CN100562222C - A kind of method of removing sensitization film in flexible printed circuit board - Google Patents
A kind of method of removing sensitization film in flexible printed circuit board Download PDFInfo
- Publication number
- CN100562222C CN100562222C CNB2006100631964A CN200610063196A CN100562222C CN 100562222 C CN100562222 C CN 100562222C CN B2006100631964 A CNB2006100631964 A CN B2006100631964A CN 200610063196 A CN200610063196 A CN 200610063196A CN 100562222 C CN100562222 C CN 100562222C
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- Prior art keywords
- stripping
- circuit board
- printed circuit
- flexible printed
- sensitization film
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- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The invention discloses a kind of method of removing sensitization film in flexible printed circuit board; it is characterized in that: the stripping step is will find the FPC semi-finished product earlier to have the diaphragm of the bad one side of fixed point to tear off before development; to tear one of diaphragm again off and face up to be positioned in the stripping line and peel off light-sensitive surface, stripper solution adopts top spray mode.The beneficial effect that the present invention is compared with the prior art is: convenient and swift, the light-sensitive surface that only will find the bad one side process exposure-processed of at least one fixed point divests, can obviously improve manufacturing efficient, effectively reduce manufacturing cost, can also significantly reduce dry film stripping quantity in stripping workload and the stripper solution.
Description
Technical field
The present invention relates to printed substrate, especially relate to a kind of method of removing sensitization film in flexible printed circuit board.
Background technology
Flexible print circuit board (Flexible Printed Circuit board, be called for short FPC) before development, all to carry out two-sided fixed point quality sampling check to the batch semi-finished product, every have one side to have found at least one fixed point bad, with regard to directly the light-sensitive surface of the process exposure-processed of this batch FPC two sides lamination being carried out the stripping processing of doing over again, following steps are arranged successively: stripping → washing → pickling → washing → anti-oxidant → washing → drying.Like this stripping not only serious waste light-sensitive surface of doing over again; the light-sensitive surface of not finding the bad process exposure-processed of fixing a point has also been divested; the workload that tears off the light-sensitive surface outer protective film in advance and the discarded object amount in the stripping groove are multiplied; obviously reduce and make efficient, increase manufacturing cost.
Summary of the invention
Technical problem to be solved by this invention is, overcome the defective that above-mentioned prior art exists, a kind of method of removing sensitization film in flexible printed circuit board is proposed, it is convenient and swift, the light-sensitive surface that only will find the bad one side process exposure-processed of at least one fixed point divests, can obviously improve manufacturing efficient, effectively reduce manufacturing cost, can also significantly reduce dry film stripping quantity in stripping workload and the stripper solution.
Technical problem of the present invention is solved by following technical scheme:
The characteristics of the method for this removing sensitization film in flexible printed circuit board are:
The stripping step is will find the FPC semi-finished product earlier to have the diaphragm of the bad one side of fixed point to tear off before development; to tear one of diaphragm again off faces up to be positioned in the stripping line and peels off light-sensitive surface; stripper solution adopts top spray mode, contacts to avoid the half-finished another side of stripper solution and FPC.
Technical problem of the present invention is solved by following further technical scheme:
After described stripping step, following steps are arranged successively: once washing → pickling → secondary water washing → anti-oxidant → three time washing → drying.
All use the antiultraviolet yellow fluorescent lamp at described stripping to the illuminating lamp of each dry step, light-sensitive surface is produced harmful effect to avoid the houselights before development.
Described stripper solution is that to be heated to temperature be 45 ℃～50 ℃ aqueous slkali, and the spray pressure of stripper solution is 0.8kg/cm
2～1.2kg/cm
2
Preferably, described aqueous slkali is that concentration is 2%～3% NaOH solution.
Described drying is that the setting baking temperature is 32 ℃～35 ℃, and the FPC semi-finished product behind the stripping are dried.About 85 ℃ baking temperature than existing stripping method has reduced nearly 50 ℃, not only makes the FPC semi-finished product avoid the influence of 85 ℃ of left and right sides higher temperatures, can also obviously reduce thermal source consumption.
Described one to three washing is that the FPC semi-finished product are peeled off one of light-sensitive surface placements that face up, and adopts upper and lower while spray Cleaning for High Capacity water, overflow water-washing method, and the spray pressure of rinse water is 0.8kg/cm
2～1.2kg/cm
2, and the rinse water in the rinsing bowl keeps fresh.FPC semi-finished product two sides is fully contacted with rinse water, cleaned timely and effectively.Described rinse water is a pure water.
Described pickling is that the FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, and pickle adopts top spray mode, and the spray pressure of pickle is 0.8kg/cm
2～1.2kg/cm
2To avoid the half-finished another side of pickle and FPC to contact.Described pickle is that concentration is 3%～5% H
2SO
4, be used for the residual NaOH alkali in neutralized product stripping rear surface, remove Superficial Foreign Body.
Described anti-oxidant be that the FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, oxidation resistance liquid adopts top spray mode, the spray pressure of oxidation resistance liquid is 0.8kg/cm
2～1.2kg/cm
2To avoid the half-finished another side of oxidation resistance liquid and FPC to contact.Described antioxidant is that concentration is 0.5%～1.3% M-667 solution, is used to suppress copper foil surface generation oxidation.
The beneficial effect that the present invention is compared with the prior art is:
Convenient and swift, the light-sensitive surface that only will find the bad one side process exposure-processed of at least one fixed point divests, and can obviously improve manufacturing efficient, effectively reduces manufacturing cost, can also significantly reduce dry film stripping quantity in stripping workload and the stripper solution.
Embodiment
The FPC semi-finished product that two-sided dry film is arranged of existing 200 batches, every FPC is of a size of 250mm * 200mm, before development, carry out two-sided fixed point quality sampling check, find bad 1 of fixed point, fraction defective 10%, need to adopt the method for FPC removing sensitization film of the present invention to carry out the processing of doing over again of single face stripping, following steps arranged successively: stripping → washing → pickling → washing → anti-oxidant → washing → drying:
(1) stripping
To find the FPC semi-finished product earlier before development has the diaphragm of the bad one side of fixed point to tear off, will tear one of diaphragm again off and face up to be positioned in the stripping line and peel off light-sensitive surface, and stripper solution adopts top spray mode, and spray pressure is 0.8～1.2kg/cm
2, stripper solution is that to be heated to temperature be that 45 ℃～50 ℃ concentration is 2%～3% NaOH solution, the speed of service of stripping production line is 2.0m/min～3.0m/min;
(2) washing
The FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, adopt upper and lower to spray pure water, overflow water-washing method simultaneously, spray pressure is 1.0kg/cm
2, and the pure water in the rinsing bowl keeps fresh;
(3) pickling
With one of the FPC semi-finished product stripping placement that faces up, pickle adopts top spray mode, and spray pressure is 1.0kg/cm
2, pickle is that concentration is 3%～5% H
2SO
4
(4) washing
The FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, adopt upper and lower to spray pure water, overflow water-washing method simultaneously, spray pressure is 1.0kg/cm
2, and the pure water in the rinsing bowl keeps fresh;
(5) anti-oxidant
With one of the FPC semi-finished product stripping placement that faces up, oxidation resistance liquid adopts top spray mode, and spray pressure is 1.0kg/cm
2, antioxidant is that concentration is 0.5%～1.3% M-667 solution;
(6) washing
The FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, adopt upper and lower to spray pure water, overflow water-washing method simultaneously, spray pressure is 1.0kg/cm
2, and the pure water in the rinsing bowl keeps fresh;
(7) drying
Setting baking temperature is 35 ℃, and the FPC semi-finished product behind the stripping are dried.
All use the antiultraviolet yellow fluorescent lamp at above-mentioned stripping to the illuminating lamp of each dry step.
FPC semi-finished product after the oven dry enter the chemical grinding line again and carry out clean, increase copper foil surface adhesive force, return the lamination operation at last.
If adopt existing FPC two sides simultaneously the method for removing sensitization film the FPC semi-finished product that two-sided dry film is arranged of above-mentioned 200 batches are carried out the stripping processing of doing over again, stripping workload and stripping contaminant capacity are respectively the twices of the inventive method.Showing that the single face stripping is done over again handles conveniently, quick, can obviously improve manufacturing efficient, effectively saves dry film, reduces manufacturing cost, also can significantly reduce dry film stripping quantity in stripping workload and the stripper solution simultaneously.
Claims (9)
1. the method for a removing sensitization film in flexible printed circuit board is characterized in that:
The stripping step is will find the FPC semi-finished product earlier to have the diaphragm of the bad one side of fixed point to tear off before development, will tear one of diaphragm again off and face up to be positioned in the stripping line and peel off light-sensitive surface, and stripper solution adopts top spray mode.
2. according to the method for the described removing sensitization film in flexible printed circuit board of claim 1, it is characterized in that:
After described stripping step, following steps are arranged successively: once washing → pickling → secondary water washing → anti-oxidant → three time washing → drying.
3. the method for single face removing sensitization film before developing according to claim 1 or 2 described flexible print circuit boards is characterized in that:
All use the antiultraviolet yellow fluorescent lamp at described stripping to the illuminating lamp of each dry step.
4. according to the method for the described removing sensitization film in flexible printed circuit board of claim 3, it is characterized in that:
Described stripper solution is that to be heated to temperature be 45 ℃～50 ℃ aqueous slkali, and the spray pressure of stripper solution is 0.8kg/cm
2～1.2kg/cm
2
5. according to the method for the described removing sensitization film in flexible printed circuit board of claim 4, it is characterized in that:
Described aqueous slkali is that concentration is 2%～3% NaOH solution.
6. according to the method for the described removing sensitization film in flexible printed circuit board of claim 5, it is characterized in that:
Described drying is that the setting baking temperature is 32 ℃～35 ℃, and the FPC semi-finished product behind the stripping are dried.
7. according to the method for the described removing sensitization film in flexible printed circuit board of claim 6, it is characterized in that:
Described one to three washing is that the FPC semi-finished product are peeled off one of light-sensitive surface placements that face up, and adopts upper and lower while spray Cleaning for High Capacity water, overflow water-washing method, and the spray pressure of rinse water is 0.8kg/cm
2～1.2kg/cm
2, and the rinse water in the rinsing bowl keeps fresh.
8. according to the method for the described removing sensitization film in flexible printed circuit board of claim 7, it is characterized in that:
Described pickling is that the FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, and pickle adopts top spray mode, and the spray pressure of pickle is 0.8kg/cm
2～1.2kg/cm
2
9. according to the method for the described removing sensitization film in flexible printed circuit board of claim 8, it is characterized in that:
Described anti-oxidant be that the FPC semi-finished product are peeled off one of the light-sensitive surface placement that faces up, oxidation resistance liquid adopts top spray mode, the spray pressure of oxidation resistance liquid is 0.8kg/cm
2～1.2kg/cm
2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100631964A CN100562222C (en) | 2006-10-18 | 2006-10-18 | A kind of method of removing sensitization film in flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100631964A CN100562222C (en) | 2006-10-18 | 2006-10-18 | A kind of method of removing sensitization film in flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101166397A CN101166397A (en) | 2008-04-23 |
| CN100562222C true CN100562222C (en) | 2009-11-18 |
Family
ID=39334787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100631964A Expired - Fee Related CN100562222C (en) | 2006-10-18 | 2006-10-18 | A kind of method of removing sensitization film in flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100562222C (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548232B (en) * | 2011-11-16 | 2014-05-21 | 大连崇达电路有限公司 | Method for preventing circuit board solder mask ink from blocking hole |
| CN103320778B (en) * | 2012-03-20 | 2015-09-23 | 春兴铸造(苏州工业园区)有限公司 | A kind of aviation pipe stainless steel passivation process |
| CN103593103B (en) * | 2013-12-03 | 2016-08-17 | 广东泰通科技股份有限公司 | The stripping of a kind of capacitive touch screen induction apparatus copper facing ITO gold-tinted technique and antioxidation synchronization processing method |
| CN104411107A (en) * | 2014-11-05 | 2015-03-11 | 深圳恒宝士线路板有限公司 | PCB electrogilding technology |
| CN107204387B (en) * | 2016-03-16 | 2019-07-05 | 钧石(中国)能源有限公司 | A kind of dyestripping method preparing HIT solar cell conductive grid line |
| CN106255332A (en) * | 2016-08-24 | 2016-12-21 | 奥士康精密电路（惠州）有限公司 | The method improving circuit board pattern transfer precision |
| CN108008606B (en) * | 2017-12-25 | 2021-01-15 | 宜昌南玻显示器件有限公司 | Stripping liquid for photosensitive dry film and production method and application thereof |
| CN108116031B (en) * | 2017-12-29 | 2021-07-06 | 东莞市合鼎电路有限公司 | Circuit board character printing method |
-
2006
- 2006-10-18 CN CNB2006100631964A patent/CN100562222C/en not_active Expired - Fee Related
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|---|---|
| CN101166397A (en) | 2008-04-23 |
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| C06 | Publication | ||
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Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract fulfillment period: 2008.4.25 to 2015.11.14 Contract record no.: 2008440000067 Denomination of invention: A method for removing sensitization film in flexible printed circuit board License type: Exclusive license Record date: 20080504 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENCE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.4.25 TO 2015.11.14 Name of requester: BIYADI ELECTRON MEMBER CO., LTD., SHENZHEN CITY Effective date: 20080504 |
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Owner name: SHENZHEN BYD ELECTRONIC COMPONENT CO., LTD. Free format text: FORMER OWNER: BIYADI CO., LTD. Effective date: 20150901 |
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Effective date of registration: 20150901 Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen BYD Electronic Component Co., Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: Biyadi Co., Ltd. |
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Granted publication date: 20091118 Termination date: 20201018 |
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| CF01 | Termination of patent right due to non-payment of annual fee |