CN106851992A - Printed board filling holes with resin plumpness control method - Google Patents
Printed board filling holes with resin plumpness control method Download PDFInfo
- Publication number
- CN106851992A CN106851992A CN201710225768.2A CN201710225768A CN106851992A CN 106851992 A CN106851992 A CN 106851992A CN 201710225768 A CN201710225768 A CN 201710225768A CN 106851992 A CN106851992 A CN 106851992A
- Authority
- CN
- China
- Prior art keywords
- resin
- consent
- printed board
- control method
- plumpness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of printed board filling holes with resin plumpness control method, comprise the following steps：Resin ink is vacuumized into bubble by vacuum machine；Consent operation, consent plumpness ＞ 100% are carried out to the via in printed board using horizontal or vertical hole plugging machine；Using stage baking：Respectively 30min is toasted at a temperature of 80 °, 120 ° and 150 °；The resin of prominent printing board surface is polished.The printed board filling holes with resin plumpness control method is steeped by the degassing of resin ink, and horizontal or vertical consent is used under vacuum conditions, efficiently solve the technical problem of resin bubble, the laggard row order segmentation baking of consent simultaneously, ensure that resin uniform shrinkage in solidification, it is ensured that the reliability of consent, and use polishes treatment after hardening, the flatness of resin has been effectively ensured, the technical problems such as buried via hole wiring board, VIP wiring board plate faces be smooth have been solved.
Description
Technical field
The present invention relates to printed board processing technique field, a kind of printed board filling holes with resin plumpness control is particularly related to
Method processed.
Background technology
With the development of assembling component microminaturization, the layout area of PCB, design area also constantly subtracts therewith
It is small.People have invented filling holes with resin technology, for production PCB printed boards provide motive force on a large scale, and effectively increase HDI,
The reliability and manufacture craft ability of the products such as thick copper, backboard.
Filling holes with resin is to be clogged via using resin, then carries out copper facing in hole surface, and this technique is in printed board
Processing technique field has been commonly used, but also there are shortcomings：Consent plumpness is not enough, consent is present has in depression, resin
Bubble, easy to crack etc., so as to influence the quality of printed board, cause yield not high.
The content of the invention
In order to overcome drawbacks described above, the invention provides a kind of printed board filling holes with resin plumpness control method.
The technical scheme that is used to solve its technical problem of the present invention is：
A kind of printed board filling holes with resin plumpness control method, comprises the following steps：
Step 1, bubble is vacuumized by resin ink by vacuum machine；
Step 2, consent operation, consent plumpness ＞ are carried out to the via in printed board using horizontal or vertical hole plugging machine
100%；
Step 3, using stage baking：Respectively 30min is toasted at a temperature of 80 °, 120 ° and 150 °；
Step 4, the resin of prominent printing board surface is polished.
As a further improvement on the present invention, in the step 4, the tree of printing board surface will be protruded using ceramic Plate grinder
Fat is polished, wherein, the linear speed of the ceramic Plate grinder is 1.5m/min, and is ground twice, and nog plate direction is rotated by 90 ° twice.
The beneficial effects of the invention are as follows：The printed board filling holes with resin plumpness control method is by resin ink degassing
Bubble, and horizontal or vertical consent is used under vacuum conditions, the technical problem of resin bubble is efficiently solved, while consent is laggard
Row order segmentation is toasted, it is ensured that resin uniform shrinkage in solidification, it is ensured that the reliability of consent, and use is polished after hardening
Treatment, has been effectively ensured the flatness of resin, solves the technical problems such as buried via hole wiring board, VIP wiring board plate faces be smooth.
Specific embodiment
In conjunction with the embodiments, the present invention is elaborated, but protection scope of the present invention is not limited to following embodiments, i.e., but
All simple equivalence changes made with scope of the present invention patent and description and modification, all still belong to patent of the present invention
Within covering scope.
A kind of printed board filling holes with resin plumpness control method, comprises the following steps：
Step 1, bubble is vacuumized by resin ink by vacuum machine；
Step 2, consent operation, consent plumpness ＞ are carried out to the via in printed board using horizontal or vertical hole plugging machine
100%；
Step 3, using stage baking：Respectively 30min is toasted at a temperature of 80 °, 120 ° and 150 °；
Step 4, is polished the resin of prominent printing board surface using ceramic Plate grinder, wherein, the ceramic Plate grinder
Linear speed is 1.5m/min, and is ground twice, and nog plate direction is rotated by 90 ° twice.
Wherein, air bubble problem in consent, is always the difficult point of jack process, and the present invention is using vertical and horizontal vacuum plug
Hole technology, application of vacuum is carried out to resin, and carries out consent under vacuo, efficiently solves the problems, such as bubble in resin, should
Technology can be generally applicable to mesh screen plughole, and aluminium flake consent, direct consent is widely used.
Need to carry out resin baking treatment after having filled in resin, the solidification of baking stage resin easily produces the problem in crack,
Influence is produced on the processing of rear operation, interim baking technology ensure that resin uniform shrinkage solidification in solidification, it is ensured that reliable
Property,
Need to carry out polishing treatment after resin solidification, the defect of depression can be produced when polishing, cause pad uneven
It is whole, cutting is carried out to the resin of prominent plate face using height cutting nog plate technology and is polished, while ensure that resin flatness, solve
The smooth problem of buried via hole wiring board, VIP wiring board plate faces.
As can be seen here, the printed board filling holes with resin plumpness control method is steeped by the degassing of resin ink, and in vacuum
Horizontal or vertical consent is used under state, the technical problem of resin bubble is efficiently solved, while the laggard row order segmentation of consent dries
It is roasting, it is ensured that resin uniform shrinkage in solidification, it is ensured that the reliability of consent, and after hardening using treatment is polished, effectively
The flatness of resin is ensure that, the technical problems such as buried via hole wiring board, VIP wiring board plate faces be smooth are solved.
Claims (2)
1. a kind of printed board filling holes with resin plumpness control method, it is characterised in that comprise the following steps：
Step 1, bubble is vacuumized by resin ink by vacuum machine；
Step 2, consent operation, consent plumpness ＞ are carried out to the via in printed board using horizontal or vertical hole plugging machine
100%；
Step 3, using stage baking：Respectively 30min is toasted at a temperature of 80 °, 120 ° and 150 °；
Step 4, the resin of prominent printing board surface is polished.
2. printed board filling holes with resin plumpness control method according to claim 1, it is characterised in that：In the step 4,
The resin of prominent printing board surface is polished using ceramic Plate grinder, wherein, the linear speed of the ceramic Plate grinder is 1.5m/min,
And grind twice, nog plate direction is rotated by 90 ° twice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710225768.2A CN106851992A (en) | 2017-04-07 | 2017-04-07 | Printed board filling holes with resin plumpness control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710225768.2A CN106851992A (en) | 2017-04-07 | 2017-04-07 | Printed board filling holes with resin plumpness control method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106851992A true CN106851992A (en) | 2017-06-13 |
Family
ID=59147220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710225768.2A Pending CN106851992A (en) | 2017-04-07 | 2017-04-07 | Printed board filling holes with resin plumpness control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106851992A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446350A (en) * | 2019-08-05 | 2019-11-12 | 深圳崇达多层线路板有限公司 | A method of making filling holes with resin on PCB |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724819A (en) * | 2012-07-09 | 2012-10-10 | 博敏电子股份有限公司 | Method for grinding hole plugging resin of circuit board |
| CN103517564A (en) * | 2013-11-08 | 2014-01-15 | 东莞生益电子有限公司 | Hole filling method in circuit board production |
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
-
2017
- 2017-04-07 CN CN201710225768.2A patent/CN106851992A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102724819A (en) * | 2012-07-09 | 2012-10-10 | 博敏电子股份有限公司 | Method for grinding hole plugging resin of circuit board |
| CN103517564A (en) * | 2013-11-08 | 2014-01-15 | 东莞生益电子有限公司 | Hole filling method in circuit board production |
| CN104582317A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Printed circuit board manufacturing method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110446350A (en) * | 2019-08-05 | 2019-11-12 | 深圳崇达多层线路板有限公司 | A method of making filling holes with resin on PCB |
| CN110831336A (en) * | 2019-11-11 | 2020-02-21 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN110831336B (en) * | 2019-11-11 | 2020-10-27 | 珠海崇达电路技术有限公司 | Resin hole plugging method for large-aperture back drilling hole |
| CN111295052A (en) * | 2020-03-25 | 2020-06-16 | 深圳捷飞高电路有限公司 | Blind hole filling process and grinding device for high-density interconnected printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |