WO2001058639A9 - Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage - Google Patents

Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage

Info

Publication number
WO2001058639A9
WO2001058639A9 PCT/JP2001/000877 JP0100877W WO0158639A9 WO 2001058639 A9 WO2001058639 A9 WO 2001058639A9 JP 0100877 W JP0100877 W JP 0100877W WO 0158639 A9 WO0158639 A9 WO 0158639A9
Authority
WO
WIPO (PCT)
Prior art keywords
solder paste
solder
flux
halogen
compound
Prior art date
Application number
PCT/JP2001/000877
Other languages
English (en)
Japanese (ja)
Other versions
WO2001058639A1 (fr
Inventor
Hitoshi Amita
Noriko Murase
Takashi Shoji
Original Assignee
Showa Denko Kk
Hitoshi Amita
Noriko Murase
Takashi Shoji
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko Kk, Hitoshi Amita, Noriko Murase, Takashi Shoji filed Critical Showa Denko Kk
Priority to AU32242/01A priority Critical patent/AU3224201A/en
Publication of WO2001058639A1 publication Critical patent/WO2001058639A1/fr
Publication of WO2001058639A9 publication Critical patent/WO2001058639A9/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Definitions

  • the present invention relates to a solder paste used for surface mounting of an electronic component, and more particularly to a solder paste having excellent storage stability, a soldering method using the solder paste, and a joined article.
  • Solder paste is used in the electronics industry to surface mount electronic components. Solder paste is suitable for automation due to its printability and adhesiveness, and its use has been increasing in recent years.
  • solder paste is applied on a printed circuit board by screen printing or dispenser, electronic components are placed, and then reflowed to fix the electronic components.
  • "Reflow J” refers to applying a solder paste to a predetermined position on a board, placing the electronic component to be joined on it, and then heating the board above the melting temperature of the solder paste to join the above components.
  • fine pitch bonding has recently been required to reduce the size of electronic products, and the use of fine pitch components, for example, a 0.3 mm pitch QFP (Quad Flat Package) type LSI, and the use of CSP (Chi ize Package) is often used.
  • QFP Quad Flat Package
  • CSP Cho ize Package
  • solder paste is required to have printing performance that is compatible with fine pitch.
  • the average particle size of the solder particles has been reduced.However, the specific surface area of the entire solder particles has been increased, so that the reaction between the solder particles and the flux has been promoted.
  • the storage stability of the solder paste deteriorates.
  • the biggest cause of the decrease in the storage stability of the solder base is that the solder powder reacts preferentially with the flux during storage, the oxidation of the solder powder progresses, and the activator in the flux is consumed, reducing the activity of the flux At the same time, the reaction product increases the viscosity of the solder paste. For this reason, when the solder paste is used, there is a problem that proper printing characteristics cannot be maintained and that the solder paste does not melt during reflow.
  • a method of coating a solder powder with glycerin Japanese Patent Publication No. 5-265898
  • a method of coating a solder powder with a coating agent that is insoluble or hardly soluble in a solder paste solvent Japanese Patent Publication No. (Kaihei 1-111 1397).
  • the latter coating agent include silicone oil, silicone base high molecular weight compound, fluorinated silicone oil, fluorosilicone resin and fluorinated hydrocarbon base polymer compound.
  • Sn-Zn solder paste is advantageous in terms of resources and cost, and since the reflow temperature is reduced to the same level as Sn-Pb solder, long life of mounted components It is attracting attention as a particularly promising one because it can be adapted to the diversification of parts as well.
  • the Sn-ZII solder paste has poorer storage stability than ordinary Pb-based solder paste, and due to the progress of oxidation of Zn in the solder powder and the reaction between Zn and flux, ⁇ Viscosity rises occasionally.
  • Zn reacts with halogen compounds in the flux at room temperature, deteriorating the storage stability of the solder paste.
  • the halogen compound in the flux reacts with Zn in the solder powder to generate a small amount of hydrogen gas, and this generated hydrogen gas is built into the solder fillet even after joining the parts, resulting in high reliability. It has been found to have significant consequences.
  • the present invention has been made in view of the above problems, and has an excellent storage stability, and particularly, a solder paste having an excellent storage stability even when the solder particle size is reduced by fine pitching, and further using this solder paste.
  • An object of the present invention is to provide a reliable soldering method and a joint. Disclosure of the invention
  • the present invention relates to a solder paste containing a halogen compound, wherein the concentration of halogen ions per gram of flux is 300 ppm or less in terms of chlorine.
  • the halogen ions include bromine ions.
  • the above-mentioned solder paste contains Zn as solder powder. including.
  • the present invention provides a method of soldering a circuit board including a step of applying the solder paste on a circuit board, a step of reflowing the solder paste, and a joined product manufactured by the method of soldering a circuit board. Including.
  • the flux contained in the solder paste is a mixture of a rosin or synthetic resin-based resin component, a halogen compound and / or an organic acid component as an activator, a solvent, a thixotropic agent, and the like.
  • the effective components for removing the surface oxide of the solder metal at the time of reflow and obtaining a good bond are a halogen compound used as an activator and a halogen or organic acid component.
  • These activators can enhance the ability to remove surface oxides, but they react with the solder powder during soldering and during storage to deteriorate the solder paste.
  • a halogen compound has a high effect as an activator, but has a strong effect of deteriorating solder paste.
  • the present inventors studied the reaction between the solder powder and the activator in the solder paste and found that the halogen ion concentration per gram of the solder paste flux was 300 ppm or less, preferably 100 ppm, in terms of chlorine. ppm or less, more preferably 50 O ppm or less, most preferably 30 O ppm or less, suppresses the reaction between the solder powder and the activator, prevents the solder paste from deteriorating, and increases the storage stability. Found that it is possible.
  • the activator is attached in order to remove the metal surface oxide and obtain a good bond.
  • the halogen compound should be at least 1 in terms of the chlorine concentration of the halogen ion concentration. It is necessary to add 0 ppm or more, preferably 100 ppm or more. It is not clear why halogen ions have an adverse effect on the storage stability of the solder paste, but in the presence of halogen ions, the oxidizing power of the halogen compound added to the flux is enhanced, and the reaction with the solder metal is accelerated. It is thought that it will be done.
  • the chlorine equivalent value of the halogen ion concentration is determined by measuring the solder ion paste, measuring the concentration of the halogen ions contained in the aqueous layer when extracted with an organic solvent / aqueous system using ion chromatography, and converting it to chlorine, and then converting the chlorine to 1 g of flux. Calculated from the value converted to per hit.
  • the chlorine conversion value is the value when the contained halogen ion is converted to chloride ion. For example, when a bromine compound is used as the activator, the amount of the bromine ion in the solder paste (g / g) , 35.4 5 3/7 9.904 (atomic weight of chlorine Z atomic weight of bromine).
  • the quantitative value (g / g) of the ion is calculated as 35.545 3 / 126.945 (the atomic weight of chlorine and the atomic weight of iodine).
  • the organic solvent used for the extraction may be any solvent which does not react with the flux, is not soluble in conventionally known water used in organic synthesis, etc., and does not contain halogen ions. Examples include methylene, toluene, xylene, benzene, getyl ether, petroleum ether and the like.
  • chloroform-form, toluene, xylene, getyl ether, and petroleum ether are preferably used.
  • the water used for the extraction need not contain halogen ions, and for example, ultrapure water is most preferably used. Note that the measurement of the halogen ion concentration by organic solvent-water extraction can be performed on a solder paste using either a water-soluble flux or a non-water-soluble flux.
  • the solder paste is adjusted so that the halogen ion concentration in the flux of the solder paste is 300 ppm or less in terms of chlorine.
  • halogens such as isopropylamine hydrobromide, butylamine hydrochloride, and cyclohexylamine hydrobromide, which are preferably used as an activator, are organic base hydrohalides. Ammonium hydride, 1,3-diphenyl In the case of anidine hydrobromide or the like, all of the halogen contained in these compounds is a halogen ion. Therefore, the amount of addition should be calculated and added so that the chlorine-equivalent value of the halogen ion is 300 Oppm or less when no other halogen compound is used in combination.
  • halogen compound a halogen compound used as a normal solder flux may be used.However, in order to further improve the solderability and wettability of the solder paste, the halogen compound is used during storage of the solder paste. It is preferable to use a halogen compound, particularly an organic bromine compound, which is stable and exists at the reflow temperature and decomposes to exhibit an activity at a reflow temperature such that the chlorine equivalent of the halogen ion is 3000 ppm or less.
  • organic bromine compound having the above-mentioned characteristics examples include a benzyl bromide compound having an alkyl substituent having 10 or more carbon atoms or a fatty acid or alicyclic compound having 10 or more carbon atoms in one molecule.
  • examples thereof include a polybromine compound containing at least two bromines, and these may be used as a mixture.
  • Benzyl bromide compounds having an alkyl chain having at least 10 carbon atoms include, for example, 4-stearoyloxybenzylbutamide, 4-stearyloxybenzyl bromide, 4-stearylbenzylbenzyl bromide, Examples include compounds such as —bromomethylbenzyl stearate, 4-stearoylaminobenzyl bromide, and 2,4-bisbromomethylbenzyl stearate. Other than these, 41 palmitoyloxybenzyl bromide, 41 myristyloxybenzyl bromide, 41 lauroyloxybenzyl bromide, 4-pentadecanyloxybenzyl bromide, etc. No.
  • the polybromine compound may have, for example, a carboxyl group, an ester group, an alcohol group, an ether group, a ketone group, or the like, and is a compound in which four or more bromine atoms are bonded.
  • these compounds include 9,10,12,13,15,16-hexabutamostate and 9,10,12,13,15,16-hexabutate methyl stearate.
  • Esters same ethyl esters, 9, 10, 12, 13—Tet Labromostearic acid, the same nutyl ester, the same ethyl ester, 9,10,12,13,15,16-hexabutamostearyl alcohol, 9,10,12,13-tetrabromostearyl alcohol, 1,2,5 6, 9, 10-hexa-substituted mocyclo dodecane.
  • Particularly preferred are mosabetic mostearic acid and hexabolic mocyclo dodecane.
  • examples of organic bromine compounds further include 1-bromo-2-butanol, 1-bromo-12-propanol, 3-bromo-11-propanol, and 3-bromo-1,2-propanediol.
  • halogen compounds The addition amount of these halogen compounds is set so that the halogen ions in the solder paste fall below 3000 ppm in terms of chlorine per gram of flux.
  • One or more halogen compounds may be added, or an organic halogen compound and an organic base hydrochloride may be used in combination.
  • Examples of the organic acid component in the present invention include succinic acid, fumaric acid, stearic acid, sebacic acid, and the like, which are well-known in the art.
  • Examples thereof include various aliphatic carboxylic esters, aromatic carboxylic esters, aliphatic sulfonic esters, and aromatic sulfonic esters. Alcohol residues of these esters are preferably alkyl, aryl, particularly t-butyl, isopropyl, and isobutyl, which have high ester decomposability, and these compounds may contain a halogen atom.
  • Specific examples include 1-n-propyl paratoluenesulfonate, isopropyl p-toluenesulfonate, isobutyl p-toluenesulfonate, 1-n-butyl paratoluenesulfonate, 1-n-propyl benzenesulfonate, and isopropyl benzenesulfonate.
  • Bil isobutyl benzenesulfonate, mono-n-butyl salicylate, isopropyl salicylate, isobutyl salicylate, n-butyl salicylate, isoprovir 4-dinitrobenzoate, t-butyl 4-dibenzoate, methyl methacrylate Mono-t-butyl, mono-t-butyl acrylate, mono-t-butyl malonate, mono-t-butyl bromoacetate and the like. Of these, n-propyl paratoluenesulfonate, isobutyl salicylate, and t-butyl bromoacetate are particularly preferred.
  • the addition amount is in the range of 0.01 to 20% by mass, and preferably 0.05 to 5% by mass, based on the total amount of the flux.
  • the above decomposable organic acid ester alone has low decomposability even at a reflow temperature, it is effective to add a small amount of an ester decomposing catalyst to accelerate the decomposition.
  • an ester decomposition catalyst any catalyst may be used as long as the decomposable organic acid ester has a function of decomposing at a temperature of the riff to promote the generation of an acid.
  • a hydrohalide of an organic base is preferable. It is valid.
  • a well-known resin blended in a conventional flux can be used.
  • Polyester, polyurethane, acrylic resin and others are used.
  • alcohols, ethers, esters, or aromatic solvents can be used as in the case of conventional fluxes and solder pastes.
  • solvent alcohols, ethers, esters, or aromatic solvents
  • inorganic agents such as fine silica particles and kaolin particles, or organic agents such as hydrogenated castor oil and amide compounds are used. You.
  • solder paste of the present invention storage stability can be further improved by using a reducing agent as a stabilizer in combination.
  • the above-mentioned reducing agent is usually used as an antioxidant for resins and the like, and can be dissolved in a solvent, such as a phenolic compound, a phosphorus compound, a sulfur compound, a tocophere and its derivatives, L-ascorbic acid and its derivatives. Derivatives and the like.
  • phenolic compounds include hydroquinone, catechol, 2,6-di-t-butyl-p-cre-v-yl, butylhydroxyanisole, 2,2,1-methylenebis (4-methyl-6-t Monobutylphenol) and the like.
  • Examples of the phosphorus compound include triphenylphosphite, trioctadecylphosphite, tridecylphosphite and the like.
  • sulfur compound examples include dilauryl-3,3'-thiodipropionate, distearyl-1,3,3,1-thiodipropionate, and dimyristyl-3,3,3-thiodipropionate.
  • tocopherol and its derivatives any compound having a reducing property and soluble in a solvent, for example, esters thereof, can be used. Particularly good results are obtained when two kinds of tocopherol or its derivative and L-ascorbic acid or its derivative are used in combination.
  • the mixing ratio is preferably 0.5: 1 to 1: 0.5 by weight, particularly preferably about 1: 1.
  • L-ascorbic acid derivatives include ascorbic acid-2-phosphate, ascorbic acid-12-sulfate, ascorbic acid-12-glucoside, ascorbic acid-12,6-dibutylate, and ascorbic acid-12,6- Distearate, ascorbic acid- 1,2,6-dimyristate, ascorbic acid-6-palmitate, ascorbic acid-6-stearate, ascorbic acid-16-myristylate, Ascorbic acid 1,2,3,5,6-tetrapalmitate, Ascorbic acid 1,2,3,5,6-tetramyristylate, Ascorbic acid 1,2,3,5,6—Tetrastearate, Ascorbic acid 1-2— Glucosido 6-palmitate, monoascorbic acid 2-glucoside 6-myristylate, mono-ascorbic acid 2-glucosido 6-stearate, mono-ascorbic acid 5,6, -benzylidene, mono-ascorbic acid 5, 6, -
  • the amount of the reducing agent added may be any amount that is sufficient to ensure the storage stability of the solder paste, but is generally in the range of 0.05% by mass to 20% by mass with respect to the total amount of the flux. Yes, more preferably 0.01% by mass or more and 10% by mass or less. If the addition amount is too small, there is no stabilizing effect, and even if it is added in an amount of 20% by mass or more, no improvement in the effect corresponding to high concentration addition is observed, which is not preferable.
  • the flux used in the solder paste of the present invention includes, for example, 20 to 60% by mass of a resin component, 0.04 to 20% by mass of a thixotropic agent, and 0.01% to the total amount of the flux.
  • a halogen compound satisfying the above-mentioned range of halogen ions, 0.05 to 20% by mass of a reducing agent, and a solvent or the like as a balance.
  • This flux is kneaded with, for example, 14 to 8% by mass and solder powder of 86 to 92% by mass based on the total amount of the solder paste to obtain a solder paste of the present invention.
  • the amount of the halide added must be such that the halogen ion concentration in the flux after the solder paste kneading is not more than 300 ppm in terms of chlorine.
  • an amine compound such as an alkanolamine, an aliphatic primary to tertiary amine, an aliphatic unsaturated amine, an aliphatic amine, or an aromatic amine as the pH adjuster.
  • amine compounds include ethanolamine, butylamine, aminopropanol, polyoxyethyleneoleylamine, polyoxyethylenelaurelamine, polyoxyethylenestearylamine, getylamine, triethylamine, and methylamine.
  • Toxiprovilamine Dimethylaminopropylamine, Dibutylaminopropylamine, Ethylhexylamine, Ethoxypropylamine, Ethylhexyloxypropylamine, Bispropylamine, Isopropylamine, Disopropyl Examples include amines.
  • the amount of the amine compound used is preferably 0.05 to 20% by mass based on the total amount of the solder paste flux. If the content is less than 0.05% by mass, the effect as a pH adjuster is not sufficient. If the content is more than 20% by mass, the pH generally exceeds 9, shifting to the alkaline side, and the solder paste tends to absorb moisture.
  • solder powder used in the solder paste of the present invention may have a conventionally known metal composition, but a solder powder containing Zn which is easily oxidized is preferably used.
  • 95.5 Sn / 3.5 Ag / 1 centered on a eutectic solder having 91% by mass of Sn and 9% by mass of Zn (hereinafter referred to as 91 Sn / 9 Zn).
  • solder powder of the present invention may be a mixture of two or more types of solder powders having different compositions.
  • the prepared solder paste can maintain the wettability of the solder on the substrate even after storage for 10 days. Is maintained well, and a reliable joint can be obtained.
  • solder paste of the present invention is suitably used when a substrate, for example, a printed wiring board and an electronic component are joined together to produce a joint.
  • a solder paste is applied to a portion where soldering is desired by a printing method or the like, and the electronic component is placed. Thereafter, the electronic component can be joined to the substrate by heating and melting and solidifying the solder particles.
  • a bonding method between the substrate and the electronic component
  • SMT surface mounting technology
  • a solder paste is applied to a desired portion on a substrate, for example, a wiring board by a printing method.
  • electronic components such as chip components and QFPs are placed on the solder paste, and soldered collectively by a reflow heat source.
  • a reflow heat source a hot blast stove, an infrared stove, a steam condensing soldering device, a light beam soldering device, or the like can be used.
  • the reflow process of the present invention differs depending on the solder alloy composition, Sn—Zn such as 91Sn / 9Zn, 89Sn / 8Zn / 3Bi, 86Sn / 8Zn / 6Bi, etc.
  • the conditions for the preheating are 130 to 180 ° C, preferably 130 to: I50.
  • the bure heat time is 60 to 120 seconds, preferably 60 to 90 seconds
  • the reflow temperature is 210 to 230 °, preferably 210 to 220.
  • C one hour of riff mouth 660 seconds, preferably 30 to 40 seconds.
  • the reflow temperature in other alloy systems is +20 to 150 ° C with respect to the melting point of the alloy used, preferably +20 to 130 ° C with respect to the melting point of the alloy.
  • the temperature, preheat time and reflow time may be in the same ranges as above.
  • the above reflow process can be carried out both in nitrogen and in air.
  • nitrogen reflow by setting the oxygen concentration to 5 vo 1% or less, preferably 0.5 vo 1% or less, the wettability of solder to a substrate such as a wiring board is improved as compared to the case of atmospheric reflow, and the solder ball Generation is reduced and stable processing is possible.
  • bonding may be performed on both surfaces of a substrate (plate to be bonded) such as a printed wiring board.
  • the electronic components on which the solder paste of the present invention can be used include, for example, LSIs, resistors, capacitors, transformers, inductors, filters, oscillators and vibrators. It is not limited.
  • the present invention provides a method of forming an adhesive film only on a predetermined surface of a substrate, for example, a predetermined surface of a circuit metal of a printed circuit board by a chemical reaction, as disclosed in Japanese Patent Publication No. 7-7244, After applying solder powder to this, apply flux, heat it to the melting temperature of the solder, reflow, and mount the circuit board on which the solder bumps are formed using SMT (Surface Mount Technology) using the solder paste of the present invention. In this case, more excellent solderability can be obtained.
  • SMT Surface Mount Technology
  • the present invention can be applied to a solder paste for fine pitch joining of microelectronic components made of a Pb-free solder alloy with low environmental pollution, and a reliable joint can be obtained even if a solder paste prepared in advance is used. As a result, for example, it is possible to cope with fine pitch bonding of a mounting wiring board, and as a result, it is possible to provide a wiring board having an excellent component life.
  • the viscosity of the solder paste at 10 rpm was measured using a Malco PCU-205 spiral viscometer.
  • a solder paste was produced in the same manner as in the example by adding the addition amount as shown in Table 1 so that the halogen ion concentration of the hydrohalide and the halogen compound exceeded 3000 ppm.
  • preheating temperature is 130 ° C
  • preheating time is 80 seconds
  • reflow is beak temperature of 220 ° C and 200 ° C.
  • the reflow time of C or longer was set to 50 seconds.
  • the solder paste used in both the examples and comparative examples was the one immediately after production and the one stored for 7 days after production.
  • Table 2 shows the measurement results.
  • the halogen ion concentration in Table 2 indicates the chlorine equivalent value. Indicates that the bonding is good, and the X mark indicates that the bonding is two or more, indicating that the bonding is poor.
  • the solder alloy structure after reflow in Examples 1 to 9 was compared with the conventional Sn—Pb based solder alloy structure, in the case of the Sn—Pb based In contrast to the remarkable coarsening of the crystal, the Sn—Zn-based solder alloy of the present invention has a small tendency to coarsen, thereby improving the mechanical properties of the solder and mounting wiring using the solder alloy. Improvement of the life characteristics of the plate was confirmed.
  • the reaction between the solder alloy and the flux was significantly suppressed, and extremely excellent storage stability was obtained.
  • the present invention has significantly improved the storage stability of Sn—Zn-based solder paste, which has been conventionally regarded as having poor storage stability, and its effectiveness was confirmed.
  • solder paste of the present invention makes it possible to provide a highly reliable circuit board soldering method and a soldered joint corresponding to a fine pitch of a mounting wiring board and diversification of components. became.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne une pâte à souder contenant un composé halogène en tant qu'activateur en une quantité telle qu'elle donne une concentration d'ions halogène pour 1 g du flux utilisé dans la pâte de 3000 ppm ou moins exprimé en termes d'ions chlore; un procédé de soudage utilisant la pâte à souder et un produit brasé préparé par utilisation du procédé de soudage. La pâte à souder présente une excellente stabilité au stockage.
PCT/JP2001/000877 2000-02-08 2001-02-08 Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage WO2001058639A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU32242/01A AU3224201A (en) 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2000035661 2000-02-08
JP2000-35661 2000-02-08
JP2000-224866 2000-07-26
JP2000224866A JP2002086292A (ja) 2000-02-08 2000-07-26 ハンダペースト

Publications (2)

Publication Number Publication Date
WO2001058639A1 WO2001058639A1 (fr) 2001-08-16
WO2001058639A9 true WO2001058639A9 (fr) 2002-01-17

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JP (1) JP2002086292A (fr)
CN (1) CN1211183C (fr)
AU (1) AU3224201A (fr)
TW (1) TW503147B (fr)
WO (1) WO2001058639A1 (fr)

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JP5273443B2 (ja) * 2008-03-24 2013-08-28 三菱マテリアル株式会社 微小はんだバンプの形成方法およびはんだペースト
CN101653876B (zh) * 2009-08-19 2012-05-02 浙江一远电子材料研究院 一种低银无卤素焊锡膏
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏
WO2012081688A1 (fr) * 2010-12-17 2012-06-21 荒川化学工業株式会社 Fondant à souder sans plomb et pâte à souder sans plomb
CN102069315B (zh) * 2011-02-21 2012-11-21 四川大学 一种高润湿性的无铅无卤焊膏
JP5974608B2 (ja) * 2011-04-26 2016-08-23 荒川化学工業株式会社 ディップはんだ付用フラックス
CN102528329B (zh) * 2011-12-30 2013-09-18 深圳市上煌实业有限公司 一种无卤无铅焊锡膏及制备方法
JP5520973B2 (ja) * 2012-01-17 2014-06-11 株式会社デンソー やに入りはんだ用フラックス及びやに入りはんだ
JP6027426B2 (ja) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 ソルダペースト及びはんだ付け実装方法
JP6405920B2 (ja) * 2014-11-12 2018-10-17 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP5816947B1 (ja) 2015-02-05 2015-11-18 株式会社弘輝 フラックス用活性剤、フラックス及びはんだ
JP6628759B2 (ja) * 2017-03-30 2020-01-15 株式会社タムラ製作所 プリコート用はんだ組成物およびプリント配線基板の製造方法
JP7011823B2 (ja) * 2018-05-14 2022-02-10 株式会社弘輝 フラックス及びはんだ材料
JP6536730B1 (ja) * 2018-08-10 2019-07-03 千住金属工業株式会社 フラックス及びはんだペースト
CN109014655B (zh) * 2018-08-15 2020-12-01 佛山市诺普材料科技有限公司 一种具有良好点胶性能的银合金焊膏及其制备方法
JP6681567B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだペースト及びフラックス
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CN111299896B (zh) * 2020-03-11 2021-07-20 漳州佳联化工有限公司 一种焊锡膏及其制备方法
CN117001208B (zh) * 2023-08-23 2024-05-03 绍兴拓邦新能源股份有限公司 一种零卤免洗助焊剂

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