CN106271219A - A kind of No clean high-temperature electronic brazing flux and preparation method thereof - Google Patents
A kind of No clean high-temperature electronic brazing flux and preparation method thereof Download PDFInfo
- Publication number
- CN106271219A CN106271219A CN201610736101.4A CN201610736101A CN106271219A CN 106271219 A CN106271219 A CN 106271219A CN 201610736101 A CN201610736101 A CN 201610736101A CN 106271219 A CN106271219 A CN 106271219A
- Authority
- CN
- China
- Prior art keywords
- parts
- brazing flux
- clean high
- stannum
- temperature electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of No clean high-temperature electronic brazing flux and preparation method thereof, described electronics brazing flux includes following raw material: bismuth chloride, hexafluosilicic acid stannum, Loprazolam stannum part, titanium dioxide, glass comminuted steel shot, acetylacetone,2,4-pentanedione zirconium, 1 benzyl glycolylurea, Polyethylene Glycol Oleate, organobentonite, decyl glucoside, poly-(3, 4 ethene dioxythiophenes) polystyrolsulfon acid, triphenylphosphine ruthenic chloride, diethylene glycol monohexyl ether, dipropylene glycol methyl ether, Starex, N, N dimethyl acetylamide, disproportionated rosin acid potassium, methyl-ethanolamine, lauroyl diethanolamine, 1 N hydroxy benzo triazole, dinonyl naphthalene sulfonate barium.Brazing flux prepared by the present invention in brazing process, the chemical salt fog of release is few, solder joint is full, corrosion-free, without rebound phenomenon, wetting power is high, shear strength is big, helps weldering excellent performance, and solder joint noresidue after soldering, surface-brightening, clean without follow-up cleaning process, easy to use.
Description
Technical field
The invention belongs to technical field of electronic materials, be specifically related to a kind of No clean high-temperature electronic brazing flux and preparation side thereof
Method.
Background technology
Brazing flux is the important component part of electronics connecting material, and in electronic-packaging processes, brazing flux acts primarily as and " helps weldering
Connect " effect.Can the performance of brazing flux play pivotal role for realize good soldering connection, therefore, more and more looks forward to
Industry payes attention to selection and the application of brazing flux.
For brazing flux, it is desirable to it has and good helps weldering property, high-insulativity and low-corrosiveness.At present, though the model of brazing flux
Many, but the use of some brazing flux can cause solder joint dirtier and not easy cleaning, the brazing flux simultaneously remained can butt welding more or less
Point produces corrosion, affects the bonding strength of solder joint, thus is substantially reduced the q&r of electronic product, to this end, No clean
Brazing flux enjoys people to pay close attention to and likes.At present, although occur in that substantial amounts of No clean brazing flux, but its properties the most all can not
Meet electrical connection techniques more preferable application development demand.
Summary of the invention
It is an object of the invention to provide a kind of No clean high-temperature electronic brazing flux and preparation method thereof, to solve above at least one
Plant technical problem.
Technical scheme is come as follows:
A kind of No clean high-temperature electronic brazing flux, by weight, including following raw material: bismuth chloride 5-11 part, hexafluosilicic acid stannum 3-9
Part, Loprazolam stannum 2-6 part, titanium dioxide 1-7 part, glass comminuted steel shot 1-4 part, acetylacetone,2,4-pentanedione zirconium 2.4-6 part, 1-benzyl glycolylurea 6-
10 parts, Polyethylene Glycol Oleate 3-9 part, organobentonite 2-6 part, decyl glucoside 4-9 part, poly-(3,4-ethylene dioxy thiophene
Fen)-polystyrolsulfon acid 3-7 part, triphenylphosphine ruthenic chloride 2-6 part, diethylene glycol monohexyl ether 18-28 part, dipropylene glycol
Monomethyl ether 16-25 part, Starex 4-9 part, N,N-dimethylacetamide 2-8 part, disproportionated rosin acid potassium 1-5 part, methyl one second
Hydramine 1-4 part, lauroyl diethanolamine 2-5 part, 1-N-hydroxy benzo triazole 3-8 part, dinonyl naphthalene sulfonate barium 2-7 part.
In technique scheme, by weight, including following raw material: bismuth chloride 5.6-9 part, hexafluosilicic acid stannum 3.2-7.5
Part, Loprazolam stannum 2.8-5.3 part, titanium dioxide 1.5-4 part, glass comminuted steel shot 1.4-3 part, acetylacetone,2,4-pentanedione zirconium 2.8-4.6 part, 1-
Benzyl glycolylurea 6.5-9 part, Polyethylene Glycol Oleate 3.5-7 part, organobentonite 2.5-4.9 part, decyl glucoside 4.2-8 part,
Poly-(3,4-ethene dioxythiophene)-polystyrolsulfon acid 3.5-6.2 part, triphenylphosphine ruthenic chloride 2.4-5 part, diethylene glycol list oneself
Ether 20-27 part, dipropylene glycol methyl ether 18-23 part, Starex 4.5-8.6 part, N,N-dimethylacetamide 2.4-7.3
Part, disproportionated rosin acid potassium 1.4-4.5 part, methyl-ethanolamine 1.6-3.8 part, lauroyl diethanolamine 2.7-4.5 part, 1-N-hydroxyl
Base BTA 3.6-7.2 part, dinonyl naphthalene sulfonate barium 2.6-5 part.
In technique scheme, by weight, including following raw material: bismuth chloride 6.8 parts, 5.3 parts of hexafluosilicic acid stannum, methane
3.7 parts of sulfonic acid stannum, titanium dioxide 2 parts, glass comminuted steel shot 1.6 parts, acetylacetone,2,4-pentanedione zirconium 3.5 parts, 1-benzyl glycolylurea 7.3 parts, oleic acid are poly-
Glycol ester 5.4 parts, organobentonite 3.8 parts, decyl glucoside 5.2 parts, poly-(3,4-ethene dioxythiophene)-polystyrene sulphur
Acid 4.9 parts, triphenylphosphine ruthenic chloride 3.5 parts, diethylene glycol monohexyl ether 23 parts, dipropylene glycol methyl ether 21 parts, oil slick pine
Perfume 6.7 parts, N,N-dimethylacetamide 4.5 parts, 3.8 parts of disproportionated rosin acid potassium, methyl-ethanolamine 2.4 parts, lauroyl diethyl
Hydramine 3.3 parts, 1-N-hydroxy benzo triazole 5.6 parts, dinonyl naphthalene sulfonate barium 4.2 parts.
Another technical scheme of the present invention is come as follows:
The preparation method of No clean high-temperature electronic brazing flux, including following preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, it is placed in 80-120 DEG C of bar
Process 2-8h under part, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Enter diethylene glycol monohexyl ether and dipropylene glycol methyl ether, be uniformly mixed；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 800-1500rpm stirring mixing 40-80 minute；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 300-600rpm stirring mixing 1-4 hour；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
In technique scheme, in step (2), under the conditions of being placed in 95 DEG C, process 6h.
In technique scheme, the temperature of the most described stirring mixing is 70-90 DEG C, and mixing speed is 500-
800rpm, mixing time is 40-60 minute.
In technique scheme, in step (4), with rotating speed for 1100rpm stirring mixing 55 minutes.
In technique scheme, in step (5), with rotating speed for 450rpm stirring mixing 2.5 hours.
Owing to have employed above technical scheme, the invention have the benefit that
Brazing flux prepared by the present invention is in whole brazing process, and the chemical salt fog of release is few, solder joint is full, without rebound phenomenon, and
Can be seen that the wetting power of this solder flux reaches 3.42 ~ 3.65mN by above test result, shear strength reaches 24.3 ~ 28.2MPa, table
Reveal and preferably help weldering performance.In addition test result also shows that the solder joint corrosive salt spray of resistance to 720h is the most unchanged, can reduce soldering
After etching problem, solder joint noresidue after soldering simultaneously, surface-brightening, clean without follow-up cleaning process, easy to use.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in further detail.Following example are used for the present invention is described,
But it is not limited to the scope of the present invention.
Embodiment 1
A kind of No clean high-temperature electronic brazing flux, by weight, including following raw material: bismuth chloride 5 parts, 3 parts of hexafluosilicic acid stannum, methane
2 parts of sulfonic acid stannum, titanium dioxide 1 part, glass comminuted steel shot 1 part, acetylacetone,2,4-pentanedione zirconium 2.4 parts, 1-benzyl glycolylurea 6 parts, oleic acid Polyethylene Glycol
Ester 3 parts, organobentonite 2 parts, decyl glucoside 4 parts, poly-(3,4-ethene dioxythiophene)-polystyrolsulfon acid 3 parts, triphenyl
Phosphine ruthenic chloride 2 parts, diethylene glycol monohexyl ether 18 parts, dipropylene glycol methyl ether 16 parts, Starex 4 parts, N, N-dimethyl
Acetamide 2 parts, 1 part of disproportionated rosin acid potassium, methyl-ethanolamine 1 part, lauroyl diethanolamine 2 parts, 1-N-hydroxy benzo three nitrogen
Azoles 3 parts, dinonyl naphthalene sulfonate barium 2 parts.
The preparation method of described No clean high-temperature electronic brazing flux, including following preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, under the conditions of being placed in 80 DEG C
Process 2h, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Entering diethylene glycol monohexyl ether and dipropylene glycol methyl ether, stirring mixing, the temperature of described stirring mixing is 70 DEG C, stirring speed
Degree is 500rpm, and mixing time is 40 minutes；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 800rpm stirring mixing 40 minutes；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 300rpm stirring mixing 1 hour；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
Embodiment 2
A kind of No clean high-temperature electronic brazing flux, by weight, including following raw material: bismuth chloride 11 parts, 9 parts of hexafluosilicic acid stannum, first
6 parts of alkyl sulfonic acid stannum, titanium dioxide 7 parts, glass comminuted steel shot 4 parts, acetylacetone,2,4-pentanedione zirconium 6 parts, 1-benzyl glycolylurea 10 parts, oleic acid Polyethylene Glycol
Ester 9 parts, organobentonite 6 parts, decyl glucoside 9 parts, poly-(3,4-ethene dioxythiophene)-polystyrolsulfon acid 7 parts, triphenyl
Phosphine ruthenic chloride 6 parts, diethylene glycol monohexyl ether 28 parts, dipropylene glycol methyl ether 25 parts, Starex 9 parts, N, N-dimethyl
Acetamide 8 parts, 5 parts of disproportionated rosin acid potassium, methyl-ethanolamine 4 parts, lauroyl diethanolamine 5 parts, 1-N-hydroxy benzo three nitrogen
Azoles 8 parts, dinonyl naphthalene sulfonate barium 7 parts.
The preparation method of described No clean high-temperature electronic brazing flux, including following preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, under the conditions of being placed in 120 DEG C
Process 8h, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Entering diethylene glycol monohexyl ether and dipropylene glycol methyl ether, stirring mixing, the temperature of described stirring mixing is 90 DEG C, stirring speed
Degree is 800rpm, and mixing time is 60 minutes；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 1500rpm stirring mixing 80 minutes；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 600rpm stirring mixing 4 hours；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
Embodiment 3
A kind of No clean high-temperature electronic brazing flux, by weight, including following raw material: bismuth chloride 5.6 parts, 3.2 parts of hexafluosilicic acid stannum,
2.8 parts of Loprazolam stannum, titanium dioxide 1.5 parts, glass comminuted steel shot 1.4 parts, acetylacetone,2,4-pentanedione zirconium 2.8 parts, 1-benzyl glycolylurea 6.5 parts,
Polyethylene Glycol Oleate 3.5 parts, organobentonite 2.5 parts, decyl glucoside 4.2 parts, poly-(3,4-ethene dioxythiophene)-polyphenyl
Vinyl sulfonic acid 3.5 parts, triphenylphosphine ruthenic chloride 2.4 parts, diethylene glycol monohexyl ether 20 parts, dipropylene glycol methyl ether 18 parts,
Starex 4.5 parts, N,N-dimethylacetamide 2.4 parts, 1.4 parts of disproportionated rosin acid potassium, methyl-ethanolamine 1.6 parts, Laurel
Acyl diethanolamine 2.7 parts, 1-N-hydroxy benzo triazole 3.6 parts, dinonyl naphthalene sulfonate barium 2.6 parts.
The preparation method of described No clean high-temperature electronic brazing flux, including following preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, under the conditions of being placed in 110 DEG C
Process 6h, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Entering diethylene glycol monohexyl ether and dipropylene glycol methyl ether, stirring mixing, the temperature of described stirring mixing is 80 DEG C, stirring speed
Degree is 650rpm, and mixing time is 55 minutes；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 1300rpm stirring mixing 55 minutes；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 450rpm stirring mixing 3 hours；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
Embodiment 4
A kind of No clean high-temperature electronic brazing flux, by weight, including following raw material: bismuth chloride 9 parts, 7.5 parts of hexafluosilicic acid stannum, first
5.3 parts of alkyl sulfonic acid stannum, titanium dioxide 4 parts, glass comminuted steel shot 3 parts, acetylacetone,2,4-pentanedione zirconium 4.6 parts, 1-benzyl glycolylurea 9 parts, the poly-second of oleic acid
Diol ester 7 parts, organobentonite 4.9 parts, decyl glucoside 8 parts, poly-(3,4-ethene dioxythiophene)-polystyrolsulfon acid 6.2
Part, triphenylphosphine ruthenic chloride 5 parts, diethylene glycol monohexyl ether 27 parts, dipropylene glycol methyl ether 23 parts, Starex 8.6 parts,
N,N-dimethylacetamide 7.3 parts, 4.5 parts of disproportionated rosin acid potassium, methyl-ethanolamine 3.8 parts, lauroyl diethanolamine 4.5
Part, 1-N-hydroxy benzo triazole 7.2 parts, dinonyl naphthalene sulfonate barium 5 parts.
The preparation method of described No clean high-temperature electronic brazing flux, including following preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, under the conditions of being placed in 90 DEG C
Process 5h, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Entering diethylene glycol monohexyl ether and dipropylene glycol methyl ether, stirring mixing, the temperature of described stirring mixing is 80 DEG C, stirring speed
Degree is 700rpm, and mixing time is 45 minutes；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 1400rpm stirring mixing 60 minutes；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 560rpm stirring mixing 3 hours；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
Embodiment 5
A kind of No clean high-temperature electronic brazing flux, by weight, including following raw material: bismuth chloride 6.8 parts, 5.3 parts of hexafluosilicic acid stannum,
3.7 parts of Loprazolam stannum, titanium dioxide 2 parts, glass comminuted steel shot 1.6 parts, acetylacetone,2,4-pentanedione zirconium 3.5 parts, 1-benzyl glycolylurea 7.3 parts, oil
Acid polyethylene glycol ester 5.4 parts, organobentonite 3.8 parts, decyl glucoside 5.2 parts, poly-(3,4-ethene dioxythiophene)-polyphenyl second
Alkene sulfonic acid 4.9 parts, triphenylphosphine ruthenic chloride 3.5 parts, diethylene glycol monohexyl ether 23 parts, dipropylene glycol methyl ether 21 parts, floating
Oil rosin 6.7 parts, N,N-dimethylacetamide 4.5 parts, 3.8 parts of disproportionated rosin acid potassium, methyl-ethanolamine 2.4 parts, lauroyl
Diethanolamine 3.3 parts, 1-N-hydroxy benzo triazole 5.6 parts, dinonyl naphthalene sulfonate barium 4.2 parts.
The preparation method of described No clean high-temperature electronic brazing flux, including following preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, under the conditions of being placed in 95 DEG C
Process 6h, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Entering diethylene glycol monohexyl ether and dipropylene glycol methyl ether, stirring mixing, the temperature of described stirring mixing is 85 DEG C, stirring speed
Degree is 600rpm, and mixing time is 60 minutes；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 1100rpm stirring mixing 55 minutes；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 450rpm stirring mixing 2.5 hours；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
Comparative example 1
This comparative example with the difference of embodiment 1 is: this comparative example is without titanium dioxide, acetylacetone,2,4-pentanedione zirconium and disproportionated rosin
Acid potassium and correlation step thereof.
Comparative example 2
To the difference of comparative example with embodiment 1 it is: this comparative example is without triphenylphosphine ruthenic chloride, 1-benzyl glycolylurea and chlorine
Change bismuth and correlation step thereof.
Test result
The solder commonly used on brazing flux Auxiliary market prepared by above example and comparative example is carried out soldering, according to the industry
The performances such as wetting power, shear strength and the corrosion resistance of brazing flux are tested by testing standard, and its test result is as shown in the table:
| Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Comparative example 1 | Comparative example 2 | |
| Wetting power/mN(250 DEG C) | 3.46 | 3.42 | 3.58 | 3.61 | 3.65 | 3.03 | 3.11 |
| Shear strength/MPa | 24.3 | 25.8 | 27.3 | 26.5 | 28.2 | 21.6 | 20.9 |
| Solder joint corrosion resistance (20wt.% NaCl salt spray is tested, 720h) | Unchanged | Unchanged | Unchanged | Unchanged | Unchanged | Unchanged | Unchanged |
| Solder joint remains | Noresidue | Noresidue | Noresidue | Noresidue | Noresidue | Slight residual | The most residual Stay |
Brazing flux prepared by the present invention is in whole brazing process, and the chemical salt fog of release is few, solder joint is full, without rebound phenomenon, and
Can be seen that the wetting power of this solder flux reaches 3.42 ~ 3.65mN by above test result, shear strength reaches 24.3 ~ 28.2MPa, table
Reveal and preferably help weldering performance.In addition test result also shows that the solder joint corrosive salt spray of resistance to 720h is the most unchanged, can reduce soldering
After etching problem, solder joint noresidue after soldering simultaneously, surface-brightening, clean without follow-up cleaning process, easy to use.
Claims (8)
1. a No clean high-temperature electronic brazing flux, it is characterised in that by weight, including following raw material: bismuth chloride 5-11 part,
Hexafluosilicic acid stannum 3-9 part, Loprazolam stannum 2-6 part, titanium dioxide 1-7 part, glass comminuted steel shot 1-4 part, acetylacetone,2,4-pentanedione zirconium 2.4-6 part,
1-benzyl glycolylurea 6-10 part, Polyethylene Glycol Oleate 3-9 part, organobentonite 2-6 part, decyl glucoside 4-9 part, poly-(3,4-
Ethene dioxythiophene)-polystyrolsulfon acid 3-7 part, triphenylphosphine ruthenic chloride 2-6 part, diethylene glycol monohexyl ether 18-28 part, one
Contracting dipropylene glycol monomethyl ether 16-25 part, Starex 4-9 part, N,N-dimethylacetamide 2-8 part, disproportionated rosin acid potassium 1-5
Part, methyl-ethanolamine 1-4 part, lauroyl diethanolamine 2-5 part, 1-N-hydroxy benzo triazole 3-8 part, dinonylnaphthalene sulfonic acid
Barium 2-7 part.
No clean high-temperature electronic brazing flux the most according to claim 1, it is characterised in that by weight, including following former
Material: bismuth chloride 5.6-9 part, hexafluosilicic acid stannum 3.2-7.5 part, Loprazolam stannum 2.8-5.3 part, titanium dioxide 1.5-4 part, fiberglass
Powder 1.4-3 part, acetylacetone,2,4-pentanedione zirconium 2.8-4.6 part, 1-benzyl glycolylurea 6.5-9 part, Polyethylene Glycol Oleate 3.5-7 part, organic bentonite
Profit soil 2.5-4.9 part, decyl glucoside 4.2-8 part, poly-(3,4-ethene dioxythiophene)-polystyrolsulfon acid 3.5-6.2 part, three
Phenylphosphine ruthenic chloride 2.4-5 part, diethylene glycol monohexyl ether 20-27 part, dipropylene glycol methyl ether 18-23 part, Starex
4.5-8.6 part, N,N-dimethylacetamide 2.4-7.3 part, disproportionated rosin acid potassium 1.4-4.5 part, methyl-ethanolamine 1.6-3.8
Part, lauroyl diethanolamine 2.7-4.5 part, 1-N-hydroxy benzo triazole 3.6-7.2 part, dinonyl naphthalene sulfonate barium 2.6-5 part.
No clean high-temperature electronic brazing flux the most according to claim 1, it is characterised in that by weight, including following former
Material: bismuth chloride 6.8 parts, 5.3 parts of hexafluosilicic acid stannum, 3.7 parts of Loprazolam stannum, titanium dioxide 2 parts, glass comminuted steel shot 1.6 parts, levulinic
Ketone zirconium 3.5 parts, 1-benzyl glycolylurea 7.3 parts, Polyethylene Glycol Oleate 5.4 parts, organobentonite 3.8 parts, decyl glucoside 5.2
Part, poly-(3,4-ethene dioxythiophene)-polystyrolsulfon acid 4.9 parts, triphenylphosphine ruthenic chloride 3.5 parts, diethylene glycol monohexyl ether
23 parts, dipropylene glycol methyl ether 21 parts, Starex 6.7 parts, N,N-dimethylacetamide 4.5 parts, disproportionated rosin acid potassium
3.8 parts, methyl-ethanolamine 2.4 parts, lauroyl diethanolamine 3.3 parts, 1-N-hydroxy benzo triazole 5.6 parts, dinonyl naphthalene
Barium sulfonate 4.2 parts.
4. the preparation method of the No clean high-temperature electronic brazing flux as described in claim 1-3 is arbitrary, it is characterised in that include following
Preparation process:
(1) weigh by certain part by weight；
(2) by bismuth chloride, hexafluosilicic acid stannum, titanium dioxide, organobentonite, glass comminuted steel shot mix homogeneously, it is placed in 80-120 DEG C of bar
Process 2-8h under part, be cooled to room temperature, be ground to 100-200 mesh, standby；
(3) adding in reactor by Starex, Polyethylene Glycol Oleate and decyl glucoside, heated and stirred melts, and then adds
Enter diethylene glycol monohexyl ether and dipropylene glycol methyl ether, be uniformly mixed；
(4) powder that step (2) obtains is equally divided into 5 parts, is added portionwise into while stirring in the solution that step (3) obtains, treats
After powder all adds, with rotating speed for 800-1500rpm stirring mixing 40-80 minute；
(5) remaining raw material is added in the solution in step (4), with rotating speed for 300-600rpm stirring mixing 1-4 hour；
(6) through filtering and regulating to appropriate viscosity, No clean high-temperature electronic brazing flux is obtained.
The preparation method of No clean high-temperature electronic brazing flux the most according to claim 4, it is characterised in that in step (2),
6h is processed under the conditions of being placed in 95 DEG C.
The preparation method of No clean high-temperature electronic brazing flux the most according to claim 4, it is characterised in that in step (3)
The temperature of described stirring mixing is 70-90 DEG C, and mixing speed is 500-800rpm, and mixing time is 40-60 minute.
The preparation method of No clean high-temperature electronic brazing flux the most according to claim 4, it is characterised in that in step (4),
With rotating speed for 1100rpm stirring mixing 55 minutes.
The preparation method of No clean high-temperature electronic brazing flux the most according to claim 4, it is characterised in that in step (5),
With rotating speed for 450rpm stirring mixing 2.5 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736101.4A CN106271219A (en) | 2016-08-26 | 2016-08-26 | A kind of No clean high-temperature electronic brazing flux and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736101.4A CN106271219A (en) | 2016-08-26 | 2016-08-26 | A kind of No clean high-temperature electronic brazing flux and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106271219A true CN106271219A (en) | 2017-01-04 |
Family
ID=57677959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610736101.4A Pending CN106271219A (en) | 2016-08-26 | 2016-08-26 | A kind of No clean high-temperature electronic brazing flux and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106271219A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0550139A1 (en) * | 1991-12-31 | 1993-07-07 | International Business Machines Corporation | A thermally stable water soluble solder flux and paste |
| JPH08155677A (en) * | 1994-12-07 | 1996-06-18 | Futaba Corp | Washingless flux for soldering |
| US20010025673A1 (en) * | 1999-12-14 | 2001-10-04 | Henderson Donald W. | Composition for increasing activity of a no-clean flux |
| CN101003111A (en) * | 2007-01-16 | 2007-07-25 | 大连理工大学 | Soldering flux in use for SnZn series solder with no lead, and preparation method |
| CN102728967A (en) * | 2012-07-19 | 2012-10-17 | 华南理工大学 | Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder |
| CN103878503A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Scaling powder and preparing method thereof |
| CN104708233A (en) * | 2015-02-28 | 2015-06-17 | 深圳市荣昌科技有限公司 | No-clean flux suitable for copper-aluminum soldering and preparation method thereof |
| CN105014253A (en) * | 2014-04-30 | 2015-11-04 | 江苏博迁新材料有限公司 | Lead-free tin solder paste and preparation method thereof |
| CN105798482A (en) * | 2016-04-29 | 2016-07-27 | 东莞永安科技有限公司 | Halogen-free non-cleaning flux and preparation method thereof |
-
2016
- 2016-08-26 CN CN201610736101.4A patent/CN106271219A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0550139A1 (en) * | 1991-12-31 | 1993-07-07 | International Business Machines Corporation | A thermally stable water soluble solder flux and paste |
| JPH08155677A (en) * | 1994-12-07 | 1996-06-18 | Futaba Corp | Washingless flux for soldering |
| US20010025673A1 (en) * | 1999-12-14 | 2001-10-04 | Henderson Donald W. | Composition for increasing activity of a no-clean flux |
| CN101003111A (en) * | 2007-01-16 | 2007-07-25 | 大连理工大学 | Soldering flux in use for SnZn series solder with no lead, and preparation method |
| CN102728967A (en) * | 2012-07-19 | 2012-10-17 | 华南理工大学 | Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder |
| CN103878503A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Scaling powder and preparing method thereof |
| CN105014253A (en) * | 2014-04-30 | 2015-11-04 | 江苏博迁新材料有限公司 | Lead-free tin solder paste and preparation method thereof |
| CN104708233A (en) * | 2015-02-28 | 2015-06-17 | 深圳市荣昌科技有限公司 | No-clean flux suitable for copper-aluminum soldering and preparation method thereof |
| CN105798482A (en) * | 2016-04-29 | 2016-07-27 | 东莞永安科技有限公司 | Halogen-free non-cleaning flux and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103979883B (en) | A kind of Ocean Oil And Gas Pipeline repairing epoxy mortar and preparation method thereof | |
| CN105112041B (en) | It is resistant to low ph environment and the fracturing fluid compared with high salinity and preparation method thereof | |
| CN101967352B (en) | Corrosion-prevention, waterproof and antifouling paint containing polymer asphalt and preparation method thereof | |
| CN104785949A (en) | Solder powder doped with tin-plated alloyed powder and soldering paste containing solder powder | |
| CN101818106A (en) | Environmentally-friendly cleaning agent and manufacturing method thereof | |
| CN103923514A (en) | PCB developing tank cleaning solution and method for cleaning developing tank by using same | |
| CN110091098A (en) | A kind of low-residual cleaning-free scaling powder and preparation method thereof | |
| CN103803854B (en) | A kind of anticorrosion waterproof rubber cement of acid and alkali-resistance and construction technology thereof | |
| CN106271219A (en) | A kind of No clean high-temperature electronic brazing flux and preparation method thereof | |
| CN109530973A (en) | A kind of low low-solid content water-based scaling powder and preparation method thereof that volatilizees | |
| CN103937340B (en) | A kind of exterior coating and preparation method thereof | |
| CN104531295A (en) | Composite flexible-membrane antirust oil | |
| CN106752771A (en) | A kind of lintel is turned over polyester fluorocarbon varnish and preparation method thereof | |
| CN106833562A (en) | Xanthans liquid dispersion and preparation method thereof | |
| CN106808542A (en) | A kind of timber preservative and preparation method thereof | |
| CN104449244B (en) | The application in Pipeline joint anticorrosion of the solvent-free double-component epoxy coating | |
| CN107603585A (en) | High-efficient, no-freon pressure break cleanup additive and preparation method | |
| CN103484207B (en) | Scrape the semi-synthetic cutting fluid of roller use, preparation method and using method thereof | |
| CN106854418A (en) | A kind of emulsified paint and preparation method | |
| CN105132111A (en) | Cutting fluid and preparation method thereof | |
| CN102181193B (en) | Emulsion ferrous metal (steel) antirust solution | |
| CN108517175A (en) | A kind of anticorrosion decorative paint of engineering machinery and preparation method thereof | |
| CN103695142A (en) | Rustproof microemulsion type metal cutting fluid and preparation method thereof | |
| CN103951987B (en) | A kind of waterproof hard pitch material and preparation method thereof | |
| CN109486570B (en) | Electro-hydraulic valve cleaning agent and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170104 |
|
| RJ01 | Rejection of invention patent application after publication |