CN102638942A - Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) - Google Patents
Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) Download PDFInfo
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- CN102638942A CN102638942A CN2012101334782A CN201210133478A CN102638942A CN 102638942 A CN102638942 A CN 102638942A CN 2012101334782 A CN2012101334782 A CN 2012101334782A CN 201210133478 A CN201210133478 A CN 201210133478A CN 102638942 A CN102638942 A CN 102638942A
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Abstract
The invention discloses a resistance welding fabrication process for eliminating silk-screen printing ink bubbles of a heavy copper PCB (printed circuit board). The resistance welding fabrication process comprises the following steps of: fixing a heavy copper PCB base plate after the silk-screen resistance-welding process on a plugboard rack, correspondingly placing the plugboard rack in a vacuumized box, carrying out vacuumizing treatment on the vacuumized box to fully expel the bubbles out of a silk-screen resistance-welding layer of the heavy copper PCB base plate, taking out the plugboard rack from the vacuumized box, and carrying out drying treatment on the heavy copper PCB base plate. The fabrication process provided by the invention adopts a vacuum exhaust method to rapidly and effectively exhaust the bubbles out of the silk-screen resistance-welding process and the problem of poor quality caused by pinholes on the circuit board after baking is solved. Compared with the prior art, the resistance welding fabrication process provided by the invention has the advantages of short bubble-emptying time, good emptying effect, high production efficiency and the like.
Description
Technical field:
The invention belongs to the printed wiring board manufacture technology field, what be specifically related to is the resistance weldering manufacture craft that a kind of thick copper PCB eliminates the ink for screen printing bubble.
Background technology:
Thick copper PCB is meant that the surface accomplishes the thick one type of PCB more than or equal to 3OZ of copper, and is as shown in Figure 1, its by base material 1, be positioned at the thick copper circuit 2 on the base material 1 and the resistance weldering ink lay 3 that covers on the thick copper circuit 2 constitutes.
Existing thick copper PCB when silk-screen resistance weldering, produces friction and Extrusion between thick copper circuit meeting and the screen printing net plate because circuit copper is thick blocked up at present; In the resistance weldering ink lay 3 that forms, produce bubble 4 easily; These bubbles 4 are concealed online Road Edge, and oven dry back bubble 4 breaks, and can produce the pin hole shape at the plate face of wiring board; Cause the resistance weldering bad, have a strong impact on the exterior quality of product.
This mainly is because copper thickness is thick more; Ink thickness between line is thick more; Bubble more greatly, many more; And line face printing ink general thickness is: line face (circuit surface) thickness L>=15 μ m, line angle (circuit turning) ink thickness is generally: L>=10 μ m, copper face ink thickness are generally 20 μ m≤L≤50 μ m.Exactly because line face, line angle ink thickness have requirement; Copper is thick thick more, and it is just more difficult that ink for screen printing will reach thickness requirement, and printing ink just needs more; So it is more just to have caused the printing ink of the critical corner of crack and circuit, copper face and base material between two lines to be piled up, bubble is just more, big more.
For avoiding occurring the problems referred to above; Usually hinder postwelding at thick copper PCB silk-screen in the industry; Left standstill 1～2 hour, and bubble is tried one's best carry out follow-up wiring board oven dry again after the emptying, but there was the halfway problem of bubble removal in the resistance weldering ink lay in this mode; Its main cause is following: one, printing ink toughness, and the bubble when leaving standstill in the printing ink can not effectively be discharged; Two, the diluent that leaves standstill in the printing ink in the process slowly volatilizees, and the printing ink back bubble that condenses is enclosed in the printing ink, therefore adopts this mode not only can not effectively remove the bubble in the resistance weldering ink lay, but also in waste production time, problem that production efficiency is low.
Summary of the invention:
For this reason, the object of the present invention is to provide a kind of thick copper PCB to eliminate the resistance weldering manufacture craft of ink for screen printing bubble, leave standstill the problem that bubble is not thoroughly in the resistance weldering ink lay, the production time is long, production efficiency is low of removing to solve present employing.
For realizing above-mentioned purpose, the present invention mainly adopts following technical scheme:
A kind of thick copper PCB eliminates the resistance weldering manufacture craft of ink for screen printing bubble; Comprise: at first silk-screen is hindered the thick copper PCB substrate of postwelding, be fixed on the flashboard rack, the flashboard rack correspondence is put into vacuumized case then; Then vacuumize processing to vacuumizing case; Bubble in the thick copper PCB substrate silk-screen solder mask is discharged fully, at last flashboard rack is taken out from vacuumize case, thick copper PCB substrate is dried processing.
Preferably, the said case that vacuumizes comprises casing and evacuator, is connected through closed conduit between said evacuator and the casing, and casing is provided with door, between this door and the casing through the rubber seal sealing.
The present invention is at thick copper circuit board silk-screen resistance postwelding; Thick copper circuit board placed vacuumize case, close and vacuumize case and make its sealing, will vacuumize the case air through evacuator then and extract out; Make and vacuumize case and be in required vacuum degree; And behind the maintenance certain hour, make and take out after bubble is all discharged in the thick copper circuit board, dry again.The present invention can make the bubble in the silk-screen resistance weldering drain fast and effectively through the mode of vacuum exhaust, prevents to toast the rear board face and pin hole occurs and cause the bad problem of quality.Compared with prior art, the present invention has that the bubble emptying time is short, emptying is effective, the production efficiency advantages of higher.
Description of drawings:
Fig. 1 is the plate face cutaway view of existing at present thick copper PCB silk-screen resistance postwelding.
Fig. 2 vacuumizes the structural representation of case for the present invention.
Identifier declaration among the figure: base material 1, thick copper circuit 2, resistance weldering ink lay 3, bubble 4, casing 5, evacuator 6, closed conduit 7, door 8, rubber seal 9.
Embodiment:
For setting forth thought of the present invention and purpose, will combine accompanying drawing and specific embodiment that the present invention is done further explanation below.
The present invention is to provide the resistance weldering manufacture craft that a kind of thick copper PCB eliminates the ink for screen printing bubble; It is mainly in thick copper circuit board manufacturing process; Especially the increase of silk-screen resistance postwelding vacuumizes processing to the wiring board substrate; Utilize pressure in bubbles in the silk-screen solder mask bigger, form pressure differential, will be arranged in silk-screen solder mask bubble and discharge than the pressure of thick copper PCB place environment; Thereby bubble is not thorough in the solution existing removal resistance of the employing static method at present weldering ink lay, the problem that the production time is long and production efficiency is low the pin hole shape appears, in baking rear board face.
The concrete operating principle of the present invention is following: the thick copper PCB substrate that at first silk-screen is hindered postwelding; Be fixed on the flashboard rack; Then the flashboard rack correspondence is put into and vacuumized case, then vacuumize processing, the bubble in the thick copper PCB substrate silk-screen solder mask is discharged fully vacuumizing case; At last flashboard rack is taken out from vacuumize case, thick copper PCB substrate is dried processing.
Thick copper PCB is carried out silk-screen resistance solder paste China ink need carry out pre-treatments such as nog plate before; So that resistance solder paste China ink can form effective the combination with the thick copper circuit figure; And formed bubble in the silk-screen resistance weldering process; Then need utilize to vacuumize case and drain, its concrete operations mode can be referring to shown in Figure 2, and Fig. 2 vacuumizes the structural representation of case for the present invention.This vacuumizes case and comprises casing 5 and evacuator 6, is connected through closed conduit 7 between said evacuator 6 and the casing 5, and casing 5 is a cuboid; Its inside is the stainless steel rectangular frame structure, outside about, about and rear side be corrosion resistant plate seal weld and be connected together, the front side is a window; Be provided with a door 8, seal through rubber seal 9 between this door 8 and the casing 5, after door 8 and casing 5 seal; Whole box body all seals, and any slit can not be arranged.
Be connected through closed conduit 7 between evacuator 6 and the casing 5, and the interface of closed conduit 7 and casing 5 requires good seal, can not leak gas.
Vacuumize when handling, at first open door 8, with the thick copper PCB substrate that is fixed on silk-screen resistance postwelding on the flashboard rack, being placed on (here can be according to needs of production in the casing 5; Place a plurality of flashboard racks, the concrete actual volume with casing is as the criterion), close door 8 then; Make whole box body 5 be in sealing and airtight state, then start evacuator, according to the parameter that configures; Air in the casing 5 is extracted, make it meet the requirements of vacuum degree, keep this vacuum degree certain hour constant afterwards; After treating that bubble drains in the thick copper PCB substrate silk-screen solder mask, open door again, thick copper PCB substrate is taken out carry out baking processing.
Need to prove; The selected parameter that vacuumizes is thick with copper and ink thickness is relevant among the present invention, and copper is thick thick more, and the ink thickness between line is thick more; Bubble more greatly, many more; The corresponding pumpdown time requires also long more, and suction requires high more, and the concrete parameter here can set up on their own according to needs of production.Thickness such as setting thick copper circuit on the thick copper PCB substrate is H; Vacuumize the case correspondence should thick copper PCB substrate silk-screen solder mask in bubble to discharge needed vacuum degree fully be P; And the time that under this vacuum degree, keeps is T, and then the thickness of thick copper circuit is H, vacuumizes between vacuum degree P corresponding in the case and the time T under this vacuum degree P and should satisfy the following table corresponding relationship.
Thick according to different Cu, and different air pressure, it is as shown in the table to define the pumpdown time:
Can be known that by last table the circuit copper of thick copper PCB is thick thick more, the bubble that produces in the resistance weldering ink lay is also many more accordingly; These bubbles are positioned at the position of resistance weldering ink lay also can so just bring bigger difficulty to the emptying bubble, at this moment relatively by down; To drain the desired vacuum degree of bubble also just high more through vacuumizing case, makes pressure in bubbles just bigger with the pressure differential that vacuumizes in the case, simultaneously in this case; Prolong the time that vacuumizes, also just be convenient to the discharge of bubble more.
Therefore can know that when the bigger pcb board of thickness drains when handling carrying out bubble, pairing vacuum degree and time are also longer relatively.
More than be manufacture craft to be welded in the resistance that a kind of thick copper PCB provided by the present invention eliminates the ink for screen printing bubble carried out detailed introduction; Used concrete example among this paper structural principle of the present invention and execution mode are set forth, above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (2)
1. manufacture craft is welded in the resistance of a thick copper PCB elimination ink for screen printing bubble; It is characterized in that comprising: at first silk-screen is hindered the thick copper PCB substrate of postwelding, be fixed on the flashboard rack, the flashboard rack correspondence is put into vacuumized case then; Then vacuumize processing to vacuumizing case; Bubble in the thick copper PCB substrate silk-screen solder mask is discharged fully, at last flashboard rack is taken out from vacuumize case, thick copper PCB substrate is dried processing.
2. thick copper PCB according to claim 1 eliminates the resistance weldering manufacture craft of ink for screen printing bubble; It is characterized in that the said case that vacuumizes comprises casing and evacuator; Be connected through closed conduit between said evacuator and the casing; Casing is provided with door, seals through rubber seal between this door and the casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101334782A CN102638942A (en) | 2012-05-02 | 2012-05-02 | Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101334782A CN102638942A (en) | 2012-05-02 | 2012-05-02 | Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) |
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| CN102638942A true CN102638942A (en) | 2012-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012101334782A Pending CN102638942A (en) | 2012-05-02 | 2012-05-02 | Resistance welding fabrication process for eliminating silk-screen printing ink bubbles of heavy copper PCB (printed circuit board) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104486913A (en) * | 2014-12-23 | 2015-04-01 | 深圳市五株科技股份有限公司 | Printing ink hole plugging process method for circuit boards |
| CN104640362A (en) * | 2013-11-11 | 2015-05-20 | 昆山苏杭电路板有限公司 | Vacuum-method thick copper solder resist printing technology |
| CN111586989A (en) * | 2020-04-28 | 2020-08-25 | 珠海杰赛科技有限公司 | Solder mask manufacturing method of thick copper circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030131741A1 (en) * | 2002-01-15 | 2003-07-17 | Hiroshi Kawakita | Vacuum print system |
| CN201369882Y (en) * | 2009-03-02 | 2009-12-23 | 汕头超声印制板公司 | Vacuum hole and bubble breakage device |
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
-
2012
- 2012-05-02 CN CN2012101334782A patent/CN102638942A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030131741A1 (en) * | 2002-01-15 | 2003-07-17 | Hiroshi Kawakita | Vacuum print system |
| CN201369882Y (en) * | 2009-03-02 | 2009-12-23 | 汕头超声印制板公司 | Vacuum hole and bubble breakage device |
| CN102361543A (en) * | 2011-09-26 | 2012-02-22 | 深南电路有限公司 | Circuit board resistance welding processing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104640362A (en) * | 2013-11-11 | 2015-05-20 | 昆山苏杭电路板有限公司 | Vacuum-method thick copper solder resist printing technology |
| CN104486913A (en) * | 2014-12-23 | 2015-04-01 | 深圳市五株科技股份有限公司 | Printing ink hole plugging process method for circuit boards |
| CN111586989A (en) * | 2020-04-28 | 2020-08-25 | 珠海杰赛科技有限公司 | Solder mask manufacturing method of thick copper circuit board |
| CN111586989B (en) * | 2020-04-28 | 2021-10-12 | 珠海杰赛科技有限公司 | Solder mask manufacturing method of thick copper circuit board |
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Application publication date: 20120815 |