CN104270900A - Manufacturing method of RFID (Radio Frequency Identification) antenna - Google Patents
Manufacturing method of RFID (Radio Frequency Identification) antenna Download PDFInfo
- Publication number
- CN104270900A CN104270900A CN201410583720.5A CN201410583720A CN104270900A CN 104270900 A CN104270900 A CN 104270900A CN 201410583720 A CN201410583720 A CN 201410583720A CN 104270900 A CN104270900 A CN 104270900A
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- Prior art keywords
- ink
- conductive substrate
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- printing
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method of an RFID (Radio Frequency Identification) antenna. The manufacturing method comprises the following steps: a, selecting a non-conductive base material, and performing surface treatment on the non-conductive base material; b, performing transfer treatment on the non-conductive base material subjected to the surface treatment by using mixed printing ink to form a printing layer; c, performing curing treatment on the mixed printing ink on the surface of the printing layer in the step b, and then performing currentless plating on the surface of the printing layer by using a currentless plating solution to form a metal layer; d, treating the non-conductive base material subjected to the treatment through the steps a to c by using an organic solution to form a protective layer on the surface of the non-conductive base material, and drying the non-conductive base material. The manufacturing method of the RFID antenna has the benefits that the technology is simple, the antenna is easy to manufacture, the energy consumption is low, the pollution is low, the cost is low, energy conservation and emission reduction are realized, and motive forces of innovation and development are brought to industry development.
Description
Technical field
The present invention relates to a kind of electronic component and manufacture field, be specifically related to a kind of manufacture method of RFID antenna.
Background technology
The manufacture method mainly etching method (i.e. subtractive processes) of current RFID antenna, etching method is after highly energy-consuming makes film metal and is pressed into base material with glue and insulating material, again with anti-etching cover up rear more than Etching fall, last stripping, cleaning, dry, such waste mass energy does metal film and pressing material, etching solution, stripper solution and additive thereof bring very large pollution and waste great lot of water resources, next is processing technology, the printing of silver slurry, aluminium stamping foil, mask plates, there is the problem such as different defect and high investment on product in these addition techniques, in sum, it is high that current antenna manufacturing process has energy consumption, pollute large, waste is large, high in cost of production shortcoming.
Summary of the invention
Instant invention overcomes current antenna manufacturing process have energy consumption high, pollute large, waste is large, high in cost of production shortcoming, provide a kind of manufacture simple, energy consumption is little, the manufacture method of polluting RFID antenna that is low, with low cost, that realize energy-saving and emission-reduction.
For achieving the above object, the present invention is by the following technical solutions:
A manufacture method for RFID antenna, it comprises the following steps:
A, selection non-conductive substrate, carry out surface treatment to it;
B, use on deployed ink non-conductive substrate after surface treatment and form printed layers by transfer processing;
C, after deployed ink is cured process to printed layers surface in step b, then uses electroless plating solution to carry out electroless plating to it on printed layers surface and form metal level.
D, organic solution process is used to form protective layer on its surface and dry to the non-conductive substrate after step a-c process.
Further technical scheme is, the non-conductive substrate after it is also included in surface treatment forms conducting by through hole mode, print silver slurry jumper or printing ink plating mode.
Further technical scheme is, described through hole mode comprises: a, by laser, die-cut or be machined in non-conductive substrate surface make through hole; B, in non-conductive substrate tow sides and hole wall, print deployed ink; C, the use electroless plating solution ink to the ink on non-conductive substrate surface and hole wall inner surface carries out the conducting of electroless plating formation containing metal level.
Further technical scheme is, described print silver slurry jumper is included in the layer on surface of metal printing dielectric ink of non-conductive substrate, on dielectric ink, then prints conductive silver paste form conducting.
Further technical scheme is, described printing ink plating mode is included in the layer on surface of metal printing dielectric ink of non-conductive substrate, then on dielectric ink, print deployed ink, use electroless plating solution to carry out electroless plating to it in deployed ink pellet surface and form conducting.
Further technical scheme is, described electroless plating solution is made up of 100g/L sodium potassium tartrate tetrahydrate, 25g/L copper sulphate, 35g/L NaOH and 8ml/L formalin, and in described formalin, content of formaldehyde is 36%-40%.
Further technical scheme is, it is 65 degree to 150 degree that described solidification to be treated to deployed ink in temperature, and the time is carry out baking process under the condition of 30 minutes to 60 minutes.
Further technical scheme is, described transfer processing be by deployed ink by printing, print or spray printing mode non-conductive substrate after surface treatment on form printed layers.
Further technical scheme is, described deployed ink adopts 1Kg ink, 30g printing ink reducer and 150g silver-coated copper powder to mix and the formation that stirs, argentiferous 40%-60% in described silver-coated copper powder.
Further technical scheme is, described non-conductive substrate is PI, PET, PC, PE, PVC or speciality paper, described surface treatment be soda acid oil removing alligatoring, corona treatment, at the coating of non-conductive substrate surface-coated one deck oleophylic ink or at non-conductive substrate surface-coated one deck water-repellent paint.
First by selecting PI in the technical program, PET, PC, PE, PVC or speciality paper are as non-conductive substrate, thus overcome in etching method, metal is made film after to be pressed into the deficiency of this mode highly energy-consuming of base material with glue and insulating material, different surface treatment modes is selected (such as again according to the non-conductive substrate of unlike material, soda acid oil removing alligatoring, corona treatment, at the coating of non-conductive substrate surface-coated one deck oleophylic ink or at non-conductive substrate surface-coated one deck water-repellent paint) by surface treatment after be conducive to the adhesion promoting ink and non-conductive substrate surface, frangible extraordinary electronic tag can be made simultaneously, then according to the antenna pattern making antenna requirement, deployed ink is passed through printing, the mode of printing or spray printing is printed on non-conductive substrate and forms printed layers, different time and temperature is being adopted to carry out baking-curing to it according to different non-conductive substrate, in printed layers, metal level is formed in the mode by electroless plating, metal level is formed without the need to activation processing operation by the mode of electroless plating, thus production process can have been saved, last again by forming protective layer by organic solvent immersion treatment, thus can metal layer be prevented, the making to single conductive layer antenna just can be completed by above-mentioned several step.
In order to make dual-layer atenna simultaneously in the technical program, thus be increased in the step non-conductive substrate after surface treatment being formed conducting by through hole mode, print silver slurry jumper or printing ink plating mode, form on non-conductive substrate surface the making that conducting just can meet different condition by Different treatments.
If the present invention needs to obtain thicker metal level can also carry out plating thickening after electroless plating technique; simultaneously in order to prevent metal layer; last available copper protective agent (model that such as, Kunshan Shen Kun surface treatment Materials Co., Ltd produces is CU-200 copper protective agent) soaks, cleans, dries.
Compared with prior art, the invention has the beneficial effects as follows:
Present invention process, manufacture simple, energy consumption is little, it is low, with low cost to pollute, achieve energy-saving and emission-reduction, bring Innovation and development power to industry development.
Embodiment
A manufacture method for RFID antenna, it comprises the following steps:
A, selection non-conductive substrate are (preferred, described non-conductive substrate can select PI, PET, PC, PE, PVC or speciality paper), to its carry out surface treatment (preferred, described surface treatment be soda acid oil removing alligatoring, corona treatment, at the coating of non-conductive substrate surface-coated one deck oleophylic ink or at non-conductive substrate surface-coated one deck water-repellent paint);
B, use deployed ink (preferred, the model that described deployed ink adopts Sheng Tianfeng Science and Technology Ltd. of 1Kg Shenzhen to produce is the ink of YH-CCI-601AE, the model that 30g is produced by Sheng Tianfeng Science and Technology Ltd. of Shenzhen is that the printing ink reducer of YH-5 and 150g silver-coated copper powder mix and stir and formed, wherein argentiferous 40%-60% in silver-coated copper powder) (preferred by transfer processing on non-conductive substrate after surface treatment, described transfer processing is by printing by deployed ink, print or spray printing mode non-conductive substrate after surface treatment on form printed layers) form printed layers,
C, process is cured (preferably to the deployed ink in printed layers surface in step b, it is 65 degree to 150 degree that described solidification to be treated to deployed ink in temperature, time is carry out baking process under the condition of 30 minutes to 60 minutes) after, then use electroless plating solution (preferred on printed layers surface, described electroless plating solution is made up of 100g/L sodium potassium tartrate tetrahydrate, 25g/L copper sulphate, 35g/L NaOH and 8ml/L formalin, and in described formalin, content of formaldehyde is 36%-40%) electroless plating formation metal level is carried out to it.
D, organic solution process (preferred, described organic solution selects silane reagent) is used to form protective layer on its surface and dry to the non-conductive substrate after step a-c process.
According to one embodiment of present invention, on non-conductive substrate after described manufacture method is also included in surface treatment by through hole mode, print silver slurry jumper or printing ink plating mode form conducting, through hole mode comprises: by laser, die-cut or be machined in non-conductive substrate surface make through hole; Deployed ink is printed in non-conductive substrate tow sides and hole wall; The ink of electroless plating solution to the ink on non-conductive substrate surface and hole wall inner surface is used to carry out the conducting of electroless plating formation containing metal level, described print silver slurry jumper is included in the layer on surface of metal printing dielectric ink of non-conductive substrate, then on dielectric ink, print conductive silver paste form conducting, described printing ink plating mode is included in the layer on surface of metal printing dielectric ink of non-conductive substrate, then on dielectric ink, print deployed ink, use electroless plating solution to carry out electroless plating to it in deployed ink pellet surface and form conducting.
The time of selecting the surface treatment that different non-conductive substrate is corresponding to process with solidification, temperature are see table 1:
Embodiment 1
Single conductive layer antenna manufactures, PET upper surface after surface treatment carries out the deployed ink of Graphic transitions by mode of printing and forms required antenna pattern, baking-curing, parameter is 100 DEG C, 30 minutes, after solidification, no current copper facing is carried out 30 minutes to it, form 1-3 micron copper metal layer, soak with silane reagent, clean, dry.
Embodiment 2
Bilayer conductive layer antenna manufactures, PET after surface treatment does through hole, carry out in one side the figure that the deployed ink of Graphic transitions forms required antenna by mode of printing, baking-curing, parameter is 100 DEG C, 30 minutes, then republish another side and carry out the another side figure that Graphic transitions ink forms antenna, baking-curing again, parameter is 100 DEG C, 30 minutes, hole wall need leave ink and there is no stopple, carry out no current copper facing 30 minutes again, form 1-3 micron copper metal layer, soak with silane reagent, clean, dry.
Embodiment 3
Bilayer conductive layer antenna manufactures, PET after surface treatment carries out by mode of printing the layer pattern that the deployed ink of Graphic transitions forms required antenna, baking-curing, parameter is 100 DEG C, 30 minutes, carry out no current copper facing 30 minutes, form 1-3 micron copper metal layer, coating prints dielectric ink, baking-curing, parameter is 120 DEG C, 60 minutes, on dielectric ink, then prints another layer pattern that conductive silver paste forms antenna again, baking-curing again, parameter is 120 DEG C, 60 minutes, soaks with silane reagent, clean, dries.
Embodiment 4
Bilayer conductive layer antenna manufactures, PET after surface treatment carries out by mode of printing the layer pattern that the deployed ink of Graphic transitions forms required antenna, baking-curing, parameter is 100 DEG C, 30 minutes, carry out no current copper facing 30 minutes, form 1-3 micron copper metal layer, coating prints dielectric ink, baking-curing, parameter is 120 DEG C, 60 minutes, on dielectric ink, then print another layer pattern that deployed ink forms antenna, baking-curing again, parameter is 100 DEG C, 30 minutes, no current copper facing, form 1-3 micron copper metal layer, soak with silane reagent, cleaning, dry.
Above embodiment is described in detail to essence of the present invention; but can not limit protection scope of the present invention; apparently; under enlightenment of the present invention; the art those of ordinary skill can also carry out many improvement and modification; it should be noted that these improve and modify all to drop within claims of the present invention.
Claims (10)
1. a manufacture method for RFID antenna, is characterized in that, it comprises the following steps:
A, selection non-conductive substrate, carry out surface treatment to it;
B, use on deployed ink non-conductive substrate after surface treatment and form printed layers by transfer processing;
C, after deployed ink is cured process to printed layers surface in step b, then uses electroless plating solution to carry out electroless plating to it on printed layers surface and form metal level.
D, organic solution process is used to form protective layer on its surface and dry to the non-conductive substrate after step a-c process.
2. manufacture method according to claim 1, is characterized in that, the non-conductive substrate after it is also included in surface treatment forms conducting by through hole mode, print silver slurry jumper or printing ink plating mode.
3. manufacture method according to claim 2, is characterized in that, described through hole mode comprises:
A, by laser, die-cut or be machined in non-conductive substrate surface make through hole;
B, in non-conductive substrate tow sides and hole wall, print deployed ink;
C, the use electroless plating solution ink to the ink on non-conductive substrate surface and hole wall inner surface carries out the conducting of electroless plating formation containing metal level.
4. manufacture method according to claim 2, is characterized in that, described print silver slurry jumper is included in the layer on surface of metal printing dielectric ink of non-conductive substrate, on dielectric ink, then prints conductive silver paste form conducting.
5. manufacture method according to claim 2, it is characterized in that, described printing ink plating mode is included in the layer on surface of metal printing dielectric ink of non-conductive substrate, then on dielectric ink, print deployed ink, use electroless plating solution to carry out electroless plating to it in deployed ink pellet surface and form conducting.
6. the manufacture method according to claim 1 or 2 any one claim, it is characterized in that, described non-conductive substrate is PI, PET, PC, PE, PVC or speciality paper, described surface treatment be soda acid oil removing alligatoring, corona treatment, at the coating of non-conductive substrate surface-coated one deck oleophylic ink or at non-conductive substrate surface-coated one deck water-repellent paint.
7. the manufacture method according to claim 1 or 2 any one claim, it is characterized in that, described deployed ink adopts 1Kg ink, 30g printing ink reducer and 150g silver-coated copper powder to mix and the formation that stirs, argentiferous 40%-60% in described silver-coated copper powder.
8. the manufacture method according to claim 1 or 2 any one claim, is characterized in that, described transfer processing be by deployed ink by printing, print or spray printing mode non-conductive substrate after surface treatment on form printed layers.
9. the manufacture method according to claim 1 or 2 any one claim, is characterized in that, it is 65 degree to 150 degree that described solidification to be treated to deployed ink in temperature, and the time is carry out baking process under the condition of 30 minutes to 60 minutes.
10. the manufacture method according to claim 1 or 2 any one claim, it is characterized in that, described electroless plating solution is made up of 100g/L sodium potassium tartrate tetrahydrate, 25g/L copper sulphate, 35g/L NaOH and 8ml/L formalin, and in described formalin, content of formaldehyde is 36%-40%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410583720.5A CN104270900A (en) | 2014-10-27 | 2014-10-27 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410583720.5A CN104270900A (en) | 2014-10-27 | 2014-10-27 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
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| CN104270900A true CN104270900A (en) | 2015-01-07 |
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| CN201410583720.5A Pending CN104270900A (en) | 2014-10-27 | 2014-10-27 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104577321A (en) * | 2015-01-22 | 2015-04-29 | 深圳市骄冠科技实业有限公司 | Manufacturing method for punching aluminum foil RFID radio frequency antenna |
| CN104968157A (en) * | 2015-05-25 | 2015-10-07 | 李恒 | Electrocoppering thin film circuit and additive manufacturing method thereof |
| CN105789869A (en) * | 2016-03-03 | 2016-07-20 | 苏州昭舜物联科技有限公司 | Laser production technology for radio frequency identification antenna capable of easily discharging waste |
| CN106229653A (en) * | 2016-08-25 | 2016-12-14 | 温州振疆电子科技有限公司 | A kind of manufacture method of RFID special type miniature antenna |
| CN107480753A (en) * | 2017-07-28 | 2017-12-15 | 永道无线射频标签(扬州)有限公司 | A kind of printed antenna label and preparation method thereof |
| CN109299624A (en) * | 2018-08-28 | 2019-02-01 | 上海幂方电子科技有限公司 | A kind of preparation method of RFID antenna |
| CN109943150A (en) * | 2019-02-01 | 2019-06-28 | 广东华祐新材料有限公司 | A kind of electrically conductive ink and its preparation method and application |
| CN110784564A (en) * | 2018-07-31 | 2020-02-11 | 华为技术有限公司 | Mobile terminal and preparation method of antenna thereof |
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| CN110784564B (en) * | 2018-07-31 | 2021-09-14 | 华为技术有限公司 | Mobile terminal and preparation method of antenna thereof |
| US11450946B2 (en) | 2018-07-31 | 2022-09-20 | Huawei Technologies Co., Ltd. | Mobile terminal and mobile terminal antenna production method |
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| CN109299624A (en) * | 2018-08-28 | 2019-02-01 | 上海幂方电子科技有限公司 | A kind of preparation method of RFID antenna |
| CN109943150A (en) * | 2019-02-01 | 2019-06-28 | 广东华祐新材料有限公司 | A kind of electrically conductive ink and its preparation method and application |
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