CN108213772A - A kind of circuit board soldering low smoke and non-toxic scaling powder - Google Patents
A kind of circuit board soldering low smoke and non-toxic scaling powder Download PDFInfo
- Publication number
- CN108213772A CN108213772A CN201810117465.3A CN201810117465A CN108213772A CN 108213772 A CN108213772 A CN 108213772A CN 201810117465 A CN201810117465 A CN 201810117465A CN 108213772 A CN108213772 A CN 108213772A
- Authority
- CN
- China
- Prior art keywords
- parts
- scaling powder
- reaction kettle
- toxic
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention belongs to soldering material technical fields, and in particular to a kind of circuit board soldering low smoke and non-toxic scaling powder.The ingredient of the scaling powder includes：Low cigarette modified rosin, hercolyn D, zinc chloride, ammonium chloride, hydrochloric acid, polyglycols, glycerine, citric acid, organic solvent, cosolvent, lubricant, thixotropic agent and aromatic.Wherein, flue gas content is relatively low when modified rosin uses, and the ingredient of cosolvent includes sodium benzoate and sodium salicylate, and lubricant is nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special.The solderability for helping weldering excellent, being remarkably improved soldering of the scaling powder, without cleaning after welding, the exhaust gas volumn that soldering process generates is relatively low, and volatile substance fragrant odour does not generate poisonous and hazardous gas with foreign flavor.
Description
Technical field
The invention belongs to soldering material technical fields, and in particular to a kind of circuit board soldering low smoke and non-toxic scaling powder.
Background technology
Electronic component is manually welded on universal plate by some Small Scale Integration plates needs, this integrated circuit plate
Personalization level is high, and client can design circuit according to need of work and use corresponding electronic component, and related elements are artificial
It is welded on universal plate；This circuit board performance is practical, and service life is long, and failure rate is low, and manufactures relative inexpensiveness, non-
Often it is suitble to apply in the relatively low equipment of yield.
The mode of welding circuit generally use soldering is completed, and when welding can also use scaling powder other than using solder, help
Solder flux can improve the quality of solder joint so that element welding is more firm, and protective layer is formed outside solder joint, avoids pad
Material oxidation improves the service life of circuit board.Conventional scaling powder contains halide, rosin and organic solvent etc., scaling powder
It is that the volatile generation smog of the ingredients such as rosin and niff, other halide and organic matter are sent out at high temperature in high temperature
Biochemical reaction may also generate noxious material, the health of harm welding operating personnel.
Invention content
In view of the above problems, the purpose of the present invention is to provide a kind of circuit board soldering low smoke and non-toxic scaling powders；This is helped
The smog generated during solder flux use is less, fragrant odour, and does not generate poisonous and harmful substance, safe and healthy.
A kind of circuit board soldering low smoke and non-toxic scaling powder, according to mass fraction, the ingredient of scaling powder includes：Low cigarette is modified
80-90 parts of rosin, 6-10 parts of hercolyn D, 3-6 parts of zinc chloride, 2-5 parts of ammonium chloride, 5-7 parts of hydrochloric acid, 1-2 parts of polyglycols,
3-5 parts of glycerine, 2-4 parts of citric acid, 15-20 parts of organic solvent, 1-3 parts of cosolvent, 2-3 parts of lubricant, 4-7 parts of thixotropic agent, virtue
3-5 parts of pastil.
Preferably, according to mass fraction, the ingredient of scaling powder includes：Low 85 parts of cigarette modified rosin, hercolyn D 8
Part, 4 parts of zinc chloride, 3 parts of ammonium chloride, 6 parts of hydrochloric acid, 1.5 parts of polyglycols, 4 parts of glycerine, 3 parts of citric acid, 17 parts of organic solvent help
2 parts of solvent, 2.5 parts of lubricant, 6 parts of thixotropic agent, 4 parts of aromatic.
In the present invention, the preparation method of low cigarette modified rosin is as follows：By rosin resin and hexamethylene according to 3:1 mass ratio
It is added in reaction kettle, is dissolved at a temperature of 150-180 DEG C, nickel catalyst is added in reaction kettle, while will reaction
It is vacuumized in kettle, hydrogen is then filled with into reaction kettle, pressure in reaction kettle is kept to react knot in 8-10MPa, reaction 3-5h
Reaction kettle is depressured after beam, while remaining hexamethylene is removed by distilling, then product is cooled to room temperature, is obtained
To required low cigarette modified rosin.
Preferably, one kind in organic solvent selection isopropanol, isomery dodecane and butyl acetate.
Preferably, cosolvent includes sodium benzoate and sodium salicylate, and the mass ratio of the two is 3:7.
Preferably, lubricant is nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special.
Preferably, a concentration of 2-3.5mol/L of hydrochloric acid.
The preparation method of the low smoke and non-toxic scaling powder of the present invention is as follows：According to mass fraction, by low cigarette modified rosin and hydrogen
Change rosin methyl ester be added in reaction kettle, reaction kettle is heated to 150-160 DEG C and is stirred, then by organic solvent, cosolvent,
Lubricant, polyglycols and glycerine are added in reaction kettle, and 3-5min is stirred with the rotating speed of 80-90r/min, then by zinc chloride and
Chloride leach is added in hydrochloric acid in reaction kettle, reacts 10-15min, then citric acid and aromatic are added to reaction kettle
In, it stirs evenly, stops heating and adding in into mixture thixotropic agent, thixotropic agent is added in mixture and stirs until mixture
Emulsification stops stirring, and object to be mixed is frozen into paste, obtains required low smoke and non-toxic scaling powder.
A kind of circuit board soldering low smoke and non-toxic scaling powder provided by the invention compared with prior art, has following excellent
Point：
The rosin used in the scaling powder be by modified low cigarette type rosin compound, welding when because high temperature and
The volatile fume of generation is less, and it is relatively low that the use of the hercolyn D in formula overcomes common rosin softening temperature, easy oxygen
Change, the shortcomings that thermal stability is poor.
Zinc chloride and ammonium chloride content in the scaling powder is relatively low, with other substances after reacting, can both improve weldering
The solderability and insulation performance connect, can also avoid butt welding point from causing to corrode, and the solid content for welding rear surface is relatively low, nothing after welding
It needs to clean.
Citric acid is added in the type scaling powder, which can remove the oxide layer of pad surface in the welding process,
The reliability of soldering is improved, and harmful substance is not generated in volatilization process, the aromatic in scaling powder is using the process can be with
The smell of fragrance is sent out, improves the bad smell of welding process, improves the work comfort sense of welding operating personnel.
Specific embodiment
The specific embodiment of the present invention is described in detail below.It is it should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to restrict the invention.
Embodiment 1
A kind of circuit board soldering low smoke and non-toxic scaling powder, according to mass fraction, the ingredient of scaling powder includes：Low cigarette is modified
80 parts of rosin, 6 parts of hercolyn D, 3 parts of zinc chloride, 2 parts of ammonium chloride, 5 parts of hydrochloric acid, 1 part of polyglycols, 3 parts of glycerine, citric acid
2 parts, 15 parts of organic solvent, 1 part of cosolvent, 2 parts of lubricant, 4 parts of thixotropic agent, 3 parts of aromatic.
Wherein, the preparation method of low cigarette modified rosin is as follows：By rosin resin and hexamethylene according to 3:1 mass ratio adds in
It into reaction kettle, is dissolved at a temperature of 150 DEG C, nickel catalyst is added in reaction kettle, while by pumping interior in reaction kettle
Then vacuum is filled with hydrogen into reaction kettle, pressure is in 8MPa, reaction 3h, after reaction to reaction kettle in holding reaction kettle
It is depressured, while remaining hexamethylene is removed by distilling, be then cooled to room temperature product, obtained required low cigarette and change
Property rosin.
In the present embodiment, organic solvent selection isopropanol；The ingredient of cosolvent includes sodium benzoate and sodium salicylate, the two
Mass ratio be 3:7.Lubricant is nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special；A concentration of 2mol/L of hydrochloric acid.
The preparation method of the low smoke and non-toxic scaling powder of the present embodiment is as follows：According to mass fraction, by low cigarette modified rosin and
Hercolyn D is added in reaction kettle, and reaction kettle is heated to 150 DEG C and is stirred, then by organic solvent, cosolvent, profit
Lubrication prescription, polyglycols and glycerine are added in reaction kettle, 3min are stirred with the rotating speed of 80r/min, then by zinc chloride and ammonium chloride
It is dissolved in hydrochloric acid, is added in reaction kettle, react 10min, then citric acid and aromatic are added in reaction kettle, stirring is equal
It is even, stop heating and adding in into mixture thixotropic agent, thixotropic agent is added to stirring in mixture until emulsifying mixture, stops
Stirring, object to be mixed are frozen into paste, obtain required low smoke and non-toxic scaling powder.
Embodiment 2
A kind of circuit board soldering low smoke and non-toxic scaling powder, according to mass fraction, the ingredient of scaling powder includes：Low cigarette is modified
90 parts of rosin, 10 parts of hercolyn D, 6 parts of zinc chloride, 5 parts of ammonium chloride, 7 parts of hydrochloric acid, 2 parts of polyglycols, 5 parts of glycerine, lemon
4 parts of acid, 20 parts of organic solvent, 3 parts of cosolvent, 3 parts of lubricant, 7 parts of thixotropic agent, 5 parts of aromatic.
Wherein, the preparation method of low cigarette modified rosin is as follows：By rosin resin and hexamethylene according to 3:1 mass ratio adds in
It into reaction kettle, is dissolved at a temperature of 180 DEG C, nickel catalyst is added in reaction kettle, while by pumping interior in reaction kettle
Then vacuum is filled with hydrogen into reaction kettle, pressure is in 10MPa, reaction 5h, after reaction to reaction kettle in holding reaction kettle
It is depressured, while remaining hexamethylene is removed by distilling, be then cooled to room temperature product, obtained required low cigarette and change
Property rosin.
In the present embodiment, organic solvent selection isomery dodecane；The ingredient of cosolvent includes sodium benzoate and sodium salicylate,
The mass ratio of the two is 3:7.Lubricant is nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special；Hydrochloric acid it is a concentration of
3.5mol/L。
The preparation method of the low smoke and non-toxic scaling powder of the present embodiment is as follows：According to mass fraction, by low cigarette modified rosin and
Hercolyn D is added in reaction kettle, and reaction kettle is heated to 160 DEG C and is stirred, then by organic solvent, cosolvent, profit
Lubrication prescription, polyglycols and glycerine are added in reaction kettle, 5min are stirred with the rotating speed of 90r/min, then by zinc chloride and ammonium chloride
It is dissolved in hydrochloric acid, is added in reaction kettle, react 15min, then citric acid and aromatic are added in reaction kettle, stirring is equal
It is even, stop heating and adding in into mixture thixotropic agent, thixotropic agent is added to stirring in mixture until emulsifying mixture, stops
Stirring, object to be mixed are frozen into paste, obtain required low smoke and non-toxic scaling powder.
Embodiment 3
A kind of circuit board soldering low smoke and non-toxic scaling powder, according to mass fraction, the ingredient of scaling powder includes：Low cigarette is modified
85 parts of rosin, 8 parts of hercolyn D, 4 parts of zinc chloride, 3 parts of ammonium chloride, 6 parts of hydrochloric acid, 1.5 parts of polyglycols, 4 parts of glycerine, lemon
3 parts of acid, 17 parts of organic solvent, 2 parts of cosolvent, 2.5 parts of lubricant, 6 parts of thixotropic agent, 4 parts of aromatic.
Wherein, the preparation method of low cigarette modified rosin is as follows：By rosin resin and hexamethylene according to 3:1 mass ratio adds in
It into reaction kettle, is dissolved at a temperature of 165 DEG C, nickel catalyst is added in reaction kettle, while by pumping interior in reaction kettle
Then vacuum is filled with hydrogen into reaction kettle, pressure is in 9MPa, reaction 4h, after reaction to reaction kettle in holding reaction kettle
It is depressured, while remaining hexamethylene is removed by distilling, be then cooled to room temperature product, obtained required low cigarette and change
Property rosin.
In the present embodiment, organic solvent selection butyl acetate.The ingredient of cosolvent include sodium benzoate and sodium salicylate, two
The mass ratio of person is 3:7.Lubricant is nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special；A concentration of 3mol/ of hydrochloric acid
L。
The preparation method of the low smoke and non-toxic scaling powder of the present embodiment is as follows：According to mass fraction, by low cigarette modified rosin and
Hercolyn D is added in reaction kettle, and reaction kettle is heated to 155 DEG C and is stirred, then by organic solvent, cosolvent, profit
Lubrication prescription, polyglycols and glycerine are added in reaction kettle, 4min are stirred with the rotating speed of 85r/min, then by zinc chloride and ammonium chloride
It is dissolved in hydrochloric acid, is added in reaction kettle, react 13min, then citric acid and aromatic are added in reaction kettle, stirring is equal
It is even, stop heating and adding in into mixture thixotropic agent, thixotropic agent is added to stirring in mixture until emulsifying mixture, stops
Stirring, object to be mixed are frozen into paste, obtain required low smoke and non-toxic scaling powder.
Embodiment 4
A kind of circuit board soldering low smoke and non-toxic scaling powder, according to mass fraction, the ingredient of scaling powder includes：Low cigarette is modified
80 parts of rosin, 10 parts of hercolyn D, 4 parts of zinc chloride, 3 parts of ammonium chloride, 5 parts of hydrochloric acid, 2 parts of polyglycols, 4 parts of glycerine, lemon
3 parts of acid, 19 parts of organic solvent, 2 parts of cosolvent, 3 parts of lubricant, 6 parts of thixotropic agent, 3 parts of aromatic.
Wherein, the preparation method of low cigarette modified rosin is as follows：By rosin resin and hexamethylene according to 3:1 mass ratio adds in
It into reaction kettle, is dissolved at a temperature of 160 DEG C, nickel catalyst is added in reaction kettle, while by pumping interior in reaction kettle
Then vacuum is filled with hydrogen into reaction kettle, pressure is in 10MPa, reaction 3h, after reaction to reaction kettle in holding reaction kettle
It is depressured, while remaining hexamethylene is removed by distilling, be then cooled to room temperature product, obtained required low cigarette and change
Property rosin.
In the present embodiment, organic solvent selection isopropanol；The ingredient of cosolvent includes sodium benzoate and sodium salicylate, the two
Mass ratio be 3:7.Lubricant is nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special；A concentration of 2.5mol/ of hydrochloric acid
L。
The preparation method of the low smoke and non-toxic scaling powder of the present embodiment is as follows：According to mass fraction, by low cigarette modified rosin and
Hercolyn D is added in reaction kettle, and reaction kettle is heated to 155 DEG C and is stirred, then by organic solvent, cosolvent, profit
Lubrication prescription, polyglycols and glycerine are added in reaction kettle, 5min are stirred with the rotating speed of 85r/min, then by zinc chloride and ammonium chloride
It is dissolved in hydrochloric acid, is added in reaction kettle, react 10min, then citric acid and aromatic are added in reaction kettle, stirring is equal
It is even, stop heating and adding in into mixture thixotropic agent, thixotropic agent is added to stirring in mixture until emulsifying mixture, stops
Stirring, object to be mixed are frozen into paste, obtain required low smoke and non-toxic scaling powder.
Performance test
According to the standard of JISZ3197-99, to the weldering property energy of the present embodiment scaling powder, corrosivity, flue gas degree and wave
Taste of getting angry is detected, and obtains following test result：
Table 1：The performance test results of the present embodiment scaling powder：
What more than test data showed the scaling powder of the present embodiment helps weldering excellent, without cleaning, soldering after welding
The exhaust gas volumn that journey generates is relatively low, and volatile substance fragrant odour does not generate poisonous and hazardous gas with foreign flavor.
Specific embodiments of the present invention are described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, those skilled in the art can make various deformations or amendments within the scope of the claims, this not shadow
Ring the substantive content of the present invention.
Claims (8)
1. a kind of circuit board soldering low smoke and non-toxic scaling powder, it is characterised in that：According to mass fraction, the ingredient of the scaling powder
Including：Low 80-90 parts of cigarette modified rosin, 6-10 parts of hercolyn D, 3-6 parts of zinc chloride, 2-5 parts of ammonium chloride, hydrochloric acid 5-7
Part, 1-2 parts of polyglycols, 3-5 parts of glycerine, 2-4 parts of citric acid, 15-20 parts of organic solvent, 1-3 parts of cosolvent, 2-3 parts of lubricant,
4-7 parts of thixotropic agent, 3-5 parts of aromatic.
2. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：According to mass parts
Number, the ingredient of the scaling powder include：Low 85 parts of cigarette modified rosin, 8 parts of hercolyn D, 4 parts of zinc chloride, 3 parts of ammonium chloride,
6 parts of hydrochloric acid, 1.5 parts of polyglycols, 4 parts of glycerine, 3 parts of citric acid, 17 parts of organic solvent, 2 parts of cosolvent, 2.5 parts of lubricant, thixotroping
6 parts of agent, 4 parts of aromatic.
3. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：The low cigarette is modified
The preparation method of rosin is as follows：By rosin resin and hexamethylene according to 3:1 mass ratio is added in reaction kettle, in 150-180
It is dissolved at a temperature of DEG C, nickel catalyst is added in reaction kettle, while vacuumized interior in reaction kettle, then to reaction kettle
Hydrogen is inside filled with, pressure in reaction kettle is kept to be depressured after reaction to reaction kettle, simultaneously in 8-10MPa, reaction 3-5h
Remaining hexamethylene by distilling is removed, is then cooled to room temperature product, obtains required low cigarette modified rosin.
4. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：Organic solvent selects
One kind in isopropanol, isomery dodecane and butyl acetate.
5. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：In the cosolvent
Including sodium benzoate and sodium salicylate, the mass ratio of the two is 3:7.
6. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：The lubricant is
Nonylphenol polyoxyethylene ether；Thixotropic agent is rilanit special.
7. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：The hydrochloric acid it is dense
It spends for 2-3.5mol/L.
8. a kind of circuit board soldering low smoke and non-toxic scaling powder according to claim 1, it is characterised in that：The scaling powder
Preparation method is as follows：According to mass fraction, low cigarette modified rosin and hercolyn D are added in reaction kettle, by reaction kettle
It is heated to 150-160 DEG C and stirs, organic solvent, cosolvent, lubricant, polyglycols and glycerine are then added to reaction kettle
In, 3-5min is stirred with the rotating speed of 80-90r/min, zinc chloride and chloride leach are then added to reaction kettle in hydrochloric acid
It is interior, 10-15min is reacted, then citric acid and aromatic are added in reaction kettle, is stirred evenly, stops heating and to mixture
Middle addition thixotropic agent, thixotropic agent is added to stirring in mixture until emulsifying mixture, stops stirring, and object to be mixed is frozen into cream
Shape obtains required low smoke and non-toxic scaling powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810117465.3A CN108213772A (en) | 2018-02-06 | 2018-02-06 | A kind of circuit board soldering low smoke and non-toxic scaling powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810117465.3A CN108213772A (en) | 2018-02-06 | 2018-02-06 | A kind of circuit board soldering low smoke and non-toxic scaling powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108213772A true CN108213772A (en) | 2018-06-29 |
Family
ID=62670562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810117465.3A Withdrawn CN108213772A (en) | 2018-02-06 | 2018-02-06 | A kind of circuit board soldering low smoke and non-toxic scaling powder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108213772A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111390431A (en) * | 2020-04-10 | 2020-07-10 | 苏州万山锡业有限公司 | Manufacturing process of low-smoke solder wire and halogen-free active agent used by manufacturing process |
| EP4000793A4 (en) * | 2020-03-30 | 2023-01-25 | Senju Metal Industry Co., Ltd. | Flux, resin flux cored solder using flux, flux coated solder using flux, and soldering method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101966632A (en) * | 2010-09-29 | 2011-02-09 | 广州瀚源电子科技有限公司 | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
| CN101992361A (en) * | 2009-08-27 | 2011-03-30 | 厦门市及时雨焊料有限公司 | Air pressure spot coating soldering paste for connector |
| CN102366861A (en) * | 2011-06-27 | 2012-03-07 | 吴江市精工铝字制造厂 | Soldering flux for welding aluminum alloy |
| CN103447716A (en) * | 2013-08-23 | 2013-12-18 | 吴江龙硕金属制品有限公司 | Halogen-free soldering flux and preparation method thereof |
| CN104476017A (en) * | 2014-11-13 | 2015-04-01 | 无锡伊佩克科技有限公司 | Soldering aid agent for lead-free solder and preparation method thereof |
| CN105945455A (en) * | 2016-06-29 | 2016-09-21 | 沈根来 | Soldering flux and preparation method thereof |
-
2018
- 2018-02-06 CN CN201810117465.3A patent/CN108213772A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101992361A (en) * | 2009-08-27 | 2011-03-30 | 厦门市及时雨焊料有限公司 | Air pressure spot coating soldering paste for connector |
| CN101966632A (en) * | 2010-09-29 | 2011-02-09 | 广州瀚源电子科技有限公司 | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
| CN102366861A (en) * | 2011-06-27 | 2012-03-07 | 吴江市精工铝字制造厂 | Soldering flux for welding aluminum alloy |
| CN103447716A (en) * | 2013-08-23 | 2013-12-18 | 吴江龙硕金属制品有限公司 | Halogen-free soldering flux and preparation method thereof |
| CN104476017A (en) * | 2014-11-13 | 2015-04-01 | 无锡伊佩克科技有限公司 | Soldering aid agent for lead-free solder and preparation method thereof |
| CN105945455A (en) * | 2016-06-29 | 2016-09-21 | 沈根来 | Soldering flux and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4000793A4 (en) * | 2020-03-30 | 2023-01-25 | Senju Metal Industry Co., Ltd. | Flux, resin flux cored solder using flux, flux coated solder using flux, and soldering method |
| US11858072B2 (en) | 2020-03-30 | 2024-01-02 | Senju Metal Industry Co., Ltd. | Flux, flux-cored solder using flux, flux-coated solder using flux and soldering method |
| CN111390431A (en) * | 2020-04-10 | 2020-07-10 | 苏州万山锡业有限公司 | Manufacturing process of low-smoke solder wire and halogen-free active agent used by manufacturing process |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104858571B (en) | A kind of stannum bismuth system lead-free tin cream halogen-free flux and preparation method thereof | |
| CN101879671B (en) | Halogen-free flux and method for preparing same | |
| CN102794582B (en) | Soldering flux matched with high-melting-point solder and preparation method thereof | |
| CN100532003C (en) | Colophony type non-halide cleaning-free soldering flux for lead-free solder wire | |
| CN104607826B (en) | Cleaning-free solid-state scaling powder for aluminum low-temperature soldering and preparing method | |
| CN102398124B (en) | Water-based cleaning-free flux for lead-free welding flux and preparation method thereof | |
| CN108213772A (en) | A kind of circuit board soldering low smoke and non-toxic scaling powder | |
| CN102581523B (en) | Halogen-free solder paste | |
| CN101391350B (en) | No-cleaning leadless solder and preparation method thereof | |
| CN101596656B (en) | Aqueous cleaning soldering flux for lead-free soldering and preparation method thereof | |
| CN101214594A (en) | Environment-friendly type lead-free solder water-based scaling powder and preparation thereof | |
| CN104476017B (en) | A kind of lead-free solder scaling powder and preparation method thereof | |
| CN109429491A (en) | Scaling powder and welding material | |
| CN101780606A (en) | Washing-free lead-free halogen-free tin soldering paste | |
| CN107442970A (en) | Low temperature No-clean Flux Used for Making Solder Paste and preparation method thereof | |
| CN108555475A (en) | A kind of lead-free and halogen-free solder(ing) paste | |
| CN105921911B (en) | A kind of preformed soldering scaling powder in the few cavity of postwelding | |
| CN109530969A (en) | A kind of environment friendly non-halogen element water-based scaling powder and preparation method thereof | |
| CN104416299B (en) | A kind of water cleaning-type solder(ing) paste scaling powder | |
| CN102528329B (en) | Halogen-free and lead-free solder paste and preparation method | |
| CN110091098A (en) | A kind of low-residual cleaning-free scaling powder and preparation method thereof | |
| CN110877171B (en) | Soldering flux for solder wire and preparation method thereof | |
| CN109530973A (en) | A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees | |
| CN105921905A (en) | Environment-friendly soldering paste and preparing method thereof | |
| CN103706961A (en) | Halogen-free tin paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180629 |