CN109299624A - A kind of preparation method of RFID antenna - Google Patents
A kind of preparation method of RFID antenna Download PDFInfo
- Publication number
- CN109299624A CN109299624A CN201810990950.1A CN201810990950A CN109299624A CN 109299624 A CN109299624 A CN 109299624A CN 201810990950 A CN201810990950 A CN 201810990950A CN 109299624 A CN109299624 A CN 109299624A
- Authority
- CN
- China
- Prior art keywords
- preparation
- circuit layer
- conductive circuit
- rfid antenna
- conductive
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/10—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation
- G06K7/10009—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves
- G06K7/10316—Methods or arrangements for sensing record carriers, e.g. for reading patterns by electromagnetic radiation, e.g. optical sensing; by corpuscular radiation sensing by radiation using wavelengths larger than 0.1 mm, e.g. radio-waves or microwaves using at least one antenna particularly designed for interrogating the wireless record carriers
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07773—Antenna details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2216—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in interrogator/reader equipment
Abstract
A kind of preparation method of RFID antenna is disclosed, forms the conductive circuit layer with predetermined pattern the method includes inkjet printing conductive silver ink on a flexible substrate；Solidify the conductive circuit layer；Plating or chemical plating are carried out to the conductive circuit layer, form the coat of metal in the conductive circuit layer.The application can quickly, simply prepare RFID antenna, while the preparation method also has many advantages, such as low cost.
Description
Technical field
This application involves the fields radio RF recognition technology (RFID), and in particular to a kind of preparation method of RFID antenna.
Background technique
RFID (Radio Frequency Identification) technology, also known as radio RF recognition technology, can pass through
Radio signals identification specific objective simultaneously reads and writes related data, without establishing mechanical or light between identifying system and specific objective
Learn contact.Wireless RF label technique (RFID) have precision is high, accommodative ability of environment is strong, read apart from it is remote, anti-interference it is strong, answer
Many advantages, such as with convenience, has widely in various fields such as industrial automation, business automation, communications and transportation control management
Using.
Currently, preparing RFID antenna frequently with the methods of etching method, coil winding method, silk-screen printing and gravure.Etching
Method prepares the process of RFID are as follows: covers the copper or aluminium of one layer of 20-25mm thickness in thereon, in addition makes an antenna positive image
Resist is imprinted on the surface of copper or aluminium by screen printing forme with the method for wire mark, and the copper or aluminium not being covered by resist can be rotten
Agent fusing is lost, the septal line for becoming antenna electric route on substrate is leaked out, liquid parting removal resist is finally coated, forms antenna.
The antenna prepared with etching method is at high cost, production process is cumbersome, low output.
Coil winding method needs the coiling tag coil on a coiling tool, and it is fixed using baking vanish, this
When aerial coil the number of turns it is generally more, after chip is welded on antenna, need to bond antenna and chip, and add
With fixation.Coil winding method is at high cost, and speed of production is slow, while the mode of welding is generallyd use by antenna prepared by this mode
The defects of being connect with chip, being easy to appear rosin joint, dry joint and weld partially.
And needed after having designed antenna when preparing RFID antenna by the way of wire mark and gravure, make wire mark template
Or gravure template, replacement preparation cannot be quickly carried out when making the antenna of different pattern.
Summary of the invention
In view of this, the application provides a kind of preparation method of RFID antenna, can low cost, quickly, simply carry out
The preparation of RFID antenna.
The application provides a kind of preparation method of RFID antenna, comprising:
According to the predetermined pattern of RFID antenna, inkjet printing conductive silver ink forms conductive circuit layer on a flexible substrate；
Solidify the conductive circuit layer；
Plating or chemical plating are carried out to the conductive circuit layer, form the coat of metal in the conductive circuit layer.
Preferably, the flexible substrates are polyimides, polyethylene terephthalate, polyethylene naphthalate
One of.
Preferably, solidifying the conductive circuit layer includes:
By tungsten halogen lamp is irradiated to the conductive circuit layer predetermined time.
Preferably, the power of the tungsten halogen lamp is 300-500W, and the distance of the tungsten halogen lamp to flexible substrates is 1-5 lis
Rice, the predetermined time are 5-30 seconds.
Preferably, the method also includes:
Before carrying out inkjet printing, hydrophilicity-imparting treatment is carried out to the flexible substrates.
Preferably, the hydrophilicity-imparting treatment include corona treatment, sided corona treatment and surface self-organization processing in extremely
Few one kind.
Preferably, when carrying out inkjet printing, the distance between spray head and the flexible substrates are 0.5-2mm.
Preferably, the coat of metal is copper coating.
Preferably, the conductive silver ink includes Silver nanoparticles, solvent, surfactant, dispersion stabilizer and auxiliary agent.
Preferably, the solvent is one of isopropanol, ethylene glycol, diethylene glycol (DEG), normal propyl alcohol and ethylene glycol ethyl ether.
The application forms conductive circuit layer by inkjet printing conductive silver ink on a flexible substrate；Then it is led described in solidification
Electric line layer；Plating or chemical plating are carried out to the conductive circuit layer, form the coat of metal in the conductive circuit layer, thus
Complete the preparation of RFID antenna.The application can quickly, simply prepare RFID antenna, have many advantages, such as low cost.
Detailed description of the invention
By referring to the drawings to the description of the embodiment of the present application, the above-mentioned and other purpose of the application, feature and
Advantage will be apparent from, in the accompanying drawings:
Fig. 1 is the flow chart of the preparation method of the RFID antenna of the embodiment of the present application；
Fig. 2 is the main view of the RFID antenna of the embodiment of the present application；
Fig. 3 is the top view of the RFID antenna of the embodiment of the present application.
Specific embodiment
The application is described below based on embodiment, but the application is not restricted to these embodiments.Under
Text is detailed to describe some specific detail sections in the datail description of the application.Do not have for a person skilled in the art
The application can also be understood completely in the description of these detail sections.In order to avoid obscuring the essence of the application, well known method, mistake
There is no narrations in detail for journey, process, element and circuit.
In addition, it should be understood by one skilled in the art that provided herein attached drawing be provided to explanation purpose, and
What attached drawing was not necessarily drawn to scale.
Unless the context clearly requires otherwise, "include", "comprise" otherwise throughout the specification and claims etc. are similar
Word should be construed as the meaning for including rather than exclusive or exhaustive meaning；That is, be " including but not limited to " contains
Justice.
In the description of the present application, it is to be understood that term " first ", " second " etc. are used for description purposes only, without
It can be interpreted as indication or suggestion relative importance.In addition, in the description of the present application, unless otherwise indicated, the meaning of " multiple "
It is two or more.
Unless otherwise clearly defined and limited, the terms such as term " installation ", " connected ", " connection ", " fixation " should be done extensively
Reason and good sense solution may be a detachable connection for example, it may be being fixedly connected, or integral；It can be mechanical connection, it can also be with
It is electrical connection；Can be directly connected, can also indirectly connected through an intermediary, can be connection inside two elements or
The interaction relationship of two elements, unless otherwise restricted clearly.For the ordinary skill in the art, Ke Yigen
The concrete meaning of above-mentioned term in this application is understood according to concrete condition.
RFID (Radio Frequency Identification, radio frequency identification) label, also known as " electronic tag ", by
Antenna, chip composition, each RFID tag have unique electronic code, are attached on object and identify target object, be commonly called as electricity
Subtab or intelligent label.After the RFID antenna for generating corresponding demand on dielectric-slab, chip is connect with RFID antenna, then
Encapsulation forms RFID tag.RFID antenna plays an important role in RFID system, is not only stored RFID tag
Modulates information reflection, while the electromagnetic wave of reader transmitting is also captured, energy is provided for the chip of RFID tag.For cooperation
The large-scale use of RFID tag, it is desirable that the processing is simple for RFID antenna, high yield rate, and manufacturing cost is low.
Fig. 1 is the flow chart of the preparation method of the RFID antenna of the embodiment of the present application.As shown in Figure 1, the preparation method
Include:
S100, according to the predetermined pattern of RFID antenna, inkjet printing conductive silver ink forms conducting wire on a flexible substrate
Layer.
RFID antenna includes substrate and the conductive pattern that is formed in substrate.
Need to carry out the conductive pattern of the RFID antenna of printing before inkjet printing it is pre-designed, and by designed conduction
Pattern (namely described predetermined pattern) is stored in ink-jet printer, by control so that the spray head of ink-jet printer is according to described
The track of predetermined pattern is mobile while spraying conductive ink, and with inkjet printing on a flexible substrate, being formed has predetermined pattern
Conductive circuit layer.When carrying out inkjet printing, the distance between the spray head of ink-jet printer and flexible substrates are 0.5-2mm, are beaten
Precision is printed up to 50um.
Preferably, it is beaten in the present embodiment using the microelectronics ink-jet printer of Shanghai Mi Fang Electronic Science and Technology Co., Ltd.
Impression is at RFID antenna.The spray head of microelectronics ink-jet printer by piezoelectric material drive manufacture, print range be 200mm ×
150mm；Repeatable accuracy is ± 25um；Voltage is 200-240VAC；Frequency is 5K/10KHz.Wherein, ink-jet printer is carrying out
Before printing, flexible substrates can be fixed in printer by way of vacuum suction and equipped with heating.On a flexible substrate
There is certain thickness conductive circuit layer by the way that inkjet printing conductive silver ink is repeated several times and is formed.
Preferably, the flexible substrates can also be carried out before inkjet printing conductive silver ink on a flexible substrate hydrophilic
Change processing.Hydrophilicity-imparting treatment, which refers to, is modified target surface by physically or chemically means, enhances the hydrophilic of target surface
Performance.It can change the chemical group on flexible substrates surface by hydrophilicity-imparting treatment to increase printing formation on the surface of the substrate
Antenna quality.Specifically, the hydrophilicity enhancing on the flexible substrates surface after hydrophilicity-imparting treatment, can make conductive silver ink more
Adhere on a flexible substrate well.This aspect makes conductive circuit layer and flexible substrates conjugation more preferable, on the other hand, also makes
The printing accuracy of conductive circuit layer more preferable (conductive silver ink for being sprayed onto flexible substrates surface is quickly attached to flexible substrates
Surface, without flowing).The hydrophilicity-imparting treatment can be handled with using plasma, sided corona treatment and surface self-organization are handled
One of or it is a variety of.The material of the flexible substrates can use polyimides, polyethylene terephthalate, poly- naphthalene two
One of formic acid glycol ester.In the present embodiment, substrate uses polyimides, by carrying out oxygen plasma to polyimides
Body processing is to carry out the hydrophilicity-imparting treatment.
In the present embodiment, the conductive silver ink can be conductive nano silver ink water, be also possible to solvent type conductive silver
Ink.Preferably, using conductive nano silver ink water, the content of nano-Ag particles is 10%- in the conductive nano silver ink water
30%, the surface of nano-Ag particles is covered with macromolecule dispersant, and the diameter of nano-Ag particles is 20-50nm.Nano-Ag particles
Diameter not only met the eutectic dot characteristics of conductive nano silver ink water, but also while meeting inkjet printing, wants solids particle size
It asks.The macromolecule dispersant can select one of lauryl amine (DDA), lauryl mercaptan (DDT) and mercaptoethanol (MEA) or
It is a variety of.In addition to this, conductive nano silver ink water also needs to meet 4 major parameters: pH value (7-9), viscosity (2-10cP), conductance
Rate (1000-4000 μ s/cm) and surface tension (20-40mN/m).The above parameter can pass through solvent, the pH of addition different content
Regulator, surfactant, dispersion stabilizer and other auxiliary agents obtain.The solvent can select isopropanol, ethylene glycol, two sweet
One of alcohol, normal propyl alcohol and ethylene glycol ethyl ether or a variety of compoundings.
In the present embodiment, select Kapton as flexible substrates, polyimide material can be at -269 DEG C -400
It is 3.5 that its dielectric constant is used within the temperature range of DEG C, with a thickness of 50um.The control ink-jet pulse voltage of ink-jet printer is set
For 26V, frequency 10kHz, spray head is maintained at 1mm at a distance from Kapton.Before printing RFID antenna, pass through pattern
The pattern of RFID antenna is drawn by software for editing, and pattern is stored according to predetermined format into ink-jet printer.Ink-jet printer is pressed
Inkjet printing is carried out according to setup parameter, forms the conductive circuit layer with predetermined pattern, the average thickness of conductive circuit layer is about
1.2μm。
S200, the solidification conductive circuit layer.
In order to make the conductive circuit layer formed after inkjet printing obtain ideal electric property, it is necessary to the figure after printing
Case is post-processed.For example, dry, annealing, sintering etc..Treatment process mainly includes that heating, drying has by solvent volatilization, removing
Machine stabilizer forms the accumulation of nano particle, merges nano particle mutually.These aftertreatment technologies to conductive circuit layer most
Whole surface structure and electric property have conclusive influence.
Preferably, the present embodiment irradiates the predetermined time so that the conductor wire to the conductive circuit layer by tungsten halogen lamp
The structure of road floor can solidify, and complete the annealing of RFID antenna.Tungsten halogen lamp (halogen lamp) is that filling gas includes
There is the gas incandescent lamp of part halogen or halide.The irradiation power of the tungsten halogen lamp is 300-500W.In irradiation, institute
The distance for stating tungsten halogen lamp to flexible substrates is 1-5 centimetres, and irradiation time is 5-30 seconds.The tungsten halogen lamp can issue 460-
The light of 510mm wavelength is blue light by optical fiber pack, irradiates conductive circuit layer, can make the liquid object in conductive circuit layer
Matter volatilization curing conductive line layer.
S300, plating or chemical plating are carried out to the conductive circuit layer, forms the coat of metal in the conductive circuit layer.
Plating or chemical plating are carried out to form the coat of metal to the conductive circuit layer.In the present embodiment, the metal
Coating is copper coating.The coat of metal can reduce the resistance of RFID antenna, improve the performance of RFID tag.While the coat of metal is also
Can play anti-corrosion, it is wear-resisting, conductive, reflective the effects of.
It is exactly to plate one layer of other gold on the surface of conductive circuit layer using electrolysis principle that (Electroplating), which is electroplated,
The process of category or alloy improves wearability, electric conductivity, reflective, resists so that playing prevents conductive circuit layer oxidation (as corroded)
The effects of corrosivity (copper sulphate etc.) and having improved aesthetic appearance.When plating, in the coating bath for filling electroplate liquid, using plating piece as yin
Pole connects on the cathode of power supply, and metal lining connects as anode in positive pole.After energization, it is anti-that the metal of anode will do it oxidation
It answers and (loses electronics), the metal ion in electroplate liquid is moved on cathode (plating piece) under the action of potential difference and is reduced into
Atom forms the coat of metal.
It generally requires to carry out Pre-treatment before plating to plating piece when being electroplated, by degreasing, derust etching off dust
The equal available clean fresh plating piece surface of work, to pass through the coat of metal that available better quality is electroplated.Work as quilt
After plating piece is electroplated, it is also necessary to carry out plating posttreatment to it.The plating posttreatment includes Passivation Treatment, i.e., the coat of metal is one
It is chemically treated in fixed solution, so that coat of metal corrosion resistance, stability are high.
Chemical plating (Electroless plating) is also referred to as electroless plating or autocatalytic plating (Auto-catalytic
Plating), be so that metal ion in plating solution is reduced into metal by suitable reducing agent in the case where no impressed current, and
The method for forming coating is deposited on the surface of conductive circuit layer.Chemical plating has many advantages, such as simple process, energy-saving and environmental protection.Change
Learn plating use scope it is very wide, Gold plated Layer uniformly, good decorative property.In terms of protective performance, the corrosion resistance and use of product can be improved
Service life.
When later period chip and RFID antenna are attached to form RFID tag, the pin of RFID chip can be fitted to
On the pin of the RFID antenna of the present embodiment printing, the quick connection of chip and RFID antenna is realized.Since inkjet printing makes
RFID antenna metal layer it is very thin, and flexible base material non-refractory, thus cannot with the method for welding by chip with
RFID antenna connection.It in the present embodiment, can be using applying conductive silver paste and the method that is heating and curing is by chip and RFID antenna
Connection, is finally packaged.
Fig. 2-Fig. 3 is the structural schematic diagram of the RFID antenna of the embodiment of the present application.As shown in Fig. 2, RFID antenna includes soft
Property substrate 1, conductive circuit layer 2 and the coat of metal 3.The conductive circuit layer 2 inkjet printing conductive nano silver in flexible substrates 1
Ink is formed.The material of flexible substrates 1 can use polyimides, polyethylene terephthalate, poly- naphthalenedicarboxylic acid second two
One of alcohol ester.In the present embodiment, the material of flexible substrates 1 is polyimides.Conductive circuit layer 2 can pass through patterning
Software is pre-designed, and the conductive circuit layer 2 of predetermined pattern is formed by inkjet printing.The conducting wire formed by inkjet printing
Route is uniform, and ink layer thickness is almost the same, and resistance is uniform.Then make conduction by aftertreatment technologies such as dry, annealing, sintering
Line layer solidification, form stable.Finally the surface of conductive circuit layer after hardening is plated by way of plating or chemical plating
One layer of metal forms the coat of metal 3.The coat of metal is copper coating in the present embodiment.
Inkjet printing conductive silver ink forms the conducting wire with predetermined pattern to the embodiment of the present application on a flexible substrate
Layer；By tungsten halogen lamp is irradiated to the conductive circuit layer predetermined time so that the conductive circuit layer solidifies；To the conduction
Line layer carries out plating or chemical plating, forms the coat of metal.It can be quickly, simply by the preparation method of the embodiment of the present application
RFID antenna is prepared, while the preparation method also has many advantages, such as low cost.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for those skilled in the art
For, the application can have various modifications and changes.All any modifications made within the spirit and principles of the present application are equal
Replacement, improvement etc., should be included within the scope of protection of this application.
Claims (10)
1. a kind of preparation method of RFID antenna, comprising:
According to the predetermined pattern of RFID antenna, inkjet printing conductive silver ink forms conductive circuit layer on a flexible substrate；
Solidify the conductive circuit layer；
Plating or chemical plating are carried out to the conductive circuit layer, form the coat of metal in the conductive circuit layer.
2. preparation method according to claim 1, which is characterized in that the flexible substrates are polyimides, gather to benzene two
One of formic acid glycol ester, polyethylene naphthalate.
3. preparation method according to claim 1, which is characterized in that solidifying the conductive circuit layer includes:
By tungsten halogen lamp is irradiated to the conductive circuit layer predetermined time.
4. preparation method according to claim 3, which is characterized in that the power of the tungsten halogen lamp is 300-500W, described
The distance of tungsten halogen lamp to flexible substrates is 1-5 centimetres, and the predetermined time is 5-30 seconds.
5. preparation method according to claim 1, which is characterized in that the method also includes:
Before carrying out inkjet printing, hydrophilicity-imparting treatment is carried out to the flexible substrates.
6. preparation method according to claim 5, which is characterized in that the hydrophilicity-imparting treatment include corona treatment,
At least one of sided corona treatment and surface self-organization processing.
7. preparation method according to claim 1, which is characterized in that when carrying out inkjet printing, spray head and the flexibility
The distance between substrate is 0.5-2mm.
8. preparation method according to claim 1, which is characterized in that the coat of metal is copper coating.
9. preparation method according to claim 1, which is characterized in that the conductive silver ink includes Silver nanoparticles, molten
Agent, surfactant, dispersion stabilizer and auxiliary agent.
10. preparation method according to claim 9, which is characterized in that the solvent be isopropanol, ethylene glycol, diethylene glycol (DEG),
One of normal propyl alcohol and ethylene glycol ethyl ether.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810990950.1A CN109299624A (en) | 2018-08-28 | 2018-08-28 | A kind of preparation method of RFID antenna |
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| CN201810990950.1A CN109299624A (en) | 2018-08-28 | 2018-08-28 | A kind of preparation method of RFID antenna |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165366A (en) * | 2019-04-22 | 2019-08-23 | 浙江大学 | A kind of graphene antenna of thermal transfer and its preparation method and application |
| CN110401030A (en) * | 2019-07-08 | 2019-11-01 | 江苏携尔泰智能设备科技有限公司 | A kind of inkjet printing formula RFID label antenna |
| CN110481180A (en) * | 2019-07-05 | 2019-11-22 | 成都科愿慧希科技有限公司 | The method that ink jet printing prepares antenna |
| CN110944467A (en) * | 2019-12-06 | 2020-03-31 | 北京万物皆媒科技有限公司 | Double-layer transparent circuit substrate and preparation method thereof |
| CN110994146A (en) * | 2019-12-03 | 2020-04-10 | 浙江清华柔性电子技术研究院 | High-temperature-resistant flexible antenna and manufacturing method thereof |
| CN112733989A (en) * | 2020-12-25 | 2021-04-30 | 浙江大学 | Flexible RFID passive temperature measurement label based on MXene ink printing |
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| CN203967239U (en) * | 2013-10-08 | 2014-11-26 | 北京北印中源科技有限公司 | A kind of full papery ultrahigh frequency RFID antenna of ink jet printing |
| CN104270900A (en) * | 2014-10-27 | 2015-01-07 | 四川合玉科技有限公司 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
| CN105720362A (en) * | 2016-02-03 | 2016-06-29 | 中国电子科技集团公司第五十四研究所 | Method for preparing radio frequency antenna through 3D printing |
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| CN203967239U (en) * | 2013-10-08 | 2014-11-26 | 北京北印中源科技有限公司 | A kind of full papery ultrahigh frequency RFID antenna of ink jet printing |
| CN104270900A (en) * | 2014-10-27 | 2015-01-07 | 四川合玉科技有限公司 | Manufacturing method of RFID (Radio Frequency Identification) antenna |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110165366A (en) * | 2019-04-22 | 2019-08-23 | 浙江大学 | A kind of graphene antenna of thermal transfer and its preparation method and application |
| CN110165366B (en) * | 2019-04-22 | 2021-02-19 | 浙江大学 | Thermal transfer printing graphene antenna and preparation method and application thereof |
| CN110481180A (en) * | 2019-07-05 | 2019-11-22 | 成都科愿慧希科技有限公司 | The method that ink jet printing prepares antenna |
| CN110401030A (en) * | 2019-07-08 | 2019-11-01 | 江苏携尔泰智能设备科技有限公司 | A kind of inkjet printing formula RFID label antenna |
| CN110994146A (en) * | 2019-12-03 | 2020-04-10 | 浙江清华柔性电子技术研究院 | High-temperature-resistant flexible antenna and manufacturing method thereof |
| CN110944467A (en) * | 2019-12-06 | 2020-03-31 | 北京万物皆媒科技有限公司 | Double-layer transparent circuit substrate and preparation method thereof |
| CN110944467B (en) * | 2019-12-06 | 2021-06-15 | 北京万物皆媒科技有限公司 | Double-layer transparent circuit substrate and preparation method thereof |
| CN112733989A (en) * | 2020-12-25 | 2021-04-30 | 浙江大学 | Flexible RFID passive temperature measurement label based on MXene ink printing |
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