WO2001058639A1 - Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage - Google Patents

Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage Download PDF

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Publication number
WO2001058639A1
WO2001058639A1 PCT/JP2001/000877 JP0100877W WO0158639A1 WO 2001058639 A1 WO2001058639 A1 WO 2001058639A1 JP 0100877 W JP0100877 W JP 0100877W WO 0158639 A1 WO0158639 A1 WO 0158639A1
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WO
WIPO (PCT)
Prior art keywords
solder paste
solder
mass
flux
halogen
Prior art date
Application number
PCT/JP2001/000877
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English (en)
Japanese (ja)
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WO2001058639A9 (fr
Inventor
Hitoshi Amita
Noriko Murase
Takashi Shoji
Original Assignee
Showa Denko K.K.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Showa Denko K.K. filed Critical Showa Denko K.K.
Priority to AU32242/01A priority Critical patent/AU3224201A/en
Publication of WO2001058639A1 publication Critical patent/WO2001058639A1/fr
Publication of WO2001058639A9 publication Critical patent/WO2001058639A9/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Definitions

  • the present invention relates to a solder paste used for surface mounting of electronic components, and more particularly, to a solder paste having excellent storage stability, a soldering method using the solder paste, and a joined article.
  • Solder paste is used in the electronics industry to surface mount electronic components. Solder paste is suitable for automation due to its printability and adhesiveness, and its use has been increasing in recent years.
  • solder paste is applied on a printed circuit board by screen printing or dispenser, electronic components are placed, and then reflowed to fix the electronic components.
  • the term "rifle opening" means that a solder paste is applied to a predetermined position on a substrate, an electronic component to be joined is placed thereon, and then the substrate is heated to a temperature equal to or higher than the melting temperature of the solder paste. Means a series of operations for joining parts.
  • fine pitch bonding has been required to reduce the size of electronic products, and the use of fine pitch components, for example, the use of a 0.3 mm pitch QFP (Quad Flat Package) type LSI, and the use of CSP ( Ch i Size Pacage) is often used.
  • QFP Quad Flat Package
  • CSP Ch i Size Pacage
  • the biggest cause of the decrease in the storage stability of the solder paste is that the solder powder reacts preferentially with the flux during storage, the oxidation of the solder powder progresses, the activator in the flux is consumed, and the activity of the flux decreases. At the same time, the viscosity of the solder paste increases due to the reaction products. For this reason, when using the solder paste, there is a problem that proper printing characteristics cannot be maintained and the solder paste does not dissolve during reflow.
  • a method of coating a solder powder with glycerin Japanese Patent Publication No. 5-265898 and a method of coating a solder powder with a coating agent that is insoluble or hardly soluble in a solder paste solvent (Japanese Patent Laid-Open No. — 1 1 3 1 9 7) is disclosed.
  • the latter coating agent include silicone oil, silicone base high molecular weight compound, fluorinated silicone oil, fluorosilicone resin, and fluorinated hydrocarbon-based polymer compound.
  • coating with a relatively large amount of the coating agent is effective in suppressing the oxidation of the solder powder.However, a large amount of the coating material is required for reflow of the solder paste. This is rather inconvenient, and solder balls may be generated frequently.
  • these coatings are only performed physically, and the adhesion is considered to be very weak, and there is a strong possibility that they will be peeled off during kneading when manufacturing the solder paste, transport during use, printing, etc. .
  • the above-mentioned resin coating agent mainly composed of rosin contains a large amount of reactive organic acid itself and protects the powder.
  • a method of adding a phenol-based, phosphite-based, or sulfur-based antioxidant as an activator for soldering flux (Japanese Patent Publication No. 59-226-32) JP-A-3-124092), one or more antioxidants containing one or more phenol skeletons having a tertiary butyl group in the molecule.
  • Method of adding 30% by weight Japanese Patent Application Laid-Open No. 5-185283
  • use of a specific surfactant Japanese Patent Application Laid-Open No. 2-147147
  • Sn-Zn solder paste is advantageous in terms of resources and cost, and since the reflow temperature can be reduced to the same level as Sn-Pb solder, the length of mounted components can be reduced. It is drawing attention as a particularly promising product because it has a long life and can respond to the diversification of parts.
  • the Sn-Zn solder paste has poorer storage stability than ordinary Pb-based solder paste, and the progress of oxidation of Zn in the solder powder and the relationship between Zn and flux. The reaction causes the viscosity to increase over time.
  • Zn reacts with halogen compounds in the flux at room temperature, deteriorating the storage stability of the solder paste.
  • the halogen compound in the flux reacts with Zn in the solder powder to generate a small amount of hydrogen gas, and the generated hydrogen gas is built into the solder fillet even after the parts are joined, so reliability is critical. Has a significant impact.
  • the present invention has been made in view of the above-described problems, and has an excellent storage stability, and in particular, a solder paste having excellent storage stability even when the solder particle diameter is reduced by fine pitching, and further using this solder paste.
  • An object of the present invention is to provide a reliable soldering method and a joint. Disclosure of the invention
  • the present invention is a solder paste comprising, in a solder paste containing a halogen compound, a halogen ion concentration per gram of the flux of not more than 300 ppm in terms of chlorine.
  • the halogen ions include bromine ions.
  • the above-mentioned solder paste contains Zn as solder powder. including.
  • the present invention provides a method of soldering a circuit board, comprising: a step of applying the solder paste on a circuit board; and a step of reflowing the solder paste, and a joined body manufactured by the method of soldering a circuit board. including.
  • the flux contained in the solder paste is a mixture of a rosin or synthetic resin-based resin component, a halogen compound and / or an organic acid component as an activator, a solvent, a thixotropic agent, and the like.
  • the effective components for removing the surface oxide of the solder metal at the mouth of the riff and obtaining good bonding are halogen compounds and / or organic acid components used as activators. is there.
  • These activators can enhance the ability to remove surface oxides, but react with the solder powder during soldering and during storage to degrade the solder paste.
  • halogen compounds have a high effect as an activator, but have a strong effect of deteriorating solder paste.
  • the present inventors have studied the reaction between the solder powder and the activator in the solder paste.
  • the halogen ion concentration per gram of the flux of the solder paste was 300 ppm or less in terms of chlorine, preferably 100 ppm or less. 100 ppm or less, more preferably 50 O ppm or less, and most preferably 30 O ppm or less, the reaction between the solder powder and the activator is suppressed, the solder paste is prevented from deteriorating, and the storage is stable. It has been found that it is possible to enhance the character.
  • the activator is attached in order to remove the metal surface oxide and obtain a good bond.
  • the halogen compound should be at least 1 in terms of the chlorine concentration of the halogen ion concentration. It is necessary to add 0 ppm or more, preferably 100 ppm or more. It is not clear why halogen ions have an adverse effect on the storage stability of the solder paste, but in the presence of halogen ions, the oxidizing power of the halogen compound added to the flux is enhanced, and the reaction with the solder metal is accelerated. It is thought that it will be done.
  • the chlorine equivalent value of the halogen ion concentration is determined by measuring the solder paste, quantifying the halogen ion concentration contained in the aqueous layer when extracted with an organic solvent-water system by ion chromatography, converting it to chlorine, and converting it to chlorine. It is calculated from the value converted per gram.
  • the chlorine conversion value is a value when the contained halogen ion is converted into chloride ion. For example, when a bromine compound is used as the activator, the amount of bromine ion in the solder paste (zg / g) , 35.4 5 3/7 9.904 (atomic weight of chlorine Z atomic weight of bromine).
  • the organic solvent used for the extraction may be any solvent which does not react with the flux, is insoluble in conventionally known water used in organic synthesis, and does not contain halogen ions. Examples include methylene, toluene, xylene, benzene, getyl ether, petroleum ether and the like. Form, toluene, xylene, getyl ether, and petroleum ether are preferably used from the viewpoint of the solubility of the flux and the ease of the extraction operation.
  • the water used for the extraction need not contain halogen ions, and for example, ultrapure water is most preferably used.
  • the measurement of the halogen ion concentration by extraction with an organic solvent-water can be carried out on a solder paste using either a water-soluble flux or a non-water-soluble flux.
  • the solder paste is used in a solder paste flux.
  • the concentration of halogen ions in is adjusted to be less than 300 ppm in terms of chlorine.
  • halogens such as isopropylamine hydrobromide, butylamine hydrochloride, and cyclohexylamine hydrobromide, which are preferably used as an activator, are organic base hydrohalides.
  • halogen compound used as a normal solder flux may be used.However, in order to further improve the solderability and wettability of the solder paste, it is stable as a halogen compound during storage of the solder paste. It is preferable to use a halogen compound, particularly an organic bromine compound, which decomposes and exhibits an activity at the reflow temperature so that the chlorine equivalent of the halogen ion becomes 3000 ppm or less.
  • organic bromine compound having the above-mentioned properties examples include a benzyl bromide compound having an alkyl substituent having 10 or more carbon atoms or a fatty acid or alicyclic compound having 10 or more carbon atoms in one molecule.
  • examples thereof include a polybromine compound containing four or more bromines, and these may be used as a mixture.
  • Benzyl bromide compounds having an alkyl chain having at least 10 carbon atoms are, for example, 4-stearoyloxybenzylbutamide, 4-stearyloxybenzyl bromide, 4-stearylbenzylbenzyl bromide, 4 Examples include compounds such as —bromomethylbenzyl stearate, 4-stearoylaminobenzyl bromide, and 2,4-bisbromomethylbenzyl stearate. Other than these, 4-palmitoyloxybenzyl bromide, 4-myristoyloxybenzyl bromide, 4-lauroyloxybenzyl bromide, 4_ndecanyloxybenzyl bromide, etc. Is mentioned.
  • the polybromine compound may have, for example, a carboxyl group, an ester group, an alcohol group, an ether group, a ketone group, or the like, and is a compound in which four or more bromine atoms are bonded.
  • these compounds include 9,10,12,13,15,16-hexabutamostate and 9,10,12,13,15,16-hexabuta Mostearic acid methyl ester, same ethyl ester, 9, 10, 12, 13-tetra Labromostearic acid, the same ethyl ester, the same ethyl ester, 9,10,12,13,15,16-hexabutamostearyl alcohol, 9,10,12,13-tetrabromostearyl alcohol, 1, 2,5,6,9,10-hexasub mouth mocyclo dodecane.
  • Particularly preferred are mosabetic mostearic acid and hexabolic mocyclododecane.
  • organic bromine compounds include 1-bromo-2-butanol, 1-bromo-2-propanol, 3-bromo-11-propanol, and 3-bromo-1,2-propanediol.
  • halogen compounds The addition amount of these halogen compounds is set so that the halogen ions in the solder paste fall below 3000 ppm in terms of chlorine per gram of flux.
  • One or more halogen compounds may be added, or an organic halogen compound and an organic base hydrochloride may be used in combination.
  • Examples of the organic acid component in the present invention include conventionally known succinic acid, fumaric acid, stearic acid, sebacic acid and the like, and an organic acid derivative which is a compound that generates an organic acid when the reflow temperature is reached is preferable.
  • Used for Examples thereof include various aliphatic carboxylic esters, aromatic carboxylic esters, aliphatic sulfonic esters, and aromatic sulfonic esters. Alcohol residues of these esters are preferably alkyl, aryl, particularly t-butyl, isopropyl and isobutyl, which have high ester decomposability, and these compounds may contain a halogen atom.
  • n-provyl paratoluenesulfonate isopropyl p-toluenesulfonate, isobutyl p-toluenesulfonate, n-butyl p-toluenesulfonate, n-provyl benzenesulfonate, and iso-propyl benzenesulfonate.
  • Bil isoptyl benzenesulfonate, salicylic acid-n-butyl mouth pill, isopropyl salicylate, isoptyl salicylate, n-butyl salicylate, isopropylate 4-nitrobenzoate, t-butyl 4-nitrobenzoate, methacrylic acid- Examples include t-butyl, t-butyl acrylate, t-butyl malonate, and t-butyl bromoacetate. Of these, para-toluenesulfonate-n-propyl, isoptyl salicylate, and t-butyl bromoacetate are particularly preferred.
  • the addition amount is in the range of 0.01 to 20% by mass, and preferably 0.05 to 5% by mass, based on the total amount of the flux.
  • the above decomposable organic acid ester alone has low decomposability even at a reflow temperature, it is effective to add a small amount of an ester decomposing catalyst to accelerate the decomposition.
  • an ester decomposition catalyst any catalyst can be used as long as the decomposable organic acid ester has a function of decomposing at the reflow temperature to promote the generation of acid.
  • a hydrohalide of an organic base is particularly effective. is there.
  • a well-known resin blended in a conventional flux can be used.
  • Polyester, polyurethane, acrylic resin and others are used.
  • alcohols, ethers, esters, or aromatic solvents can be used as in the case of conventional fluxes and solder pastes.
  • solvent alcohols, ethers, esters, or aromatic solvents
  • inorganic agents such as fine silica particles and kaolin particles, or organic agents such as hydrogenated castor oil and amide compounds are used. You.
  • solder paste of the present invention storage stability can be further improved by using a reducing agent as a stabilizer in combination.
  • the reducing agent is usually used as an antioxidant for resins and the like, and is soluble in solvents such as phenolic compounds, phosphorus compounds, sulfur compounds, tocopherol and derivatives thereof, and L-ascorbic acid and derivatives thereof. And the like.
  • phenolic compounds include hydroquinone, catechol, 2,6-di-t-butyl-p-cresol, butylhydroxyanisole, 2,2,1-methylenebis (4-methyl-6-t-butylphenol ).
  • Examples of the phosphorus-based compound include triphenylphosphite, trioctyl phosphite, tridecyl phosphite and the like.
  • sulfur compound examples include dilauryl-1,3,3,1-thiodipropionate, distearyl-1,3,3′-thiodipropionate, and dimyristyl-1,3,3,1-thiodipropionate.
  • tocopherol and its derivatives any compounds which have reducing properties and are soluble in a solvent, for example, esters thereof, can be used. Particularly good results are obtained when two kinds of tocopherol or a derivative thereof and L-ascorbic acid or a derivative thereof are used in combination.
  • the mixing ratio is preferably 0.5: 1 to 1: 0.5 by weight, particularly preferably about 1: 1.
  • L-ascorbic acid derivatives include ascorbic acid-2-phosphate, ascorbic acid-12-sulfate, ascorbic acid-2-glucoside, ascorbic acid-12,6-dibutylate, ascorbic acid-12, 6-distearate, ascorbic acid 1, 2, 6-dimyristate, ascorbic acid 6-palmitate, ascorbic acid 6-stearate, ascorbic acid 6-myristylate, Ascorbic acid 1,2,3,5,6-tetrapalmitate, ascorbic acid—2,3,5,6—tetramyristylate, ascorbic acid 1,2,3,5,6-tetrastearate, ascorbic acid 12—glucoside 6 — palmitate, ascorbic acid 1 2 — glucoside 1 6 — myristylate, ascorbic acid 1 2 — glucoside 6—stearate, ascorbic acid 1,5,6—benzylidene, ascorbic acid 1,5,6 —propylidene, Ascorbic acid 1-2
  • the amount of the reducing agent added may be an amount sufficient to sufficiently secure the storage stability of the solder paste, but is generally from 0.005% by mass to 20% by mass with respect to the total amount of the flux. And more preferably 0.01% by mass or more and 10% by mass or less. If the addition amount is too small, there is no stabilizing effect, and even if it is added in an amount of 20% by mass or more, no improvement in the effect corresponding to high concentration addition is observed, which is not preferable.
  • the flux used in the solder paste of the present invention is, for example, 20 to 60% by mass of a resin component, 0.04 to 20% by mass of a thixotropic agent, and 0.01% by mass based on the total amount of the flux.
  • a halogen compound satisfying the above-mentioned range of halogen ions, 0.05 to 20% by mass of a reducing agent, and a solvent or the like as a balance.
  • This flux is kneaded with, for example, 14 to 8% by mass and solder powder of 86 to 92% by mass based on the total amount of the solder paste to obtain a solder paste of the present invention.
  • the amount of the halide to be added must be such that the halogen ion concentration in the flux after kneading the solder paste is not more than 300 ppm in terms of chlorine.
  • the moisture such as the flux and the humidity of the atmosphere are adjusted, and the moisture content in the solder paste is controlled to 0.5% by mass or less, more preferably 0.3% by mass or less. Is preferred. More than 0.5% by weight of water in the paste If mixed in, the dissociation of the halide is promoted, and the dissociated halogen reacts with the solder alloy powder, which is not preferable. Further, the pH value of the solder paste is preferably in the range of 4 to 9, more preferably 6 to 8, from the viewpoint of suppressing the reaction between the solder powder and the flux.
  • an amine compound such as an alkanolamine, an aliphatic primary to tertiary amine, an aliphatic unsaturated amine, an alicyclic amine or an aromatic amine as the pH adjuster.
  • amine compounds include ethanolamine, butylamine, aminopropanol, polyoxyethyleneoleylamine, polyoxyethylenelaurelamine, polyoxyethylenestearylamine, getylamine, triethylamine, and methylamine.
  • Toxipropylamine, dimethylaminopropylamine, dibutylaminopropylamine, ethylhexylamine, ethoxypropylamine, ethylhexyloxypropylamine, bisproviramine, isopropylamine, diiso Propylamine and the like can be mentioned.
  • the amount of the amine compound used is preferably 0.05 to 20% by mass based on the total amount of the solder paste flux. If the content is less than 0.05% by mass, the effect as a pH adjuster is not sufficient. If the content is more than 20% by mass, the pH generally exceeds 9, shifting to the alkaline side, and the solder paste tends to absorb moisture.
  • azoles for example, benzotriazole, benzimidazole, tolyltriazole, etc. may be added to the flux to prevent copper in the circuit.
  • the addition amount of the antibacterial agent is preferably 0.5 to 20% by mass based on the total amount of the flux.
  • the solder powder used in the solder paste of the present invention may have a conventionally known metal composition, but a solder powder containing Zn which is easily oxidized is preferably used.
  • Sn-Zn, Sn_Ag-Zn, Sn-Bi-Sb-Zn, Sn-Bi-Cu-Zn, Sn-Ag-Sb-Zn, Sn-Ag-Cu- Zn-based and Sn-ZnBi-based are mentioned.
  • 95.5Sn / 3.5Ag / Ng is mainly composed of eutectic solder having 91% by mass of Sn and 9% by mass of Zn (hereinafter referred to as 91Sn / 9Zn).
  • solder powder of the present invention may be a mixture of two or more types of solder powders having different compositions.
  • the prepared solder paste can maintain the wettability of the solder on the substrate even after storage for 10 days. Is maintained well, and a reliable joint can be obtained.
  • solder paste of the present invention is suitably used when a board, for example, a printed wiring board and an electronic component are joined together to produce a joint.
  • a solder paste is applied to a portion where soldering is desired by a printing method or the like, and the electronic component is placed.
  • the electronic components can be joined to the substrate by heating and melting and solidifying the solder particles.
  • a bonding method between a substrate and an electronic component
  • SMT surface mounting technology
  • a solder paste is applied to a desired portion on a substrate, for example, a wiring board by a printing method.
  • electronic components such as chip components and QFPs are placed on the solder paste, and soldered collectively by a reflow heat source.
  • a reflow heat source a hot blast stove, an infrared stove, a steam condensing soldering device, a light beam soldering device, or the like can be used.
  • preheating is performed in the case of a Sn--Zn system such as 91Sn / 9Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn / 6Bi.
  • preheating temperature is 130-180 ° C, preferably 130-150 ° C
  • the preheating time is 60-120 seconds, preferably 60-90.
  • reflow temperature is 210-230 °, preferably 210-220 °, riff opening hour 30 660 seconds, preferably 30 to 40 seconds.
  • the reflow temperature in other alloy systems is +20 to 150 ° C with respect to the melting point of the alloy used (preferably +20 to 130 ° C with respect to the melting point of the alloy;
  • the temperature, the preheating time, and the one hour of the riff opening may be in the same ranges as described above.
  • the above reflow process can be carried out both in nitrogen and in air.
  • nitrogen reflow by setting the oxygen concentration to 5 V o 1% or less, preferably 0.5 vo 1% or less, the wettability of solder to a substrate such as a wiring board is improved as compared with the case of air reflow, The generation of solder balls is reduced and stable processing can be performed.
  • bonding may be performed on both surfaces of a substrate (plate to be bonded) such as a printed wiring board.
  • the electronic parts on which the solder paste of the present invention can be used include, for example, an LSI, a resistor, a capacitor, a transformer, an inductance, a filter, an oscillator and a vibrator, but are not limited thereto. It is not done.
  • the present invention provides a method of forming an adhesive film only on a predetermined surface of a substrate, for example, a predetermined surface of a circuit metal of a printed circuit board by a chemical reaction, as disclosed in Japanese Patent Publication No. 7-7244, After applying solder powder to this, apply flux, heat to the melting temperature of the solder and reflow, and mount it on the circuit board on which solder bumps have been formed using SMT (Surface Mount Technology) using the solder paste of the present invention. In this case, more excellent solderability can be obtained.
  • SMT Surface Mount Technology
  • the present invention can be applied to solder paste for fine pitch joining of microelectronic components made of a solder alloy that does not contain Pb and has low environmental pollution, and a reliable joint can be obtained even if a solder paste prepared in advance is used. As a result, for example, it is possible to cope with fine pitch bonding of a mounting wiring board, and as a result, it is possible to provide a wiring board having an excellent component life.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une pâte à souder contenant un composé halogène en tant qu'activateur en une quantité telle qu'elle donne une concentration d'ions halogène pour 1 g du flux utilisé dans la pâte de 3000 ppm ou moins exprimé en termes d'ions chlore; un procédé de soudage utilisant la pâte à souder et un produit brasé préparé par utilisation du procédé de soudage. La pâte à souder présente une excellente stabilité au stockage.
PCT/JP2001/000877 2000-02-08 2001-02-08 Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage WO2001058639A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU32242/01A AU3224201A (en) 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000035661 2000-02-08
JP2000-35661 2000-02-08
JP2000-224866 2000-07-26
JP2000224866A JP2002086292A (ja) 2000-02-08 2000-07-26 ハンダペースト

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WO2001058639A1 true WO2001058639A1 (fr) 2001-08-16
WO2001058639A9 WO2001058639A9 (fr) 2002-01-17

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CN (1) CN1211183C (fr)
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CN102756220A (zh) * 2011-04-26 2012-10-31 荒川化学工业株式会社 浸焊用助熔剂
CN109014655A (zh) * 2018-08-15 2018-12-18 佛山市诺普材料科技有限公司 一种具有良好点胶性能的银合金焊膏及其制备方法
CN117001208A (zh) * 2023-08-23 2023-11-07 绍兴拓邦新能源股份有限公司 一种零卤免洗助焊剂

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CN100425385C (zh) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 一种无铅焊锡膏及其制备方法
JP5273443B2 (ja) * 2008-03-24 2013-08-28 三菱マテリアル株式会社 微小はんだバンプの形成方法およびはんだペースト
CN101653876B (zh) * 2009-08-19 2012-05-02 浙江一远电子材料研究院 一种低银无卤素焊锡膏
WO2012081688A1 (fr) * 2010-12-17 2012-06-21 荒川化学工業株式会社 Fondant à souder sans plomb et pâte à souder sans plomb
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JP5520973B2 (ja) * 2012-01-17 2014-06-11 株式会社デンソー やに入りはんだ用フラックス及びやに入りはんだ
JP6027426B2 (ja) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 ソルダペースト及びはんだ付け実装方法
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CN109014655A (zh) * 2018-08-15 2018-12-18 佛山市诺普材料科技有限公司 一种具有良好点胶性能的银合金焊膏及其制备方法
CN117001208A (zh) * 2023-08-23 2023-11-07 绍兴拓邦新能源股份有限公司 一种零卤免洗助焊剂
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CN1211183C (zh) 2005-07-20
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