CN201369882Y - Vacuum hole and bubble breakage device - Google Patents
Vacuum hole and bubble breakage device Download PDFInfo
- Publication number
- CN201369882Y CN201369882Y CNU2009200522082U CN200920052208U CN201369882Y CN 201369882 Y CN201369882 Y CN 201369882Y CN U2009200522082 U CNU2009200522082 U CN U2009200522082U CN 200920052208 U CN200920052208 U CN 200920052208U CN 201369882 Y CN201369882 Y CN 201369882Y
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- China
- Prior art keywords
- vacuum
- bubble breakage
- hole
- door
- pcb
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- Expired - Fee Related
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Abstract
A vacuum hole and bubble breakage device is characterized in that the vacuum hole and bubble breakage device comprises a vacuum box, a vacuum pump and a vacuum pumping pipe; the vacuum pump is connected with one end of the vacuum pumping pipe through a connecting pipe; and the other end of the vacuum pumping pipe stretches into the vacuum box. The vacuum box comprises a vacuum box body and a vacuum door; and the vacuum door can be mounted at the opening of the vacuum box body in a rotating manner. The vacuum hole and bubble breakage device further comprises an electromagnetic valve; and the electromagnetic valve is connected with the vacuum pumping pipe through the connecting pipe. Compared with the prior art, the utility model has the beneficial effects that the vacuum hole and bubble breakage operation for a PCB after the silkscreen printing and hole sealing operations is performed through the vacuum hole and bubble breakage device, so that the phenomenon of oil explosion of the PCB is obviously reduced in the subsequent plate braking procedure; the amount of oil explosion holes of the PCB after finishing the subsequent plate braking procedure is greatly reduced; the amount of oil explosion holes on the surface of the element is reduced by about 50 percent; and the amount of oil explosion holes on the solder surface is reduced by about 80 percent.
Description
Technical field
The utility model relates to a kind of vacuum holes air bubble apparatus.
Background technology
The existing flow process that PCB is carried out consent is silk-screen consent, drying-plate, nog plate.PCB is by the silk-screen consent, exist certain bubble between the filler in the hole inevitably, because the existence of bubble in the inner stuffing of hole, in follow-up drying-plate operation, the bubble expanded by heating can occur and break, cause the filler outflow and consent occurs and fill out not enough " quick-fried oil " phenomenon.
Above-mentioned prior art causes bigger influence because " quick-fried oil " problem is more serious to the quality of product, and because of " quick-fried oil " defective often causes scrapping of plate, the cost of manufacture height need feed intake sometimes again, and causing make efficiency, low to reach fabrication cycle long.
Summary of the invention
The purpose of this utility model is that prior art is improved, a kind of vacuum holes air bubble apparatus is provided, can reduce the generation of " quick-fried oil " phenomenon in the follow-up drying-plate operation effectively, the quick-fried oilhole number of PCB declined to a great extent after the drying-plate operation was finished, and the technical scheme of employing is as follows:
Vacuum holes air bubble apparatus of the present utility model is characterized in that: comprise vacuum tank, vacuum pump, vacuum-pumping tube, described vacuum pump is by an end of tube connector connection vacuum-pumping tube, and the vacuum-pumping tube other end stretches in the vacuum tank.
Described vacuum tank comprises vacuum chamber and Vacuum door, and Vacuum door and vacuum chamber separate, and utilizes the bearing diagonal of the deadweight of Vacuum door and vacuum chamber open lower end to make simpler, the more convenient operation of sealing of Vacuum door and vacuum chamber opening.Close Vacuum door, the opening sealing of vacuum chamber can be opened Vacuum door, place or take out in the past PCB in the vacuum chamber.
In order to allow air enter automatically in the vacuum tank, finish the work of vacuum holes bubble automatically, described vacuum holes air bubble apparatus also comprises electromagnetically operated valve, electromagnetically operated valve connects vacuum-pumping tube by tube connector.When closed electromagnetic valve, electromagnetically operated valve is not in communication with the outside; After vacuum tank vacuumized, in case electromagnetically operated valve is opened, vacuum-pumping tube was in communication with the outside by electromagnetically operated valve, and extraneous air just can enter in the vacuum tank by electromagnetically operated valve automatically, finishes the work of vacuum holes bubble automatically.
The utility model beneficial effect against existing technologies is that because the PCB after adopting vacuum holes air bubble apparatus to the silk-screen consent carries out the work of vacuum holes bubble, therefore " quick-fried oil " phenomenon of PCB obviously reduces in the follow-up drying-plate operation; The quick-fried oilhole number of PCB declined to a great extent after follow-up drying-plate operation was finished, and it is about 50% that the quick-fried oilhole number of component side descends, and the quick-fried oilhole number of solder side descends about 80%;
Description of drawings
Accompanying drawing is the structural representation of the utility model preferred embodiment.
Embodiment
As shown in drawings, vacuum holes air bubble apparatus in this preferred embodiment comprises support 5 and is installed in vacuum tank 1, vacuum pump 2, vacuum-pumping tube 3, electromagnetically operated valve 4 on the support 5, described vacuum pump 2 connects an end of vacuum-pumping tube 3 by tube connector 6, vacuum-pumping tube 3 other ends stretch in the vacuum tank 1, and electromagnetically operated valve 4 connects vacuum-pumping tube 3 by tube connector 6.When electromagnetically operated valve 4 cut out, electromagnetically operated valve 4 was not in communication with the outside; After vacuum tank 2 vacuumized, in case electromagnetically operated valve 4 is opened, vacuum-pumping tube 3 was in communication with the outside by electromagnetically operated valve 4, and extraneous air just can enter in the vacuum tank 1 by electromagnetically operated valve 4 automatically, finishes the work of vacuum holes bubble automatically.
Described vacuum tank 1 comprises vacuum chamber 101 and Vacuum door 102, the Vacuum door 102 rotating opening parts that are installed in vacuum chamber 101.Close Vacuum door 102, the opening sealing of vacuum chamber 101 can be opened Vacuum door 102, place or take out in the past PCB in the vacuum chamber 101.
Introduce the course of work below:
After the good plate of filling perforation is put into vacuum chamber 101, shut Vacuum door 102, start vacuum pump 2, vacuum pump 2 is extracted the air of vacuum chamber 101 the insides out by vacuum-pumping tube 3, make vacuum chamber 101 the insides form vacuum, require (guarantee vacuum degree-more than the 24inHg) according to technological operation, the vacuum state that more than the vacuum degree that requires, keeps certain hour, follow opens solenoid valve 4, allow the air of outside pass through electromagnetically operated valve 4, tube connector 6 enters into vacuum chamber 101 the insides, play the vacuum breaker effect, behind the vacuum breaker, just can open Vacuum door 102 and take out plate fully.
Claims (3)
1, a kind of vacuum holes air bubble apparatus is characterized in that: comprise vacuum tank, vacuum pump, vacuum-pumping tube, described vacuum pump is by an end of tube connector connection vacuum-pumping tube, and the vacuum-pumping tube other end stretches in the vacuum tank.
2, vacuum holes air bubble apparatus as claimed in claim 1, it is characterized in that: described vacuum tank comprises vacuum chamber and Vacuum door, the rotating opening part that is installed in vacuum chamber of Vacuum door.
3, vacuum holes air bubble apparatus as claimed in claim 1 or 2 is characterized in that: described vacuum holes air bubble apparatus also comprises electromagnetically operated valve, and electromagnetically operated valve connects vacuum-pumping tube by tube connector.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009200522082U CN201369882Y (en) | 2009-03-02 | 2009-03-02 | Vacuum hole and bubble breakage device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2009200522082U CN201369882Y (en) | 2009-03-02 | 2009-03-02 | Vacuum hole and bubble breakage device |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201369882Y true CN201369882Y (en) | 2009-12-23 |
Family
ID=41488764
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2009200522082U Expired - Fee Related CN201369882Y (en) | 2009-03-02 | 2009-03-02 | Vacuum hole and bubble breakage device |
Country Status (1)
Country | Link |
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CN (1) | CN201369882Y (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102638942A (en) * | 2012-05-02 | 2012-08-15 | 深圳崇达多层线路板有限公司 | Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) |
CN104998439A (en) * | 2015-08-18 | 2015-10-28 | 安徽日正新源电气技术有限公司 | Workpiece surface vacuum defoaming method |
CN109195333A (en) * | 2018-10-13 | 2019-01-11 | 同健(惠阳)电子有限公司 | A kind of technology of wiring board filling holes with resin deaeration |
CN114056979A (en) * | 2021-11-04 | 2022-02-18 | 广东粤辉科技股份有限公司 | Vacuum defoaming device for adhesive tape processing |
-
2009
- 2009-03-02 CN CNU2009200522082U patent/CN201369882Y/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102638942A (en) * | 2012-05-02 | 2012-08-15 | 深圳崇达多层线路板有限公司 | Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) |
CN104998439A (en) * | 2015-08-18 | 2015-10-28 | 安徽日正新源电气技术有限公司 | Workpiece surface vacuum defoaming method |
CN104998439B (en) * | 2015-08-18 | 2017-06-23 | 安徽日正新源电气技术有限公司 | A kind of workpiece surface vacuum defoamation method |
CN109195333A (en) * | 2018-10-13 | 2019-01-11 | 同健(惠阳)电子有限公司 | A kind of technology of wiring board filling holes with resin deaeration |
CN114056979A (en) * | 2021-11-04 | 2022-02-18 | 广东粤辉科技股份有限公司 | Vacuum defoaming device for adhesive tape processing |
CN114056979B (en) * | 2021-11-04 | 2024-05-14 | 广东粤辉科技股份有限公司 | Adhesive tape processing vacuum bubble removal device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091223 Termination date: 20130302 |