTFE high frequency plate or ceramic wafer through sided corona treatment；
S4. development exposure development step: is exposed to the ink layer on the PTFE high frequency plate or ceramic wafer；
S5. baking-curing baking procedure: is carried out to the ink layer after exposure development.
Further, in S2. sided corona treatment step, electricity first is carried out to the side copper-clad surface of PTFE high frequency plate or ceramic wafer
Dizzy processing, PTFE high frequency plate or ceramic wafer carry out sided corona treatment to its other side copper-clad surface after turn-over.
Further, in S3. print steps, first to the first oil of side copper-clad surface spraying of PTFE high frequency plate or ceramic wafer
Layer of ink sprays the second ink layer to its other side copper-clad surface after PTFE high frequency plate or ceramic wafer turn-over.
Further, each with 10 times or more lens examinations when exposure aligning is completed in S4. exposure development step
The Aligning degree of piece PTFE high frequency plate or ceramic wafer；Exposure energy is arranged in 11 to 13 lattice epiphragmas.
Further, in S5. baking procedure, PTFE high frequency plate or ceramic wafer toast after being segmented: first segment: 80 DEG C
Temperature is toasted 30 minutes；Second segment: 110 DEG C of temperature are toasted 30 minutes；Third section: 150 DEG C of temperature are toasted 45 minutes.
Another aspect of the present invention provides a kind of welding devices of 5G high frequency circuit board, and the 5G high frequency circuit board is PTFE high
The surface of frequency plate or ceramic wafer, PTFE high frequency plate or ceramic wafer is equipped with copper-clad surface, including corona sprays connecting line equipment, exposure development
Equipment and roasting plant, the corona spraying connecting line equipment include putting trigger, panel turnover machine, the first corona equipment, the second corona to set
Standby, spraying equipment, unloader put PTFE high frequency plate or the ceramic wafer placed on trigger and pure water is used to clean twice, the first electricity
Dizzy equipment carries out sided corona treatment to the side copper-clad surface of PTFE high frequency plate or ceramic wafer, and panel turnover machine is by PTFE high frequency plate or ceramic wafer
Turn-over, the second corona equipment carry out sided corona treatment to the other side copper-clad surface of PTFE high frequency plate or ceramic wafer, and spraying equipment is passing through
Ink layer is sprayed on the copper-clad surface of sided corona treatment, unloader carries out receipts plate to PTFE high frequency plate or ceramic wafer.
Further, the spraying equipment first sprays the first ink to the side copper-clad surface of PTFE high frequency plate or ceramic wafer
Layer, then the second ink layer is sprayed to its other side copper-clad surface after PTFE high frequency plate or ceramic wafer turn-over.
Further, in the exposure development equipment, with 10 times or more lens examinations per a piece of PTFE high frequency plate or pottery
The Aligning degree of porcelain plate；Exposure energy is arranged in 11 to 13 lattice epiphragmas.
The beneficial effects of the present invention are: the welding resistance method and welding devices of 5G high frequency circuit board of the invention use corona
Processing is combined with spraying ink, is avoided occurring the phenomenon that dregs of fat and plate face dew copper in the plate face of high frequency circuit board, is greatly improved
The quality of wiring board, the printing high frequency plate producing adhesive force and have good uniformity；And saved ink, reduce manufacture at
This；It uses pure water cleaning instead in pretreatment procedure, does not need not only to be printed hastily in specific time in this way, also avoid
The problem of getting rid of oil or influencing product electric signal is caused because not carrying out time control, is reduced the rate of washing of returning of high frequency plate, is improved life
Produce efficiency.
Detailed description of the invention
Fig. 1 is the welding resistance method implementation diagram of existing PTFE high frequency circuit board；
Fig. 2 is the flow diagram of the welding resistance method of 5G high frequency circuit board of the present invention；
Fig. 3 is the structural schematic diagram of the welding devices of 5G high frequency circuit board of the present invention.
Specific embodiment
Specifically illustrate embodiments of the present invention with reference to the accompanying drawing, attached drawing is only for reference and illustrates use, does not constitute pair
The limitation of the invention patent protection scope.
PTFE material is a kind of high frequency material, has excellent electrical property and chemical stability, and power supply signal frequency
It is very small to increase loss on base material；However high frequency material has manufacturing deficiency, welding resistance is easy to get rid of oil.In process of production, I
All PTFE copper-clad plate is controlled within 4 hours as far as possible in the processing time etched between silk-screen, what reason this is
it has been investigated that PTFE substrate surface following exposure to the time in air growth and microcosmic structure change occurs, such as Fig. 1
It is shown: where the figure on the arrow left side is PTFE substrate with standing time increased variation, and right figure is ink for screen printing and PTFE base
The combination effect on material surface.PTFE substrate exposure aerial time is longer, and the roughness on surface can be smaller and smaller, when putting
Tending to be smooth substantially when setting the time up to 8 hours, substrate surface is smooth to make the binding force of ink and substrate when silk-screen weaken, in conjunction with
Power decrease can directly result in high frequency circuit board and get rid of oil.
As shown in Fig. 2, the present embodiment is related to a kind of welding resistance method of 5G high frequency circuit board, as 5G high frequency circuit board
The surface of PTFE high frequency plate or ceramic wafer is equipped with copper-clad surface, comprising the following steps:
S1. pre-treatment step: PTFE high frequency plate or ceramic wafer are cleaned twice using pure water；
S2. sided corona treatment sided corona treatment step: is carried out to the copper-clad surface of PTFE high frequency plate or ceramic wafer；
S3. print steps: ink layer is sprayed on the copper-clad surface of PTFE high frequency plate or ceramic wafer through sided corona treatment；
S4. development exposure development step: is exposed to the ink layer on the PTFE high frequency plate or ceramic wafer；
S5. baking-curing baking procedure: is carried out to the ink layer after exposure development.
In S2 sided corona treatment step, sided corona treatment first is carried out to the side copper-clad surface of PTFE high frequency plate or ceramic wafer,
PTFE high frequency plate or ceramic wafer carry out sided corona treatment to its other side copper-clad surface after turn-over.
Further, in S3. print steps, first to the first oil of side copper-clad surface spraying of PTFE high frequency plate or ceramic wafer
Layer of ink sprays the second ink layer to its other side copper-clad surface after PTFE high frequency plate or ceramic wafer turn-over.
The workflow of the welding resistance method of the 5G high frequency circuit board of the present embodiment are as follows:
Pure water washes twice → corona technique → ink coating → exposure development → tunnel baking
1. pre-treatment:
In PTFE plate, ceramic wafer pre-treatment twice using pure water cleaning, the transmission on electric signal, which is effectively reduced, to be influenced；
2. printing:
A. after pre-treatment, in the not tangible shaping area of hand, gloves is worn and also cannot；
B. connecting line equipment (line has plate putting machine, turnover machine and spraying equipment line) operation is sprayed using corona, works as processing
Ceramics or when PTFE plate, open corona equipment, when handling non-high frequency plate, close corona equipment, corona spray connecting line equipment as
Usual spray line uses, and has obtained not getting rid of oily and ink uniformity after corona sprays connecting line equipment corona spray treatment good
Good wiring board.It should be noted that Ying Qingjie, dry impact frame and rubber roller before being switched on, cause ablation to prevent high pressure electric leakage；
3. exposure development:
A. when exposure aligning is completed, with the alignment of the every a piece of PTFE high frequency plate of 10 times or more lens examinations or ceramic wafer
Degree, can not have to inclined problem.
B. exposure energy is higher than common ink, and setting avoids energy is low heavy tin is caused to fall oil in 11-13 lattice epiphragma.
4. baking: solidify after green oil: PTFE high frequency plate or ceramic wafer toast after being segmented: first segment: 80 DEG C of temperature are dried
It is 30 minutes roasting；Second segment: 110 DEG C of temperature are toasted 30 minutes；Third section: 150 DEG C of temperature are toasted 45 minutes.
As shown in figure 3, on the other hand the embodiment of the present invention is related to a kind of welding devices of 5G high frequency circuit board, the 5G high
Frequency wiring board is PTFE high frequency plate or ceramic wafer, and the surface of PTFE high frequency plate or ceramic wafer is equipped with copper-clad surface, including corona sprays
Connecting line equipment, exposure development equipment and roasting plant, the corona spraying connecting line equipment include putting trigger, panel turnover machine, the first electricity
Dizzy equipment, the second corona equipment, spraying equipment, unloader, put the PTFE high frequency placed on trigger and pure water is used to clean twice
Plate or ceramic wafer, the first corona equipment carry out sided corona treatment to the side copper-clad surface of PTFE high frequency plate or ceramic wafer, and panel turnover machine will
PTFE high frequency plate or ceramic wafer turn-over, the second corona equipment carry out corona to the other side copper-clad surface of PTFE high frequency plate or ceramic wafer
Processing, spraying equipment spray ink layer on the copper-clad surface through sided corona treatment, and unloader carries out PTFE high frequency plate or ceramic wafer
Receive plate.
In the present embodiment, surface treatment of the corona unit for plastic film class or plastic plate based article, when right
Above-mentioned material progress ink printing, compound, blown film, coating, splicing, material modification, grafting, polymerization, plated film, curtain coating, stickup add
Before work, in order to make product surface have stronger adhesion strength, prevent raw material occurs in process of production printing get rid of color, it is compound glue
Paste phenomena such as insecure, coating leak adhesive is uneven, it is necessary to first carry out corona shock treatment.
In the present embodiment, the spraying equipment is first to the first oil of side copper-clad surface spraying of PTFE high frequency plate or ceramic wafer
Layer of ink, then the second ink layer is sprayed to its other side copper-clad surface after PTFE high frequency plate or ceramic wafer turn-over.
In the present embodiment, in the exposure development equipment, with 10 times or more lens examinations per a piece of PTFE high frequency plate
Or the Aligning degree of ceramic wafer；Exposure energy is arranged in 11 to 13 lattice epiphragmas.
The welding devices to 5G high frequency circuit board of the invention are used in combination in corona equipment and spraying equipment by the present embodiment
In, the influence to high-frequency signal is reduced using pure water cleaning, welding resistance is carried out by way of spraying ink after corona, obtains attached
The 5G high frequency printing plate puted forth effort and had good uniformity.
The above embodiment is a preferred embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention,
It should be equivalent substitute mode, be included within the scope of the present invention.
Claims (8)
1. a kind of welding resistance method of 5G high frequency circuit board, the 5G high frequency circuit board is PTFE high frequency plate or ceramic wafer, PTFE high
The surface of frequency plate or ceramic wafer is equipped with copper-clad surface, which comprises the following steps:
S1. pre-treatment step: PTFE high frequency plate or ceramic wafer are cleaned twice using pure water；
S2. sided corona treatment sided corona treatment step: is carried out to the copper-clad surface of PTFE high frequency plate or ceramic wafer；
S3. print steps: ink layer is sprayed on the copper-clad surface of PTFE high frequency plate or ceramic wafer through sided corona treatment；
S4. development exposure development step: is exposed to the ink layer on the PTFE high frequency plate or ceramic wafer；
S5. baking-curing baking procedure: is carried out to the ink layer after exposure development.
2. the welding resistance method of 5G high frequency circuit board according to claim 1, it is characterised in that:
In S2. sided corona treatment step, sided corona treatment, PTFE high first are carried out to the side copper-clad surface of PTFE high frequency plate or ceramic wafer
Frequency plate or ceramic wafer carry out sided corona treatment to its other side copper-clad surface after turn-over.
3. the welding resistance method of 5G high frequency circuit board according to claim 1, it is characterised in that:
In S3. print steps, the first ink layer first is sprayed to the side copper-clad surface of PTFE high frequency plate or ceramic wafer, in PTFE high
The second ink layer is sprayed to its other side copper-clad surface after frequency plate or ceramic wafer turn-over.
4. the welding resistance method of 5G high frequency circuit board according to claim 1, it is characterised in that:
In S4. exposure development step, when exposure aligning is completed, with 10 times or more lens examinations per a piece of PTFE high frequency plate or
The Aligning degree of ceramic wafer；Exposure energy is arranged in 11 to 13 lattice epiphragmas.
5. the welding resistance method of 5G high frequency circuit board according to claim 1, it is characterised in that:
In S5. baking procedure, PTFE high frequency plate or ceramic wafer toast after being segmented: first segment: 80 DEG C of temperature toast 30 points
Clock；Second segment: 110 DEG C of temperature are toasted 30 minutes；Third section: 150 DEG C of temperature are toasted 45 minutes.
6. a kind of welding devices of 5G high frequency circuit board, the 5G high frequency circuit board is PTFE high frequency plate or ceramic wafer, PTFE high
The surface of frequency plate or ceramic wafer is equipped with copper-clad surface, it is characterised in that: including corona spraying connecting line equipment, exposure development equipment and baking
Roasting equipment, the corona spraying connecting line equipment include put trigger, panel turnover machine, the first corona equipment, the second corona equipment, spraying are set
Standby, unloader puts PTFE high frequency plate or the ceramic wafer placed on trigger and pure water is used to clean twice, the first corona equipment pair
The side copper-clad surface of PTFE high frequency plate or ceramic wafer carries out sided corona treatment, and panel turnover machine is by PTFE high frequency plate or ceramic wafer turn-over, and the
Two corona equipment carry out sided corona treatment to the other side copper-clad surface of PTFE high frequency plate or ceramic wafer, and spraying equipment is through sided corona treatment
Copper-clad surface on spray ink layer, unloader carries out receipts plate to PTFE high frequency plate or ceramic wafer.
7. the welding devices of 5G high frequency circuit board according to claim 6, it is characterised in that:
The spraying equipment first sprays the first ink layer to the side copper-clad surface of PTFE high frequency plate or ceramic wafer, then in PTFE high frequency
The second ink layer is sprayed to its other side copper-clad surface after plate or ceramic wafer turn-over.
8. the welding devices of 5G high frequency circuit board according to claim 6, it is characterised in that:
In the exposure development equipment, with the every a piece of PTFE high frequency plate of 10 times or more lens examinations or the Aligning degree of ceramic wafer；
Exposure energy is arranged in 11 to 13 lattice epiphragmas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910503598.9A CN110402036A (en) | 2019-06-12 | 2019-06-12 | A kind of the welding resistance method and welding devices of 5G high frequency circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910503598.9A CN110402036A (en) | 2019-06-12 | 2019-06-12 | A kind of the welding resistance method and welding devices of 5G high frequency circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856370A (en) * | 2019-12-02 | 2020-02-28 | 上海第二工业大学 | Resistance welding pretreatment method for 5G high-frequency circuit board |
| CN111432556A (en) * | 2020-03-02 | 2020-07-17 | 博罗康佳精密科技有限公司 | Preparation process of PCB high-frequency board for 5G base station |
| CN111845025A (en) * | 2020-07-02 | 2020-10-30 | 惠州市特创电子科技有限公司 | Printing screen and preparation method, construction method and application thereof |
| CN112770507A (en) * | 2020-12-10 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Corona resistance welding circuit board and preparation method thereof |
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN114340177A (en) * | 2022-01-17 | 2022-04-12 | 广东小镓技术有限公司 | High-efficient corona unit and printed circuit board |
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| CN104968157A (en) * | 2015-05-25 | 2015-10-07 | 李恒 | Electrocoppering thin film circuit and additive manufacturing method thereof |
| CN205883730U (en) * | 2016-06-17 | 2017-01-11 | 吉安市浚图科技有限公司 | Circuit board automatic hindering in succession welds production line |
| CN107852825A (en) * | 2015-07-14 | 2018-03-27 | 爱克发-格法特公司 | Printed circuit board (PCB) is manufactured using UV free radicals curable ink-jet ink |
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- 2019-06-12 CN CN201910503598.9A patent/CN110402036A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104968157A (en) * | 2015-05-25 | 2015-10-07 | 李恒 | Electrocoppering thin film circuit and additive manufacturing method thereof |
| CN107852825A (en) * | 2015-07-14 | 2018-03-27 | 爱克发-格法特公司 | Printed circuit board (PCB) is manufactured using UV free radicals curable ink-jet ink |
| CN205883730U (en) * | 2016-06-17 | 2017-01-11 | 吉安市浚图科技有限公司 | Circuit board automatic hindering in succession welds production line |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110856370A (en) * | 2019-12-02 | 2020-02-28 | 上海第二工业大学 | Resistance welding pretreatment method for 5G high-frequency circuit board |
| CN111432556A (en) * | 2020-03-02 | 2020-07-17 | 博罗康佳精密科技有限公司 | Preparation process of PCB high-frequency board for 5G base station |
| CN111845025A (en) * | 2020-07-02 | 2020-10-30 | 惠州市特创电子科技有限公司 | Printing screen and preparation method, construction method and application thereof |
| CN112770507A (en) * | 2020-12-10 | 2021-05-07 | 惠州市特创电子科技股份有限公司 | Corona resistance welding circuit board and preparation method thereof |
| CN112770525A (en) * | 2020-12-18 | 2021-05-07 | 珠海杰赛科技有限公司 | Manufacturing method of printed circuit board |
| CN114340177A (en) * | 2022-01-17 | 2022-04-12 | 广东小镓技术有限公司 | High-efficient corona unit and printed circuit board |
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Address after: 516300 Jinpaishan Mountain, Taiyang Depression, Baihua Town, Huidong County, Huizhou City, Guangdong Province Applicant after: Huizhou techuang Electronic Technology Co.,Ltd. Address before: Baihua town Taiyang Ao jinpaishan, Huidong County, Huizhou City, Guangdong Province Applicant before: HUIZHOU GLORYSKY ELECTRONICS TECHNOLOGY Co.,Ltd. |
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