CN109195333A - A kind of technology of wiring board filling holes with resin deaeration - Google Patents
A kind of technology of wiring board filling holes with resin deaeration Download PDFInfo
- Publication number
- CN109195333A CN109195333A CN201811192883.5A CN201811192883A CN109195333A CN 109195333 A CN109195333 A CN 109195333A CN 201811192883 A CN201811192883 A CN 201811192883A CN 109195333 A CN109195333 A CN 109195333A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- resin
- filling holes
- resin material
- via hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to a kind of technologies of wiring board filling holes with resin deaeration, comprising: clears up the plate face of wiring board；The potting resin material into the via hole of the wiring board；The via hole for completing filling holes with resin is vacuumized, the resin material deaeration is made；The wiring board for exhausting vacuum is subjected to prebake, makes the resin material semi-solid preparation；The wiring board for completing prebake is ground；The wiring board for completing grinding is toasted, the resin material is solidified.After completing filling holes with resin, wiring board is put into vacuum evacuation device and is vacuumized, sloughs the bubble in via hole in resin, avoid consent discontented, copper facing injustice, patch rosin joint etc. abnormal, the reliability and quality of product are improved, meanwhile, also avoid the use of vacuum taphole equipment, save production cost, then preliminary drying dry-cure is carried out, grinding avoids resin from being fully cured and is hardened, to reduce the difficulty of grinding, quality of finished product good.
Description
Technical field
The present invention relates to wiring board production technical field, in particular to a kind of method of wiring board filling holes with resin.
Background technique
Wiring board is important electronic component, is the supporter of electronic component, is the load of electronic component electrical connection
Body, electronic product develop to " light, thin, short, small " direction, and wiring board is also to high density, highly difficult development, in actual wiring board
In production, consent need to be carried out with via hole of the resin to wiring board, currently, there are two ways to filling holes with resin: one is vacuum
The equipment price of filling holes with resin, vacuum resin consent is expensive, and resin consumes big in production process, it is difficult to universal；Another kind is silk
The method of print machine aluminium flake halftone consent, the bubble in the method via hole in resin cannot exclude, when using baking, part
Bubble under the effect of thermal expansion, will lead to the exceptions such as consent discontented, copper facing injustice, patch rosin joint, the final matter for influencing product
Amount.
Summary of the invention
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of technologies of wiring board filling holes with resin deaeration.
The technical scheme to solve the above technical problems is that
A kind of technology of wiring board filling holes with resin deaeration, comprising:
Supplied materials processing step: the plate face of wiring board is cleared up；
Filling holes with resin step: the potting resin material into the via hole of the wiring board；
Vacuum step: the via hole for completing filling holes with resin is vacuumized, the resin material deaeration is made；
Pre-bake step: the wiring board for exhausting vacuum is subjected to prebake, makes the resin material semi-solid preparation；
Grinding steps: the wiring board for completing prebake is ground；
Curing schedule: toasting the wiring board for completing grinding, solidifies the resin material.
Further, the supplied materials processing step includes:
The wiring board is washed；
Roughening treatment is carried out to the copper face of the via hole；
The wiring board after roughening is washed and dried.
Further, the filling holes with resin step passes through silk-screen printing technique potting resin material into the via hole.
Further, in the vacuum step, the vacuum degree vacuumized is 10-1-10-5Pa, inclined heated plate 5-
10min。
Further, the pre-bake step uses electric heating drying, and drying temperature is 90-110 DEG C, drying time 30-
60min。
Further, the curing schedule uses electric heating drying, and baking temperature is 150-155 DEG C, drying time 60-
120min。
Compared with prior art, the beneficial effects of the present invention are:
After completing filling holes with resin, the via hole for completing filling holes with resin is vacuumized, is sloughed in via hole in resin
Bubble, improve the reliability and quality of product, the present invention is vacuumized using conventional wiring board consent production equipment, increase
Equipment, vaccum-pumping equipment price is low, realizes the purpose of bubble in removing resin, has reached the requirement of high-end product, meanwhile, also keep away
Exempt from the use of vacuum taphole equipment, to reduce expensive equipment funds investment and resin consumption, save production cost,
The wiring board for completing consent is carried out the preliminary drying dry-cure of preference temperature and time by the present invention, makes the resin material semi-solid preparation,
Then it is ground, avoids resin from being fully cured and be hardened, to reduce the difficulty of grinding, make the resin of residual in the circuit board more
It easily removes, reduces and grind bad, quality of finished product good.
Detailed description of the invention
The invention will be further described with embodiment with reference to the accompanying drawing.
Fig. 1 is the flow diagram of the wiring board filling holes with resin deaeration technology of one embodiment of the invention.
Specific embodiment
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.Below with reference to the attached drawing of the embodiment of the present invention, technical solution of the present invention is described further, the present invention is not only
It is limited to following specific embodiments.
The present invention provides a kind of technology of wiring board filling holes with resin deaeration, as shown in Figure 1, comprising the following steps:
Step 101, the plate face of wiring board is cleared up, this step is also referred to as supplied materials processing step.
Specifically, in this step, the wiring board is washed, it is dirty to wash the PCB surface；Then right
The copper face of the via hole carries out roughening treatment, polishes the copper face of the via hole of the wiring board, makes the via hole
Copper face roughening, the copper face roughening of the via hole, the surface area of copper face increases, is conducive to it and preferably connects with resin material
Touching；The wiring board after roughening is washed and dried, the wiring board for completing roughening treatment is cleaned and dried, is kept
The cleaning of wiring board.
In a preferred embodiment, in the supplied materials processing step, using brownification liquid medicine to the copper of the via hole
Face is handled, its copper face is roughened, and carries out roughening treatment, operation letter to the copper face in the via hole of wiring board using brownification liquid medicine
Easily convenient, the copper face surface of roughening is more uniform, so that via hole and resin be made to better contact with, effect is more preferable, meanwhile, brownification
Processing is also passivated copper face, avoids that adverse reaction occurs, influences consent quality.
Step 102, the potting resin material into the via hole of the wiring board, this step are also referred to as filling holes with resin step.
Specifically, it in this step, needs to carry out the concrete condition of filling holes with resin according to via hole on the wiring board, uses aluminium
Corresponding halftone is made in piece, by silk-screen printing into the via hole of the wiring board potting resin material.
Step 103, the via hole for completing filling holes with resin is vacuumized, makes the resin material deaeration, this step
Suddenly it is also referred to as vacuum step.
Specifically, in this step, the wiring board for completing filling holes with resin is placed in vacuum plant, adjusting vacuum degree is
10-1-10-5Pa carries out deaeration 5-10min, vacuumizes to the via hole for completing filling holes with resin, makes the resinous wood
Expect deaeration, remove the bubble in the via hole in resin material, avoids in via hole that bubble is expanded through overbaking in resin
Be diffused into the edge in hole, to avoid consent discontented, copper facing injustice, patch rosin joint etc. abnormal, improve the reliability of product with
Quality, meanwhile, the use of vacuum taphole equipment is also avoided, to reduce expensive equipment funds investment, saving is produced into
This.
Step 104, the wiring board for exhausting vacuum is subjected to prebake, makes the resin material semi-solid preparation, this step
Also referred to as pre-bake step.
Specifically, in this step, the wiring board for exhausting vacuum is placed in electric dryer and carries out prebake, adjusted
90-110 DEG C of temperature, 30-60min is toasted, the resin material semi-solid preparation is made.The wiring board for completing consent is carried out at prebake
Reason, avoids resin from being fully cured and is hardened, advantageously reduce the difficulty of subsequent grinding, is easier the resin remained in the circuit board
It is bad to reduce grinding for removal.
Step 105, the wiring board for completing prebake is ground, this step is also referred to as grinding steps.
Specifically, in this step, the wiring board for completing prebake is ground by grinder, removal remains in
The extra resin material of the PCB surface.
Step 106, the wiring board for completing grinding is toasted, solidifies the resin material, this step is also referred to as
For curing schedule.
Specifically, in this step, the wiring board for completing grinding is placed in electric dryer and is toasted, adjust temperature
150-155 DEG C of degree toasts 60-120min, the resin material is fully cured.Entire filling holes with resin process is completed, will be completed
The cured wiring board is transported to next process and carries out subsequent processing.
The present invention is further described with embodiment below.
Embodiment 1
Wiring board to be processed is provided, the plate face of wiring board is washed.
Wiring board after cleaning is handled using copper face of the brownification liquid medicine to the via hole of wiring board, is roughened its copper face.
Wiring board after roughening treatment is washed and is dried.
By silk-screen printing into the via hole of wiring board potting resin material, wherein the web plate of silk-screen printing be aluminium flake
Halftone.
It is placed in vacuum plant to filling holes with resin wiring board is completed, adjusting vacuum degree is 10-3Pa, deaeration 8min, removal are led
Bubble in through-hole in resin material.
Using electric heating drying, preliminary drying dry-cure is carried out to the wiring board for exhausting vacuum, makes resin material semi-solid preparation, setting is pre-
Drying temperature is 95 DEG C, toasts duration 50min, makes resin material semi-solid preparation.
The wiring board for completing prebake is ground.
Using electric heating drying, the wiring board for completing grinding is toasted, resin material is solidified, setting baking temperature is
It 150 DEG C, drying time 100min, completes the wiring board material after solidifying and is delivered to next process progress subsequent processing.
Method carries out filling holes with resin processing to wiring board through this embodiment, and on inspection, the consent of wiring board is flat and smooth,
Bubble and cavity is not present in the consent of wiring board, and the plate face of wiring board is not also worn, and quality of finished product good reaches vacuum resin plug
The quality in hole avoids the equipment funds investment of expensive vacuum resin hole plugging machine, reduces the consumption of resin, saved at
This.
Embodiment 2
Wiring board to be processed is provided, the plate face of wiring board is washed.
Wiring board after cleaning is handled using copper face of the brownification liquid medicine to the via hole of wiring board, is roughened its copper face.
Wiring board after roughening treatment is washed and is dried.
By silk-screen printing into the via hole of wiring board potting resin material, wherein the web plate of silk-screen printing be aluminium flake
Halftone.
It is placed in vacuum plant to filling holes with resin wiring board is completed, adjusting vacuum degree is 10-5Pa, deaeration 5min, removal are led
Bubble in through-hole in resin material.
Using electric heating drying, preliminary drying dry-cure is carried out to the wiring board for exhausting vacuum, makes resin material semi-solid preparation, setting is pre-
Drying temperature is 95 DEG C, toasts duration 50min, makes resin material semi-solid preparation.
The wiring board for completing prebake is ground.
Using electric heating drying, the wiring board for completing grinding is toasted, resin material is solidified, setting baking temperature is
It 150 DEG C, drying time 100min, completes the wiring board material after solidifying and is delivered to next process progress subsequent processing.
Method carries out filling holes with resin processing to wiring board through this embodiment, and on inspection, the consent of wiring board is flat and smooth,
A small amount of consent on wiring board is there are minute bubbles, and the plate face of wiring board is not worn, quality of finished product good, avoids expensive vacuum
The equipment funds of filling holes with resin machine are put into, and are reduced the consumption of resin, have been saved cost.
Embodiment 3
Wiring board to be processed is provided, the plate face of wiring board is washed.
Wiring board after cleaning is handled using copper face of the brownification liquid medicine to the via hole of wiring board, is roughened its copper face.
Wiring board after roughening treatment is washed and is dried.
By silk-screen printing into the via hole of wiring board potting resin material, wherein the web plate of silk-screen printing be aluminium flake
Halftone.
It is placed in vacuum plant to filling holes with resin wiring board is completed, adjusting vacuum degree is 10-3Pa, deaeration 8min, removal are led
Bubble in through-hole in resin material.
Using electric heating drying, preliminary drying dry-cure is carried out to the wiring board for exhausting vacuum, makes resin material semi-solid preparation, setting is pre-
Drying temperature is 110 DEG C, toasts duration 30min, makes resin material semi-solid preparation.
The wiring board for completing prebake is ground.
Using electric heating drying, the wiring board for completing grinding is toasted, resin material is solidified, setting baking temperature is
It 155 DEG C, drying time 80min, completes the wiring board material after solidifying and is delivered to next process progress subsequent processing.
Method carries out filling holes with resin processing to wiring board through this embodiment, and on inspection, the consent of wiring board is flat and smooth,
Bubble and cavity is not present in the consent of wiring board, and the plate face of wiring board is not also worn, and quality of finished product good reaches vacuum resin plug
The quality in hole avoids the equipment funds investment of expensive vacuum resin hole plugging machine, reduces the consumption of resin, saved at
This.
By contrast, between embodiment 1 and embodiment 2, by the time for adjusting vacuum degree and vacuumizing, make resulting route
There is some difference for gas bubbles left situation in the consent of plate, and bubble is not present in the consent of the wiring board of embodiment 1, and embodiment 2 is few
For number consent there are minute bubbles, the product effect of embodiment 1 is better than embodiment 2.Between embodiment 1 and embodiment 3, pass through adjusting
Prebake and cured baking temperature and time, obtained wiring board effect is the same, but embodiment 3 saves baking time, mentions
High working efficiency.Wherein, embodiment 3 is a preferred version provided by the invention.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (6)
1. a kind of technology of wiring board filling holes with resin deaeration characterized by comprising
Supplied materials processing step: the plate face of wiring board is cleared up；
Filling holes with resin step: the potting resin material into the via hole of the wiring board；
Vacuum step: the via hole for completing filling holes with resin is vacuumized, the resin material deaeration is made；
Pre-bake step: the wiring board for exhausting vacuum is subjected to prebake, makes the resin material semi-solid preparation；
Grinding steps: the wiring board for completing prebake is ground；
Curing schedule: toasting the wiring board for completing grinding, solidifies the resin material.
2. the technology of wiring board filling holes with resin deaeration according to claim 1, which is characterized in that the supplied materials processing step
Include:
The wiring board is washed；
Roughening treatment is carried out to the copper face of the via hole；
The wiring board after roughening is washed and dried.
3. the technology of wiring board filling holes with resin deaeration according to claim 1, which is characterized in that the filling holes with resin step
By silk-screen printing technique into the via hole potting resin material.
4. the technology of wiring board filling holes with resin deaeration according to claim 1, which is characterized in that the vacuum step
In, the vacuum degree vacuumized is 10-1-10-5Pa, inclined heated plate 5-10min.
5. the technology of wiring board filling holes with resin deaeration according to claim 1, which is characterized in that the pre-bake step is adopted
With electric heating drying, drying temperature is 90-110 DEG C, drying time 30-60min.
6. the technology of wiring board filling holes with resin deaeration according to claim 1, which is characterized in that the curing schedule uses
Electric heating drying, baking temperature are 150-155 DEG C, drying time 60-120min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811192883.5A CN109195333A (en) | 2018-10-13 | 2018-10-13 | A kind of technology of wiring board filling holes with resin deaeration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811192883.5A CN109195333A (en) | 2018-10-13 | 2018-10-13 | A kind of technology of wiring board filling holes with resin deaeration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109195333A true CN109195333A (en) | 2019-01-11 |
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ID=64944694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811192883.5A Pending CN109195333A (en) | 2018-10-13 | 2018-10-13 | A kind of technology of wiring board filling holes with resin deaeration |
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| CN (1) | CN109195333A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188733A (en) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | Vacuum hole plugging method |
| CN112388901A (en) * | 2020-10-26 | 2021-02-23 | 无锡吉微精密电子有限公司 | Crystal oscillator epoxy injection molding process |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112533379A (en) * | 2020-11-18 | 2021-03-19 | 安徽四创电子股份有限公司 | Manufacturing method of PCB resin plug hole |
| CN113194614A (en) * | 2021-05-06 | 2021-07-30 | 惠州市聚诚盛电子科技有限公司 | Circuit board processing method |
| CN113225922A (en) * | 2021-05-31 | 2021-08-06 | 深圳市百柔新材料技术有限公司 | Slurry vacuum hole plugging device and hole plugging method |
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| CN201369882Y (en) * | 2009-03-02 | 2009-12-23 | 汕头超声印制板公司 | Vacuum hole and bubble breakage device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188733A (en) * | 2019-07-03 | 2021-01-05 | 深圳碳森科技有限公司 | Vacuum hole plugging method |
| CN112388901A (en) * | 2020-10-26 | 2021-02-23 | 无锡吉微精密电子有限公司 | Crystal oscillator epoxy injection molding process |
| CN112423476A (en) * | 2020-10-26 | 2021-02-26 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112423476B (en) * | 2020-10-26 | 2022-04-15 | 深圳崇达多层线路板有限公司 | Method for improving poor hole plugging of PCB resin |
| CN112533379A (en) * | 2020-11-18 | 2021-03-19 | 安徽四创电子股份有限公司 | Manufacturing method of PCB resin plug hole |
| CN113194614A (en) * | 2021-05-06 | 2021-07-30 | 惠州市聚诚盛电子科技有限公司 | Circuit board processing method |
| CN113225922A (en) * | 2021-05-31 | 2021-08-06 | 深圳市百柔新材料技术有限公司 | Slurry vacuum hole plugging device and hole plugging method |
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Application publication date: 20190111 |