CN108555474A - A kind of halogen-free environmental-friendly lead-free tin cream and preparation method thereof - Google Patents
A kind of halogen-free environmental-friendly lead-free tin cream and preparation method thereof Download PDFInfo
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- CN108555474A CN108555474A CN201810286338.6A CN201810286338A CN108555474A CN 108555474 A CN108555474 A CN 108555474A CN 201810286338 A CN201810286338 A CN 201810286338A CN 108555474 A CN108555474 A CN 108555474A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention belongs to Electronic Packaging field of welding material, a kind of halogen-free environmental-friendly lead-free tin cream and preparation method thereof is provided.The halogen-free environmental-friendly lead-free tin cream is made of 80 ~ 90% kamash alloy powder and 10 ~ 20% weld-aiding cream；The kamash alloy powder is one kind in Sn 3.0Ag 0.5Cu, Sn 3.0Ag 0.5Cu 0.01P, n 3.0Ag 0.5Cu 0.05Pr；The weld-aiding cream is grouped as by the group of following weight percent meter：Rosin resin 25 ~ 49%, diisooctyl fumarate 0.5 ~ 6%, hexadecylic acid pentaerythritol ester 0.5 ~ 6%, dimethylolpropionic acid 1 ~ 10%, ethylene dilaurate amide 0.5 ~ 2%, surfactant 0.05 ~ 12%, thixotropic agent 1 ~ 8%, solvent 25 ~ 47%, antioxidant 0.2 ~ 10%.Lead-free tin cream of the present invention is halogen-free, environmentally friendly, the rate of spread is high, surface insulation resistance is high, hole ratio is low and heat resistanceheat resistant is caved in, the package requirements especially suitable for high-end precise electronic product.
Description
Technical field
The present invention relates to Electronic Packaging field of welding material, especially relate to a kind of halogen-free environmental-friendly lead-free tin cream and its
Preparation method.
Background technology
With the rapid development of electronics industry, electronic product function is more and more complete, will be used wider and wider, however makes
But increasingly severe with environment, especially welding spot size increasingly reduces the mechanics integrity problem brought, electron production in recent years
The new challenge of the use band of product, more stringent requirements are proposed service reliability of the people to electronic product.Past 10 years
In unleaded evolution, lead-free tin cream achieves fast development.The lead-free tin cream that existing market uses is used containing halogen mostly
The raw material of element are welded as activating agent (such as dibromo butene glycol, cyclohexylamine hydrochloride) to be removed in brazing process
Oxidation film in base material and glass putty.A kind of medium temperature tin alloy of through-hole coating operations as disclosed in Chinese patent CN102069323B
Solder(ing) paste uses dibromo butene glycol.However, excessive uses halogen active agent, if mismatch, come later in soldering
Remain in solder joint not as good as decomposing and volatilizing, the mechanical property of butt welding point and electric property are brought potential bad shadow by this
It rings, for example butt welding point and substrate generate burn into and reduce surface insulation resistance and cause short circuit etc.；On the other hand, halogen active agent
Can volatilize the chemical fumes containing halogen in being brazed thermal histories, and serious harm is brought to the health of operating personnel.Cause
This, is highly desirable to carry out formula improvement to lead-free tin cream used at present.
Invention content
In order to solve the above-mentioned technical problem, the purpose of the present invention is to provide a kind of halogen-free environmental-friendly lead-free tin cream and its systems
Preparation Method, lead-free tin cream of the invention is halogen-free, environmentally friendly, hole ratio is low, wetability is good and surface insulation resistance is high.
The purpose of the present invention is realized at least through one of following technical proposal.
The lead-free tin cream is by weight percent at being grouped as：Kamash alloy powder 80~90% and weld-aiding cream 10~
20%；
The kamash alloy powder be Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu-0.01P,
One in Sn-0.3Ag-0.7Cu-0.05Pr, Sn-1.0Ag-0.5Cu-0.01P, Sn-1.Ag-0.5Cu-0.05Pr
Kind；
The weld-aiding cream is grouped as by the group of following weight percent meter：Rosin resin 25~49%, fumaric acid two are different pungent
Ester 0.5~6%, hexadecylic acid pentaerythritol ester 0.5~6%, dimethylolpropionic acid 1~10%, ethylene dilaurate amide 0.5~
2%, surfactant 0.2~12%, thixotropic agent 1~8%, solvent 25~47%, antioxidant 0.2~10%.
Further, the rosin resin is perhydrogenated rosin, pentalyn and modified vinyl chloride-vinyl acetate copolymer resin
The composition of one or more of (such as the model H15/45M of Germany's production)；
Further, the surfactant is polyoxyethylene glycerol ether, secondary octyl phenol polyethenoxy ether and nonyl phenol
The composition of one or more of class polyoxyethylene ether；
Further, the thixotropic agent is the group of modified hydrogenated castor oil and octadecyl Stearyl Amine one or two
Close object；The modified hydrogenated castor oil of ST (THIXATROL ST) may be used in modified hydrogenated castor oil.
Further, the solvent be ethohexadiol, tetrahydrofurfuryl alcohol, propylene glycol phenylate, tetraethyleneglycol dimethyl ether and
One or more of compositions of triethyl group carbitol ether；
Further, the antioxidant is 2-mercaptobenzimidazole, 1- vinyl imidazoles, 2-methylimidazole and 2,6-
One or more of composition in di-tert-butyl-4-methy phenol；
Further, the method for the halogen-free environmental-friendly lead-free tin cream, preparation process are as follows：
(1) to weigh above-mentioned each component by the weight percent spare；
(2) rosin resin, antioxidant and solvent are added in the reaction vessel, is heated to 130~150 DEG C, stirring 20~
40 minutes, it is made to be uniformly mixed；
(3) mixture that above-mentioned steps (2) obtain is cooled to 100~120 DEG C, dimethylolpropionic acid is then added, stirs
It mixes 20~40 minutes, it is made to be uniformly mixed；
(4) continue the mixture that above-mentioned steps (3) obtain to be cooled to 70~90 DEG C, it is different then to sequentially add fumaric acid two
Monooctyl ester, hexadecylic acid pentaerythritol ester and surfactant stir 10~30 minutes, it is made to be uniformly mixed；
(5) continue the mixture that above-mentioned steps (4) obtain to be cooled to 50~70 DEG C, then sequentially add the bimonthly osmanthus of ethylene
Sour amide and thixotropic agent emulsify 10~30 minutes, and emulsifying rate is 4000~7000r/min, keep its fully emulsified and mix equal
It is even；
(6) mixture prepared by above-mentioned steps (5) is cooled to room temperature, and is ground three times using three-roll grinder, finally
Weld-aiding cream granularity is 1~5 μm, is then allowed to stand 24-48 hours latter, obtained weld-aiding cream；
(7) weld-aiding cream and kamash alloy powder that prepared by above-mentioned steps (6) are placed in solder paste stirrer, are then extracted true
Sky, vacuum degree 10-2The Pa orders of magnitude, then weld-aiding cream and kamash alloy powder are stirred with the mixing speed of 150~250r/min, it stirs
It is 30~50 minutes to mix the time so that weld-aiding cream and kamash alloy powder are uniformly mixed, that is, halogen-free environmental-friendly lead-free is prepared
Tin cream.
Present invention is generally directed to existing lead-free tin cream there are do harm to huamn body in a large amount of halogen raw materials, welding process with
And the low problem of postwelding welding spot reliability and research and develop, the present invention selects diisooctyl fumarate and hexadecylic acid pentaerythritol ester conduct
Activating agent, both activating agents belong to liquid active agent, active at room temperature with the good compatibilities such as rosin resin, antioxidant
Very low, in solder reflow process, decomposable asymmetric choice net goes out the stronger fumaric acid of activity, hexadecylic acid and alcohols material again, effectively removes female by weldering
Oxide in material and unleaded glass putty, auxiliary wetting；Coordinate the higher dimethylolpropionic acid activating agent of activity simultaneously, can increase
The welding activity of strong weld-aiding cream, obtains the solder joint of full light；Weld-aiding cream each group is effectively improved using ethylene dilaurate amide
Divide the degree of scatter in emulsion process；Use the modified hydrogenated castor oil of ST (THIXATROL ST) and octadecyl Stearyl Amine
It can effectively improve the thixotropic property of tin cream so that tin cream is easy demoulding in printing process；The imidazoles substance and first used
Base phenol can be reacted with tin in glass putty is preferable over the oxygen in air in brazing process, prevent the oxidation of tin cream, be reduced
Hole ratio is welded, solder joint mechanical strength is improved.
Compared with prior art, the technology of the present invention has following features compared with oneself has technology：
A) weld-aiding cream formula system does not contain any fluorine, chlorine, bromine, iodine and astatine halogens, environmental friendliness and no harm；
B) there is good printing performance in printing process, no drawings point, it is cold cave in and bridging printing defects, brazing process moistens
It is moist it is high, without hot Collapse defect；
C) solder joint hole ratio is low after being brazed, surface insulation resistance is high, free of cleaning, is suitable for high-end precise electronic product
Package requirements.
Specific implementation mode
With reference to specific embodiment to the present invention implementation be described in further detail, but the present invention implementation and
It protects without being limited thereto.
Embodiment 1
The halogen-free environmental-friendly lead-free tin cream of the embodiment of the present invention 1 is grouped as by the group of following weight percent meter (as by total
Weight 100g meters)：
Sn-3.0Ag-0.5Cu 88.5% and weld-aiding cream 11.5%；
Wherein, the weld-aiding cream is grouped as by the group of following weight percent meter：Perhydrogenated rosin 49%, fumaric acid two are different
Monooctyl ester 0.5%, hexadecylic acid pentaerythritol ester 6%, dimethylolpropionic acid 1%, ethylene dilaurate amide 0.5%, polyoxyethylene
The modified hydrogenated castor oil of glycerin ether 12%, ST (THIXATROL ST) 5.8%, ethohexadiol 10%, tetraethyleneglycol dimethyl ether
15%, 2-mercaptobenzimidazole 0.2%.
Preparation method：
(1) to weigh above-mentioned each component by the weight percent spare；
(2) perhydrogenated rosin, 2-mercaptobenzimidazole, ethohexadiol and tetraethylene glycol diformazan are added in the reaction vessel
Ether is heated to 130 DEG C, stirs 20 minutes, it is made to be uniformly mixed；
(3) mixture that above-mentioned steps (2) obtain is cooled to 100 DEG C, dimethylolpropionic acid is then added, stir 20 points
Clock makes it be uniformly mixed；
(4) continue the mixture that above-mentioned steps (3) obtain to be cooled to 90 DEG C, it is different pungent then to sequentially add fumaric acid two
Ester, hexadecylic acid pentaerythritol ester and surfactant stir 30 minutes, it is made to be uniformly mixed；
(5) continue the mixture that above-mentioned steps (4) obtain to be cooled to 70 DEG C, then sequentially add ethylene dilaurate acyl
Amine and thixotropic agent emulsify 30 minutes, and emulsifying rate 7000r/min keeps its fully emulsified and is uniformly mixed；
(6) mixture prepared by above-mentioned steps (5) is cooled to room temperature, and is ground three times using three-roll grinder, finally
Weld-aiding cream granularity is 1~5 μm, and 24 hours after being then allowed to stand, weld-aiding cream is made；
(7) weld-aiding cream and load weighted Sn-3.0Ag-0.5Cu kamash alloys powder that prepared by above-mentioned steps (6) are placed in tin
In cream blender, vacuum, vacuum degree 10 are then extracted-2The Pa orders of magnitude, then weld-aiding cream is stirred with the mixing speed of 250r/min
With Sn-3.0Ag-0.5Cu kamash alloy powder, mixing time is 50 minutes so that weld-aiding cream and Sn-3.0Ag-0.5Cu tinbases
Alloy powder is uniformly mixed, that is, halogen-free environmental-friendly lead-free tin cream is prepared.
Embodiment 2
The halogen-free environmental-friendly lead-free tin cream of the embodiment of the present invention 2 is grouped as by the group of following weight percent meter：
Sn-0.3Ag-0.7Cu-0.01P 90% and weld-aiding cream 10%；
Wherein, the weld-aiding cream is grouped as by the group of following weight percent meter：Pentalyn 10%, H15/
45M is modified vinyl chloride-vinyl acetate copolymer resin 15%, diisooctyl fumarate 6%, hexadecylic acid pentaerythritol ester 0.5%, dimethylolpropionic acid
10%, ethylene dilaurate amide 2%, secondary octyl phenol polyethenoxy ether 0.1%, nonylphenol class polyoxyethylene ether 0.1%, ST change
Property rilanit special (THIXATROL ST) 4%, octadecyl Stearyl Amine 4%, triethyl group carbitol ether 38.3%, 1- ethylene
Base imidazoles 5%, 2-methylimidazole 5%.
Preparation method can refer to embodiment 1.
Embodiment 3
The halogen-free environmental-friendly lead-free tin cream of the embodiment of the present invention 3 is grouped as by the group of following weight percent meter：
Sn-0.3Ag-0.7Cu-0.05Pr 80% and weld-aiding cream 20%；
Wherein, the weld-aiding cream is grouped as by the group of following weight percent meter：Pentalyn 32%, fumaric acid
Di-isooctyl 6%, hexadecylic acid pentaerythritol ester 4%, dimethylolpropionic acid 3%, ethylene dilaurate amide 1%, polyoxyethylene
Glycerin ether 1%, secondary octyl phenol polyethenoxy ether 2%, nonylphenol class polyoxyethylene ether 2%, octadecyl Stearyl Amine 1%, second
Base hexylene glycol 15%, tetrahydrofurfuryl alcohol 15%, propylene glycol phenylate 17%, 2,6 di tert butyl 4 methyl phenol 1%.
Preparation method can refer to embodiment 1.
Embodiment 4
The halogen-free environmental-friendly lead-free tin cream of the embodiment of the present invention 4 is grouped as by the group of following weight percent meter：
Sn-1.0Ag-0.5Cu-0.01P 88% and weld-aiding cream 12%；
Wherein, the weld-aiding cream is grouped as by the group of following weight percent meter：Perhydrogenated rosin 20%, rosin Ji Wusi
Alcohol ester 10%, H15/45M are modified vinyl chloride-vinyl acetate copolymer resin 10%, diisooctyl fumarate 3%, hexadecylic acid pentaerythritol ester 4%, two
Hydroxymethylbutyrate 5%, ethylene dilaurate amide 1%, polyoxyethylene glycerol ether 3%, octadecyl Stearyl Amine 6%, tetrahydrochysene
Furfuryl alcohol 14%, propylene glycol phenylate 20%, 2,6 di tert butyl 4 methyl phenol 4%.
Preparation method can refer to embodiment 1.
Embodiment 5
The halogen-free environmental-friendly lead-free tin cream of the embodiment of the present invention 5 is grouped as by the group of following weight percent meter：
Sn-1.0Ag-0.5Cu-0.01P 88.5% and weld-aiding cream 11.5%；
Wherein, the weld-aiding cream is grouped as by the group of following weight percent meter：Perhydrogenated rosin 30%, H15/45M change
Property vinyl chloride-vinyl acetate copolymer resin 15%, diisooctyl fumarate 2%, hexadecylic acid pentaerythritol ester 1%, dimethylolpropionic acid 8%, ethylene
Dilaurate amide 1.5%, secondary octyl phenol polyethenoxy ether 2%, the modified hydrogenated castor oil of ST (THIXATROL ST) 7%, four
Glycol dimethyl ether 20%, triethyl group carbitol ether 8.5%, 2,6 di tert butyl 4 methyl phenol 5%.
Preparation method can refer to embodiment 1.
According to GB/T9491-2002 and IPC-TM-650 standards, to the performance of foregoing invention embodiment 1 to embodiment 5 into
Row assessment, the results are shown in Table 1.
1 embodiment 1 of table is to 5 assessment result of embodiment
By 1 assessment result of table it may be concluded that the halogen-free environmental-friendly lead-free tin cream of the present invention has rate of spread height, surface
The advantages that insulation resistance is high, hole ratio is low and cold and heat resistanceheat resistant is caved in, disclosure satisfy that the package requirements of high-end precise electronic product.
Claims (10)
1. a kind of halogen-free environmental-friendly lead-free tin cream, which is characterized in that the lead-free tin cream is by following weight percent at grouping
At：Kamash alloy powder 80~90% and weld-aiding cream 10~20%；
The kamash alloy powder is Sn-3.0Ag-0.5Cu, Sn-0.3Ag-0.7Cu-0.01P, Sn-0.3Ag-0.7Cu-
One kind in 0.05Pr, Sn-1.0Ag-0.5Cu-0.01P, Sn-1.Ag-0.5Cu-0.05Pr；
The weld-aiding cream is grouped as by the group of following weight percent meter：Rosin resin 25~49%, diisooctyl fumarate 0.5
~6%, hexadecylic acid pentaerythritol ester 0.5~6%, dimethylolpropionic acid 1~10%, ethylene dilaurate amide 0.5~2%,
Surfactant 0.2~12%, thixotropic agent 1~8%, solvent 25~47%, antioxidant 0.2~10%.
2. halogen-free environmental-friendly lead-free tin cream according to claim 1, which is characterized in that the rosin resin is perhydrogenating
The composition of one or more of rosin, pentalyn and modified vinyl chloride-vinyl acetate copolymer resin.
3. halogen-free environmental-friendly lead-free tin cream according to claim 1, which is characterized in that the surfactant is polyoxy
The composition of one or more of Ethylene Glycol ether, secondary octyl phenol polyethenoxy ether and nonylphenol class polyoxyethylene ether.
4. halogen-free environmental-friendly lead-free tin cream according to claim 1, which is characterized in that the thixotropic agent is modified hydrogenated
The composition of castor oil and octadecyl Stearyl Amine one or two.
5. halogen-free environmental-friendly lead-free tin cream according to claim 1, which is characterized in that the solvent is ethyl hexyl two
One or more of compositions of alcohol, tetrahydrofurfuryl alcohol, propylene glycol phenylate, tetraethyleneglycol dimethyl ether and triethyl group carbitol ether.
6. halogen-free environmental-friendly lead-free tin cream according to claim 1, which is characterized in that the antioxidant is 2- sulfydryls
One or more of combination in benzimidazole, 1- vinyl imidazoles, 2-methylimidazole and 2,6 di tert butyl 4 methyl phenol
Object.
7. the method for preparing the halogen-free environmental-friendly lead-free tin cream of claim 1-6 any one of them, which is characterized in that preparation process
It is as follows：
(1) to weigh above-mentioned each component by the weight percent spare；
(2) rosin resin, antioxidant and solvent are added in the reaction vessel, is heated to 130~150 DEG C, stirring makes its mixing
Uniformly；
(3) above-mentioned steps (2) finally obtained mixture is cooled to 100~120 DEG C, dimethylolpropionic acid is then added, stirs
Mixing makes it be uniformly mixed；
(4) continue above-mentioned steps (3) finally obtained mixture to be cooled to 70~90 DEG C, it is different then to sequentially add fumaric acid two
Monooctyl ester, hexadecylic acid pentaerythritol ester and surfactant, stirring make it be uniformly mixed；
(5) continue above-mentioned steps (4) finally obtained mixture to be cooled to 50~70 DEG C, then sequentially add the bimonthly osmanthus of ethylene
Sour amide and thixotropic agent keep its fully emulsified and are uniformly mixed using mulser；
(6) mixture prepared by above-mentioned steps (5) is cooled to room temperature, and is ground three times using three-roll grinder, finally helps weldering
Cream granularity is 1~5 μm, is then allowed to stand 24-48 hours latter, obtained weld-aiding cream；
(7) weld-aiding cream and kamash alloy powder that prepared by above-mentioned steps (6) are placed in solder paste stirrer, then extract vacuum, very
Reciprocal of duty cycle is 10-2The Pa orders of magnitude, then weld-aiding cream and kamash alloy powder are stirred with the mixing speed of 150~250r/min, when stirring
Between be 30~50 minutes so that weld-aiding cream and kamash alloy powder are uniformly mixed, that is, halogen-free environmental-friendly lead-free tin cream is prepared.
8. the method for halogen-free environmental-friendly lead-free tin cream according to claim 17, which is characterized in that step (5) described emulsification
Time be 10~30 minutes, mulser rotating speed be 4000~7000r/min.
9. the method for halogen-free environmental-friendly lead-free tin cream according to claim 17, which is characterized in that stirred in step (2)
Time is 20~40 minutes.
10. the method for halogen-free environmental-friendly lead-free tin cream according to claim 17, which is characterized in that stirring in step (4)
Time be 10~30 minutes.
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| CN109604859A (en) * | 2018-11-30 | 2019-04-12 | 湖南人文科技学院 | Preparation method, ceramics and its packaging method of the solder paste of ceramic package |
| CN111136402A (en) * | 2019-12-20 | 2020-05-12 | 深圳市朝日电子材料有限公司 | Enhanced composite soldering paste and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
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| CN101508061A (en) * | 2009-03-30 | 2009-08-19 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN101879671A (en) * | 2010-06-13 | 2010-11-10 | 汕头市骏码凯撒有限公司 | Halogen-free flux and method for preparing same |
| CN102166689A (en) * | 2011-03-30 | 2011-08-31 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| JP2013126671A (en) * | 2011-12-16 | 2013-06-27 | Tamura Seisakusho Co Ltd | Soldering flux |
| CN102554489A (en) * | 2011-12-28 | 2012-07-11 | 宁波圣之岛焊锡材料有限公司 | Low-rosin halogen and lead-free solder paste and preparation method thereof |
| CN102941420A (en) * | 2012-11-15 | 2013-02-27 | 重庆大学 | High-activity environmental-friendly low-sliver Sn-Ag-Cu system lead-free halogen-free tin paste |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
| CN105014253A (en) * | 2014-04-30 | 2015-11-04 | 江苏博迁新材料有限公司 | Lead-free tin solder paste and preparation method thereof |
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| CN109604859A (en) * | 2018-11-30 | 2019-04-12 | 湖南人文科技学院 | Preparation method, ceramics and its packaging method of the solder paste of ceramic package |
| CN109604859B (en) * | 2018-11-30 | 2021-07-23 | 湖南人文科技学院 | Preparation method of solder paste for ceramic packaging, ceramic and packaging method thereof |
| CN111136402A (en) * | 2019-12-20 | 2020-05-12 | 深圳市朝日电子材料有限公司 | Enhanced composite soldering paste and preparation method thereof |
| CN113210931A (en) * | 2021-05-13 | 2021-08-06 | 北京达博长城锡焊料有限公司 | Soldering flux for solder paste, preparation method thereof and halogen-free and lead-free solder paste |
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