CN104968157A - Electrocoppering thin film circuit and additive manufacturing method thereof - Google Patents
Electrocoppering thin film circuit and additive manufacturing method thereof Download PDFInfo
- Publication number
- CN104968157A CN104968157A CN201510272240.1A CN201510272240A CN104968157A CN 104968157 A CN104968157 A CN 104968157A CN 201510272240 A CN201510272240 A CN 201510272240A CN 104968157 A CN104968157 A CN 104968157A
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- China
- Prior art keywords
- film circuit
- coppering
- electro
- conductive adhesive
- anisotropic conductive
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemically Coating (AREA)
Abstract
The invention relates to an electrocoppering thin film circuit and an additive manufacturing method thereof. The manufacturing method comprises the steps of: 1) performing high frequency corona and surface coating processing on an insulation base material to prepare a priming layer; 2) printing catalyst or reducing agent printing ink on the priming layer; 3) successively performing chemical non-electric electroplating and multistage electric electroplating on the printed priming layer to thicken a copper plating layer; 4) printing an anisotropic conductive adhesive at the position of the copper plating layer needing to bonded with a chip to obtain an anisotropic conductive adhesive trace; 5) coating an antioxidation coating; and 6) storing a finished products in a warehousing. The electrocoppering thin film circuit of the invention comprises the antioxidation coating, the copper plating layer, the catalyst or reducing agent printing ink, the insulation base material, the anisotropic conductive adhesive trace and the priming layer; the antioxidation coating, the anisotropic conductive adhesive trace, the copper plating layer, the catalyst or reducing agent printing ink, the priming layer and the insulation base material are successively arranged from top to bottom. Compared with the prior art, the electrocoppering thin film circuit has the advantages of good conductivity, high folding endurance, small pollution, low cost, etc.
Description
Technical field
The present invention relates to a kind of metal book film circuit, especially relate to a kind of electro-coppering book film circuit and addition manufacture method thereof.
Background technology
Along with the development of Internet of Things, market rolls up for the demand of radio-frequency (RF) identification (Radio Frequency Identification, RFID) electronic tag, there is wide prospect.But the important component part of RFID---the manufacture method existing defects always of antenna, seriously constrains further developing of RFID label tag market.Current RFID electric tag antenna is generally obtained by etching made with aluminum foil, and the conductivity of aluminium, easily oxidizable is poor, and antenna easily fractures, Q value not high (Q value is higher, and the loss of electrical property is less, and efficiency is higher); Take etch process can erode a large amount of raw metal in preparation process, the aluminum metal of more than 80% is corroded, and stays to be less than 20% and to make product, thus causes great waste; In addition etching antenna employs multiple soda acid chemicals in manufacturing process, can produce a large amount of waste water.
Summary of the invention
An object of the present invention be in order to overcome above-mentioned prior art exist defect and a kind of addition manufacture method polluting little, that cost is low electro-coppering book film circuit is provided.
Two of object of the present invention be provide a kind of conduct electricity very well to overcome defect that above-mentioned prior art exists, folding resistance is high, it is little to pollute, cost is low electro-coppering book film circuit.
Three of object of the present invention provides a kind of application of electro-coppering book film circuit applied widely to overcome defect that above-mentioned prior art exists.
Object of the present invention can be achieved through the following technical solutions:
An addition manufacture method for electro-coppering book film circuit, comprises the following steps:
1) on insulating substrate, carry out high-frequency corona and the process of surface energy coating, make prime coat;
2) printed catalyst or reducing agent ink on described prime coat;
3) prime coat after printing carries out successively the plating of chemical non-electrical and multistage plating thickening copper plate;
4) on copper plate, need binding chip place to print anisotropic conductive adhesive, obtain anisotropic conductive adhesive mark;
5) antioxidation coating is coated with;
6) finished product warehouse-in.
Step 1) in, described insulating substrate comprises plastic film, plastic plate, paper, cloth, nonwoven fabrics, glass, pottery or epoxy resin board.
Described step 2) in, pattern and the circuit design of printing-ink match.
Step 3) in, described chemical non-electrical plating adopts cold displacement reaction or silver mirror reaction, and solution temperature is 10 ~ 60 degree.
Step 3) in, described multistage plating is specially: the electric conductivity utilizing chemical reaction deposit metallic copper, and realize multistage energising plating, thicken metallic copper thickness, electric current strengthens step by step, makes layers of copper reach the thickness of design, and the temperature of solution is 10 ~ 60 degree.
Step 3) in, described copper plate is phosphorous copper plate.
Step 4) in, described anisotropic conductive adhesive comprises solid epoxy, solvent, latent curing agent and tin alloy powder, and each Ingredients Weight ratio is: solid epoxy 50--80%, latent curing agent 5--20%, tin alloy powder 5--30%, all the other are solvent.
The electro-coppering book film circuit that a kind of addition manufacture method manufactures, comprise antioxidation coating, copper plate, catalyst or reducing agent ink, insulating substrate, anisotropic conductive adhesive mark and prime coat, described antioxidation coating, anisotropic conductive adhesive mark, copper plate, catalyst or reducing agent ink, prime coat and insulating substrate set gradually from top to bottom.
An application for electro-coppering book film circuit, described electro-coppering book film circuit application is in the antenna of RFID label tag, book membrane switch, Flexible Printed Circuit, rigid wiring board or nonmetallic materials selective electroplating plate.
Compared with prior art, the present invention has the following advantages:
(1) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: because aluminum antenna takes etch process can erode a large amount of raw metal in preparation process, the aluminum metal of more than 80% is corroded (we are called " subtraction "), stay and be less than 20% and make product, thus cause great waste; And present invention employs " addition ", metal is the place being electroplated onto needs, and the utilance of metallic copper reaches 100%.
(2) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: electro-coppering book film circuit is not oxidizable.
(3) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: electro-coppering book film circuit is not easy to fracture.
(4) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: electro-coppering antenna Q value high (Q value is higher, and the loss of electrical property is less, and efficiency is higher).
(5) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: aluminium etching antenna employs multiple soda acid chemicals in manufacturing process, and is disposable use, can produces a large amount of chemical waste fluid and be difficult to process.And adopting copper plating process, electroplate liquid is recycled, and only need add part raw material and water, does not discharge electroplate liquid, so decrease pollution.
(6) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: aluminium can not soldering, and copper metal can soldering, so the binding reliability of chip on copper antenna is very high.
(7) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, compared with aluminum antenna: aluminium surface can not electroplating other metals, and copper metal can electroplating other metals, so may be used for book membrane switch, Flexible Printed Circuit, and aluminum metal cannot be accomplished.
(8) the present invention adopts addition manufacture method to manufacture electro-coppering book film circuit, is a quantum jump of selective electroplating technique in nonmetallic materials, can electroplates into metal, so the purposes of this technique is extremely wide in any nonmetallic materials by the pattern of design.
Accompanying drawing explanation
Fig. 1 is Making programme figure of the present invention;
Fig. 2 is the structural representation of electro-coppering book film circuit of the present invention;
Fig. 3 be anisotropic conductive adhesive mark of the present invention schematic diagram is set.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.The present embodiment is implemented premised on technical solution of the present invention, give detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
As shown in Figure 1, the invention provides a kind of addition manufacture method of electro-coppering book film circuit, comprise the following steps:
Step S1, insulating substrate carries out high-frequency corona and the process of surface energy coating, makes prime coat.Insulating substrate can be plastic film, plastic plate, paper, cloth, nonwoven fabrics, glass, pottery or epoxy resin board etc.
Step S2, printed catalyst or reducing agent ink on described prime coat, pattern and the circuit design of printing-ink match.
Catalyst or reducing agent ink have the function that reduction copper ion becomes copper metal, containing in the solution of copper ion, can play displacement reaction or silver mirror reaction, and the resin in ink, very strong bonding force can be had with insulating substrate.Prime coat after high-frequency corona method and the process of surface energy coating can make catalyst or reducing agent ink be bonded in securely on insulating substrate, plays the effect of intermediary.In the present embodiment, catalyst or reducing agent ink adopt commercially available ink, and model is HY-1 and HY-2 (upper marine rainbow grain husk Industrial Co., Ltd. produces).
According to the difference of printing kind and technique, the pressed powder active material addition manner of the catalyst in ink or reducing agent is also different, the thing liquid that is pre-mixed of pure ink and active material can be adopted to carry out printed patterns, also can the Bian first printed patterns of pure ink, then dusted active material pressed powder before ink also end solidification.
Step S3, prime coat after printing carries out chemical non-electrical plating.The plating of chemistry non-electrical adopts cold displacement reaction or silver mirror reaction, and solution temperature is 10 ~ 60 degree, utilizes temperature can control the speed of chemical reaction.
Step S4, multistage plating thickeies copper plate, and thickness can control.Copper plate is phosphorous copper plate.Multistage plating is specially: the electric conductivity utilizing chemical reaction deposit metallic copper, and realize multistage energising plating, thicken metallic copper thickness, electric current strengthens step by step, makes layers of copper light and reaches the thickness of design.The temperature of solution is 10 ~ 60 degree, the speed utilizing temperature and the magnitude of current at different levels can control to electroplate and product quality.
Step S5, copper plate needs binding chip place print anisotropic conductive adhesive, obtains anisotropic conductive adhesive mark.Anisotropic conductive adhesive is made up of solid epoxy, solvent, latent curing agent and a small amount of tin alloy powder, each Ingredients Weight ratio is: solid epoxy 50--80%, latent curing agent 5--20%, tin alloy powder 5--30%, quantity of solvent is determined for applicable operating procedure.Anisotropic conductive adhesive can make the IC chip of au bump directly be tied to copper book film circuit, accomplishes to conduct electricity up and down and transverse direction is non-conductive.
Step S6, coating antioxidation coating.Antioxidation coating has reproducibility 150 ~ 180 degrees Celsius time, does not affect the soldering performance of copper plate.At normal temperatures, sulfuration and the oxidation of copper plate can be prevented.
Step S7, finished product is put in storage.
The electro-coppering book film circuit manufactured through above-mentioned addition manufacture method is as shown in Fig. 2-Fig. 3, comprise antioxidation coating 1, copper plate 2, catalyst or reducing agent ink 3, insulating substrate 4, anisotropic conductive adhesive mark 5 and prime coat 6, antioxidation coating 1, anisotropic conductive adhesive mark 5, copper plate 2, catalyst or reducing agent ink 3, prime coat 6 and insulating substrate 4 set gradually from top to bottom.
The electro-coppering book film circuit manufactured by said method can be applied to the antenna of RFID label tag, book membrane switch, Flexible Printed Circuit, rigid wiring board or nonmetallic materials selective electroplating plate.
Claims (9)
1. an addition manufacture method for electro-coppering book film circuit, is characterized in that, comprise the following steps:
1) on insulating substrate, carry out high-frequency corona and the process of surface energy coating, make prime coat;
2) printed catalyst or reducing agent ink on described prime coat;
3) prime coat after printing carries out successively the plating of chemical non-electrical and multistage plating thickening copper plate;
4) on copper plate, need binding chip place to print anisotropic conductive adhesive, obtain anisotropic conductive adhesive mark;
5) antioxidation coating is coated with;
6) finished product warehouse-in.
2. the addition manufacture method of electro-coppering book film circuit according to claim 1, is characterized in that, step 1) in, described insulating substrate comprises plastic film, plastic plate, paper, cloth, nonwoven fabrics, glass, pottery or epoxy resin board.
3. the addition manufacture method of electro-coppering book film circuit according to claim 1, is characterized in that, described step 2) in, pattern and the circuit design of printing-ink match.
4. the addition manufacture method of electro-coppering book film circuit according to claim 1, is characterized in that, step 3) in, described chemical non-electrical plating adopts cold displacement reaction or silver mirror reaction, and solution temperature is 10 ~ 60 degree.
5. the addition manufacture method of electro-coppering book film circuit according to claim 1, it is characterized in that, step 3) in, described multistage plating is specially: the electric conductivity utilizing chemical reaction deposit metallic copper, realize multistage energising plating, thicken metallic copper thickness, electric current strengthens step by step, make layers of copper reach the thickness of design, the temperature of solution is 10 ~ 60 degree.
6. the addition manufacture method of electro-coppering book film circuit according to claim 1, is characterized in that, step 3) in, described copper plate is phosphorous copper plate.
7. the addition manufacture method of electro-coppering book film circuit according to claim 1, it is characterized in that, step 4) in, described anisotropic conductive adhesive comprises solid epoxy, solvent, latent curing agent and tin alloy powder, each Ingredients Weight ratio is: solid epoxy 50--80%, latent curing agent 5--20%, tin alloy powder 5--30%, all the other are solvent.
8. one kind as arbitrary in claim 1-7 as described in addition manufacture method manufacture electro-coppering book film circuit, it is characterized in that, comprise antioxidation coating, copper plate, catalyst or reducing agent ink, insulating substrate, anisotropic conductive adhesive mark and prime coat, described antioxidation coating, anisotropic conductive adhesive mark, copper plate, catalyst or reducing agent ink, prime coat and insulating substrate set gradually from top to bottom.
9. an application for electro-coppering book film circuit as claimed in claim 8, is characterized in that, described electro-coppering book film circuit application is in the antenna of RFID label tag, book membrane switch, Flexible Printed Circuit, rigid wiring board or nonmetallic materials selective electroplating technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510272240.1A CN104968157A (en) | 2015-05-25 | 2015-05-25 | Electrocoppering thin film circuit and additive manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510272240.1A CN104968157A (en) | 2015-05-25 | 2015-05-25 | Electrocoppering thin film circuit and additive manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN104968157A true CN104968157A (en) | 2015-10-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201510272240.1A Pending CN104968157A (en) | 2015-05-25 | 2015-05-25 | Electrocoppering thin film circuit and additive manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299625A (en) * | 2016-09-30 | 2017-01-04 | 广东通宇通讯股份有限公司 | The manufacture method of a kind of antenna and antenna |
| CN110402036A (en) * | 2019-06-12 | 2019-11-01 | 惠州市特创电子科技有限公司 | A kind of the welding resistance method and welding devices of 5G high frequency circuit board |
| CN110446370A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of high Precision Aluminium substrate and flexible plate surface continuous high-efficient welding procedure |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2891100Y (en) * | 2006-02-17 | 2007-04-18 | 李树群 | Reverse encapsulated electronic tag |
| JP2010050205A (en) * | 2008-08-20 | 2010-03-04 | Fujikura Ltd | Membrane wiring board and method of manufacturing the same |
| CN103442519A (en) * | 2013-08-14 | 2013-12-11 | 上海淞渡电子有限公司 | Method for manufacturing printed wiring board by means of addition process |
| CN104270900A (en) * | 2014-10-27 | 2015-01-07 | 四川合玉科技有限公司 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
| CN204906875U (en) * | 2015-05-25 | 2015-12-23 | 李恒 | Electro -coppering book membrane circuit that addition was made |
-
2015
- 2015-05-25 CN CN201510272240.1A patent/CN104968157A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2891100Y (en) * | 2006-02-17 | 2007-04-18 | 李树群 | Reverse encapsulated electronic tag |
| JP2010050205A (en) * | 2008-08-20 | 2010-03-04 | Fujikura Ltd | Membrane wiring board and method of manufacturing the same |
| CN103442519A (en) * | 2013-08-14 | 2013-12-11 | 上海淞渡电子有限公司 | Method for manufacturing printed wiring board by means of addition process |
| CN104270900A (en) * | 2014-10-27 | 2015-01-07 | 四川合玉科技有限公司 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
| CN204906875U (en) * | 2015-05-25 | 2015-12-23 | 李恒 | Electro -coppering book membrane circuit that addition was made |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299625A (en) * | 2016-09-30 | 2017-01-04 | 广东通宇通讯股份有限公司 | The manufacture method of a kind of antenna and antenna |
| CN110402036A (en) * | 2019-06-12 | 2019-11-01 | 惠州市特创电子科技有限公司 | A kind of the welding resistance method and welding devices of 5G high frequency circuit board |
| CN110446370A (en) * | 2019-07-23 | 2019-11-12 | 河南博美通电子科技有限公司 | A kind of high Precision Aluminium substrate and flexible plate surface continuous high-efficient welding procedure |
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Application publication date: 20151007 |
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| RJ01 | Rejection of invention patent application after publication |