CN108581275B - No-clean type soldering flux - Google Patents
No-clean type soldering flux Download PDFInfo
- Publication number
- CN108581275B CN108581275B CN201711306678.2A CN201711306678A CN108581275B CN 108581275 B CN108581275 B CN 108581275B CN 201711306678 A CN201711306678 A CN 201711306678A CN 108581275 B CN108581275 B CN 108581275B
- Authority
- CN
- China
- Prior art keywords
- parts
- following components
- weight
- acid
- clean
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to the technical field of welding materials, and discloses a no-clean soldering flux which comprises the following components in percentage by mass: the no-clean type soldering flux is characterized by comprising 7.0-8.5% of film forming agent, 3.5-4.0% of active agent, 0.3-0.4% of surfactant, 0.20-0.25% of corrosion inhibitor, 0.45-0.50% of additive and the balance of solvent, wherein the components are uniformly mixed, heated to 70-80 ℃, refluxed and stirred for reaction for 2-2.5 hours, cooled to 20-25 ℃, and filtered to obtain the product.
Description
Technical Field
The invention belongs to the technical field of welding materials, and particularly relates to a no-clean soldering flux.
Background
The soldering is the main technological process in electronic assembly, the soldering flux is the auxiliary material used in soldering, and the main function of the soldering flux is to remove the oxides on the surfaces of the solder and the soldered parent metal, so that the necessary cleanness of the metal surface is achieved. It can prevent surface from being oxidized again during welding, reduce surface tension of solder and raise welding performance. The quality of the soldering flux directly influences the quality of electronic products. In recent decades, rosin resin-based flux mainly composed of rosin, resin, halide-containing activator, additive and organic solvent has been commonly used in the soldering process for electronic product production. Although the soldering flux has good solderability and low cost, the residue after soldering is high, the residue contains halogen ions, the problems of electric insulation performance reduction, short circuit and the like are gradually caused, and the rosin resin soldering flux residue on an electronic printed board needs to be cleaned to solve the problem. This not only increases the production cost, but also the cleaning agent for cleaning the rosin resin flux residue is mainly a fluorochloro compound. The compound is a depletion substance of the atmospheric ozone layer, and belongs to the banned and eliminated list. The technology still used by a plurality of companies belongs to the technology of adopting the rosin tree finger scaling powder to solder and then cleaning by using the cleaning agent, and has lower efficiency and higher cost.
Disclosure of Invention
The invention aims to solve the existing problems and provides a no-clean soldering flux which does not contain a halide activator, has strong capability of removing metal oxides, low splash value, basically no corrosiveness to devices, good welding quality, extremely high surface insulation resistance, no need of cleaning after welding, equipment and solvent saving and environmental protection.
The invention is realized by the following technical scheme:
the no-clean type soldering flux comprises the following components in percentage by mass: 7.0-8.5% of film-forming agent, 3.5-4.0% of active agent, 0.3-0.4% of surfactant, 0.20-0.25% of corrosion inhibitor, 0.45-0.50% of additive and the balance of solvent, uniformly mixing the above components, heating to 70-80 ℃, refluxing, stirring, reacting for 2-2.5 hours, cooling to 20-25 ℃, and filtering to obtain the product, wherein the film-forming agent comprises the following components in parts by weight: 45-55 parts of amino acid ester, 30-35 parts of glycerin monostearate, 25-30 parts of epoxy resin, 20-25 parts of naphthalene diphenol resin and 15-20 parts of bishydroxy biphenyl resin.
As a further description of the above scheme, the active agent consists of the following ingredients in parts by weight: 12-15 parts of adipic acid, 13-15 parts of sebacic acid, 15-18 parts of salicylic acid, 18-20 parts of stearic acid, 21-23 parts of boric acid and 24-26 parts of triethanolamine.
As a further description of the above scheme, the solvent consists of the following components in parts by weight: 80-90 parts of absolute ethyl alcohol, 20-24 parts of ethylene glycol monobutyl ether, 15-18 parts of turpentine and 10-15 parts of ethylene glycol phenyl ether.
As a further description of the above scheme, the surfactant is composed of the following ingredients in parts by weight: OP-1015-20 parts, TX-10 phosphate 12-15 parts, BYK 33310-12 parts and CTAB 8-10 parts.
As a further description of the above scheme, the corrosion inhibitor is composed of the following components in parts by weight: 14-17 parts of triethylamine, 11-13 parts of benzimidazole, 10-12 parts of tolyltriazole and 7-9 parts of benzotriazole.
As a further description of the above scheme, the additive consists of the following components in parts by weight: 18-21 parts of talcum powder, 14-16 parts of activated clay, 12-15 parts of palmitic acid, 10-12 parts of castor oil derivative and 8-10 parts of vegetable wax.
Compared with the prior art, the invention has the following advantages: in order to solve the problems of larger corrosivity to welding parts and serious reoxidation of welding materials and welding surfaces during welding of the existing soldering flux, the invention provides the no-clean soldering flux which does not contain halide activator, prevents the metal to be welded from being oxidized at high temperature, has strong capacity of removing metal oxide, low splash value, basically has no corrosivity to the parts, has good welding quality and extremely high surface insulation resistance, adopts organic acid as an activator, decomposes after reacting with the oxide on the metal surface, absorbs hydrogen gas to generate the organic acid and the metal, the metal is melted into the welding materials to generate new alloy after cooling, the organic acid decomposes or sublimates at the welding temperature, has no residue, adds turpentine in a solvent, not only enables the welding points to be smooth and bright, but also can be matched with a film forming agent, has good compatibility, does not need to be cleaned after welding, saves equipment and the solvent, is beneficial to environmental protection.
Detailed Description
The present invention is further illustrated by the following specific examples.
Example 1
The no-clean type soldering flux comprises the following components in percentage by mass: the preparation method comprises the following steps of uniformly mixing 7.0% of a film forming agent, 3.5% of an active agent, 0.3% of a surfactant, 0.20% of a corrosion inhibitor, 0.45% of an additive and the balance of a solvent, heating to 70 ℃, carrying out reflux stirring reaction for 2 hours, cooling to 20 ℃, and filtering to obtain the product, wherein the film forming agent comprises the following components in parts by weight: 45 parts of amino acid ester, 30 parts of glycerin monostearate, 25 parts of epoxy resin, 20 parts of naphthalene diphenol resin and 15 parts of bishydroxybiphenyl resin.
As a further description of the above scheme, the active agent consists of the following ingredients in parts by weight: 12 parts of adipic acid, 13 parts of sebacic acid, 15 parts of salicylic acid, 18 parts of stearic acid, 21 parts of boric acid and 24 parts of triethanolamine.
As a further description of the above scheme, the solvent consists of the following components in parts by weight: 80 parts of absolute ethyl alcohol, 20 parts of ethylene glycol monobutyl ether, 15 parts of turpentine and 10 parts of ethylene glycol phenyl ether.
As a further description of the above scheme, the surfactant is composed of the following ingredients in parts by weight: OP-1015 parts, TX-10 phosphate 12 parts, BYK 33310 parts and CTAB 8 parts.
As a further description of the above scheme, the corrosion inhibitor is composed of the following components in parts by weight: 14 parts of triethylamine, 11 parts of benzimidazole, 10 parts of tolyltriazole and 7 parts of benzotriazole.
As a further description of the above scheme, the additive consists of the following components in parts by weight: 18 parts of talcum powder, 14 parts of activated clay, 12 parts of palmitic acid, 10 parts of castor oil derivative and 8 parts of vegetable wax.
Example 2
The no-clean type soldering flux comprises the following components in percentage by mass: the preparation method comprises the following steps of uniformly mixing 8.0% of a film forming agent, 3.8% of an active agent, 0.35% of a surfactant, 0.23% of a corrosion inhibitor, 0.48% of an additive and the balance of a solvent, heating to 75 ℃, carrying out reflux stirring reaction for 2.3 hours, cooling to 23 ℃, and filtering to obtain the product, wherein the film forming agent comprises the following components in parts by weight: 50 parts of amino acid ester, 33 parts of glycerin monostearate, 28 parts of epoxy resin, 23 parts of naphthalene diphenol resin and 17 parts of bishydroxybiphenyl resin.
As a further description of the above scheme, the active agent consists of the following ingredients in parts by weight: 13 parts of adipic acid, 14 parts of sebacic acid, 16 parts of salicylic acid, 19 parts of stearic acid, 22 parts of boric acid and 25 parts of triethanolamine.
As a further description of the above scheme, the solvent consists of the following components in parts by weight: 85 parts of absolute ethyl alcohol, 22 parts of ethylene glycol monobutyl ether, 16 parts of turpentine and 12 parts of ethylene glycol phenyl ether.
As a further description of the above scheme, the surfactant is composed of the following ingredients in parts by weight: OP-1017 parts, TX-10 phosphate 13 parts, BYK 33311 parts and CTAB 9 parts.
As a further description of the above scheme, the corrosion inhibitor is composed of the following components in parts by weight: 15 parts of triethylamine, 12 parts of benzimidazole, 11 parts of tolyltriazole and 8 parts of benzotriazole.
As a further description of the above scheme, the additive consists of the following components in parts by weight: 19 parts of talcum powder, 15 parts of activated clay, 13 parts of palmitic acid, 11 parts of castor oil derivative and 9 parts of vegetable wax.
Example 3
The no-clean type soldering flux comprises the following components in percentage by mass: the preparation method comprises the following steps of uniformly mixing 8.5% of a film forming agent, 4.0% of an active agent, 0.4% of a surfactant, 0.25% of a corrosion inhibitor, 0.50% of an additive and the balance of a solvent, heating to 80 ℃, carrying out reflux stirring reaction for 2.5 hours, cooling to 25 ℃, and filtering to obtain the product, wherein the film forming agent comprises the following components in parts by weight: 55 parts of amino acid ester, 35 parts of glycerin monostearate, 30 parts of epoxy resin, 25 parts of naphthalene diphenol resin and 20 parts of bishydroxybiphenyl resin.
As a further description of the above scheme, the active agent consists of the following ingredients in parts by weight: 15 parts of adipic acid, 15 parts of sebacic acid, 18 parts of salicylic acid, 20 parts of stearic acid, 23 parts of boric acid and 26 parts of triethanolamine.
As a further description of the above scheme, the solvent consists of the following components in parts by weight: 90 parts of absolute ethyl alcohol, 24 parts of ethylene glycol monobutyl ether, 18 parts of turpentine and 15 parts of ethylene glycol phenyl ether.
As a further description of the above scheme, the surfactant is composed of the following ingredients in parts by weight: OP-1020 parts, TX-10 phosphate ester 15 parts, BYK 33312 parts and CTAB 10 parts.
As a further description of the above scheme, the corrosion inhibitor is composed of the following components in parts by weight: triethylamine, benzimidazole, tolyltriazole and benzotriazole.
As a further description of the above scheme, the additive consists of the following components in parts by weight: 21 parts of talcum powder, 16 parts of activated clay, 15 parts of palmitic acid, 12 parts of castor oil derivative and 10 parts of vegetable wax.
Comparative example 1
The only difference from example 1 is that inorganic metal salt is used as the active agent, and one or more of zinc chloride, stannic chloride, lead chloride and sodium fluoride can be used, and the rest is kept unchanged.
Comparative example 2
The only difference from example 2 is that rosin was used as film former, the rest remaining unchanged.
Example 3
The difference from the example 3 is only that the following components are contained in percentage by mass: 10.5 percent of film forming agent, 5.0 percent of active agent, 0.8 percent of surfactant, 0.4 percent of corrosion inhibitor, 0.6 percent of additive and the balance of solvent, and the balance is kept consistent.
Comparative test
The methods of examples 1-3 and comparative examples 1-3 were used to prepare the flux, while the existing rosin flux was used as a control, and the solder wire was used as a flux, and each group of flux was used to solder copper sheets, keeping the independent variables consistent, and recording the soldering performance as shown in the following table:
the following tests show that: the flux prepared by the invention is prepared according to the compatibility among the components and the volatility after welding, has good compatibility, strong capability of removing metal oxides, low splash value, no corrosion to devices basically, good welding quality and extremely high surface insulation resistance, does not need to be cleaned after welding, saves equipment and solvent and is beneficial to environmental protection.
Claims (6)
1. The no-clean soldering flux is characterized by comprising the following components in percentage by mass: 7.0-8.5% of film-forming agent, 3.5-4.0% of active agent, 0.3-0.4% of surfactant, 0.20-0.25% of corrosion inhibitor, 0.45-0.50% of additive and the balance of solvent, uniformly mixing the components, heating to 70-80 ℃, refluxing, stirring, reacting for 2-2.5 hours, cooling to 20-25 ℃, and filtering to obtain the product, wherein the film-forming agent comprises the following components in parts by weight: 45-55 parts of amino acid ester, 30-35 parts of glycerin monostearate, 25-30 parts of epoxy resin, 20-25 parts of naphthalene diphenol resin and 15-20 parts of bishydroxy biphenyl resin.
2. The no-clean flux according to claim 1, wherein the active agent comprises the following components in parts by weight: 12-15 parts of adipic acid, 13-15 parts of sebacic acid, 15-18 parts of salicylic acid, 18-20 parts of stearic acid, 21-23 parts of boric acid and 24-26 parts of triethanolamine.
3. The no-clean flux according to claim 1, wherein the solvent comprises the following components in parts by weight: 80-90 parts of absolute ethyl alcohol, 20-24 parts of ethylene glycol monobutyl ether, 15-18 parts of turpentine and 10-15 parts of ethylene glycol phenyl ether.
4. The no-clean flux according to claim 1, wherein the surfactant comprises the following components in parts by weight: OP-1015-20 parts, TX-10 phosphate 12-15 parts, BYK 33310-12 parts and CTAB 8-10 parts.
5. The no-clean flux according to claim 1, wherein the corrosion inhibitor comprises the following components in parts by weight: 14-17 parts of triethylamine, 11-13 parts of benzimidazole, 10-12 parts of tolyltriazole and 7-9 parts of benzotriazole.
6. The no-clean flux according to claim 1, wherein the additive comprises the following components in parts by weight: 18-21 parts of talcum powder, 14-16 parts of activated clay, 12-15 parts of palmitic acid, 10-12 parts of castor oil derivative and 8-10 parts of vegetable wax.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711306678.2A CN108581275B (en) | 2017-12-11 | 2017-12-11 | No-clean type soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711306678.2A CN108581275B (en) | 2017-12-11 | 2017-12-11 | No-clean type soldering flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108581275A CN108581275A (en) | 2018-09-28 |
| CN108581275B true CN108581275B (en) | 2020-12-04 |
Family
ID=63633083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711306678.2A Active CN108581275B (en) | 2017-12-11 | 2017-12-11 | No-clean type soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108581275B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111716038A (en) * | 2019-03-20 | 2020-09-29 | 天津市同鑫泰钢管制造有限公司 | Anti-cracking soldering flux for welding of long-distance transportation spiral steel pipe |
| CN112048363A (en) * | 2020-09-16 | 2020-12-08 | 江苏赢新润滑科技有限公司 | Environment-friendly anti-splashing liquid for automobile welding |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SE457335B (en) * | 1984-07-20 | 1988-12-19 | Ytkemiska Inst | FLUID SOFTWARE FOR SOFT WOOLING AND PROCEDURE FOR SOFT WOOLING WITH USE OF THE FLUID SOFTWARE |
| CN103084755A (en) * | 2013-01-31 | 2013-05-08 | 广东普赛特电子科技股份有限公司 | Blending modification halogen-free solder paste and preparation method thereof |
| CN103192200A (en) * | 2013-03-24 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | Three-prevention electronic liquid soldering flux and preparation method thereof |
| CN104400257B (en) * | 2014-10-29 | 2017-02-01 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
| CN106392380A (en) * | 2016-10-26 | 2017-02-15 | 安徽飞达电气科技有限公司 | No-clean flux high in welding passing rate |
-
2017
- 2017-12-11 CN CN201711306678.2A patent/CN108581275B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN108581275A (en) | 2018-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101966632B (en) | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof | |
| JP4601670B2 (en) | Aqueous antioxidants of tin and tin alloys | |
| CN100528462C (en) | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof | |
| EP3650164B1 (en) | Flux and soldering material | |
| CN102357746A (en) | Low-content modified rosin halogen-free soldering flux for lead-free solder wires | |
| CN105014253A (en) | Lead-free tin solder paste and preparation method thereof | |
| CN102366862B (en) | A kind of halogen-free soldering flux with low solid content and preparation method thereof | |
| CN108581275B (en) | No-clean type soldering flux | |
| CN109262162A (en) | A kind of high-performance solder(ing) paste | |
| CN103042319A (en) | Water-base halogen-free no-clean scaling powder used for lead-free solder | |
| CN111299896B (en) | Soldering paste and preparation method thereof | |
| CN101733573B (en) | Lead-free and halogen-free environmental soldering paste for electronic industry | |
| KR102422105B1 (en) | Flux and Solder Paste | |
| CN111590233B (en) | High-weldability environment-friendly superfine solder wire for intelligent manipulator welding and preparation method thereof | |
| CN102166692B (en) | Halogen-free soldering flux | |
| CN85102604A (en) | Resina-type flux of brazing | |
| CN114571138B (en) | Environment-friendly soldering flux and preparation method and application thereof | |
| CN112621013B (en) | Soldering tin bar special for solar photovoltaic solder strip and preparation method thereof | |
| JP7097611B2 (en) | Flux and solder materials | |
| CN112621012A (en) | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof | |
| CN110977250A (en) | Soldering flux and preparation method thereof | |
| CN114367760B (en) | High-reliability halogen-free lead-free soldering paste and preparation method thereof | |
| CN108817733A (en) | A kind of halogen-free scaling powder and preparation method thereof | |
| CN115781098B (en) | High-temperature-resistant and oxidation-resistant soldering tin powder and solder paste containing metal indium and preparation methods thereof | |
| CN117773414A (en) | Solder paste for welding sintered silver pads of battery pieces |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201117 Address after: 233300 beside zhesu shuixibian, Longgang Road, Bengbu City, Anhui Province Applicant after: Wuhe Junbao Steel Structure Co.,Ltd. Address before: 242500 Wei five road, Jingchuan Town Economic Development Zone, Jingxian County, Xuancheng, Anhui. Applicant before: ANHUI BAOCHEN ELECTROMECHANICAL EQUIPMENT TECHNOLOGY Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A washable soldering flux Effective date of registration: 20230605 Granted publication date: 20201204 Pledgee: Huishang Bank Co.,Ltd. Bengbu Wuhe sub branch Pledgor: Wuhe Junbao Steel Structure Co.,Ltd. Registration number: Y2023980042796 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |