CN109514125A - A kind of solder(ing) paste - Google Patents
A kind of solder(ing) paste Download PDFInfo
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- CN109514125A CN109514125A CN201811551398.2A CN201811551398A CN109514125A CN 109514125 A CN109514125 A CN 109514125A CN 201811551398 A CN201811551398 A CN 201811551398A CN 109514125 A CN109514125 A CN 109514125A
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- China
- Prior art keywords
- weight percent
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- ing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to be related to lotion technical field of welding materials, more particularly to a kind of solder(ing) paste, including scaling powder and kamash alloy powder, scaling powder includes the raw material of following weight percent: thixotropic agent 2%-15%, activating agent 0%-13%, newtrex 17%-22%, hydrogenated rosin 0%-12%, surplus are organic solvent；Thixotropic agent includes the raw material of following weight percent: ethylene bis stearamide 0%-5%, and high-performance amide waxe micro mist 0%-4%, polyamide modified rilanit special derivative 0%-3%, surplus is butyl carbitol-terpinol mixture；Activating agent includes the raw material of following weight percent: decyl acid 1%-6%, fluorinated surfactant 0.5%-5%, 2- ethyl imidazol(e) 1%-5%, and surplus is butyl carbitol-terpinol mixture；Present invention improves tin cream ontology gravity flow flat characteristics, improve the consistency that conducting repeated adhesion takes tin cream amount；Wetability when also improving welding also improves remaining insulation impedance value after welding simultaneously.
Description
Technical field
The present invention relates to be related to lotion technical field of welding materials, and in particular to a kind of solder(ing) paste.
Background technique
With the development of electronic technology, surface mounting technology occupies the effect increasingly reused in electronics assembly technology,
And solder(ing) paste is the most important auxiliary stood in the breach with the development of electronic technology especially surface mounting technology
One of material.Solder(ing) paste is a complicated system, is the cream as made of solder powder, scaling powder and other additives mixeds
Body.Solder(ing) paste has certain viscosity at normal temperature, electronic component just can be sticked to commitment positions, under welding temperature, with
The volatilization of solvent and portions additive will be formed together with printed circuit pad solder permanently connected by weldering component.Especially
It is with the development of Chinese electronic technology in recent years, in high-end, High Density Packaging field.Traditional solder(ing) paste operator when in use
The frequency for scraping tin cream of member is high, and the wetability of product is low after the completion of welding and insulation impedance value is low.
Summary of the invention
In view of the problems of the existing technology, the present invention provides a kind of solder(ing) pastes.
To solve the above problems, the present invention the following technical schemes are provided:
A kind of solder(ing) paste, including scaling powder and kamash alloy powder, the scaling powder include the raw material of following weight percent:
Thixotropic agent 2%-15%, activating agent 0%-13%, newtrex 17%-22%, hydrogenated rosin 0%-12%, surplus are organic molten
Agent；The thixotropic agent includes the raw material of following weight percent: ethylene bis stearamide 0%-5%, high-performance amide waxe micro mist
0%-4%, polyamide modified rilanit special derivative 0%-3%, surplus are butyl carbitol-terpinol mixture；
The activating agent includes the raw material of following weight percent: decyl acid 1%-6%, fluorinated surfactant 0.5%-5%, 2-
Ethyl imidazol(e) 1%-5%, surplus are butyl carbitol-terpinol mixture.
Further, the kamash alloy powder is made of tin Sn 8%, lead Pb 90.5%, silver Ag 1.5%.
Further, ethylene bis stearamide 5%, high-performance amide waxe micro mist 2.5%, polyamide modified hydrogenated castor
Oily derivative 2.5%.
Further, the activating agent includes the raw material of following weight percent: decyl acid 5%, fluorine surface-active
Agent 2%, 2- ethyl imidazol(e) 3%.
Further, the weight ratio of the scaling powder and kamash alloy powder is (8%-13%): (88%-93%).
Further, the scaling powder further includes hydroquinone 0%-5%.
The utility model has the advantages that the present invention is reduced by adjusting the component in thixotropic agent so as to improve tin cream ontology gravity flow flat characteristic
The frequency for scraping tin cream of operator improves the consistency that conducting repeated adhesion takes tin cream amount；By adjusting the activating agent inside tin cream at
Part, traditional amine salt activating agent is removed, uses the acids and imidazoles activating agent of part long-chain instead, not only improves profit when welding
It is moist at the same also improve welding after remaining insulation impedance value, to improve the electrical property of consumer product.
Specific embodiment
Method of the invention is illustrated below by specific embodiment, but the present invention is not limited thereto.Following realities
Experimental method described in example is applied, is conventional method unless otherwise specified.
Ethylene bis stearamide 5%, high-performance amide waxe micro mist 2.5%, polyamide modified rilanit special derivative
2.5%；The activating agent includes the raw material of following weight percent: decyl acid 5%, fluorinated surfactant 2%, 2- ethyl
Imidazoles 3%；The weight ratio of the scaling powder and kamash alloy powder is (8%-13%): (88%-93%)；The scaling powder also wraps
Include hydroquinone 0%-5%
Embodiment one, by weight ratio be 7%:93% scaling powder and kamash alloy powder form, the scaling powder include with
The raw material of lower weight percent: thixotropic agent 6%, activating agent 6%, newtrex 21%, hydrogenated rosin 8%, organic solvent are
59%, kamash alloy powder is made of tin Sn 8%, lead Pb 90.5%, silver Ag 1.5%, and thixotropic agent includes following weight percent
Raw material: ethylene bis stearamide 5%, high-performance amide waxe micro mist 2.5%, polyamide modified rilanit special derivative
2.5%, butyl carbitol-terpinol mixture 90%；Activating agent includes the raw material of following weight percent: decyl acid
5%, fluorinated surfactant 2%, 2- ethyl imidazol(e) 3%, butyl carbitol-terpinol mixture has 90%.
Preparation method is the following steps are included: first by the newtrex of above-mentioned weight percent, hydrogenated rosin and organic molten
Agent is placed in reaction kettle and mixes, and is heated with stirring to 150 DEG C and is dissolved；Then thixotropic agent and activating agent are added into reaction kettle；
Again after reaction kettle fully reacting, it is cooled to room temperature, scaling powder is prepared；In proportion by scaling powder and kamash alloy powder finally
It is mixed in dispersion machine, is made after mixing evenly.
Several preferred embodiments of the invention have shown and described in above description, but as previously described, it should be understood that the present invention
Be not limited to forms disclosed herein, should not be regarded as an exclusion of other examples, and can be used for various other combinations,
Modification and environment, and the above teachings or related fields of technology or knowledge can be passed through within that scope of the inventive concept describe herein
It is modified.And changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, then it all should be in this hair
In the protection scope of bright appended claims.
Claims (6)
1. a kind of solder(ing) paste, including scaling powder and kamash alloy powder, which is characterized in that the scaling powder includes following weight percent
The raw material of ratio: thixotropic agent 2%-15%, activating agent 0%-13%, newtrex 17%-22%, hydrogenated rosin 0%-12% are remaining
Amount is organic solvent；
The thixotropic agent includes the raw material of following weight percent: ethylene bis stearamide 0%-5%, high-performance amide waxe micro mist
0%-4%, polyamide modified rilanit special derivative 0%-3%, surplus are butyl carbitol-terpinol mixture；
The activating agent includes the raw material of following weight percent: decyl acid 1%-6%, fluorinated surfactant 0.5%-5%, 2-
Ethyl imidazol(e) 1%-5%, surplus are butyl carbitol-terpinol mixture.
2. a kind of solder(ing) paste according to claim 1, which is characterized in that the kamash alloy powder is by tin Sn 8%, lead Pb
90.5%, silver Ag 1.5% is formed.
3. a kind of solder(ing) paste according to claim 1, which is characterized in that the thixotropic agent includes following weight percent
Raw material: ethylene bis stearamide 5%, high-performance amide waxe micro mist 2.5%, polyamide modified rilanit special derivative
2.5%.
4. a kind of solder(ing) paste according to claim 1, which is characterized in that the activating agent includes following weight percent
Raw material: decyl acid 5%, fluorinated surfactant 2%, 2- ethyl imidazol(e) 3%.
5. a kind of solder(ing) paste according to claim 1, which is characterized in that the weight ratio of the scaling powder and kamash alloy powder
For (8%-13%): (88%-93%).
6. a kind of solder(ing) paste according to claim 1, which is characterized in that the scaling powder further includes hydroquinone 0%-
5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811551398.2A CN109514125A (en) | 2018-12-18 | 2018-12-18 | A kind of solder(ing) paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811551398.2A CN109514125A (en) | 2018-12-18 | 2018-12-18 | A kind of solder(ing) paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109514125A true CN109514125A (en) | 2019-03-26 |
Family
ID=65796656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811551398.2A Pending CN109514125A (en) | 2018-12-18 | 2018-12-18 | A kind of solder(ing) paste |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109514125A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115213585A (en) * | 2022-06-28 | 2022-10-21 | 成都凯天电子股份有限公司 | Composite activator for aluminum alloy active tungsten argon arc welding and preparation method thereof |
| CN115971719A (en) * | 2023-02-27 | 2023-04-18 | 深圳市唯特偶新材料股份有限公司 | Solder paste for improving welding cavity of large-area bonding pad of electronic device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107107278A (en) * | 2015-02-05 | 2017-08-29 | 株式会社弘辉 | Scaling powder activating agent, scaling powder and soft solder |
| JPWO2018003820A1 (en) * | 2016-06-29 | 2018-07-05 | 株式会社タムラ製作所 | Flux composition, solder paste composition, and electronic circuit board |
| CN108274153A (en) * | 2018-02-01 | 2018-07-13 | 江兵 | A kind of special scaling powder of solder(ing) paste and preparation method thereof |
| CN108544140A (en) * | 2018-04-26 | 2018-09-18 | 东莞市仁信电子有限公司 | Semiconductor special-purpose high temperature solder(ing) paste |
| CN108555475A (en) * | 2018-04-27 | 2018-09-21 | 深圳市博士达焊锡制品有限公司 | A kind of lead-free and halogen-free solder(ing) paste |
| CN108655606A (en) * | 2018-08-02 | 2018-10-16 | 烟台艾邦电子材料有限公司 | A kind of formula and preparation method thereof of low melting point SMT solder(ing) pastes |
-
2018
- 2018-12-18 CN CN201811551398.2A patent/CN109514125A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107107278A (en) * | 2015-02-05 | 2017-08-29 | 株式会社弘辉 | Scaling powder activating agent, scaling powder and soft solder |
| JPWO2018003820A1 (en) * | 2016-06-29 | 2018-07-05 | 株式会社タムラ製作所 | Flux composition, solder paste composition, and electronic circuit board |
| CN108274153A (en) * | 2018-02-01 | 2018-07-13 | 江兵 | A kind of special scaling powder of solder(ing) paste and preparation method thereof |
| CN108544140A (en) * | 2018-04-26 | 2018-09-18 | 东莞市仁信电子有限公司 | Semiconductor special-purpose high temperature solder(ing) paste |
| CN108555475A (en) * | 2018-04-27 | 2018-09-21 | 深圳市博士达焊锡制品有限公司 | A kind of lead-free and halogen-free solder(ing) paste |
| CN108655606A (en) * | 2018-08-02 | 2018-10-16 | 烟台艾邦电子材料有限公司 | A kind of formula and preparation method thereof of low melting point SMT solder(ing) pastes |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115213585A (en) * | 2022-06-28 | 2022-10-21 | 成都凯天电子股份有限公司 | Composite activator for aluminum alloy active tungsten argon arc welding and preparation method thereof |
| CN115213585B (en) * | 2022-06-28 | 2023-12-15 | 成都凯天电子股份有限公司 | Composite active agent for aluminum alloy active tungsten electrode argon arc welding and preparation method thereof |
| CN115971719A (en) * | 2023-02-27 | 2023-04-18 | 深圳市唯特偶新材料股份有限公司 | Solder paste for improving welding cavity of large-area bonding pad of electronic device |
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Application publication date: 20190326 |
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