CN111432556A - Preparation process of PCB high-frequency board for 5G base station - Google Patents
Preparation process of PCB high-frequency board for 5G base station Download PDFInfo
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- CN111432556A CN111432556A CN202010136179.9A CN202010136179A CN111432556A CN 111432556 A CN111432556 A CN 111432556A CN 202010136179 A CN202010136179 A CN 202010136179A CN 111432556 A CN111432556 A CN 111432556A
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- frequency board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a preparation process of a PCB high-frequency board for a 5G base station, which comprises the following steps: the molding process comprises the following steps: (1) and (3) plate stacking treatment: selecting a proper cover plate to be abutted against the PCB high-frequency plate, and adding a bonding material between the cover plate and the PCB high-frequency plate; (2) routing treatment: the distance between the lower cutter position of the milling cutter and the PCB high-frequency board exists, and the milling cutter cuts into the PCB high-frequency board at the corner position. Through increasing the laminating material between apron and PCB high frequency board for the laminating degree of apron and PCB high frequency board is higher, and the position that the control gong sword cut in addition makes the appearance edge burr of the PCB high frequency board of final shaping few and level, need not the manual work and further carries out the processing of burr, has promoted the quality of PCB high frequency board greatly and has reduced the disability rate, has reduced the manufacturing cost of enterprise, and has promoted production efficiency greatly.
Description
Technical Field
The invention relates to the technical field of PCB (printed circuit board), in particular to a preparation process of a PCB high-frequency board for a 5G base station.
Background
With the comprehensive arrival of the 5G commercial era, each link in the communication field needs to use the PCB, and the number of 5G base stations is expected to be greatly increased. The peak rate of 4G is 100Mbps to 1Gbps, while 5G provides bandwidth with the peak value of more than 10Gbps, 1ms time delay and ultra-high density connection, the mobility reaches 500km/h, and the flow density reaches 10Mbps/m 2. At present, three operators in China enter a 5G construction large-speed acceleration stage, 5G standard tests and application tests are developed, 5G coverage time tables are planned in places and infrastructure construction is accelerated, so that the aim of large-scale commercial use in 2020 is fulfilled. Since 5G requires massive connection, the number of base stations in the 5G era will increase greatly compared with the 4G era. By the end of 2017, the number of 4G macro base stations in China reaches about 360 thousands, the planning of 5G macro base stations of three operators is 1.5 times that of 4G, the total number reaches about 540 thousands, and the peak period of 5G base station construction is about 2019-2023.
The PCB high-frequency board is a special circuit board with higher electromagnetic frequency, is used for PCBs in the fields of high frequency (the frequency is more than 300MHZ or the wavelength is less than 1 meter) and microwave (the frequency is more than 3GHZ or the wavelength is less than 0.1 meter), and is a circuit board produced on a microwave substrate copper-clad plate by utilizing partial procedures of a common rigid circuit board manufacturing method or a special processing method. The substrate material needs to have excellent electrical property and good chemical stability, and the loss requirement on the substrate along with the increase of the frequency of the power supply signal is very small, so the importance of the high-frequency plate is highlighted. The PCB high-frequency board for the 5G base station is similar to the common FR4 processing flow, but due to the difference between boards, too many burrs are easily formed on the edge after forming in the process of processing the PCB high-frequency board, manual processing is needed, the quality of the PCB high-frequency board is greatly influenced, the rejection rate is also improved, the production cost is increased, and the production efficiency is reduced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides a preparation process of a PCB high-frequency board for a 5G base station.
The invention discloses a preparation process of a PCB high-frequency board for a 5G base station, which comprises the following steps: the molding process comprises the following steps:
(1) and (3) plate stacking treatment: selecting a proper cover plate to be abutted against the PCB high-frequency plate, and adding a bonding material between the cover plate and the PCB high-frequency plate;
(2) routing treatment: the distance between the lower cutter position of the milling cutter and the PCB high-frequency board exists, and the milling cutter cuts into the PCB high-frequency board at the corner position.
According to an embodiment of the present invention, the bonding material is kraft paper or white paper.
According to one embodiment of the present invention, the bonding material is 1 kraft paper or 2 to 3 white papers.
According to an embodiment of the present invention, the cover plate is any one of a paper backing plate, an FR4 inner layer waste board (after etching copper) or an expired substrate (after etching copper).
According to one embodiment of the invention, the technical edge of the PCB high-frequency board is provided with a pre-drilled hole, and the routing knife is arranged in the pre-drilled hole in a penetrating manner.
According to an embodiment of the present invention, the method further includes a pattern transfer process, the pattern transfer process including:
(1) pretreatment: processing the PCB high-frequency board by adopting a chemical cleaning mode;
(2) exposure: when manual alignment exposure is used, a 10X magnifier is adopted for alignment, and the alignment degree is within +/-1.5 mil; when the automatic alignment exposure is used, the PE value is set to be less than or equal to 50 mu m;
(3) acid etching:
(31) manufacturing a first plate: measuring the end point and the middle point of the PCB high-frequency board and the MI indicating measuring line, and controlling the middle value and then carrying out the next production;
(32) placing the plates: when the PCB high-frequency board is a single-sided circuit product, the circuit surface of the PCB high-frequency board faces downwards for etching; when the PCB high-frequency board is a double-sided circuit product, the dense circuit surface of the PCB high-frequency board faces downwards for etching;
(33) line width and line distance measurement: measuring by using a line width and line distance measuring instrument;
(34) controlling an etching factor: electroless copper plating, wherein the etching factor is more than or equal to 3.5; the etching factor is more than or equal to 3 when the electroplated copper is present.
According to one embodiment of the present invention, the chemical cleaning comprises: the PCB high-frequency board sequentially passes through an acid washing section, an overflow water washing section, a pressurizing water washing section, a high-pressure water washing section and a drying section.
According to one embodiment of the invention, when the alignment exposure is performed manually, the film is cleaned once when one PCB high-frequency board is exposed, and the exposure table top is cleaned once when five PCB high-frequency boards are exposed.
According to an embodiment of the present invention, during the automatic alignment exposure, a film butt-joint production is adopted, the film alignment degree is checked by a 10X magnifying glass every 25PN L production, and the film is selected to have a thickness of 4 mil.
According to one embodiment of the invention, the sheet is placed with a line width of 1PN L spot check for every 30PN L produced.
The PCB high-frequency board forming device has the advantages that the attaching material is added between the cover plate and the PCB high-frequency board, so that the attaching degree of the cover plate and the PCB high-frequency board is higher, and the cutting position of the milling cutter is controlled, so that the appearance edge of the finally formed PCB high-frequency board is less and smooth, manual further burr treatment is not needed, the quality of the PCB high-frequency board is greatly improved, the rejection rate is reduced, the production cost of an enterprise is reduced, and the production efficiency is greatly improved.
Detailed Description
In the following description, numerous implementation details are set forth in order to provide a thorough understanding of the present invention. It should be understood, however, that these implementation details are not to be interpreted as limiting the invention. That is, details of these implementations are not necessary in some embodiments of the invention.
In addition, the descriptions related to the first, the second, etc. in the present invention are only used for description purposes, do not refer to specific meanings or sequence meanings, and do not limit the present invention, which are only used for distinguishing components or operations described in the same technical terms, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
Example one
The invention discloses a preparation process of a PCB high-frequency board for a 5G base station, which comprises a forming process, wherein the forming process comprises the following steps:
(1) and (3) plate stacking treatment: selecting a cover plate with a proper specification and size, abutting the cover plate with a PCB high-frequency plate, and arranging a bonding material between the cover plate and the PCB high-frequency plate;
(2) routing treatment: and controlling the lower cutter position of the routing knife, namely, the distance exists between the lower cutter position of the routing knife and the PCB high-frequency board, and the routing knife is cut into at the corner position of the PCB high-frequency board.
Preferably, the conformable material is kraft paper or white paper. Specifically, the attaching material is 1 piece of kraft paper or 2-3 pieces of white paper, so that the attaching between the cover plate and the PCB high-frequency board is tighter.
Preferably, the cover plate is any one of a paper backing plate, an FR4 inner layer waste plate (after copper etching) or an expired substrate (after copper etching), and the waste material is reused, so that the material and the cost can be saved.
When the method is specifically applied, the diameter of the milling cutter is phi 1.5mm, the rotating speed is 33Krpm, the lower cutting speed is 1.0m/min, the starting speed is 5m/min, and the milling speed is 6m/min, wherein the number of stacked plates is 2PN L. specifically, after the high-frequency plate is milled, the milling cutter can still be used on FR4 as the service life of a new milling cutter due to the fact that the high-frequency plate is different from FR4 and the actual milling quality is taken as a standard, and the milling stroke is set to be less than or equal to 10m, and the cost of the production process is saved.
Preferably, the technical edge of the PCB high-frequency board is provided with a pre-drilled hole, and the routing knife penetrates through the pre-drilled hole. Specifically, the aperture size of the pre-drilled hole is less than 0.05mm of the tool diameter of the milling cutter, and the phenomena of plate burning and plate edge roughness caused by the fact that the milling cutter is broken and broken when the PTFE material is used for milling plates by the lower cutter are effectively prevented through the arrangement of the pre-drilled hole.
Specifically, the edge of the PCB high-frequency board can be covered with solder mask ink after the PCB high-frequency board is formed, so that the problems of line oxidation, line open circuit or short circuit and the like are prevented, and the quality of the PCB high-frequency board is further improved.
The preparation process of the PCB high-frequency board for the 5G base station further comprises a pattern transfer process, wherein the pattern transfer process comprises the following steps:
(1) pretreatment: the PCB high-frequency board is treated in a chemical cleaning mode, and damage to the PCB high-frequency board is reduced.
(2) Exposure: when manual alignment exposure is used, a 10X magnifier is selected for alignment, and the alignment degree is controlled within +/-1.5 mil; when the automatic alignment exposure is used, the PE value is set to be less than or equal to 50 μm.
(3) Acid etching:
(31) manufacturing a first plate: measuring each end point, the middle point and the MI indication measuring line of the PCB high-frequency board, and controlling the middle value and then continuing the production;
(32) placing the plates: when the PCB high-frequency board is a single-sided circuit product, placing the circuit surface downwards and etching; if the PCB high-frequency board is a double-sided circuit product, placing the dense circuit face downwards and etching;
(33) line width and line distance measurement: measuring the end point, the middle point and the MI indicating and measuring line of the PCB high-frequency board by adopting a line width and line distance measuring instrument;
(34) controlling an etching factor: measuring the burr of the circuit, and controlling the etching factor without plating copper, wherein the etching factor is more than or equal to 3.5; the etching factor is more than or equal to 3 when the electroplated copper is present.
Preferably, the chemical cleaning comprises: sequentially carrying out acid washing, overflow water washing, pressurization water washing and high-pressure water washing on the PCB high-frequency board and drying. Specifically, the acid washing section is 3-5% sulfuric acid. By adopting the chemical cleaning mode, the problem of deformation of the PCB high-frequency board is effectively avoided, and the accuracy of the size of the PCB high-frequency board is further ensured.
Preferably, when manual alignment exposure is performed, in order to further increase the alignment accuracy, the film needs to be cleaned every time one PCB high-frequency board is exposed; and cleaning the exposure table board every time five PCB high-frequency boards are exposed. Specifically, the exposure table top is cleaned by dipping industrial alcohol with dust-free cloth, and the film is cleaned by dipping film water with the dust-free cloth.
Preferably, when performing the automatic alignment exposure, the film is produced by butting, and the alignment of the film needs to be checked by a 10X magnifying glass every 25PN L is produced, specifically, the film is selected to be 4mil thick.
When the measuring device is specifically applied, the shape of the first plate is rectangular, and during measurement, four end points, middle points and MI (micro-electromechanical) indication measuring lines of the first plate are mainly measured, measuring points are added, and the structural size of the first plate is further ensured to meet requirements.
Preferably, when the board is placed, 1PN L is extracted for measuring the end point and the middle point every 30PN L is produced, and the quality of the PCB high-frequency board is ensured not to change in the production process.
Example two
The invention discloses a preparation process of a PCB high-frequency board for a 5G base station, which comprises a forming process, wherein the forming process comprises the following steps:
(1) and (3) plate stacking treatment: selecting a cover plate with a proper specification and size, abutting the cover plate with a PCB high-frequency plate, and arranging a bonding material between the cover plate and the PCB high-frequency plate;
(2) routing treatment: and controlling the lower cutter position of the routing knife, namely, the distance exists between the lower cutter position of the routing knife and the PCB high-frequency board, and the routing knife is cut into at the corner position of the PCB high-frequency board.
Preferably, the conformable material is kraft paper or white paper. Specifically, the attaching material is 1 piece of kraft paper or 2-3 pieces of white paper, so that the attaching between the cover plate and the PCB high-frequency board is tighter.
Preferably, the cover plate is any one of a paper backing plate, an FR4 inner layer waste plate (after copper etching) or an expired substrate (after copper etching), and the waste material is reused, so that the material and the cost can be saved.
When the method is specifically applied, the diameter of the milling cutter is phi 2.0mm, the rotating speed is 26Krpm, the lower cutter speed is 1.0m/min, the starting speed is 5m/min, the milling speed is 8m/min, the number of stacked plates is 2PN L, specifically, after the high-frequency plate is milled, the milling cutter can still be used on FR4 as the service life of a new milling cutter due to the fact that the high-frequency plate has a certain difference with FR4 and the actual milling quality is taken as a standard, and the milling stroke is set to be less than or equal to 10m, and the cost of the production process is saved.
Preferably, the technical edge of the PCB high-frequency board is provided with a pre-drilled hole, and the routing knife penetrates through the pre-drilled hole. Specifically, the aperture size of the pre-drilled hole is less than 0.05mm of the tool diameter of the milling cutter, and the phenomena of plate burning and plate edge roughness caused by the fact that the milling cutter is broken and broken when the PTFE material is used for milling plates by the lower cutter are effectively prevented through the arrangement of the pre-drilled hole.
Specifically, the edge of the PCB high-frequency board can be covered with solder mask ink after the PCB high-frequency board is formed, so that the problems of line oxidation, line open circuit or short circuit and the like are prevented, and the quality of the PCB high-frequency board is further improved.
The preparation process of the PCB high-frequency board for the 5G base station further comprises a pattern transfer process, wherein the pattern transfer process comprises the following steps:
(1) pretreatment: the PCB high-frequency board is treated in a chemical cleaning mode, and damage to the PCB high-frequency board is reduced.
(2) Exposure: when manual alignment exposure is used, a 10X magnifier is selected for alignment, and the alignment degree is controlled within +/-1.5 mil; when the automatic alignment exposure is used, the PE value is set to be less than or equal to 50 μm.
(3) Acid etching:
(31) manufacturing a first plate: measuring each end point, the middle point and the MI indication measuring line of the PCB high-frequency board, and controlling the middle value and then continuing the production;
(32) placing the plates: when the PCB high-frequency board is a single-sided circuit product, placing the circuit surface downwards and etching; if the PCB high-frequency board is a double-sided circuit product, placing the dense circuit face downwards and etching;
(33) line width and line distance measurement: measuring the end point, the middle point and the MI indicating and measuring line of the PCB high-frequency board by adopting a line width and line distance measuring instrument;
(34) controlling an etching factor: measuring the burr of the circuit, and controlling the etching factor without plating copper, wherein the etching factor is more than or equal to 3.5; the etching factor is more than or equal to 3 when the electroplated copper is present.
Preferably, the chemical cleaning comprises: sequentially carrying out acid washing, overflow water washing, pressurization water washing and high-pressure water washing on the PCB high-frequency board and drying. Specifically, the acid washing section is 3-5% sulfuric acid. By adopting the chemical cleaning mode, the problem of deformation of the PCB high-frequency board is effectively avoided, and the accuracy of the size of the PCB high-frequency board is further ensured.
Preferably, when manual alignment exposure is performed, in order to further increase the alignment accuracy, the film needs to be cleaned every time one PCB high-frequency board is exposed; and cleaning the exposure table board every time five PCB high-frequency boards are exposed. Specifically, the exposure table top is cleaned by dipping industrial alcohol with dust-free cloth, and the film is cleaned by dipping film water with the dust-free cloth.
Preferably, when performing the automatic alignment exposure, the film is produced by butting, and the alignment of the film needs to be checked by a 10X magnifying glass every 25PN L is produced, specifically, the film is selected to be 4mil thick.
When the measuring device is specifically applied, the shape of the first plate is rectangular, and during measurement, four end points, middle points and MI (micro-electromechanical) indication measuring lines of the first plate are mainly measured, measuring points are added, and the structural size of the first plate is further ensured to meet requirements.
Preferably, when the board is placed, 1PN L is extracted for measuring the end point and the middle point every 30PN L is produced, and the quality of the PCB high-frequency board is ensured not to change in the production process.
To sum up, through increasing laminating material between apron and PCB high frequency board for the laminating degree of apron and PCB high frequency board is higher, and the position that the control gong sword cut in addition makes the appearance edge burr of the PCB high frequency board of final shaping few and level, need not the artifical processing that further carries out the burr, has promoted the quality of PCB high frequency board greatly and has reduced the disability rate, has reduced enterprise manufacturing cost, and has promoted production efficiency greatly. In addition, the line width and line distance precision of the PCB high-frequency board is further controlled through a pattern transfer process, so that the finally formed PCB high-frequency board meets the requirements.
The above description is only an embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A preparation process of a PCB high-frequency board for a 5G base station is characterized by comprising the following steps: a molding process, the molding process comprising:
(1) and (3) plate stacking treatment: selecting a proper cover plate to be abutted against the PCB high-frequency plate, and adding a bonding material between the cover plate and the PCB high-frequency plate;
(2) routing treatment: and a distance exists between the lower cutter position of the routing cutter and the PCB high-frequency board, and the routing cutter is cut into the PCB high-frequency board at the corner position.
2. The process for preparing a PCB high-frequency board for a 5G base station according to claim 1, wherein the attaching material is kraft paper or white paper.
3. The process for preparing a PCB high-frequency board for a 5G base station according to claim 2, wherein the attaching material is 1 piece of kraft paper or 2-3 pieces of white paper.
4. The process for preparing a PCB high-frequency board for a 5G base station according to claim 1, wherein the cover plate is any one of a paper backing plate, an FR4 inner layer waste board (after copper etching) or an overdue substrate (after copper etching).
5. The manufacturing process of the PCB high-frequency board for the 5G base station according to claim 1, wherein the process edge of the PCB high-frequency board is provided with a pre-drilled hole, and the routing knife is arranged in the pre-drilled hole in a penetrating manner.
6. The process for preparing a PCB high-frequency board for a 5G base station according to any one of claims 1 to 5, further comprising a pattern transfer process, wherein the pattern transfer process comprises the following steps:
(1) pretreatment: processing the PCB high-frequency board by adopting a chemical cleaning mode;
(2) exposure: when manual alignment exposure is used, a 10X magnifier is adopted for alignment, and the alignment degree is within +/-1.5 mil; when the automatic alignment exposure is used, the PE value is set to be less than or equal to 50 mu m;
(3) acid etching:
(31) manufacturing a first plate: measuring the end point, the middle point and the MI indication measuring line of the PCB high-frequency board, and controlling the middle value and then carrying out the next production;
(32) placing the plates: when the PCB high-frequency board is a single-sided circuit product, the circuit surface of the PCB high-frequency board faces downwards for etching; when the PCB high-frequency board is a double-sided circuit product, the dense circuit surface of the PCB high-frequency board faces downwards for etching;
(33) line width and line distance measurement: measuring by using a line width and line distance measuring instrument;
(34) controlling an etching factor: electroless copper plating, wherein the etching factor is more than or equal to 3.5; the etching factor is more than or equal to 3 when the electroplated copper is present.
7. The manufacturing process of the PCB high-frequency board for the 5G base station according to claim 6, wherein the chemical cleaning comprises the following steps: and sequentially passing the PCB high-frequency board through an acid washing section, an overflow water washing section, a pressurizing water washing section, a high-pressure water washing section and a drying section.
8. The manufacturing process of the PCB high-frequency board for the 5G base station according to claim 6, wherein during the manual alignment exposure, a film is cleaned once when each PCB high-frequency board is exposed, and an exposure table top is cleaned once when each five PCB high-frequency boards are exposed.
9. The process for preparing the PCB high-frequency board for the 5G base station according to the claim 6, wherein during the automatic alignment exposure, a film butt joint production is adopted, the film alignment degree is checked by the 10X magnifier every time 25PN L is produced, and the film is selected to have a thickness of 4 mil.
10. The process for preparing a PCB high-frequency board for a 5G base station as claimed in claim 6, wherein the board is placed with a line width and line distance of 1PN L checked every 30PN L produced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010136179.9A CN111432556A (en) | 2020-03-02 | 2020-03-02 | Preparation process of PCB high-frequency board for 5G base station |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010136179.9A CN111432556A (en) | 2020-03-02 | 2020-03-02 | Preparation process of PCB high-frequency board for 5G base station |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012124363A (en) * | 2010-12-09 | 2012-06-28 | Ngk Spark Plug Co Ltd | Manufacturing method for multilayer wiring board |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| US20180177057A1 (en) * | 2018-01-08 | 2018-06-21 | Kunshan TVS Electronic Technology Co.,Ltd | Gold-plating etching process for 5g communication high-frequency signal boards |
| CN110402036A (en) * | 2019-06-12 | 2019-11-01 | 惠州市特创电子科技有限公司 | A kind of the welding resistance method and welding devices of 5G high frequency circuit board |
| CN110405817A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of cutting forming method of 5G high frequency circuit board |
-
2020
- 2020-03-02 CN CN202010136179.9A patent/CN111432556A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012124363A (en) * | 2010-12-09 | 2012-06-28 | Ngk Spark Plug Co Ltd | Manufacturing method for multilayer wiring board |
| CN106231805A (en) * | 2016-08-15 | 2016-12-14 | 建业科技电子（惠州）有限公司 | A kind of semi-automatic exposure machine does the processing technology of inner plating |
| US20180177057A1 (en) * | 2018-01-08 | 2018-06-21 | Kunshan TVS Electronic Technology Co.,Ltd | Gold-plating etching process for 5g communication high-frequency signal boards |
| CN110402036A (en) * | 2019-06-12 | 2019-11-01 | 惠州市特创电子科技有限公司 | A kind of the welding resistance method and welding devices of 5G high frequency circuit board |
| CN110405817A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of cutting forming method of 5G high frequency circuit board |
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Application publication date: 20200717 |