CN115971719A - Solder paste for improving welding cavity of large-area bonding pad of electronic device - Google Patents
Solder paste for improving welding cavity of large-area bonding pad of electronic device Download PDFInfo
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- CN115971719A CN115971719A CN202310171228.6A CN202310171228A CN115971719A CN 115971719 A CN115971719 A CN 115971719A CN 202310171228 A CN202310171228 A CN 202310171228A CN 115971719 A CN115971719 A CN 115971719A
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- 238000003466 welding Methods 0.000 title claims abstract description 39
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 36
- 238000005476 soldering Methods 0.000 claims abstract description 33
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 31
- 239000000843 powder Substances 0.000 claims abstract description 31
- 230000004907 flux Effects 0.000 claims abstract description 28
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 20
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 20
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 20
- 150000007524 organic acids Chemical class 0.000 claims abstract description 12
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 11
- 239000013543 active substance Substances 0.000 claims abstract description 10
- 239000004094 surface-active agent Substances 0.000 claims abstract description 10
- -1 polysiloxane Polymers 0.000 claims abstract description 8
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- DAXAFMSSNPTLPA-UHFFFAOYSA-N oxan-4-yl(phenyl)methanol Chemical compound C=1C=CC=CC=1C(O)C1CCOCC1 DAXAFMSSNPTLPA-UHFFFAOYSA-N 0.000 claims abstract description 6
- 230000005496 eutectics Effects 0.000 claims abstract description 4
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 11
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 11
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 10
- 239000002904 solvent Substances 0.000 claims description 10
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 6
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 6
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 6
- 239000004359 castor oil Substances 0.000 claims description 6
- 235000019438 castor oil Nutrition 0.000 claims description 6
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 6
- 239000001630 malic acid Substances 0.000 claims description 6
- 235000011090 malic acid Nutrition 0.000 claims description 6
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 6
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 6
- 239000012190 activator Substances 0.000 claims description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 4
- 239000011800 void material Substances 0.000 claims description 4
- 239000012188 paraffin wax Substances 0.000 claims description 3
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 2
- CYEJMVLDXAUOPN-UHFFFAOYSA-N 2-dodecylphenol Chemical compound CCCCCCCCCCCCC1=CC=CC=C1O CYEJMVLDXAUOPN-UHFFFAOYSA-N 0.000 claims description 2
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- 239000001361 adipic acid Substances 0.000 claims description 2
- 235000011037 adipic acid Nutrition 0.000 claims description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical class C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 claims 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 10
- 238000009835 boiling Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 7
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 abstract description 3
- 229960004217 benzyl alcohol Drugs 0.000 abstract description 3
- 235000019445 benzyl alcohol Nutrition 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000012360 testing method Methods 0.000 description 7
- 239000002994 raw material Substances 0.000 description 6
- 239000003112 inhibitor Substances 0.000 description 4
- 239000001384 succinic acid Substances 0.000 description 4
- MQGIBEAIDUOVOH-UHFFFAOYSA-N 1-[2-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCOCCCC MQGIBEAIDUOVOH-UHFFFAOYSA-N 0.000 description 3
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- 239000000126 substance Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- NDSYZZUVPRGESW-UHFFFAOYSA-N 2-(2-octoxyethoxy)ethanol Chemical compound CCCCCCCCOCCOCCO NDSYZZUVPRGESW-UHFFFAOYSA-N 0.000 description 1
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
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Abstract
A solder paste for improving welding holes of large-area bonding pads of electronic devices comprises alloy powder and soldering flux, wherein the alloy powder is formed by mixing one or more than two tin-based alloy powders and has eutectic composition, and the soldering flux is composed of the following components in percentage by weight: 22 to 44 percent of modified rosin, 11 to 16 percent of thixotropic agent, 4 to 10 percent of organic acid active agent, 5 to 8 percent of surfactant and 0.5 to 1.5 percent of organic modified polysiloxane, and the balance of phenyl (tetrahydro-2H-pyran-4-yl) methanol, wherein the phenyl methanol has a low boiling point design, the boiling point temperature is 112 to 113 degrees, and the low boiling point is designed, so that the phenyl methanol can be boiled quickly in the temperature rising process, not only the bubble formation in the welding process is broken, but also a quick escape channel is formed, and the release efficiency and the effect of gas can be greatly improved.
Description
Technical Field
The invention relates to the field of processing materials of electronic devices, in particular to a soldering paste for improving a welding cavity of a large-area bonding pad of an electronic device.
Background
In the current electronic assembly connection, a Surface Mount Technology (SMT) is generally adopted, and solder paste welding is more and more widely applied to the welding process of various electronic devices and can well play the welding role. With the higher precision of electronic devices, higher requirements are put forward on the reliability of welding spots, including mechanical properties such as welding strength, welding spot brittleness, impact toughness, shock resistance, drop resistance and the like, and also including heat conduction performance and electric conduction performance of the welding spots. Among these critical properties, solder voiding is a major concern. Once the area of the cavity is too large, the mechanical performance of the solder joint is reduced, and meanwhile, the transmission of electrical signals and the heat transmission of the device during working are influenced, so that the service life of the solder joint is finally greatly reduced, and the reliability problem of soldering is caused.
In the actual welding process, water contained in the solder paste is heated and evaporated into water vapor, the water vapor generated by the reaction of the organic acid activator and the metal oxide and other solvents are volatilized into gas, the gas substances must smoothly escape from the molten solder to form a full welding point, otherwise, the gas substances are wrapped by the subsequently solidified solder alloy to form a cavity inside or on the surface of the welding point. When the area of the welding spot is smaller, on one hand, the volume of the required solder paste is smaller, and the amount of the formed volatile gas is less; on the other hand, the gas has small resistance and short distance to escape to the welding spot, and the gas can escape more easily. Therefore, the welding void ratio of the small welding spots is usually smaller, and most of the solder paste in the current industry can meet the welding void requirement of the small welding spots. On the contrary, the welding holes of the large-area welding pad are not controlled, the required amount of tin paste is large, more water vapor is needed, the water vapor is easier to wrap by a large amount of molten solder, the number of the holes formed after welding is large, and the single area is huge. Such as a heat sink pad of QFN, a heat sink pad of MOS, a DBC of igbt, etc. The voids of QFN and MOS heat dissipation pads are basically above 25%, and even below 40% are difficult to control. There is no effective solution for this within the industry.
In contrast, chinese patent CN200580045159 and japanese patent 2003-264367 both solve the problem of bubble voids by selecting a special rosin resin, while in japanese patent 10-178261, the void voids are reduced by selecting a specific active agent, and chinese patent CN 102528315A uses a specific acid anhydride additive to eliminate moisture during the soldering process, but this method only consumes moisture to a certain extent and reduces voids caused by moisture residue, and cannot substantially contribute to the volatilization of the solvent in the solder paste.
The Chinese invention patent CN202011178823.5 discloses a laser soldering tin paste and a preparation method thereof, and the adopted technical scheme is as follows: a laser welding solder paste comprises, by weight, 86-88% of alloy powder and 12-14% of paste flux; the alloy powder is an alloy powder with eutectic components formed by mixing one or more than two tin-based alloy powders; the paste flux consists of the following raw materials in percentage by weight: 35-50% of rosin, 5-10% of thixotropic agent, 3-6% of organic acid active agent, 1-3% of organic halogen active agent, 35-45% of organic solvent and 5-10% of special solvent. The invention has the advantages that: the flux boiling caused by rapid temperature rise can be inhibited, and the effect of inhibiting the solder balls and the flux from splashing caused by rapid heating of the solder paste is realized.
Disclosure of Invention
The invention aims to provide soldering paste for improving the welding cavity of a large-area bonding pad of an electronic device, which can greatly reduce the welding cavity of the large-area bonding pad and improve the welding quality of a large welding spot.
In order to achieve the purpose, the invention provides the following technical scheme:
a solder paste for improving welding holes of large-area bonding pads of electronic devices comprises alloy powder and soldering flux, wherein the alloy powder is formed by mixing one or more than two tin-based alloy powders and has eutectic composition, and the soldering flux is composed of the following components in percentage by weight: 22 to 44 percent of modified rosin, 11 to 16 percent of thixotropic agent, 4 to 10 percent of organic acid active agent, 5 to 8 percent of surfactant, 0.5 to 1.5 percent of organic modified polysiloxane and the balance of solvent phenyl (tetrahydro-2H-pyran-4-yl) methanol.
Further, the modified rosin is preferably at least one of water-white hydrogenated rosin and acrylic rosin.
Further, the thixotropic agent is preferably at least one of a stemmed castor oil, stearic acid, oleic acid amide and a high molecular paraffin.
Further, the organic acid activator is preferably at least one of succinic acid, adipic acid, azelaic acid, glutaric acid, citric acid, and malic acid.
Further, the surfactant is preferably at least one of nonylphenol polyoxyethylene ether, octylphenol polyoxyethylene ether, and dodecylphenol polyoxyethylene ether.
Further, the alloy powder was Sn42Bi58 having a melting point of 138 ℃ or Sn96.5Ag3.0Cu0.5 having a melting point of 217 ℃.
Has the advantages that:
the modified rosin used in the invention has good wettability and high activity, and can quickly remove micro oxides on the surface of a large bonding pad and oxides on the surface of tin powder, so that molten solder can be quickly spread on the surface of the bonding pad;
the used organic modified polysiloxane serving as the bubble inhibitor can greatly improve the exhaust efficiency of the molten solder at high temperature, and provides a channel for quickly escaping water vapor generated in the welding process, so that large-area cavities caused by bubble residues are reduced, and the effect is particularly obvious in the welding process of large-area bonding pads.
The solvent adopts phenyl (tetrahydro-2H-pyran-4-yl) methanol, not only has the effect of the solvent, but also has the design of low boiling point, the boiling point temperature is 112-113 degrees, compared with the traditional solvent of tetraethylene glycol dibutyl ether, the boiling point is about 370 degrees, the boiling point is low, so that the solvent can be quickly boiled in the temperature rising process, not only bubbles are broken in the welding process, but also a quick escape channel is formed, and the release efficiency and the effect of gas can be greatly improved.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Example 1:
a solder paste for improving welding cavities of large-area bonding pads of electronic devices comprises the following raw materials in parts by weight: the soldering flux consists of soldering flux and alloy powder, wherein the alloy powder is 89.5 percent, and the soldering flux is 10.5 percent. Wherein the alloy powder is Sn96.5Ag3.0Cu0.5 with the melting point of 138 ℃ prepared according to the joint industrial standard J-STD-005; the soldering flux consists of the following components: 17% of water white hydrogenated rosin and 19% of acrylic acid rosin; the thixotropic agent is 11% of the stemmed castor oil; the organic acid active agents comprise 3.5 percent of succinic acid and 2.6 percent of malic acid; the surfactant is 5.6 percent of nonylphenol polyoxyethylene ether; 1.5 percent of organic modified polysiloxane; the balance being phenyl (tetrahydro-2H-pyran-4-yl) methanol.
The test performance results are shown in table 1 for example 1.
Example 2
A solder paste for improving welding cavities of large-area bonding pads of electronic devices comprises the following raw materials in parts by weight: the soldering flux consists of soldering flux and alloy powder, wherein the alloy powder is 89.5 percent, and the soldering flux is 10.5 percent. Wherein the alloy powder is Sn96.5Ag3.0Cu0.5 with the melting point of 138 ℃ prepared according to the joint industrial standard J-STD-005; the soldering flux consists of the following components: water white hydrogenated rosin 35%; the thixotropic agent is 16% of high molecular paraffin; the organic acid active agent is 6.5 percent of azelaic acid and 2.6 percent of citric acid; the surfactant is 8% of octyl phenol polyoxyethylene ether; 1% of organic modified polysiloxane; the balance being phenyl (tetrahydro-2H-pyran-4-yl) methanol.
The test performance results are shown in table 1, example 2.
Example 3:
a solder paste for improving welding cavities of large-area bonding pads of electronic devices comprises the following raw materials in parts by weight: the soldering flux consists of 90.5% of soldering flux and 9.5% of alloy powder. Wherein the alloy powder is Sn96.5Ag3.0Cu0.5 with the melting point of 138 ℃ prepared according to the joint industrial standard J-STD-005; the soldering flux consists of the following components: 14% of water-white hydrogenated rosin and 16% of acrylic rosin; the thixotropic agent is 14 percent of the stemmed castor oil; the organic acid active agents comprise 4.5 percent of succinic acid and 3.6 percent of malic acid; the surfactant is 8% of nonylphenol polyoxyethylene ether; the bubble inhibitor is 1.0 percent of organic modified polysiloxane; the balance being tetraethylene glycol dibutyl ether.
The test performance results are shown in table 1, example 3.
Comparative example 1:
the comparative example consists of the following raw materials in weight ratio: the soldering flux consists of soldering flux and alloy powder, wherein the alloy powder is 89.5 percent, and the soldering flux is 10.5 percent. Wherein the alloy powder is Sn96.5Ag3.0Cu0.5 with the melting point of 138 ℃ prepared according to the joint industrial standard J-STD-005; the soldering flux consists of the following components: 17% of water white hydrogenated rosin and 19% of acrylic rosin; the thixotropic agent is 11% of the stemmed castor oil; the organic acid active agents comprise 3.5 percent of succinic acid and 2.6 percent of malic acid; 5.6 percent of nonylphenol polyoxyethylene ether as a surfactant; the balance of organic solvent diethylene glycol octyl ether.
The results of the test properties are shown in table 1 for comparative example 1.
Comparative example 2:
the comparative example consists of the following raw materials in weight ratio: the soldering flux consists of 90.5% of soldering flux and 9.5% of alloy powder. Wherein the alloy powder is Sn96.5Ag3.0Cu0.5 with the melting point of 138 ℃ prepared according to the joint industrial standard J-STD-005; the soldering flux consists of the following components: 14% of water-white hydrogenated rosin and 16% of acrylic rosin; the thixotropic agent is 14 percent of the stemmed castor oil; the organic acid activator is 4.5 percent of succinic acid and 3.6 percent of malic acid; the surfactant is 8% of nonylphenol polyoxyethylene ether; the balance being tetraethylene glycol dibutyl ether.
The test performance results are shown in table 1 for comparative example 2.
Table 1 test performance results
| DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION | Hole test data |
| Example 1 | 11.3％ |
| Example 2 | 13.6％ |
| Example 3 | 19.6％ |
| Comparative example 1 | 33.4％ |
| Comparative example 2 | 31.7％ |
As can be seen from table 1, it is,
the use of the bubble inhibitor resulted in a very significant reduction in the number of dissolved voids, and it was found that the inhibitor organomodified polysiloxane indeed improved the venting efficiency of molten solder during high temperature soldering, and ultimately significantly reduced solder voids.
After the new solvent is replaced, the welding cavity is reduced more obviously, so that the generation of the cavity is broken by adding the phenylcarbinol with the low boiling point, the airflow release rate and the release effect are improved, and the welding cavity is reduced greatly finally.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (7)
1. The utility model provides an improve empty soldering paste of electron device large tracts of land pad welding, includes alloy powder and scaling powder, and the alloy powder is mixed by one or more than two kinds of tin base alloy powder and is formed, has the alloy powder that the eutectic is constituteed, its characterized in that: the soldering flux consists of the following components in percentage by weight: 22 to 44 percent of modified rosin, 11 to 16 percent of thixotropic agent, 4 to 10 percent of organic acid active agent, 5 to 8 percent of surfactant, 0.5 to 1.5 percent of organic modified polysiloxane and the balance of solvent phenyl (tetrahydro-2H-pyran-4-yl) methanol.
2. The solder paste for improving solder voiding of large area pads of electronic devices as claimed in claim 1, wherein: the soldering paste comprises 88% -92% of alloy powder and 8% -12% of soldering flux.
3. The solder paste for improving void formation in soldering of large area pads of electronic devices as claimed in claim 1, wherein: the modified rosin is at least one of water-white hydrogenated rosin and acrylic acid rosin.
4. The solder paste for improving solder voiding of large area pads of electronic devices as claimed in claim 1, wherein: the thixotropic agent is at least one of the stemmed castor oil, stearic acid, oleamide and high molecular paraffin.
5. The solder paste for improving solder voiding of large area pads of electronic devices as claimed in claim 1, wherein: the organic acid activator is at least one of succinic acid, adipic acid, azelaic acid, glutaric acid, citric acid and malic acid.
6. The solder paste for improving solder voiding of large area pads of electronic devices as claimed in claim 1, wherein: the surfactant is at least one of nonylphenol polyoxyethylene ether, octylphenol polyoxyethylene ether and dodecylphenol polyoxyethylene ether.
7. The solder paste for improving solder voiding of large area pads of electronic devices as claimed in claim 2, wherein: the alloy powder is Sn42Bi58 with a melting point of 138 ℃ or Sn96.5Ag3.0Cu0.5 with a melting point of 217 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310171228.6A CN115971719A (en) | 2023-02-27 | 2023-02-27 | Solder paste for improving welding cavity of large-area bonding pad of electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310171228.6A CN115971719A (en) | 2023-02-27 | 2023-02-27 | Solder paste for improving welding cavity of large-area bonding pad of electronic device |
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| CN115971719A true CN115971719A (en) | 2023-04-18 |
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| CN115070260A (en) * | 2022-07-02 | 2022-09-20 | 宏桥金属制品(昆山)有限公司 | High-performance tin soldering rod and preparation method thereof |
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