WO2001058639A1 - Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method - Google Patents

Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method Download PDF

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Publication number
WO2001058639A1
WO2001058639A1 PCT/JP2001/000877 JP0100877W WO0158639A1 WO 2001058639 A1 WO2001058639 A1 WO 2001058639A1 JP 0100877 W JP0100877 W JP 0100877W WO 0158639 A1 WO0158639 A1 WO 0158639A1
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WO
WIPO (PCT)
Prior art keywords
solder paste
solder
mass
flux
halogen
Prior art date
Application number
PCT/JP2001/000877
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French (fr)
Japanese (ja)
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WO2001058639A9 (en
Inventor
Hitoshi Amita
Noriko Murase
Takashi Shoji
Original Assignee
Showa Denko K.K.
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Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to AU32242/01A priority Critical patent/AU3224201A/en
Publication of WO2001058639A1 publication Critical patent/WO2001058639A1/en
Publication of WO2001058639A9 publication Critical patent/WO2001058639A9/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616Halogen compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent

Definitions

  • the present invention relates to a solder paste used for surface mounting of electronic components, and more particularly, to a solder paste having excellent storage stability, a soldering method using the solder paste, and a joined article.
  • Solder paste is used in the electronics industry to surface mount electronic components. Solder paste is suitable for automation due to its printability and adhesiveness, and its use has been increasing in recent years.
  • solder paste is applied on a printed circuit board by screen printing or dispenser, electronic components are placed, and then reflowed to fix the electronic components.
  • the term "rifle opening" means that a solder paste is applied to a predetermined position on a substrate, an electronic component to be joined is placed thereon, and then the substrate is heated to a temperature equal to or higher than the melting temperature of the solder paste. Means a series of operations for joining parts.
  • fine pitch bonding has been required to reduce the size of electronic products, and the use of fine pitch components, for example, the use of a 0.3 mm pitch QFP (Quad Flat Package) type LSI, and the use of CSP ( Ch i Size Pacage) is often used.
  • QFP Quad Flat Package
  • CSP Ch i Size Pacage
  • the biggest cause of the decrease in the storage stability of the solder paste is that the solder powder reacts preferentially with the flux during storage, the oxidation of the solder powder progresses, the activator in the flux is consumed, and the activity of the flux decreases. At the same time, the viscosity of the solder paste increases due to the reaction products. For this reason, when using the solder paste, there is a problem that proper printing characteristics cannot be maintained and the solder paste does not dissolve during reflow.
  • a method of coating a solder powder with glycerin Japanese Patent Publication No. 5-265898 and a method of coating a solder powder with a coating agent that is insoluble or hardly soluble in a solder paste solvent (Japanese Patent Laid-Open No. — 1 1 3 1 9 7) is disclosed.
  • the latter coating agent include silicone oil, silicone base high molecular weight compound, fluorinated silicone oil, fluorosilicone resin, and fluorinated hydrocarbon-based polymer compound.
  • coating with a relatively large amount of the coating agent is effective in suppressing the oxidation of the solder powder.However, a large amount of the coating material is required for reflow of the solder paste. This is rather inconvenient, and solder balls may be generated frequently.
  • these coatings are only performed physically, and the adhesion is considered to be very weak, and there is a strong possibility that they will be peeled off during kneading when manufacturing the solder paste, transport during use, printing, etc. .
  • the above-mentioned resin coating agent mainly composed of rosin contains a large amount of reactive organic acid itself and protects the powder.
  • a method of adding a phenol-based, phosphite-based, or sulfur-based antioxidant as an activator for soldering flux (Japanese Patent Publication No. 59-226-32) JP-A-3-124092), one or more antioxidants containing one or more phenol skeletons having a tertiary butyl group in the molecule.
  • Method of adding 30% by weight Japanese Patent Application Laid-Open No. 5-185283
  • use of a specific surfactant Japanese Patent Application Laid-Open No. 2-147147
  • Sn-Zn solder paste is advantageous in terms of resources and cost, and since the reflow temperature can be reduced to the same level as Sn-Pb solder, the length of mounted components can be reduced. It is drawing attention as a particularly promising product because it has a long life and can respond to the diversification of parts.
  • the Sn-Zn solder paste has poorer storage stability than ordinary Pb-based solder paste, and the progress of oxidation of Zn in the solder powder and the relationship between Zn and flux. The reaction causes the viscosity to increase over time.
  • Zn reacts with halogen compounds in the flux at room temperature, deteriorating the storage stability of the solder paste.
  • the halogen compound in the flux reacts with Zn in the solder powder to generate a small amount of hydrogen gas, and the generated hydrogen gas is built into the solder fillet even after the parts are joined, so reliability is critical. Has a significant impact.
  • the present invention has been made in view of the above-described problems, and has an excellent storage stability, and in particular, a solder paste having excellent storage stability even when the solder particle diameter is reduced by fine pitching, and further using this solder paste.
  • An object of the present invention is to provide a reliable soldering method and a joint. Disclosure of the invention
  • the present invention is a solder paste comprising, in a solder paste containing a halogen compound, a halogen ion concentration per gram of the flux of not more than 300 ppm in terms of chlorine.
  • the halogen ions include bromine ions.
  • the above-mentioned solder paste contains Zn as solder powder. including.
  • the present invention provides a method of soldering a circuit board, comprising: a step of applying the solder paste on a circuit board; and a step of reflowing the solder paste, and a joined body manufactured by the method of soldering a circuit board. including.
  • the flux contained in the solder paste is a mixture of a rosin or synthetic resin-based resin component, a halogen compound and / or an organic acid component as an activator, a solvent, a thixotropic agent, and the like.
  • the effective components for removing the surface oxide of the solder metal at the mouth of the riff and obtaining good bonding are halogen compounds and / or organic acid components used as activators. is there.
  • These activators can enhance the ability to remove surface oxides, but react with the solder powder during soldering and during storage to degrade the solder paste.
  • halogen compounds have a high effect as an activator, but have a strong effect of deteriorating solder paste.
  • the present inventors have studied the reaction between the solder powder and the activator in the solder paste.
  • the halogen ion concentration per gram of the flux of the solder paste was 300 ppm or less in terms of chlorine, preferably 100 ppm or less. 100 ppm or less, more preferably 50 O ppm or less, and most preferably 30 O ppm or less, the reaction between the solder powder and the activator is suppressed, the solder paste is prevented from deteriorating, and the storage is stable. It has been found that it is possible to enhance the character.
  • the activator is attached in order to remove the metal surface oxide and obtain a good bond.
  • the halogen compound should be at least 1 in terms of the chlorine concentration of the halogen ion concentration. It is necessary to add 0 ppm or more, preferably 100 ppm or more. It is not clear why halogen ions have an adverse effect on the storage stability of the solder paste, but in the presence of halogen ions, the oxidizing power of the halogen compound added to the flux is enhanced, and the reaction with the solder metal is accelerated. It is thought that it will be done.
  • the chlorine equivalent value of the halogen ion concentration is determined by measuring the solder paste, quantifying the halogen ion concentration contained in the aqueous layer when extracted with an organic solvent-water system by ion chromatography, converting it to chlorine, and converting it to chlorine. It is calculated from the value converted per gram.
  • the chlorine conversion value is a value when the contained halogen ion is converted into chloride ion. For example, when a bromine compound is used as the activator, the amount of bromine ion in the solder paste (zg / g) , 35.4 5 3/7 9.904 (atomic weight of chlorine Z atomic weight of bromine).
  • the organic solvent used for the extraction may be any solvent which does not react with the flux, is insoluble in conventionally known water used in organic synthesis, and does not contain halogen ions. Examples include methylene, toluene, xylene, benzene, getyl ether, petroleum ether and the like. Form, toluene, xylene, getyl ether, and petroleum ether are preferably used from the viewpoint of the solubility of the flux and the ease of the extraction operation.
  • the water used for the extraction need not contain halogen ions, and for example, ultrapure water is most preferably used.
  • the measurement of the halogen ion concentration by extraction with an organic solvent-water can be carried out on a solder paste using either a water-soluble flux or a non-water-soluble flux.
  • the solder paste is used in a solder paste flux.
  • the concentration of halogen ions in is adjusted to be less than 300 ppm in terms of chlorine.
  • halogens such as isopropylamine hydrobromide, butylamine hydrochloride, and cyclohexylamine hydrobromide, which are preferably used as an activator, are organic base hydrohalides.
  • halogen compound used as a normal solder flux may be used.However, in order to further improve the solderability and wettability of the solder paste, it is stable as a halogen compound during storage of the solder paste. It is preferable to use a halogen compound, particularly an organic bromine compound, which decomposes and exhibits an activity at the reflow temperature so that the chlorine equivalent of the halogen ion becomes 3000 ppm or less.
  • organic bromine compound having the above-mentioned properties examples include a benzyl bromide compound having an alkyl substituent having 10 or more carbon atoms or a fatty acid or alicyclic compound having 10 or more carbon atoms in one molecule.
  • examples thereof include a polybromine compound containing four or more bromines, and these may be used as a mixture.
  • Benzyl bromide compounds having an alkyl chain having at least 10 carbon atoms are, for example, 4-stearoyloxybenzylbutamide, 4-stearyloxybenzyl bromide, 4-stearylbenzylbenzyl bromide, 4 Examples include compounds such as —bromomethylbenzyl stearate, 4-stearoylaminobenzyl bromide, and 2,4-bisbromomethylbenzyl stearate. Other than these, 4-palmitoyloxybenzyl bromide, 4-myristoyloxybenzyl bromide, 4-lauroyloxybenzyl bromide, 4_ndecanyloxybenzyl bromide, etc. Is mentioned.
  • the polybromine compound may have, for example, a carboxyl group, an ester group, an alcohol group, an ether group, a ketone group, or the like, and is a compound in which four or more bromine atoms are bonded.
  • these compounds include 9,10,12,13,15,16-hexabutamostate and 9,10,12,13,15,16-hexabuta Mostearic acid methyl ester, same ethyl ester, 9, 10, 12, 13-tetra Labromostearic acid, the same ethyl ester, the same ethyl ester, 9,10,12,13,15,16-hexabutamostearyl alcohol, 9,10,12,13-tetrabromostearyl alcohol, 1, 2,5,6,9,10-hexasub mouth mocyclo dodecane.
  • Particularly preferred are mosabetic mostearic acid and hexabolic mocyclododecane.
  • organic bromine compounds include 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-11-propanol, and 3-bromo-1,2-propanediol.
  • halogen compounds The addition amount of these halogen compounds is set so that the halogen ions in the solder paste fall below 3000 ppm in terms of chlorine per gram of flux.
  • One or more halogen compounds may be added, or an organic halogen compound and an organic base hydrochloride may be used in combination.
  • Examples of the organic acid component in the present invention include conventionally known succinic acid, fumaric acid, stearic acid, sebacic acid and the like, and an organic acid derivative which is a compound that generates an organic acid when the reflow temperature is reached is preferable.
  • Used for Examples thereof include various aliphatic carboxylic esters, aromatic carboxylic esters, aliphatic sulfonic esters, and aromatic sulfonic esters. Alcohol residues of these esters are preferably alkyl, aryl, particularly t-butyl, isopropyl and isobutyl, which have high ester decomposability, and these compounds may contain a halogen atom.
  • n-provyl paratoluenesulfonate isopropyl p-toluenesulfonate, isobutyl p-toluenesulfonate, n-butyl p-toluenesulfonate, n-provyl benzenesulfonate, and iso-propyl benzenesulfonate.
  • Bil isoptyl benzenesulfonate, salicylic acid-n-butyl mouth pill, isopropyl salicylate, isoptyl salicylate, n-butyl salicylate, isopropylate 4-nitrobenzoate, t-butyl 4-nitrobenzoate, methacrylic acid- Examples include t-butyl, t-butyl acrylate, t-butyl malonate, and t-butyl bromoacetate. Of these, para-toluenesulfonate-n-propyl, isoptyl salicylate, and t-butyl bromoacetate are particularly preferred.
  • the addition amount is in the range of 0.01 to 20% by mass, and preferably 0.05 to 5% by mass, based on the total amount of the flux.
  • the above decomposable organic acid ester alone has low decomposability even at a reflow temperature, it is effective to add a small amount of an ester decomposing catalyst to accelerate the decomposition.
  • an ester decomposition catalyst any catalyst can be used as long as the decomposable organic acid ester has a function of decomposing at the reflow temperature to promote the generation of acid.
  • a hydrohalide of an organic base is particularly effective. is there.
  • a well-known resin blended in a conventional flux can be used.
  • Polyester, polyurethane, acrylic resin and others are used.
  • alcohols, ethers, esters, or aromatic solvents can be used as in the case of conventional fluxes and solder pastes.
  • solvent alcohols, ethers, esters, or aromatic solvents
  • inorganic agents such as fine silica particles and kaolin particles, or organic agents such as hydrogenated castor oil and amide compounds are used. You.
  • solder paste of the present invention storage stability can be further improved by using a reducing agent as a stabilizer in combination.
  • the reducing agent is usually used as an antioxidant for resins and the like, and is soluble in solvents such as phenolic compounds, phosphorus compounds, sulfur compounds, tocopherol and derivatives thereof, and L-ascorbic acid and derivatives thereof. And the like.
  • phenolic compounds include hydroquinone, catechol, 2,6-di-t-butyl-p-cresol, butylhydroxyanisole, 2,2,1-methylenebis (4-methyl-6-t-butylphenol ).
  • Examples of the phosphorus-based compound include triphenylphosphite, trioctyl phosphite, tridecyl phosphite and the like.
  • sulfur compound examples include dilauryl-1,3,3,1-thiodipropionate, distearyl-1,3,3′-thiodipropionate, and dimyristyl-1,3,3,1-thiodipropionate.
  • tocopherol and its derivatives any compounds which have reducing properties and are soluble in a solvent, for example, esters thereof, can be used. Particularly good results are obtained when two kinds of tocopherol or a derivative thereof and L-ascorbic acid or a derivative thereof are used in combination.
  • the mixing ratio is preferably 0.5: 1 to 1: 0.5 by weight, particularly preferably about 1: 1.
  • L-ascorbic acid derivatives include ascorbic acid-2-phosphate, ascorbic acid-12-sulfate, ascorbic acid-2-glucoside, ascorbic acid-12,6-dibutylate, ascorbic acid-12, 6-distearate, ascorbic acid 1, 2, 6-dimyristate, ascorbic acid 6-palmitate, ascorbic acid 6-stearate, ascorbic acid 6-myristylate, Ascorbic acid 1,2,3,5,6-tetrapalmitate, ascorbic acid—2,3,5,6—tetramyristylate, ascorbic acid 1,2,3,5,6-tetrastearate, ascorbic acid 12—glucoside 6 — palmitate, ascorbic acid 1 2 — glucoside 1 6 — myristylate, ascorbic acid 1 2 — glucoside 6—stearate, ascorbic acid 1,5,6—benzylidene, ascorbic acid 1,5,6 —propylidene, Ascorbic acid 1-2
  • the amount of the reducing agent added may be an amount sufficient to sufficiently secure the storage stability of the solder paste, but is generally from 0.005% by mass to 20% by mass with respect to the total amount of the flux. And more preferably 0.01% by mass or more and 10% by mass or less. If the addition amount is too small, there is no stabilizing effect, and even if it is added in an amount of 20% by mass or more, no improvement in the effect corresponding to high concentration addition is observed, which is not preferable.
  • the flux used in the solder paste of the present invention is, for example, 20 to 60% by mass of a resin component, 0.04 to 20% by mass of a thixotropic agent, and 0.01% by mass based on the total amount of the flux.
  • a halogen compound satisfying the above-mentioned range of halogen ions, 0.05 to 20% by mass of a reducing agent, and a solvent or the like as a balance.
  • This flux is kneaded with, for example, 14 to 8% by mass and solder powder of 86 to 92% by mass based on the total amount of the solder paste to obtain a solder paste of the present invention.
  • the amount of the halide to be added must be such that the halogen ion concentration in the flux after kneading the solder paste is not more than 300 ppm in terms of chlorine.
  • the moisture such as the flux and the humidity of the atmosphere are adjusted, and the moisture content in the solder paste is controlled to 0.5% by mass or less, more preferably 0.3% by mass or less. Is preferred. More than 0.5% by weight of water in the paste If mixed in, the dissociation of the halide is promoted, and the dissociated halogen reacts with the solder alloy powder, which is not preferable. Further, the pH value of the solder paste is preferably in the range of 4 to 9, more preferably 6 to 8, from the viewpoint of suppressing the reaction between the solder powder and the flux.
  • an amine compound such as an alkanolamine, an aliphatic primary to tertiary amine, an aliphatic unsaturated amine, an alicyclic amine or an aromatic amine as the pH adjuster.
  • amine compounds include ethanolamine, butylamine, aminopropanol, polyoxyethyleneoleylamine, polyoxyethylenelaurelamine, polyoxyethylenestearylamine, getylamine, triethylamine, and methylamine.
  • Toxipropylamine, dimethylaminopropylamine, dibutylaminopropylamine, ethylhexylamine, ethoxypropylamine, ethylhexyloxypropylamine, bisproviramine, isopropylamine, diiso Propylamine and the like can be mentioned.
  • the amount of the amine compound used is preferably 0.05 to 20% by mass based on the total amount of the solder paste flux. If the content is less than 0.05% by mass, the effect as a pH adjuster is not sufficient. If the content is more than 20% by mass, the pH generally exceeds 9, shifting to the alkaline side, and the solder paste tends to absorb moisture.
  • azoles for example, benzotriazole, benzimidazole, tolyltriazole, etc. may be added to the flux to prevent copper in the circuit.
  • the addition amount of the antibacterial agent is preferably 0.5 to 20% by mass based on the total amount of the flux.
  • the solder powder used in the solder paste of the present invention may have a conventionally known metal composition, but a solder powder containing Zn which is easily oxidized is preferably used.
  • Sn-Zn, Sn_Ag-Zn, Sn-Bi-Sb-Zn, Sn-Bi-Cu-Zn, Sn-Ag-Sb-Zn, Sn-Ag-Cu- Zn-based and Sn-ZnBi-based are mentioned.
  • 95.5Sn / 3.5Ag / Ng is mainly composed of eutectic solder having 91% by mass of Sn and 9% by mass of Zn (hereinafter referred to as 91Sn / 9Zn).
  • solder powder of the present invention may be a mixture of two or more types of solder powders having different compositions.
  • the prepared solder paste can maintain the wettability of the solder on the substrate even after storage for 10 days. Is maintained well, and a reliable joint can be obtained.
  • solder paste of the present invention is suitably used when a board, for example, a printed wiring board and an electronic component are joined together to produce a joint.
  • a solder paste is applied to a portion where soldering is desired by a printing method or the like, and the electronic component is placed.
  • the electronic components can be joined to the substrate by heating and melting and solidifying the solder particles.
  • a bonding method between a substrate and an electronic component
  • SMT surface mounting technology
  • a solder paste is applied to a desired portion on a substrate, for example, a wiring board by a printing method.
  • electronic components such as chip components and QFPs are placed on the solder paste, and soldered collectively by a reflow heat source.
  • a reflow heat source a hot blast stove, an infrared stove, a steam condensing soldering device, a light beam soldering device, or the like can be used.
  • preheating is performed in the case of a Sn--Zn system such as 91Sn / 9Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn / 6Bi.
  • preheating temperature is 130-180 ° C, preferably 130-150 ° C
  • the preheating time is 60-120 seconds, preferably 60-90.
  • reflow temperature is 210-230 °, preferably 210-220 °, riff opening hour 30 660 seconds, preferably 30 to 40 seconds.
  • the reflow temperature in other alloy systems is +20 to 150 ° C with respect to the melting point of the alloy used (preferably +20 to 130 ° C with respect to the melting point of the alloy;
  • the temperature, the preheating time, and the one hour of the riff opening may be in the same ranges as described above.
  • the above reflow process can be carried out both in nitrogen and in air.
  • nitrogen reflow by setting the oxygen concentration to 5 V o 1% or less, preferably 0.5 vo 1% or less, the wettability of solder to a substrate such as a wiring board is improved as compared with the case of air reflow, The generation of solder balls is reduced and stable processing can be performed.
  • bonding may be performed on both surfaces of a substrate (plate to be bonded) such as a printed wiring board.
  • the electronic parts on which the solder paste of the present invention can be used include, for example, an LSI, a resistor, a capacitor, a transformer, an inductance, a filter, an oscillator and a vibrator, but are not limited thereto. It is not done.
  • the present invention provides a method of forming an adhesive film only on a predetermined surface of a substrate, for example, a predetermined surface of a circuit metal of a printed circuit board by a chemical reaction, as disclosed in Japanese Patent Publication No. 7-7244, After applying solder powder to this, apply flux, heat to the melting temperature of the solder and reflow, and mount it on the circuit board on which solder bumps have been formed using SMT (Surface Mount Technology) using the solder paste of the present invention. In this case, more excellent solderability can be obtained.
  • SMT Surface Mount Technology
  • the present invention can be applied to solder paste for fine pitch joining of microelectronic components made of a solder alloy that does not contain Pb and has low environmental pollution, and a reliable joint can be obtained even if a solder paste prepared in advance is used. As a result, for example, it is possible to cope with fine pitch bonding of a mounting wiring board, and as a result, it is possible to provide a wiring board having an excellent component life.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A solder paste which comprises a halogen compound as an activator in such an amount as to give a halogen ion concentration per 1 g of the flux used in the paste of 3,000 ppm or less in terms of a chlorine ion; a method for soldering using the solder paste; and a jointed product prepared by using the soldering method. The solder paste exhibits excellent storage stability.

Description

明 細 書 ハンダペースト、 該ハンダペース トを用いたハンダ付方法  Description Solder paste, soldering method using the solder paste
並びに該ハンダ付方法により製造された接合物 技術分野 And a joint manufactured by the soldering method
本発明は電子部品の表面実装に用いられるハンダペーストに関し、 さらに詳 しくは、 保存安定性に優れたハンダペース ト、 並びに、 該ハンダペース トを用 いたハンダ付け方法、 及び接合物に関する。 背景技術  The present invention relates to a solder paste used for surface mounting of electronic components, and more particularly, to a solder paste having excellent storage stability, a soldering method using the solder paste, and a joined article. Background art
ハンダペース トは、 エレクトロニクス産業において電子部品を表面実装する ために用いられる。 ハンダぺ一ストはその印刷適性、 粘着性のため自動化に適 しており、 近年その使用量が増大している。  Solder paste is used in the electronics industry to surface mount electronic components. Solder paste is suitable for automation due to its printability and adhesiveness, and its use has been increasing in recent years.
エレク トロニクス産業においては、 ハンダペーストはプリント基板上にスク リーン印刷またはディスペンサーにより塗布され、 電子部品が載置され、 つい でリフローして電子部品が固定化される。 本明細書で 「リフ口一」 とはハンダ ペーストを基板の所定位置に塗布し、 接合すべき電子部品をその上に載置し、 その後基板をハンダぺ一ストの融解温度以上に加熱し上記部品の接合を行う一 連の操作を意味する。  In the electronics industry, solder paste is applied on a printed circuit board by screen printing or dispenser, electronic components are placed, and then reflowed to fix the electronic components. In the present specification, the term "rifle opening" means that a solder paste is applied to a predetermined position on a substrate, an electronic component to be joined is placed thereon, and then the substrate is heated to a temperature equal to or higher than the melting temperature of the solder paste. Means a series of operations for joining parts.
一方、 最近では電子製品の小型化のためファインピッチ接合が要求され、 フ アインピツチの部品、 例えば 0. 3mmピッチの QFP (Quad F l a t P a c ka g e) タイプ L S Iの使用や、 さらには C SP (Ch i S i z e P a c ka g e) などが多く用いられている。 このため、 ハンダペース ト には、 ファイ ンピッチ対応の印刷性能が要求されている。 このような産業界の 望に応えるため、 ハンダ粒子の平均粒子径を下げることがなされているが、 一 方ハンダ粒子全体の比表面積が増大するため、 ハンダ粒子とフラックスとの反 応が促進され、ハンダペース 卜の保存安定性が悪化するという問題点があった。 ハンダペース卜の保存安定性低下の最大原因は、 保存中にハンダ粉末がフラ ックスと優先的に反応し、 ハンダ粉末の酸化が進行してフラックス中の活性剤 が消費され、 フラックスの活性度が低下すると同時に、 反応生成物によりハン ダペーストの粘度が増加してしまうためである。 このため、 ハンダペーストの 使用において、 適正な印刷特性が維持出来なくなる上に、 リフロー時に溶解し なくなるという問題が生ずる。 On the other hand, in recent years, fine pitch bonding has been required to reduce the size of electronic products, and the use of fine pitch components, for example, the use of a 0.3 mm pitch QFP (Quad Flat Package) type LSI, and the use of CSP ( Ch i Size Pacage) is often used. For this reason, solder paste is required to have a printing performance compatible with fine pitch. In order to respond to the demands of the industry, the average particle size of the solder particles has been reduced.However, the specific surface area of the entire solder particles has been increased, so that the reaction between the solder particles and the flux has been promoted. However, there is a problem that the storage stability of the solder paste deteriorates. The biggest cause of the decrease in the storage stability of the solder paste is that the solder powder reacts preferentially with the flux during storage, the oxidation of the solder powder progresses, the activator in the flux is consumed, and the activity of the flux decreases. At the same time, the viscosity of the solder paste increases due to the reaction products. For this reason, when using the solder paste, there is a problem that proper printing characteristics cannot be maintained and the solder paste does not dissolve during reflow.
従来より、 ハンダペーストの保存安定性を向上させるために、 ハンダ粒子の 表面を保護し、 粒子金属の反応性を下げる努力がなされてきた。  Conventionally, efforts have been made to protect the surface of the solder particles and reduce the reactivity of the metal particles in order to improve the storage stability of the solder paste.
例えば、 ハンダ粉末をグリセリンで被覆する方法 (日本特公平 5— 2 6 5 9 8号公報)、ハンダ粉末をハンダペーストの溶剤に対し不溶性あるいは難溶性の コーティング剤によりコートする方法 (日本特開平 1— 1 1 3 1 9 7号公報) が開示されている。 後者のコーティング剤の好適な例としてはシリコーンオイ ル、 シリコーンべ一ス高分子量化合物、 フッ素化シリコーンオイル、 フルォロ シリコーン樹脂およびフッ素化炭化水素ベース高分子化合物などが挙げられて いる。  For example, a method of coating a solder powder with glycerin (Japanese Patent Publication No. 5-265898) and a method of coating a solder powder with a coating agent that is insoluble or hardly soluble in a solder paste solvent (Japanese Patent Laid-Open No. — 1 1 3 1 9 7) is disclosed. Preferable examples of the latter coating agent include silicone oil, silicone base high molecular weight compound, fluorinated silicone oil, fluorosilicone resin, and fluorinated hydrocarbon-based polymer compound.
またハンダ粉末を、 常温ではフラックスと不相溶であるが、 ハンダ付け温度 で相溶するロジンを主体とする樹脂でコートする方法 (日本特開平 3 — 1 8 4 6 9 8号公報、 特開平 4 - 2 5 1 6 9 1号公報) が提案されている。  Also, a method of coating a solder powder with a resin mainly composed of rosin, which is incompatible with the flux at room temperature but is compatible with the soldering temperature (Japanese Patent Application Laid-Open No. HEI 3-184696, Japanese Patent Application Laid-open No. No. 4-251691) has been proposed.
前述のコ一ティング剤でコ一トする方法では、 比較的多量のコ一ティング剤 で被覆を行えばハンダ粉末の酸化を抑えるに有効であるが、 多量の被覆材料は ハンダペーストのリフローに対しむしろ不都合であって、 逆にハンダボ一ルが 多発するおそれがある。 またこれらの被覆は物理的に行われているだけで、 付 着は非常に弱いと考えられ、 ハンダペーストを製造する際の混練あるいは使用 時の移送、 印刷等の取扱ではがれてしまう恐れが強い。 また、 前述のロジンを 主体とする樹脂のコーティング剤はそれ自身に反応性の有機酸を多く含み粉末 を保護しているとは言い難い。  In the above-mentioned method of coating with a coating agent, coating with a relatively large amount of the coating agent is effective in suppressing the oxidation of the solder powder.However, a large amount of the coating material is required for reflow of the solder paste. This is rather inconvenient, and solder balls may be generated frequently. In addition, these coatings are only performed physically, and the adhesion is considered to be very weak, and there is a strong possibility that they will be peeled off during kneading when manufacturing the solder paste, transport during use, printing, etc. . In addition, it is difficult to say that the above-mentioned resin coating agent mainly composed of rosin contains a large amount of reactive organic acid itself and protects the powder.
その他、 ハンダ付けフラックスの活性剤として、 フエノール系、 フォスファ ィ ト系または硫黄系の抗酸化剤を添加する方法 (日本特公昭 5 9 - 2 2 6 3 2 号公報、 特開平 3— 1 2 4 0 9 2号公報)、 分子内に第三ブチル基のついたフエ ノ—ル骨格を一つまたはそれ以上含む酸化防止剤の一種またはそれ以上を 1〜 3 0重量%添加する方法 (日本特開平 5— 1 8 5 2 8 3号公報)、 また特定の界 面活性剤を用いること (日本特閧平 2 _ 1 4 7 1 9 4号公報) などが提案され ている。 In addition, a method of adding a phenol-based, phosphite-based, or sulfur-based antioxidant as an activator for soldering flux (Japanese Patent Publication No. 59-226-32) JP-A-3-124092), one or more antioxidants containing one or more phenol skeletons having a tertiary butyl group in the molecule. Method of adding 30% by weight (Japanese Patent Application Laid-Open No. 5-185283), use of a specific surfactant (Japanese Patent Application Laid-Open No. 2-147147), etc. Has been proposed.
また最近は環境問題から、 鉛を含まない P bフ リ一ハンダペーストが推奨さ れおり、 これに対応すべく開発が進められている。 中でも、 S n— Z n系のハ ンダぺ一ストは、 資源、 コス ト的に有利で、 しかも S n— P b系のハンダと同 等レベルまでリフロー温度が下げられるため、実装部品の長寿命化がはかられ、 また部品の多様化にも対応できることから、 特に有望なものとして注目されて いる。 しかし、 S n— Z n系のハンダぺ一ストは、 通常の P bベースのハンダ ペース トより更に保存安定性が悪く、 ハンダ粉末中の、 Z nの酸化の進行や Z nとフラックスとの反応により、 経時的に粘度が上昇する。 特に Z nが常温に おいてフラヅクス中のハロゲン化合物と反応し、 ハンダペース 卜の保存安定性 を悪化させている。 また、 フラックス中のハロゲン化合物と、 ハンダ粉末中の Z nが反応して微量の水素ガスを発生し、 この発生した水素ガスが部品接合後 もハンダフィレツ ト内に内蔵されるため、 信頼性に重大な影響をもたらすこと がわかった。  Recently, lead-free Pb-free solder paste has been recommended due to environmental issues, and development is under way to address this. Above all, Sn-Zn solder paste is advantageous in terms of resources and cost, and since the reflow temperature can be reduced to the same level as Sn-Pb solder, the length of mounted components can be reduced. It is drawing attention as a particularly promising product because it has a long life and can respond to the diversification of parts. However, the Sn-Zn solder paste has poorer storage stability than ordinary Pb-based solder paste, and the progress of oxidation of Zn in the solder powder and the relationship between Zn and flux. The reaction causes the viscosity to increase over time. In particular, Zn reacts with halogen compounds in the flux at room temperature, deteriorating the storage stability of the solder paste. In addition, the halogen compound in the flux reacts with Zn in the solder powder to generate a small amount of hydrogen gas, and the generated hydrogen gas is built into the solder fillet even after the parts are joined, so reliability is critical. Has a significant impact.
本発明は、 上記の問題点に鑑みなされたもので、 保存安定性に優れ、 特にフ ァインピッチ化によりハンダ粒子径を小さく した場合も保存安定性が優れたハ ンダペースト、更にこのハンダペーストを用いた信頼性の高いハンダ付け方法、 及び接合物を提供することを目的とする。 発明の開示  The present invention has been made in view of the above-described problems, and has an excellent storage stability, and in particular, a solder paste having excellent storage stability even when the solder particle diameter is reduced by fine pitching, and further using this solder paste. An object of the present invention is to provide a reliable soldering method and a joint. Disclosure of the invention
本発明は、 ハロゲン化合物を含むハンダぺ一ス トにおいて、 フラックス 1グ ラム当たりのハロゲンイオン濃度が塩素換算値で 3 0 0 O p p m以下であるこ とから成るハンダペース トである。 上記ハロゲンイオンは臭素イオンであるこ とを含む。 また上記ハンダペーストが、 ハンダ粉末として Z nを含有すること を含む。 The present invention is a solder paste comprising, in a solder paste containing a halogen compound, a halogen ion concentration per gram of the flux of not more than 300 ppm in terms of chlorine. The halogen ions include bromine ions. In addition, the above-mentioned solder paste contains Zn as solder powder. including.
また本発明は、 上記ハンダペース トを回路板上に塗布する工程と、 上記ハン ダペーストをリフローする工程とを含む回路板のハンダ付け方法、 及び上記回 路板のハンダ付け方法により製造した接合物を含む。  Further, the present invention provides a method of soldering a circuit board, comprising: a step of applying the solder paste on a circuit board; and a step of reflowing the solder paste, and a joined body manufactured by the method of soldering a circuit board. including.
上述の如く、 ハンダペーストのフラックス 1グラム当たりのハロゲンイオン 濃度を塩素換算値で 3 0 0 0 p p m以下とすることにより、 長時間の保存安定 性が維持されることになる。 発明を実施するための最良の形態  As described above, long-term storage stability can be maintained by setting the concentration of halogen ions per gram of flux of the solder paste to 300 ppm or less in terms of chlorine. BEST MODE FOR CARRYING OUT THE INVENTION
ハンダペーストに含まれるフラックスは、 ロジンまたは合成樹脂系の樹脂成 分、 活性剤としてハロゲン化合物および/または有機酸成分、 溶剤、 チクソト 口ビヅク剤等を配合したものである。 これらの成分のうち、 リフ口一時にハン ダ金属の表面酸化物を除去し良好な結合を得るために有効な成分は、 活性剤と して使用されているハロゲン化合物および/または有機酸成分である。 これら の活性剤は、 表面酸化物の除去能力を高めることができるが、 ハンダぺ一ス ト とした時、 また保存中においてハンダ粉末と反応しハンダペーストを劣化させ る。 特にハロゲン化合物は活性剤としての効果が高いものの、 一方でハンダぺ —ストを劣化させる影響が強い。  The flux contained in the solder paste is a mixture of a rosin or synthetic resin-based resin component, a halogen compound and / or an organic acid component as an activator, a solvent, a thixotropic agent, and the like. Among these components, the effective components for removing the surface oxide of the solder metal at the mouth of the riff and obtaining good bonding are halogen compounds and / or organic acid components used as activators. is there. These activators can enhance the ability to remove surface oxides, but react with the solder powder during soldering and during storage to degrade the solder paste. In particular, halogen compounds have a high effect as an activator, but have a strong effect of deteriorating solder paste.
本発明者らはハンダぺ一ストにおけるハンダ粉と活性剤の反応について検討 した結果、 ハンダペース 卜のフラックス 1グラム当たりにおけるハロゲンィォ ン濃度を塩素換算値で 3 0 0 0 p p m以下、 好ましくは 1 0 0 0 p p m以下、 より好ましくは 5 0 O p p m以下、 最も好ましくは 3 0 O p p m以下とするこ とにより、 ハンダ粉と活性剤の反応を抑制し、 ハンダペース トの劣化を防止し、 保存安定性を高めることが可能であることを見出した。  The present inventors have studied the reaction between the solder powder and the activator in the solder paste. As a result, the halogen ion concentration per gram of the flux of the solder paste was 300 ppm or less in terms of chlorine, preferably 100 ppm or less. 100 ppm or less, more preferably 50 O ppm or less, and most preferably 30 O ppm or less, the reaction between the solder powder and the activator is suppressed, the solder paste is prevented from deteriorating, and the storage is stable. It has been found that it is possible to enhance the character.
但し、 活性剤は、 金属表面酸化物を除去し良好な結合を得るために添付され るのであって、 上述の如き効果を得るには、 ハロゲン化合物は、 ハロゲンィォ ン濃度の塩素換算値で少なくとも 1 0 p p m以上、 好ましくは、 1 0 0 p p m 以上添加することが必要である。 ハロゲンイオンがハンダペーストの保存安定性に悪影響を及ぼす理由は明か ではないが、 ハロゲンイオンの存在下で、 フラックスに添加されているハロゲ ン化合物の酸化力が増強され、 ハンダ金属との反応が促進されるものと考えら れる。 However, the activator is attached in order to remove the metal surface oxide and obtain a good bond. To obtain the above-mentioned effect, the halogen compound should be at least 1 in terms of the chlorine concentration of the halogen ion concentration. It is necessary to add 0 ppm or more, preferably 100 ppm or more. It is not clear why halogen ions have an adverse effect on the storage stability of the solder paste, but in the presence of halogen ions, the oxidizing power of the halogen compound added to the flux is enhanced, and the reaction with the solder metal is accelerated. It is thought that it will be done.
ハロゲンイオン濃度の塩素換算値は、 ハンダペース トを計りとり、 有機溶剤 —水系で抽出した時の水層中に含まれるハロゲンイオン濃度を、 イオンクロマ トグラフィ一で定量し、 更に塩素換算しフラックス 1グラム当たりに換算した 値から求められる。 塩素換算値とは、 含有ハロゲンイオンを塩素イオンに換算 した時の値であり、 例えば、 活性剤に臭素化合物を使用した場合、 ハンダぺ一 スト中における臭素イオンの定量値 ( z g / g ) に、 3 5 . 4 5 3 / 7 9 . 9 0 4 (塩素の原子量 Z臭素の原子量) の値を乗じればよい。 また、 活性剤にョ ゥ素化合物を使用した場合は、 該イオンの定量値 ( g/ g ) に、 3 5 . 4 5 3 / 1 2 6 . 9 0 4 5 (塩素の原子量/ヨウ素の原子量) の値を乗じればよい。 ここで、 抽出に用いられる有機溶剤としては、 フラックスと反応せず、 有機 合成等で使われる従来周知の水に可溶しない、 ハロゲンイオンを含まない溶剤 であれば良く、 例えばクロ口ホルム、 塩化メチレン、 トルエン、 キシレン、 ベ ンゼン、 ジェチルエーテル、 石油エーテル等が挙げられる。 フラックスの溶解 性、 抽出操作のしゃすさ等からクロ口ホルム、 トルエン、 キシレン、 ジェチル エーテル、 石油エーテルが好適に用いられる。 抽出に使われる水は、 ハロゲン イオンを含んでいなければよく、 例えば超純水が最も好適に用いられる。 なお、 有機溶剤—水抽出によるハロゲンイオン濃度測定は、 水溶性フラックス、 非水 溶性フラヅクスの何れを用いたハンダペーストにおいても実施することができ 本発明では、 ハンダペーストを、 ハンダペース トのフラックス中におけるハ ロゲンイオン濃度を塩素換算値で 3 0 0 0 p p m以下となるようにする。 例え ば、 活性剤として好適に用いられる、 有機塩基のハロゲン化水素酸塩であるィ ソプロピルアミン臭化水素酸塩、 プチルァミン塩化水素酸塩や、 シクロへキシ ルァミン臭化水素酸塩等のハロゲン化水素酸ァミン塩、 1 , 3—ジフヱニルグ ァニジン臭化水素酸塩等の場合、 これらの化合物中に含まれるハロゲンは、 全 量ハロゲンイオンである。 よって、 その添加量は、 他にハロゲン化合物を併用 しない場合は、 ハロゲンイオンの塩素換算値が 3000 p pm以下となるよう 計算し添加すればよい。 The chlorine equivalent value of the halogen ion concentration is determined by measuring the solder paste, quantifying the halogen ion concentration contained in the aqueous layer when extracted with an organic solvent-water system by ion chromatography, converting it to chlorine, and converting it to chlorine. It is calculated from the value converted per gram. The chlorine conversion value is a value when the contained halogen ion is converted into chloride ion. For example, when a bromine compound is used as the activator, the amount of bromine ion in the solder paste (zg / g) , 35.4 5 3/7 9.904 (atomic weight of chlorine Z atomic weight of bromine). When an iodine compound is used as the activator, the quantitative value (g / g) of the ion is calculated as 35.545 3 / 126.045 (atomic weight of chlorine / atomic weight of iodine). ). Here, the organic solvent used for the extraction may be any solvent which does not react with the flux, is insoluble in conventionally known water used in organic synthesis, and does not contain halogen ions. Examples include methylene, toluene, xylene, benzene, getyl ether, petroleum ether and the like. Form, toluene, xylene, getyl ether, and petroleum ether are preferably used from the viewpoint of the solubility of the flux and the ease of the extraction operation. The water used for the extraction need not contain halogen ions, and for example, ultrapure water is most preferably used. The measurement of the halogen ion concentration by extraction with an organic solvent-water can be carried out on a solder paste using either a water-soluble flux or a non-water-soluble flux. In the present invention, the solder paste is used in a solder paste flux. The concentration of halogen ions in is adjusted to be less than 300 ppm in terms of chlorine. For example, halogens such as isopropylamine hydrobromide, butylamine hydrochloride, and cyclohexylamine hydrobromide, which are preferably used as an activator, are organic base hydrohalides. Ammonium hydride, 1,3-diphenyl In the case of anidine hydrobromide or the like, all of the halogen contained in these compounds is a halogen ion. Therefore, when no other halogen compound is used in combination, the addition amount may be calculated and added so that the chlorine-equivalent value of the halogen ion is 3000 ppm or less.
ハロゲン化合物は、 通常のハンダ用フラックスとして使用されているハロゲ ン化合物を用いてもよいが、 ハンダペーストのハンダ付け性、 濡れ性をさらに 改良するために、 ハンダペースト保存中にはハロゲン化合物として安定に存在 し、 リフロー温度では、 分解して活性力を発揮するハロゲン化合物、 特に有機 臭素化合物を、 ハロゲンイオンの塩素換算値が 3000 ppm以下となるよう にして用いることが好ましい。  As the halogen compound, a halogen compound used as a normal solder flux may be used.However, in order to further improve the solderability and wettability of the solder paste, it is stable as a halogen compound during storage of the solder paste. It is preferable to use a halogen compound, particularly an organic bromine compound, which decomposes and exhibits an activity at the reflow temperature so that the chlorine equivalent of the halogen ion becomes 3000 ppm or less.
上述の如き特性を有する有機臭素化合物を例示すると、 炭素数 10以上のァ ルキル置換基を有する臭化べンジル化合物、 または炭素数 1 0以上の脂肪酸ま たは脂環式化合物の一分子中に 4個以上の臭素を含むポリ臭素化合物が挙げら れ、 これらを混合して使用しても良い。  Examples of the organic bromine compound having the above-mentioned properties include a benzyl bromide compound having an alkyl substituent having 10 or more carbon atoms or a fatty acid or alicyclic compound having 10 or more carbon atoms in one molecule. Examples thereof include a polybromine compound containing four or more bromines, and these may be used as a mixture.
炭素数 10以上のアルキル鎖を持った臭化べンジル化合物は、 具体的には例 えば 4ーステアロイルォキシベンジルブ口マイ ド、 4—ステアリルォキシベン ジルブロマイ ド、 4ーステアリルべンジルブロマイ ド、 4—ブロモメチルベン ジルステアレート、 4—ステアロイルァミノべンジルブロマイ ド、 2, 4—ビ スブロモメチルベンジルステアレ一ト等のような化合物が挙げられる。 これ以 外にも 4—パルミ トイルォキシベンジルブ口マイ ド、 4—ミ リス トイルォキシ ベンジルブロマイ ド、 4—ラウロイルォキシベンジルブロマイ ド、 4_ゥンデ カノィルォキシベンジルブ口マイ ド等が挙げられる。  Benzyl bromide compounds having an alkyl chain having at least 10 carbon atoms are, for example, 4-stearoyloxybenzylbutamide, 4-stearyloxybenzyl bromide, 4-stearylbenzylbenzyl bromide, 4 Examples include compounds such as —bromomethylbenzyl stearate, 4-stearoylaminobenzyl bromide, and 2,4-bisbromomethylbenzyl stearate. Other than these, 4-palmitoyloxybenzyl bromide, 4-myristoyloxybenzyl bromide, 4-lauroyloxybenzyl bromide, 4_ndecanyloxybenzyl bromide, etc. Is mentioned.
またポリ臭素化合物としては、 例えばカルボキシル基、 エステル基、 アルコ —ル基、 エーテル基、 ケトン基などを有していても良く、 4個以上の臭素原子 が結合した化合物である。  The polybromine compound may have, for example, a carboxyl group, an ester group, an alcohol group, an ether group, a ketone group, or the like, and is a compound in which four or more bromine atoms are bonded.
これら化合物の具体例としては、 9 , 1 0, 1 2 , 13, 1 5 , 1 6—へキ サブ口モステアリン酸、 9, 10 , 12 , 1 3, 1 5 , 1 6—へキサブ口モス テアリン酸メチルエステル、 同ェチルエステル、 9, 10, 1 2, 13—テト ラブロモステアリン酸、 同 チルエステル、 同ェチルエステル、 9, 1 0, 1 2, 13, 1 5 , 1 6—へキサブ口モステアリルアルコール、 9 , 10 , 1 2 , 13—テトラブロモステアリルアルコール、 1 , 2 , 5, 6 , 9, 10—へキ サブ口モシクロ ドデカン等が挙げられる。 特にへキサブ口モステアリン酸、 へ キサブ口モシクロドデカンが好ましい。 Specific examples of these compounds include 9,10,12,13,15,16-hexabutamostate and 9,10,12,13,15,16-hexabuta Mostearic acid methyl ester, same ethyl ester, 9, 10, 12, 13-tetra Labromostearic acid, the same ethyl ester, the same ethyl ester, 9,10,12,13,15,16-hexabutamostearyl alcohol, 9,10,12,13-tetrabromostearyl alcohol, 1, 2,5,6,9,10-hexasub mouth mocyclo dodecane. Particularly preferred are mosabetic mostearic acid and hexabolic mocyclododecane.
また上記以外にも、 有機臭素化合物として更に例示すれば、 1—ブロモ— 2 —ブ夕ノール、 1ーブロモー 2—プロパノール、 3—ブロモ一 1—プロパノ一 ル、 3—ブロモー 1, 2—プロパンジオール、 1 , 4—ジブロモ一 2—ブ夕ノ —ル、 1, 3—ジブ口モー 2—プロパノール、 2, 3—ジブロモ一 1—プロパ ノール、 1, 4ジブ口モー 2 , 3—ブタンジオール、 2, 3—ジブロ乇一 2— ブテン一 1, 4—ジオール、 1—ブロモー 3 _メチル一 1ーブテン、 1, 4— ジブロモブテン、 1—ブロモー 1—プロペン、 2, 3—ジブロモプロペン、 ブ ロモ酢酸ェチル、 ひ—ブロモカプリル酸ェチル、 ひ—ブロモプロビオン酸ェチ ル、 ?一ブロモプロビオン酸ェチル、 ひ—ブロモ—酢酸ェチル、 2 , 3—ジブ ロモコハク酸、 2—ブロモコハク酸、 2, 2—ブロモアジビン酸、 2, 4ージ ブロモアセトフエノン、 1, 1—ジブロモテトラクロロェタン、 1, 2—ジブ 口モー 1—フエニルェ夕ン、 1, 2—ジブ口モスチレン等の臭化物が挙げられ るがこれらの例示に限定されるものではない。 また臭素の代わりに、 塩素、 ョ ゥ素を含む有機ハロゲン化合物を用いても良い。  In addition to the above, examples of organic bromine compounds include 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-11-propanol, and 3-bromo-1,2-propanediol. 1,4-dibromo-1-2-butanol, 1,3-dibromo-l-propanol, 2,3-dibromo-l-propanol, 1,4-dibromol-mo, 2,3-butanediol, 2,3-Dibromo-2-butene-1,4-diol, 1-bromo-3-methyl-1-butene, 1,4-dibromobutene, 1-bromo-1-propene, 2,3-dibromopropene, bromo Ethyl acetate, ethyl ethyl bromocaprylate, ethyl ethyl bromopropionate, ethyl ethyl bromopropionate, ethyl ethyl bromoacetate, 2,3-dibromosuccinic acid, 2-bromosuccinic acid, 2, 2-bromoazivic acid, 2, Examples include bromides such as 4-dibromoacetophenone, 1,1-dibromotetrachloroethane, 1,2-dibutene 1,1-phenylene, and 1,2-dibutene mostyrene. It is not limited. An organic halogen compound containing chlorine or iodine may be used instead of bromine.
これらのハロゲン化合物の添加量は、 ハンダペース ト中のハロゲンイオンが フラックス 1グラム当たりの塩素換算値で 3000 p pm以下に収まるように する。 またハロゲン化合物は 1種類またはそれ以上を添加してもよく、 また有 機ハ口ゲン化合物と有機塩基のハ口ゲン化水素酸塩を併用してもよい。  The addition amount of these halogen compounds is set so that the halogen ions in the solder paste fall below 3000 ppm in terms of chlorine per gram of flux. One or more halogen compounds may be added, or an organic halogen compound and an organic base hydrochloride may be used in combination.
本発明における有機酸成分としては、 従来周知のコハク酸、 フ夕ル酸、 ステ アリン酸、 セバシン酸等が挙げられ、 リフロー温度に達した時に有機酸を発生 する化合物である有機酸誘導体は好適に用いられる。 その例としては、 各種脂 肪族カルボン酸エステル、 芳香族カルボン酸エステル、 脂肪族スルホン酸エス テル、 芳香族スルホン酸エステル等が挙げられる。 これらエステルのアルコール残基としては、 アルキル、 ァリル、 特にエステ ルの分解性が高い t 一ブチル基、 イソプロピル基、 イソブチル基が好ましく、 またこれらの化合物はハロゲン原子を含んでいてもよい。 Examples of the organic acid component in the present invention include conventionally known succinic acid, fumaric acid, stearic acid, sebacic acid and the like, and an organic acid derivative which is a compound that generates an organic acid when the reflow temperature is reached is preferable. Used for Examples thereof include various aliphatic carboxylic esters, aromatic carboxylic esters, aliphatic sulfonic esters, and aromatic sulfonic esters. Alcohol residues of these esters are preferably alkyl, aryl, particularly t-butyl, isopropyl and isobutyl, which have high ester decomposability, and these compounds may contain a halogen atom.
具体的な例としては、 パラトルエンスルホン酸一 n—プロビル、 パラ トルェ ンスルホン酸イソプロビル、 パラ トルエンスルホン酸イソブチル、 パラ トルェ ンスルホン酸一 n—ブチル、 ベンゼンスルホン酸一 n—プロビル、 ベンゼンス ルホン酸イソプロビル、 ベンゼンスルホン酸イソプチル、 サリチル酸— n—プ 口ピル、 サリチル酸イソプロピル、 サリチル酸イソプチル、 サリチル酸— n— ブチル、 4—ニトロ安息香酸イソプロビル、 4—ニトロ安息香酸— t —ブチル、 メ夕クリル酸— t—ブチル、 アクリル酸— t—ブチル、 マロン酸— t—ブチル、 ブロモ酢酸一 t—プチルなどが挙げられる。 この中で特にパラ トルエンスルホ ン酸ー n—プロビル、 サリチル酸イソプチル、 ブロモ酢酸— t —ブチルが特に 好ましい。 添加量としてはフラックス全量に対して 0 . 0 1〜2 0質量%、 好 ましくは 0 . 0 5〜 5質量%の範囲を使用する。  Specific examples include n-provyl paratoluenesulfonate, isopropyl p-toluenesulfonate, isobutyl p-toluenesulfonate, n-butyl p-toluenesulfonate, n-provyl benzenesulfonate, and iso-propyl benzenesulfonate. Bil, isoptyl benzenesulfonate, salicylic acid-n-butyl mouth pill, isopropyl salicylate, isoptyl salicylate, n-butyl salicylate, isopropylate 4-nitrobenzoate, t-butyl 4-nitrobenzoate, methacrylic acid- Examples include t-butyl, t-butyl acrylate, t-butyl malonate, and t-butyl bromoacetate. Of these, para-toluenesulfonate-n-propyl, isoptyl salicylate, and t-butyl bromoacetate are particularly preferred. The addition amount is in the range of 0.01 to 20% by mass, and preferably 0.05 to 5% by mass, based on the total amount of the flux.
上記の分解性の有機酸エステルは、 単独ではリフロー温度においても分解性 が低いため、 分解を促進するためには少量のエステル分解触媒の添加が有効で ある。 エステル分解触媒としては、 分解性の有機酸エステルがリフロー温度で 分解して酸の発生を促進する作用を有する触媒であればよいが、 その中で特に 有機塩基のハロゲン化水素酸塩が有効である。  Since the above decomposable organic acid ester alone has low decomposability even at a reflow temperature, it is effective to add a small amount of an ester decomposing catalyst to accelerate the decomposition. As the ester decomposition catalyst, any catalyst can be used as long as the decomposable organic acid ester has a function of decomposing at the reflow temperature to promote the generation of acid. Among them, a hydrohalide of an organic base is particularly effective. is there.
本発明のハンダペーストに配合される樹脂成分としては、 従来フラックスに 配合される周知の樹脂を用いることができ、 例えば、 天然ロジン、 不均化ロジ ン、 重合ロジン、 変性ロジンなど、 合成樹脂としてはポリエステル、 ポリウレ タン、 アクリル系樹脂その他が用いられる。  As the resin component blended in the solder paste of the present invention, a well-known resin blended in a conventional flux can be used. For example, natural rosin, disproportionated rosin, polymerized rosin, modified rosin, etc. Polyester, polyurethane, acrylic resin and others are used.
溶剤としては、 従来のフラックスやハンダペーストと同様にアルコール類、 エーテル類、 エステル類、 又は芳香族系の溶剤が利用でき、 例えばベンジルァ ルコール、 ブ夕ノール、 ェチルセ口ソルブ、 ブチルセ口ソルブ、 ブチルカルビ トール、 ジエチレングリコールへキシルエーテル、 プロピレングリコールモノ フエ二ルェ一テル、 ジォクチルフ夕レート、 キシレン等が一種または混合して 用いられる。 As the solvent, alcohols, ethers, esters, or aromatic solvents can be used as in the case of conventional fluxes and solder pastes.For example, benzyl alcohol, butanol, ethyl solvent, butyl solvent, butyl carbitol , Diethylene glycol hexyl ether, propylene glycol monophenyl ether, dioctyl phthalate, xylene, etc. Used.
また印刷性を改善するために添加されるチクソ トロビック剤としては、 微細 なシリカ粒子、 カオリン粒子などの無機系のもの、 または水添ヒマシ油、 アマ ィ ド化合物などの有機系のものが使用される。  As the thixotropic agent added to improve printability, inorganic agents such as fine silica particles and kaolin particles, or organic agents such as hydrogenated castor oil and amide compounds are used. You.
本発明のハンダペーストにおいては、還元剤を安定剤として併用することで、 保存安定性を更に向上させることができる。  In the solder paste of the present invention, storage stability can be further improved by using a reducing agent as a stabilizer in combination.
上記還元剤としては、 通常樹脂などの酸化防止剤として使用されており、 溶 剤に溶解可能なフエノール系化合物、 りん系化合物、 硫黄系化合物、 トコフエ ロール及びその誘導体、 L—ァスコルビン酸及びその誘導体等が挙げられる。 具体的には、 フエノール系化合物としては、 ハイ ドロキノン、 カテコール、 2 , 6—ジー t 一ブチル一 p—クレゾール、 ブチルヒドロキシァニソール、 2 , 2, 一メチレンビス (4ーメチルー 6— t —ブチルフエノール) などを挙げる ことができる。  The reducing agent is usually used as an antioxidant for resins and the like, and is soluble in solvents such as phenolic compounds, phosphorus compounds, sulfur compounds, tocopherol and derivatives thereof, and L-ascorbic acid and derivatives thereof. And the like. Specifically, phenolic compounds include hydroquinone, catechol, 2,6-di-t-butyl-p-cresol, butylhydroxyanisole, 2,2,1-methylenebis (4-methyl-6-t-butylphenol ).
りん系化合物としては、 トリフエニルフォスファイ ト、 トリオク夕デシルフ ォスファイ ト、 トリデシルフォスフアイ ト等が挙げられる。  Examples of the phosphorus-based compound include triphenylphosphite, trioctyl phosphite, tridecyl phosphite and the like.
また硫黄系化合物としては、 ジラウリル一 3 , 3, 一チォジプロピオネート、 ジステアリル一 3, 3 ' —チォジプロピオネート、 ジミリスチル一 3 , 3, 一 チォジプロピオネートなどを挙げることができる。  Examples of the sulfur compound include dilauryl-1,3,3,1-thiodipropionate, distearyl-1,3,3′-thiodipropionate, and dimyristyl-1,3,3,1-thiodipropionate.
トコフエロール及びその誘導体、 Lーァスコルビン酸及びその誘導体として は、 還元性を有し、 溶剤に対して可溶な化合物、 例えばこれらのエステルであ れば使用可能である。 特にトコフエロールまたはその誘導体と L一ァスコルビ ン酸またはその誘導体の 2種を併用した時に好結果が得られる。 配合比として は重量比で 0 . 5 : 1〜 1 : 0 . 5、 特に好ましくはほぼ 1対 1がよい。  As tocopherol and its derivatives, and L-ascorbic acid and its derivatives, any compounds which have reducing properties and are soluble in a solvent, for example, esters thereof, can be used. Particularly good results are obtained when two kinds of tocopherol or a derivative thereof and L-ascorbic acid or a derivative thereof are used in combination. The mixing ratio is preferably 0.5: 1 to 1: 0.5 by weight, particularly preferably about 1: 1.
L—ァスコルビン酸誘導体の具体例としては、 ァスコルビン酸— 2—リン酸、 ァスコルビン酸一 2—硫酸、 ァスコルビン酸— 2—グルコシ ド、 ァスコルビン 酸一 2 , 6—ジブチレ一ト、 ァスコルビン酸一 2 , 6—ジステアレ一ト、 ァス コルビン酸一 2, 6—ジミリスチレ一ト、 ァスコルビン酸一 6—パルミテート、 ァスコルビン酸一 6—ステアレ一ト、 ァスコルビン酸一 6—ミ リスチレ一ト、 ァスコルビン酸一 2 , 3, 5 , 6—テトラパルミテート、 ァスコルビン酸— 2 , 3 , 5 , 6 —テトラミ リスチレート、 ァスコルビン酸一 2, 3, 5, 6—テト ラステアレート、 ァスコルビン酸一 2 —グルコシド一 6 —パルミテート、 ァス コルビン酸一 2 —グルコシド一 6 —ミリスチレート、 ァスコルビン酸一 2 —グ ルコシド一 6—ステアレート、 ァスコルビン酸一 5 , 6—ベンジリデン、 ァス コルビン酸一 5 , 6 —プロピリデン、 ァスコルビン酸一 2 —リン酸一 5 , 6 - ベンジリデン、 ァスコルビン酸一 2 —リン酸一 5 , 6—プロピリデン等が、 ま た、 トコフエロール誘導体の具体例としては、 トコ一ル、 酢酸トコフエロール、 リン酸トコフエロール、 ソルビン酸トコフエロール、 ニコチン酸トコフエ口一 ル等が挙げられる。 Specific examples of L-ascorbic acid derivatives include ascorbic acid-2-phosphate, ascorbic acid-12-sulfate, ascorbic acid-2-glucoside, ascorbic acid-12,6-dibutylate, ascorbic acid-12, 6-distearate, ascorbic acid 1, 2, 6-dimyristate, ascorbic acid 6-palmitate, ascorbic acid 6-stearate, ascorbic acid 6-myristylate, Ascorbic acid 1,2,3,5,6-tetrapalmitate, ascorbic acid—2,3,5,6—tetramyristylate, ascorbic acid 1,2,3,5,6-tetrastearate, ascorbic acid 12—glucoside 6 — palmitate, ascorbic acid 1 2 — glucoside 1 6 — myristylate, ascorbic acid 1 2 — glucoside 6—stearate, ascorbic acid 1,5,6—benzylidene, ascorbic acid 1,5,6 —propylidene, Ascorbic acid 1-2-phosphate 5,6-benzylidene, ascorbic acid 12-5-phosphate 6,5-propylidene, etc., and specific examples of tocopherol derivatives include tocoyl, tocopherol acetate, and phosphoric acid. Examples include tocopherol, tocopherol sorbate, and tocopherol nicotinate.
これらの還元剤は、 単独であってもまたは混合して使用してもよい。 還元剤 の添加量は、 ハンダペース卜の保存安定性を充分に確保するに足る量であれば よいが、 一般的にはフラックス全量に対し 0 . 0 0 5質量%以上 2 0質量%以 下であり、 さらに好ましくは 0 . 0 1質量%以上 1 0質量%以下である。 添加 量が少なすぎると安定化効果が無く、 2 0質量%以上添加しても高濃度添加に 見合うだけの効果の向上が認められないので好ましくない。  These reducing agents may be used alone or in combination. The amount of the reducing agent added may be an amount sufficient to sufficiently secure the storage stability of the solder paste, but is generally from 0.005% by mass to 20% by mass with respect to the total amount of the flux. And more preferably 0.01% by mass or more and 10% by mass or less. If the addition amount is too small, there is no stabilizing effect, and even if it is added in an amount of 20% by mass or more, no improvement in the effect corresponding to high concentration addition is observed, which is not preferable.
本発明のハンダぺ一ストに用いられるフラックスは、 例えば、 フラックス全 量に対し、 2 0 ~ 6 0質量%の樹脂成分、 0 . 0 4〜2 0質量%のチクソトロ ビック剤、 0 . 0 1〜2 0質量%の有機酸成分、 上述したハロゲンイオンの範 囲を満たすハロゲン化合物、 0 . 0 0 5〜2 0質量%の還元剤及び残部として 溶剤その他を用いる。 このフラックスを、 例えば、 ハンダぺ一スト全量に対し 1 4〜8質量%と、 ハンダ粉末 8 6〜9 2質量%とを混練して本発明のハンダ ペース トとする。 この場合のハロゲン化物の添加量は、 ハンダペースト混練後 のフラックス中のハロゲンイオン濃度が塩素換算値で 3 0 0 0 p p m以下とな るようにする必要がある。  The flux used in the solder paste of the present invention is, for example, 20 to 60% by mass of a resin component, 0.04 to 20% by mass of a thixotropic agent, and 0.01% by mass based on the total amount of the flux. To 20% by mass of an organic acid component, a halogen compound satisfying the above-mentioned range of halogen ions, 0.05 to 20% by mass of a reducing agent, and a solvent or the like as a balance. This flux is kneaded with, for example, 14 to 8% by mass and solder powder of 86 to 92% by mass based on the total amount of the solder paste to obtain a solder paste of the present invention. In this case, the amount of the halide to be added must be such that the halogen ion concentration in the flux after kneading the solder paste is not more than 300 ppm in terms of chlorine.
配合物の調合、 混練においてフラックスなどの水分、 雰囲気の湿度を調節し、 ハンダぺ—スト中の水分含有量を、 0 . 5質量%以下、 より好ましくは 0 . 3 質量%以下に管理するのが好ましい。 ペースト中に水分が 0 . 5質量%より多 く混入するとハロゲン化物の解離を促進し、 その解離したハロゲンがハンダ合 金粉末と反応するために好ましくない。 また、 ハンダペーストの pH値も 4〜 9、 より好ましくは 6〜8の範囲にあることが、 ハンダ粉とフラックスとの反 応を抑制する意味で好ましい。 この場合、 pH調整剤として、 アルカノ一ルァ ミン類、 脂肪族第 1〜第 3アミン類、 脂肪族不飽和アミン類、 脂環式ァミン類、 芳香族ァミン類などのアミン化合物を用いることが好ましい。 In the preparation and kneading of the mixture, the moisture such as the flux and the humidity of the atmosphere are adjusted, and the moisture content in the solder paste is controlled to 0.5% by mass or less, more preferably 0.3% by mass or less. Is preferred. More than 0.5% by weight of water in the paste If mixed in, the dissociation of the halide is promoted, and the dissociated halogen reacts with the solder alloy powder, which is not preferable. Further, the pH value of the solder paste is preferably in the range of 4 to 9, more preferably 6 to 8, from the viewpoint of suppressing the reaction between the solder powder and the flux. In this case, it is preferable to use an amine compound such as an alkanolamine, an aliphatic primary to tertiary amine, an aliphatic unsaturated amine, an alicyclic amine or an aromatic amine as the pH adjuster. .
これらァミン化合物の具体的な化合物としては、 エタノールァミン、 ブチル ァミン、 ァミノプロパノール、 ポリオキシエチレンォレイルァミン、 ポリオキ シエチレンラウレルァミン、 ポリオキシエチレンステアリルァミン、 ジェチル ァミン、 トリェチルァミン、 メ トキシプロピルァミン、 ジメチルァミノプロピ ルァミン、 ジブチルァミノプロビルァミン、 ェチルへキシルァミン、 エトキシ プロピルアミン、 ェチルへキシルォキシプロピルァミン、 ビスプロビルァミン、 ィソプロピルァミン、 ジィソプロピルアミンなどを挙げることができる。  Specific examples of these amine compounds include ethanolamine, butylamine, aminopropanol, polyoxyethyleneoleylamine, polyoxyethylenelaurelamine, polyoxyethylenestearylamine, getylamine, triethylamine, and methylamine. Toxipropylamine, dimethylaminopropylamine, dibutylaminopropylamine, ethylhexylamine, ethoxypropylamine, ethylhexyloxypropylamine, bisproviramine, isopropylamine, diiso Propylamine and the like can be mentioned.
ァミン化合物の使用量は、 ハンダぺ一ス トのフラックスの全量に対し、 0. 05〜20質量%とすることが好ましい。 0. 05質量%未満では pH調整剤 としての効果が十分でなく、 20質量%を超えると一般に pHが 9を超え、 ァ ルカリ側に移行しハンダペーストが吸湿しやすくなる。  The amount of the amine compound used is preferably 0.05 to 20% by mass based on the total amount of the solder paste flux. If the content is less than 0.05% by mass, the effect as a pH adjuster is not sufficient. If the content is more than 20% by mass, the pH generally exceeds 9, shifting to the alkaline side, and the solder paste tends to absorb moisture.
更に回路の銅を防鲭するためフラックス中に、 ァゾ一ル類、 例えばべンゾト リアゾール、 ベンズィミダゾ一ル、 トリルトリアゾ一ルなどを添加しても良い。 防鯖剤の添加量は、 フラックス全量に対して 0. ◦ 5〜20質量%が好ましい。 本発明のハンダペーストに使用するハンダ粉末は、 従来周知の金属組成のも のでよいが、 酸化しやすい Z nを含むハンダ粉末が好適に用いられる。 例えば、 Sn— Zn系、 Sn_Ag— Zn系、 S n— B i— S b— Z n系、 Sn— B i 一 Cu— Zn系、 Sn— Ag— Sb— Zn系、 Sn— Ag— Cu— Zn系、 S n- Z n-B i系が挙げられる。  Further, azoles, for example, benzotriazole, benzimidazole, tolyltriazole, etc. may be added to the flux to prevent copper in the circuit. The addition amount of the antibacterial agent is preferably 0.5 to 20% by mass based on the total amount of the flux. The solder powder used in the solder paste of the present invention may have a conventionally known metal composition, but a solder powder containing Zn which is easily oxidized is preferably used. For example, Sn-Zn, Sn_Ag-Zn, Sn-Bi-Sb-Zn, Sn-Bi-Cu-Zn, Sn-Ag-Sb-Zn, Sn-Ag-Cu- Zn-based and Sn-ZnBi-based are mentioned.
上記の具体例としては、 Snが 91質量%、 Z nが 9質量%の共晶ハンダ(以 下 91 Sn/9 Znと表す。) を中心として、 95. 5 S n/3. 5 Ag/ 1 Z n、 5 1 Sn/45B i/3 Sb/1 Zn、 84 S n/ 10 B i / 5 S b/ 1 Zn、 88. 2 S n/ 10 B i/0. 8Cu/l Zn、 88 S n/4 A g/7 Sb/l Zn、 97 S n/1 Ag/1 S b/1 Z n、 91. 2 S n/2 Ag/ 0. 8 Cu/6 Zn、 89 S n/8 Z n/3 B i、 86 S n/ 8 Z n/ 6 B i、 89. 1 S n/2 Ag/0. 9 C u/ 8 Z nなどが挙げられる。 また本発明の ハンダ粉末として、 異なる組成のハンダ粉末を 2種類以上混合したものでもよ い o As an example of the above, 95.5Sn / 3.5Ag / Ng is mainly composed of eutectic solder having 91% by mass of Sn and 9% by mass of Zn (hereinafter referred to as 91Sn / 9Zn). 1 Zn, 5 1 Sn / 45B i / 3 Sb / 1 Zn, 84 S n / 10 Bi / 5 Sb / 1 Zn, 88.2 S n / 10 B i / 0.8 Cu / l Zn, 88 S n / 4 A g / 7 Sb / l Zn, 97 S n / 1 Ag / 1 S b / 1 Z n, 91. 2 S n / 2 Ag / 0.8 Cu / 6 Zn, 89 S n / 8 Z n / 3 B i, 86 S n / 8 Z n / 6 B i, 89.1 S n / 2 Ag / 0. 9 Cu / 8Zn. The solder powder of the present invention may be a mixture of two or more types of solder powders having different compositions.
上述の如きハロゲンイオンの含有量をフラックス 1グラム当たりの塩素換算 値で 3000 ppm以下とすることにより、 調合されたハンダペーストは、 1 0日間保存後使用しても、 基板へのハンダの濡れ性が良好に保持され、 信頼性 のある接合を得ることができる。  By adjusting the content of halogen ions to 3000 ppm or less in terms of chlorine per gram of flux as described above, the prepared solder paste can maintain the wettability of the solder on the substrate even after storage for 10 days. Is maintained well, and a reliable joint can be obtained.
本発明のハンダペース トは、 基板、 例えば、 プリン ト配線板と電子部品を接 合して接合物を製造する際に好適に使用される。 本発明のハンダペース 卜の使 用方法、 並びに電子部品接合物の製造方法では、 例えば、 ハンダ付けを所望す る部分に、 印刷法等でハンダペーストを塗布し、 電子部品を載置し、 その後加 熱してハンダ粒子を溶融し凝固させることにより電子部品を基板に接合するこ とができる。  The solder paste of the present invention is suitably used when a board, for example, a printed wiring board and an electronic component are joined together to produce a joint. In the method of using a solder paste and the method of manufacturing an electronic component joint according to the present invention, for example, a solder paste is applied to a portion where soldering is desired by a printing method or the like, and the electronic component is placed. The electronic components can be joined to the substrate by heating and melting and solidifying the solder particles.
基板と電子部品の接合方法 (実装方法) としては、 例えば表面実装技術 (S MT) があげられる。 この実装方法は、 まずハンダペース トを印刷法により基 板、 例えば配線板上の所望する箇所に塗布する。 次いで、 チップ部品や QFP などの電子部品をハンダペースト上に載置し、 リフロー熱源により一括してハ ンダ付けする。 リフロー熱源には、 熱風炉、 赤外線炉、 蒸気凝縮ハンダ付け装 置、 光ビームハンダ付け装置等を使用することができる。  As a bonding method (mounting method) between a substrate and an electronic component, for example, surface mounting technology (SMT) can be cited. In this mounting method, first, a solder paste is applied to a desired portion on a substrate, for example, a wiring board by a printing method. Next, electronic components such as chip components and QFPs are placed on the solder paste, and soldered collectively by a reflow heat source. As the reflow heat source, a hot blast stove, an infrared stove, a steam condensing soldering device, a light beam soldering device, or the like can be used.
本発明のリフローのプロセスはハンダ合金組成で異なるが、 9 1 S n/9 Z n、 89 Sn/8 Zn/3B i, 86 Sn/8 Zn/6B iなどの Sn— Zn 系の場合、 プレヒートとリフローの 2段工程で行うのが好ましく、 それそれの 条件は、 プレヒートが温度 130〜 180°C、 好ましくは、 130〜 150°C、 プレヒート時間が 60〜 120秒、 好ましくは、 60〜90秒、 リフローは温 度が 2 10〜230° 好ましくは、 210〜220° リフ口一時間が 30 〜6 0秒、 好ましくは、 3 0〜4 0秒である。 なお他の合金系におけるリフロ —温度は、 用いる合金の融点に対し + 2 0〜十 5 0 ° ( 、 好ましくは、 合金の融 点に対し + 2 0〜十 3 0 °Cとし、 他のプレヒート温度、 プレヒート時間、 リフ 口一時間は上記と同様の範囲であればよい。 Although the reflow process of the present invention differs depending on the solder alloy composition, in the case of a Sn--Zn system such as 91Sn / 9Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn / 6Bi, preheating is performed. And the reflow are preferably performed in two steps.The preheating temperature is 130-180 ° C, preferably 130-150 ° C, and the preheating time is 60-120 seconds, preferably 60-90. Second, reflow temperature is 210-230 °, preferably 210-220 °, riff opening hour 30 660 seconds, preferably 30 to 40 seconds. The reflow temperature in other alloy systems is +20 to 150 ° C with respect to the melting point of the alloy used (preferably +20 to 130 ° C with respect to the melting point of the alloy; The temperature, the preheating time, and the one hour of the riff opening may be in the same ranges as described above.
本発明のハンダペーストでは上記のリフロープロセスを窒素中でも大気中で も実施することが可能である。 窒素リフロ一の場合は酸素濃度を 5 V o 1 %以 下、 好ましくは 0 . 5 v o 1 %以下とすることで大気リフローの場合より配線 板などの基板へのハンダの濡れ性が向上し、 ハンダボールの発生も少なくなり 安定した処理ができる。  With the solder paste of the present invention, the above reflow process can be carried out both in nitrogen and in air. In the case of nitrogen reflow, by setting the oxygen concentration to 5 V o 1% or less, preferably 0.5 vo 1% or less, the wettability of solder to a substrate such as a wiring board is improved as compared with the case of air reflow, The generation of solder balls is reduced and stable processing can be performed.
この後、 基板を冷却し表面実装が完了する。 この実装方法による電子部品接 合物の製造方法においては、 プリント配線板等の基板 (被接合板) の両面に接 合を行ってもよい。 なお、 本発明のハンダペーストを使用することができる電 子部品としては、 例えば、 L S I、 抵抗器、 コンデンサ、 トランス、 インダク タンス、 フィル夕、 発振子 ·振動子等があげられるが、 これに限定されるもの ではない。  After that, the board is cooled and the surface mounting is completed. In the method of manufacturing a bonded electronic component by this mounting method, bonding may be performed on both surfaces of a substrate (plate to be bonded) such as a printed wiring board. The electronic parts on which the solder paste of the present invention can be used include, for example, an LSI, a resistor, a capacitor, a transformer, an inductance, a filter, an oscillator and a vibrator, but are not limited thereto. It is not done.
また本発明は、 日本特閧平 7— 7 2 4 4号に開示のあらかじめ基板の所定の 表面、 例えばプリント基板の回路金属の、 所定の表面にのみ化学反応により粘 着性皮膜を形成し、 これにハンダ粉末を付着させた後フラックスを塗布し、 ハ ンダの溶融温度まで加熱してリフローさせ、 ハンダバンプを形成した回路基板 にも本発明のハンダペーストを用いて S M T (表面実装技術) で実装した場合、 より優れたハンダ付け性を得ることができる。  Further, the present invention provides a method of forming an adhesive film only on a predetermined surface of a substrate, for example, a predetermined surface of a circuit metal of a printed circuit board by a chemical reaction, as disclosed in Japanese Patent Publication No. 7-7244, After applying solder powder to this, apply flux, heat to the melting temperature of the solder and reflow, and mount it on the circuit board on which solder bumps have been formed using SMT (Surface Mount Technology) using the solder paste of the present invention. In this case, more excellent solderability can be obtained.
本発明は、 環境汚染が少ない P bを含まないハンダ合金による極小電子部品 のフアインピッチ接合用のハンダペース卜に適用することができ、 予め調合し たハンダペーストを用いても信頼性のある接合が得られ、 例えば実装配線板の ファインピッチ接合に対応でき、 その結果、 部品寿命の優れた配線板を提供す ることができる。  INDUSTRIAL APPLICABILITY The present invention can be applied to solder paste for fine pitch joining of microelectronic components made of a solder alloy that does not contain Pb and has low environmental pollution, and a reliable joint can be obtained even if a solder paste prepared in advance is used. As a result, for example, it is possible to cope with fine pitch bonding of a mounting wiring board, and as a result, it is possible to provide a wiring board having an excellent component life.
以下実施例をもって発明の内容をさらに具体的に説明するが、 本発明はこれ らの実施例に限定されるものではない。  Hereinafter, the content of the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

Claims

実施例  Example
[試験法]  [Test method]
①ハロゲンイオン濃度測定  ①Halogen ion concentration measurement
ハンダペースト 1 gにクロ口ホルム 5mlを加えて攪拌し、 フラックス分を 溶解した後、 超純水 10mlを加えてハロゲンイオンを水に抽出し、 水層をィ オンクロマトグラフィ一で測定した。  To 1 g of the solder paste was added 5 ml of black form and stirred to dissolve the flux, and then 10 ml of ultrapure water was added to extract the halogen ions into water. The aqueous layer was measured by ion chromatography.
使用した装置: YOKOGAWA I C— 100 Equipment used: YOKOGAWA I C— 100
分離カラム : S AM3— 125 Separation column: S AM3— 125
充填剤 :親水性低交換容量強イオン交換樹脂 Filler: hydrophilic low exchange capacity strong ion exchange resin
粒子径: 10 m Particle size: 10 m
交換容量: 60 e q/ml Exchange capacity: 60 eq / ml
溶離液と流量: 4 mM Na 2 CO 3/4mM NaHC03、 2ml/分 除去液と流量: 0. 05M n—ドデシルベンゼンスルホン酸、 2 ml/分 温度: 40 °C Eluent and flow rate: 4 mM Na 2 CO 3/4 mM NaHC03, 2 ml / min Eluent and flow rate: 0.05 M n-dodecylbenzenesulfonic acid, 2 ml / min Temperature: 40 ° C
サンプル量: 100 1 Sample volume: 100 1
②粘度測定  ②Viscosity measurement
ハンダペース トの 10 r pmにおける粘度は、 マルコム社製 P CU- 205 型スパイラル粘度計を用いて測定した。  The viscosity of the solder paste at 10 rpm was measured using a Malco PCU-205 spiral viscometer.
③ボイ ドの観察 (接合の信頼性)  3) Observation of void (reliability of joint)
60mm平方の銅板に厚さ 150ミクロンのメタルマスクを用いて、 直径 6 mmx 6個のパターンを印刷後、 大気雰囲気下でリフローし、 次いでカッター でハンダと共に銅板を切断した後、 該ハンダ部分を顕微鏡により観察し、 ボイ ドの発生状況を観察した。 6個のパターンについて大きさが 10 m以上のボ ィ ドを計測し、 1個のパターン当たりの平均個数が 2個以上であった場合を不 合格とした。  After printing a pattern of 6 mm diameter x 6 pieces on a 60 mm square copper plate using a 150 micron thick metal mask, reflow under the air atmosphere, then cut the copper plate together with the solder with a cutter, and then microscope the solder part To observe the occurrence of voids. The size of a board with a size of 10 m or more was measured for 6 patterns, and the case where the average number per pattern was 2 or more was rejected.
(実施例 1〜9、 比較例 1〜3)  (Examples 1-9, Comparative Examples 1-3)
<フラックス及びハンダペーストの製造〉  <Production of flux and solder paste>
樹脂成分として重合ロジン 17. 5質量%、 不均化ロジン 27. 5質量%、 チクソ トロビック剤として水添ヒマシ油 7質量%、 有機塩基ハ口ゲン化水素酸 塩としてジフヱ二ルグァ二ジン臭化水素酸塩、 シクロへキシルアミン臭化水素 酸塩、 ハロゲン化合物としてへキサブ口モシクロドデカン、 2 , 3—ジブロモ 一 2—ブテン一 1 , 4ージオール、 4—ステアロイルォキシベンジルブ口マイ ド、 有機酸成分としてサリチル酸イソブチル、 p—トルエンスルホン酸— n— プロビルをそれそれ表 1に示す量、 更に p H調整剤としてトリエ夕ノールアミ ン 2質量%、 還元剤としてハイ ドロキノン 0 . 3質量%、 防鲭剤としてべンズ イミダゾ一ルを 1質量%加え、 溶剤としてジエチレングリコール モノ一 2— ェチルへキシルエーテルを加えて 1 0 0質量%とするフラックスを調製した。 Polymerized rosin 17.5% by mass, disproportionated rosin 27.5% by mass as resin component, 7% by mass of hydrogenated castor oil as a thixotropic agent, dihydroguanidine hydrobromide, cyclohexylamine hydrobromide as an organic base hydrocyanic acid hydrochloride, and hexacyclohexyl moclocyclo as a halogen compound Table 1 shows dodecane, 2,3-dibromo-12-butene-11,4-diol, 4-stearoyloxybenzylbutamate, isobutyl salicylate and p-toluenesulfonic acid-n-propyl as organic acid components. In addition, 2% by mass of triethanolamine as a pH adjuster, 0.3% by mass of hydroquinone as a reducing agent, 1% by mass of benzimidazole as a protective agent, and diethylene glycol mono-monomer as a solvent were added. A flux was prepared by adding ethyl hexyl ether to 100% by mass.
表 1 table 1
Figure imgf000017_0001
Figure imgf000017_0001
このフラックス 1 1質量%に 89 Sn/8Zn/3B iの P bフリ一ハンダ 粉末 89質量%を添加し、 プラネ夕リーミルで混練し 3 k gのハンダペース ト を製造した。  89% by mass of Pb free solder powder of 89 Sn / 8Zn / 3Bi was added to 11% by mass of this flux and kneaded with a planetary mill to produce a 3 kg solder paste.
比較例として、 ハロゲン化水素酸塩、 ハロゲン化合物  As comparative examples, hydrohalides, halogen compounds
が 3000 ppm越えるように、 表 1に示すような添加 を加えて、 実施例と 同様に、 ハンダぺ一ストを製造した。 ぐ電子部品接合物の製造 > Was added as shown in Table 1 so as to exceed 3000 ppm, and a solder paste was produced in the same manner as in the example. Manufacturing of electronic component joints>
実装方法として S M Tを用いた。 実施例 1〜9、 比較例 1〜3の組成のハン ダペーストをそれそれ 1枚の回路板に印刷し、 L S I、 チップ抵抗、 チップコ ンデンサ一をハンダペースト上に載置した後、 リフロー熱源により加熱してハ ンダ付けした。 リフ口一熱源には熱風炉を用いた。  SMT was used as the mounting method. Each of the solder pastes of Examples 1 to 9 and Comparative Examples 1 to 3 was printed on one circuit board, and the LSI, chip resistor, and chip capacitor were mounted on the solder paste and heated by a reflow heat source. And soldered. A hot blast stove was used as a heat source for the riff opening.
リフ口一条件は、 プレヒートが温度 1 3 0 ° (、 プレヒート時間が 8 0秒、 リ フローはビーク温度が 2 2 0 °C, 2 0 0 °C以上のリフロー時間を 5 0秒とした。 実施例、 比較例共、 用いたハンダペーストは、 製造直後のものと製造後 7日 間保存したものを用いた。  One condition of the riff opening was that the preheating was performed at a temperature of 130 ° (preheating time was set to 80 seconds, and the reflow was performed at a beak temperature of 220 ° C and a reflow time of 200 ° C or more was set to 50 seconds. The solder paste used in both the examples and comparative examples was the one immediately after production and the one stored for 7 days after production.
作製したプリント配線板および用いたハンダペーストについて前述した測定 方法により特性を測定した。 測定結果を表 2に示す。 なお、 表 2中のハロゲン イオン濃度は塩素換算値を示し、 接合状態は 7日保存のハンダペーストを用い て接合した時の状態を示し、 〇印は 1個パターン当たりのボイ ドが 2個以下で あり、 接合が良であることを示し、 X印は、 2個以上であり、 接合不良を示す。 表 2  The characteristics of the produced printed wiring board and the used solder paste were measured by the measurement method described above. Table 2 shows the measurement results. Note that the halogen ion concentration in Table 2 indicates the value in terms of chlorine, the bonding state indicates the state when bonding was performed using solder paste stored for 7 days, and the symbol 〇 indicates that no more than 2 voids per pattern Indicates that the bonding is good, and the X mark indicates that the bonding is two or more, indicating a poor bonding. Table 2
Figure imgf000018_0001
Figure imgf000018_0001
上記表 2より明らかなように、 本発明に依るハンダペース トは、 7日間保存 するとハロゲンイオン濃度、 粘度とも製造直後のハンダペーストに較べ若干上 昇したが、 いずれも接合状態は良好であった。 更に、 同様に 9 1 311/9211、 86 Sn/8 Zn/6B iの Pbフリーハ ンダ粉末を使用して同様の実験を行つたが、 全く同様の結果が得られた。 As is evident from Table 2 above, when the solder paste according to the present invention was stored for 7 days, both the halogen ion concentration and the viscosity increased slightly as compared to the solder paste immediately after the production, but the bonding state was good in each case. . Further, similar experiments were performed using Pb-free solder powders of 9311/9211 and 86Sn / 8Zn / 6Bi, and the same result was obtained.
また実施例 1〜 9のリフ口一後のハンダ合金組織と従来の S n— P b系ハン ダぺ一ストのハンダ合金組織とを比較したところ、 Sn— Pb系の場合、 高温 環境下での結晶の粗大化が著しいのに対し、 本発明の S n— Z n系ハンダ合金 では粗大化の傾向が小さく、 これによりハンダの機械的物性が向上し、 このハ ンダ合金を用いた実装配線板の寿命特性の向上が確認された。 産業上の利用可能性  Also, a comparison of the solder alloy structure after the riff opening of Examples 1 to 9 with the conventional Sn—Pb based solder alloy structure shows that in the case of Sn—Pb based In contrast to the remarkable coarsening of the crystal, the Sn—Zn-based solder alloy of the present invention has a small tendency to coarsen, thereby improving the mechanical properties of the solder and mounting wiring using the solder alloy. Improvement of the life characteristics of the plate was confirmed. Industrial applicability
本発明のハンダペーストにより、 ハンダ合金とフラックスの反応が大幅に抑 制され、 極めて優れた保存安定性が得られた。 特に本発明は、 従来より保存安 定性が悪いとされた S n— Z n系ハンダペース 卜においても、 保存安定性を格 段に向上させ、 その有効性が確認できた。  With the solder paste of the present invention, the reaction between the solder alloy and the flux was significantly suppressed, and extremely excellent storage stability was obtained. In particular, the present invention has significantly improved the storage stability of Sn—Zn-based solder paste, which has been conventionally regarded as having poor storage stability, and its effectiveness has been confirmed.
また本発明のハンダペーストの開発により、実装配線板のファインピッチ化、 部品の多様化に対応した信頼性の高い回路板のハンダ付け方法、 ハンダ付けし た接合物を提供することが可能となった。  In addition, the development of the solder paste of the present invention has made it possible to provide a highly reliable circuit board soldering method and a soldered joint corresponding to the fine pitch of the mounting wiring board and diversification of components. Was.
PCT/JP2001/000877 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method WO2001058639A1 (en)

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CN102528329A (en) * 2011-12-30 2012-07-04 深圳市上煌实业有限公司 Halogen-free and lead-free solder paste and preparation method
CN102725099A (en) * 2010-01-08 2012-10-10 荒川化学工业株式会社 Flux composition for lead-free solder and lead-free solder paste
CN102756220A (en) * 2011-04-26 2012-10-31 荒川化学工业株式会社 Flux for dip soldering
CN109014655A (en) * 2018-08-15 2018-12-18 佛山市诺普材料科技有限公司 A kind of silver alloy soldering paste and preparation method thereof with good dispensing performance
CN117001208A (en) * 2023-08-23 2023-11-07 绍兴拓邦新能源股份有限公司 Zero-halogen no-clean soldering flux

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JP2006181635A (en) * 2004-12-28 2006-07-13 Senju Metal Ind Co Ltd Method for preventing blackening of lead-free solder and solder paste
CN100425385C (en) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 Leadless solder paste and its preparation method
JP5273443B2 (en) * 2008-03-24 2013-08-28 三菱マテリアル株式会社 Method for forming minute solder bump and solder paste
CN101653876B (en) * 2009-08-19 2012-05-02 浙江一远电子材料研究院 Low-silver halogen free soldering paste
KR20140023266A (en) 2010-12-17 2014-02-26 아라까와 가가꾸 고교 가부시끼가이샤 Lead-free solder flux and lead-free solder paste
CN102069315B (en) * 2011-02-21 2012-11-21 四川大学 Unleaded halogen-free soldering paste with high wettability
JP5520973B2 (en) * 2012-01-17 2014-06-11 株式会社デンソー Flux for flux cored solder and flux solder
JP6027426B2 (en) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 Solder paste and soldering mounting method
JP6405920B2 (en) * 2014-11-12 2018-10-17 千住金属工業株式会社 Solder paste flux, solder paste and solder joint
JP5816947B1 (en) * 2015-02-05 2015-11-18 株式会社弘輝 Activator for flux, flux and solder
JP6628759B2 (en) * 2017-03-30 2020-01-15 株式会社タムラ製作所 Precoat solder composition and method for manufacturing printed wiring board
JP7011823B2 (en) * 2018-05-14 2022-02-10 株式会社弘輝 Flux and solder materials
JP6536730B1 (en) * 2018-08-10 2019-07-03 千住金属工業株式会社 Flux and solder paste
JP6681567B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder paste and flux
JP6681566B1 (en) * 2019-05-27 2020-04-15 千住金属工業株式会社 Solder paste and flux
CN111299896B (en) * 2020-03-11 2021-07-20 漳州佳联化工有限公司 Soldering paste and preparation method thereof

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Publication number Priority date Publication date Assignee Title
CN102725099A (en) * 2010-01-08 2012-10-10 荒川化学工业株式会社 Flux composition for lead-free solder and lead-free solder paste
CN102756220A (en) * 2011-04-26 2012-10-31 荒川化学工业株式会社 Flux for dip soldering
CN102528329A (en) * 2011-12-30 2012-07-04 深圳市上煌实业有限公司 Halogen-free and lead-free solder paste and preparation method
CN102528329B (en) * 2011-12-30 2013-09-18 深圳市上煌实业有限公司 Halogen-free and lead-free solder paste and preparation method
CN109014655A (en) * 2018-08-15 2018-12-18 佛山市诺普材料科技有限公司 A kind of silver alloy soldering paste and preparation method thereof with good dispensing performance
CN117001208A (en) * 2023-08-23 2023-11-07 绍兴拓邦新能源股份有限公司 Zero-halogen no-clean soldering flux
CN117001208B (en) * 2023-08-23 2024-05-03 绍兴拓邦新能源股份有限公司 Zero-halogen no-clean soldering flux

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AU3224201A (en) 2001-08-20
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TW503147B (en) 2002-09-21
CN1358123A (en) 2002-07-10
JP2002086292A (en) 2002-03-26

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