CN115070259A - Novel environment-friendly lead-free soldering paste of superfine soldering tin powder - Google Patents
Novel environment-friendly lead-free soldering paste of superfine soldering tin powder Download PDFInfo
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- CN115070259A CN115070259A CN202210837756.6A CN202210837756A CN115070259A CN 115070259 A CN115070259 A CN 115070259A CN 202210837756 A CN202210837756 A CN 202210837756A CN 115070259 A CN115070259 A CN 115070259A
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- powder
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- solder powder
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- 238000005476 soldering Methods 0.000 title claims abstract description 67
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 78
- 239000000843 powder Substances 0.000 claims abstract description 60
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 230000004907 flux Effects 0.000 claims abstract description 33
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 20
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 20
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 20
- 230000007797 corrosion Effects 0.000 claims abstract description 17
- 238000005260 corrosion Methods 0.000 claims abstract description 17
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 16
- 239000003112 inhibitor Substances 0.000 claims abstract description 15
- 239000013543 active substance Substances 0.000 claims abstract description 13
- 239000003960 organic solvent Substances 0.000 claims abstract description 13
- 229940087305 limonene Drugs 0.000 claims abstract description 8
- 235000001510 limonene Nutrition 0.000 claims abstract description 8
- 125000005456 glyceride group Chemical group 0.000 claims abstract description 7
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 8
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 8
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 claims description 8
- 229930195729 fatty acid Natural products 0.000 claims description 8
- 239000000194 fatty acid Substances 0.000 claims description 8
- 150000004665 fatty acids Chemical class 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 claims description 8
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 8
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 8
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims description 6
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 6
- TVACALAUIQMRDF-UHFFFAOYSA-N dodecyl dihydrogen phosphate Chemical compound CCCCCCCCCCCCOP(O)(O)=O TVACALAUIQMRDF-UHFFFAOYSA-N 0.000 claims description 6
- 229920001223 polyethylene glycol Polymers 0.000 claims description 6
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 6
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 claims description 5
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 5
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 claims description 5
- KJIOQYGWTQBHNH-UHFFFAOYSA-N undecanol Chemical compound CCCCCCCCCCCO KJIOQYGWTQBHNH-UHFFFAOYSA-N 0.000 claims description 5
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 4
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 claims description 4
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 4
- 229920001732 Lignosulfonate Polymers 0.000 claims description 4
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 4
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 4
- 239000001361 adipic acid Substances 0.000 claims description 4
- 235000011037 adipic acid Nutrition 0.000 claims description 4
- 229920000180 alkyd Polymers 0.000 claims description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 4
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 claims description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 4
- 239000004359 castor oil Substances 0.000 claims description 4
- 235000019438 castor oil Nutrition 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 4
- HSEMFIZWXHQJAE-UHFFFAOYSA-N hexadecanamide Chemical compound CCCCCCCCCCCCCCCC(N)=O HSEMFIZWXHQJAE-UHFFFAOYSA-N 0.000 claims description 4
- 235000019357 lignosulphonate Nutrition 0.000 claims description 4
- 239000001630 malic acid Substances 0.000 claims description 4
- 235000011090 malic acid Nutrition 0.000 claims description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 claims description 4
- 229960004889 salicylic acid Drugs 0.000 claims description 4
- 235000002906 tartaric acid Nutrition 0.000 claims description 4
- 239000011975 tartaric acid Substances 0.000 claims description 4
- UFTFJSFQGQCHQW-UHFFFAOYSA-N triformin Chemical compound O=COCC(OC=O)COC=O UFTFJSFQGQCHQW-UHFFFAOYSA-N 0.000 claims description 4
- 230000007613 environmental effect Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 12
- 230000003647 oxidation Effects 0.000 abstract description 9
- 238000007254 oxidation reaction Methods 0.000 abstract description 9
- 239000012756 surface treatment agent Substances 0.000 abstract description 5
- 150000004701 malic acid derivatives Chemical class 0.000 abstract description 4
- 238000010301 surface-oxidation reaction Methods 0.000 abstract description 3
- 239000010949 copper Substances 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 229910052718 tin Inorganic materials 0.000 description 5
- 229910052797 bismuth Inorganic materials 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- -1 glycerol ester Chemical class 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerol Natural products OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- 238000003916 acid precipitation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N cyclobenzothiazole Natural products C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
Abstract
The invention provides novel environment-friendly lead-free solder paste of superfine solder powder, and relates to the technical field of household kitchens. The novel environment-friendly lead-free solder paste of the superfine solder powder comprises 88-92% of solder powder and the balance of soldering flux, wherein the soldering flux comprises an organic solvent, an active agent, resin, a thixotropic agent and a corrosion inhibitor, the solder powder is subsphaeroidal alloy powder with the granularity of 30-40 mu m, and the solder powder comprises 95-98% of Sn, 1-2% of Cu, 0.1-3% of Ag, 0.1-1% of Bi and 0.01-1% of Ni, and the balance of a surface treatment agent. The surface treatment agent is added to improve the wettability and the surface oxidation resistance of the soldering tin, and the mass ratio of 8: 1: the hydrogenated rosin glyceride, the limonene resin and the dehydrated malic acid resin of the formula 1 can improve the toughness, the oxidation resistance and the thermal stability of the resin, can increase the adhesion of tin paste, and have the functions of protecting and preventing PCB from being oxidized again after welding.
Description
Technical Field
The invention relates to the technical field of welding materials, in particular to novel environment-friendly lead-free solder paste of superfine solder powder.
Background
The soldering paste is a new type of soldering material produced along with SMT, and is a paste mixture formed by mixing soldering tin powder, soldering flux and other surfactants, thixotropic agents, etc. it is mainly used for soldering electronic components of PCB surface resistance, capacitance, IC, etc. in SMT industry, in which the grain form of soldering tin powder, the mass ratio of soldering tin powder and soldering flux and the oxidation degree of soldering tin powder are all the important factors for determining soldering quality
The existing lead-free solder paste uses Cu or Ag with good conductivity to replace Pb of the traditional lead-containing solder paste, the cost is increased along with the environmental protection, the scaling powder of the solder paste usually adopts natural rosin as base resin, but the natural rosin has the problems of easy oxidation, poor thermal stability, brittle texture, easy crack formation, easy superfine development of solder powder, easy oxidation of fine particles, low final reliability of the solder paste, poor stability of a welding point and the like.
Disclosure of Invention
Technical problem to be solved
Aiming at the defects of the prior art, the invention provides a novel environment-friendly lead-free soldering paste of superfine soldering powder, which solves the problems that natural rosin is easy to oxidize, poor in thermal stability, crisp in texture and easy to form cracks, and fine particles are easy to oxidize along with the superfine development of the soldering powder, so that the final reliability of the soldering paste is low and the stability of a welding point is poor.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: the novel environment-friendly lead-free solder paste of the superfine solder powder comprises 88-92% of the total mass of the solder paste and the balance of soldering flux, wherein the soldering flux comprises an organic solvent, an active agent, resin, a thixotropic agent and a corrosion inhibitor.
Preferably, the solder powder adopts near-spherical alloy powder with the grain size of 30-40 μm.
Preferably, the solder powder consists of 95 to 98 percent of Sn, 1 to 2 percent of Cu, 0.1 to 3 percent of Ag, 0.1 to 1 percent of Bi and 0.01 to 1 percent of Ni by mass, and the balance of surface treating agent.
Preferably, the surface treatment agent is formed by mixing 60% of dodecyl phosphate monoester, 20% of quaternary ammonium salt and 20% of polyethylene glycol by mass, and the content of the surface treatment agent is 0.1% -0.5% of the mass of the soldering tin powder.
Preferably, the organic solvent is a mixture of more than two of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, ethylene glycol monobutyl ether, undecanol and dodecanol, and the content of the organic solvent is 40% -55% of the mass of the soldering flux.
Preferably, the active agent is one or a mixture of more of succinic acid, adipic acid, glutaric acid, azelaic acid, sebacic acid, tartaric acid, salicylic acid, phthalic acid and terephthalic acid, and the content of the active agent is 1% -3% of the mass of the soldering flux.
Preferably, the resin is selected from one or more of hydrogenated rosin glyceride, pentaerythritol rosin ester, modified rosin resin, limonene resin, malic acid anhydride resin and alkyd resin, and the content of the resin is 35% -40% of the mass of the soldering flux.
Preferably, the thixotropic agent is one or more of hydrogenated castor oil, hexadecanoic acid amide, fatty acid monoglyceride and fatty acid triglyceride, and the content of the thixotropic agent is 1-5% of the mass of the soldering flux.
Preferably, the corrosion inhibitor is one or more of thiobenzothiazole, benzotriazole and sulfonated lignin, and the content of the corrosion inhibitor is 0.1% -0.9% of the soldering flux.
(III) advantageous effects
The invention provides an environment-friendly lead-free solder paste of novel superfine solder powder. The method has the following beneficial effects:
1. according to the invention, the surface treatment agent formed by mixing the dodecyl phosphate monoester, the quaternary ammonium salt and the polyethylene glycol is added into the solder powder, when the dodecyl phosphate monoester and the quaternary ammonium salt are dispersed in the polyethylene glycol, a protective film can be formed on the surface of the superfine solder powder, the oxidation speed of the solder powder can be slowed down, and meanwhile, the traditional rosin is replaced by selecting the mixture of hydrogenated rosin glycerol ester, limonene resin and dehydrated malic acid resin, so that the toughness, oxidation resistance and thermal stability of the resin can be improved, and the reliability of the solder paste is improved.
2. According to the invention, proper Bi and Ni are added to replace Cu and Ag metal materials, so that the environment is ensured, the contents of Cu and Ag are reduced, the production cost in actual production can be reduced, and meanwhile, Cu, Ag, Bi and Ni are adopted as main alloy components of the soldering tin powder, the primary crystal temperature of the soldering tin powder can be lower than 220 ℃, and the elongation, the shear strength and the tensile strength of the soldering tin paste can be increased.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
the embodiment of the invention provides a novel environment-friendly lead-free solder paste of superfine solder powder, which comprises 88-92% of solder powder and the balance of soldering flux, wherein the soldering flux comprises an organic solvent, an active agent, resin, a thixotropic agent and a corrosion inhibitor.
The solder powder is nearly spherical alloy powder with the granularity of 30-40 mu m, and in order to not influence the printing, spot injection and welding effects of the solder paste, the solder powder is specifically selected from solder powder with the granularity of 35 mu m accounting for 60 percent by weight of the solder powder, solder powder with the granularity of 30-35 mu m accounting for 20 percent by weight of the solder powder, and solder powder with the granularity of 35-40 mu m accounting for 20 percent by weight of the solder powder.
The solder powder consists of 95-98% of Sn, 1-2% of Cu, 0.1-3% of Ag, 0.1-1% of Bi and 0.01-1% of Ni by mass, and the balance of a surface treating agent, wherein Pb in the traditional solder powder is replaced by Cu and Ag, so that the pollution of Pb to the environment after the waste electrical components are corroded by acid rain can be prevented, 1% of Cu and 3% of Ag are specifically selected, the solder powder has high tensile strength and good conductive performance, but the cost is high, metal elements of the solder powder are compensated by Bi and Ni, the content of Ag can be properly reduced, and the cost is reduced.
The surface treating agent is formed by mixing 60% of dodecyl phosphate monoester, 20% of quaternary ammonium salt and 20% of polyethylene glycol by mass, the content of the surface treating agent is 0.1-0.5% of the mass of the soldering tin powder, and the solder wettability and the surface oxidation resistance can be improved.
The organic solvent is a mixture of more than two of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, ethylene glycol monobutyl ether, undecanol and dodecanol, the content of the organic solvent is 40-55% of the mass of the soldering flux, and the mass ratio is 4: 4: the diethylene glycol dimethyl ether, the diethylene glycol diethyl ether and the ethylene glycol monobutyl ether of the 3 have low melting points, low melting conditions and low energy consumption, but have slow crystallization speed, and are not beneficial to the welding of multiple welding spots and large workload.
The active agent is one or a mixture of more of succinic acid, adipic acid, glutaric acid, azelaic acid, sebacic acid, tartaric acid, salicylic acid, phthalic acid and terephthalic acid, the content of the active agent is 1-3% of the mass of the soldering flux, the effect of removing oxidation substances on the surface layer of a PCB copper film pad and the welding part of a part can be achieved, and the effect of reducing the surface tension of tin can be achieved.
The resin is composed of one or more of hydrogenated rosin glyceride, pentaerythritol rosin ester, modified rosin resin, limonene resin, malic acid anhydride resin and alkyd resin, the content of the resin is 35% -40% of the mass of the soldering flux, and the resin is prepared by mixing the following components in percentage by mass: 1: the hydrogenated rosin glyceride, the limonene resin and the dehydrated malic acid resin of the formula 1 can improve the toughness, the oxidation resistance and the thermal stability of the resin, can increase the adhesion of tin paste, and have the functions of protecting and preventing PCB from being oxidized again after welding.
The thixotropic agent is selected from one or more of hydrogenated castor oil, hexadecanoic acid amide, fatty acid monoglyceride and fatty acid triglyceride, the content of the thixotropic agent is 1-5% of the mass of the soldering flux, and the thixotropic agent plays a role in preventing trailing, adhesion and other phenomena in printing by adjusting the viscosity and the printing performance of the solder paste.
The corrosion inhibitor is selected from one or more of sulfenyl benzothiazole, benzotriazole and sulfonated lignin, the content of the corrosion inhibitor is 0.1-0.9% of that of the soldering flux, the corrosion inhibitor can slow down the corrosion speed of the soldering point, and the durability and the stability of the soldering point are improved.
Example two:
the embodiment of the invention provides a novel environment-friendly lead-free solder paste of superfine solder powder, which comprises 88-92% of solder powder and the balance of soldering flux, wherein the soldering flux comprises an organic solvent, an active agent, resin, a thixotropic agent and a corrosion inhibitor.
The solder powder is nearly spherical alloy powder with the granularity of 30-40 mu m, and in order to not influence the printing, spot injection and welding effects of the solder paste, the solder powder is specifically selected from solder powder with the granularity of 35 mu m accounting for 60 percent by weight of the solder powder, solder powder with the granularity of 30-35 mu m accounting for 20 percent by weight of the solder powder, and solder powder with the granularity of 35-40 mu m accounting for 20 percent by weight of the solder powder.
The solder powder consists of 95-98% of Sn, 1-2% of Cu, 0.1-3% of Ag, 0.1-1% of Bi, 0.01-1% of Ni and the balance of a surface treating agent by mass, Pb in the traditional solder powder is replaced by the Cu and the Ag, the pollution of Pb to the environment after the waste electrical components are corroded by acid rain can be prevented, and the cost can be controlled while the tensile strength and the good conductive performance of welding are ensured by specifically selecting the 2% of Cu and the 1% of Ag.
The surface treating agent is formed by mixing 60% of dodecyl phosphate monoester, 20% of quaternary ammonium salt and 20% of polyethylene glycol by mass, the content of the surface treating agent is 0.1-0.5% of the mass of the soldering tin powder, and the solder wettability and the surface oxidation resistance can be improved.
The organic solvent is a mixture of more than two of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, ethylene glycol monobutyl ether, undecanol and dodecanol, the content of the organic solvent is 40% -55% of the mass of the soldering flux, and the diethylene glycol dimethyl ether and the undecanol are selected in a mass ratio of 3: 2, so that the soldering flux can be rapidly melted, the crystallization speed can be high, the overall soldering time is short, and the soldering efficiency is high.
The active agent is one or a mixture of more of succinic acid, adipic acid, glutaric acid, azelaic acid, sebacic acid, tartaric acid, salicylic acid, phthalic acid and terephthalic acid, and the content of the active agent is 1-3% of the mass of the soldering flux.
The resin is composed of one or more of hydrogenated rosin glyceride, pentaerythritol rosin ester, modified rosin resin, limonene resin, malic acid anhydride resin and alkyd resin, the content of the resin is 35% -40% of the mass of the soldering flux, and the resin is prepared by mixing the following components in percentage by mass: 1: the hydrogenated rosin glyceride, the limonene resin and the dehydrated malic acid resin of the formula 1 can improve the toughness, the oxidation resistance and the thermal stability of the resin, can increase the adhesion of tin paste, and have the functions of protecting and preventing PCB from being oxidized again after welding.
The thixotropic agent is one or more of hydrogenated castor oil, hexadecanoic acid amide, fatty acid monoglyceride and fatty acid triglyceride, the content of the thixotropic agent is 1-5% of the mass of the soldering flux, and the thixotropic agent plays a role in preventing trailing, adhesion and other phenomena in printing by adjusting the viscosity and the printing performance of the soldering paste.
The corrosion inhibitor is selected from one or more of sulfenyl benzothiazole, benzotriazole and sulfonated lignin, the content of the corrosion inhibitor is 0.1-0.9% of that of the soldering flux, the corrosion inhibitor can slow down the corrosion speed of the soldering point, and the durability and the stability of the soldering point are improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a novel unleaded solder paste of environmental protection of superfine solder powder, includes solder powder and scaling powder, its characterized in that: the mass of the soldering tin powder accounts for 88-92% of the total mass of the soldering tin paste, and the balance is soldering flux, wherein the soldering flux comprises an organic solvent, an active agent, resin, a thixotropic agent and a corrosion inhibitor.
2. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 1, wherein: the solder powder adopts near-spherical alloy powder with the granularity of 30-40 mu m.
3. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 1, wherein: the soldering tin powder consists of 95-98% of Sn, 1-2% of Cu, 0.1-3% of Ag, 0.1-1% of Bi and 0.01-1% of Ni by mass, and the balance of a surface treating agent.
4. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 2, wherein: the surface treating agent is formed by mixing 60% of dodecyl phosphate monoester, 20% of quaternary ammonium salt and 20% of polyethylene glycol by mass, and the content of the surface treating agent is 0.1% -0.5% of the mass of the soldering tin powder.
5. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 1, wherein: the organic solvent is a mixture of more than two of diethylene glycol dimethyl ether, diethylene glycol diethyl ether, ethylene glycol monobutyl ether, undecanol and dodecanol, and the content of the organic solvent is 40-55% of the mass of the soldering flux.
6. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 1, wherein: the active agent is one or a mixture of more of succinic acid, adipic acid, glutaric acid, azelaic acid, sebacic acid, tartaric acid, salicylic acid, phthalic acid and terephthalic acid, and the content of the active agent is 1-3% of the mass of the soldering flux.
7. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 1, wherein: the resin is composed of one or more of hydrogenated rosin glyceride, pentaerythritol rosin ester, modified rosin resin, limonene resin, malic acid anhydride resin and alkyd resin, and the content of the resin is 35% -40% of the mass of the soldering flux.
8. The environment-friendly lead-free solder paste of the novel ultrafine solder powder as claimed in claim 1, characterized in that: the thixotropic agent is selected from one or more of hydrogenated castor oil, hexadecanoic acid amide, fatty acid monoglyceride and fatty acid triglyceride, and the content of the thixotropic agent is 1-5% of the mass of the soldering flux.
9. The novel environment-friendly lead-free solder paste of ultrafine solder powder as claimed in claim 1, wherein the corrosion inhibitor is selected from one or more of thiobenzothiazole, benzotriazole and sulfonated lignin, and the content of the corrosion inhibitor is 0.1-0.9% of the soldering flux.
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