CN110303273A - Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module - Google Patents
Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module Download PDFInfo
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- CN110303273A CN110303273A CN201910560792.0A CN201910560792A CN110303273A CN 110303273 A CN110303273 A CN 110303273A CN 201910560792 A CN201910560792 A CN 201910560792A CN 110303273 A CN110303273 A CN 110303273A
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- parts
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- halogen
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- temperature environment
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof that the invention discloses a kind of for heat radiation module, including glass putty and scaling powder, the specific gravity of the scaling powder and glass putty is 9.5 ~ 12%, and the combustion adjuvant includes 30 ~ 45 parts of rosin, 6 ~ 9 parts of thixotropic agent, 5 ~ 8 parts of short chain organic acid, 25 ~ 40 parts of tripropylene glycol butyl ether, 6 ~ 10 parts of imidazoles and 5 ~ 6 parts of long chain organic acid；The preparation method includes: that blender is added in rosin, thixotropic agent, diethylene glycol (DEG) hexyl ether, long chain organic acid, is heated to dissolving；Short chain organic acid and imidazoles are added at 135 ~ 145 DEG C；Cooled and solidified；It is fully ground；It is mixed and stirred for glass putty by 9.5 ~ 12% specific gravity.The solder(ing) paste is Halogen formula, and welding effect is good, and is not in that bismuth is black after welding.
Description
Technical field
The present invention relates to technical field of welding materials, especially a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module
And preparation method thereof.
Background technique
In the surface mounting technology of the 1970s, abbreviation SMT refers to and prints, is coated on printed circuit board pad
Solder(ing) paste, and Surface Mount Component is accurately placed on the pad for being coated with solder(ing) paste, it is bent according to specific reflux temperature
Line heater circuit plate, allows solder(ing) paste to melt, and forms weldering after alloying component cooled and solidified between component and printed circuit board
Put and realize the technology of metallurgy connection.Solder(ing) paste is a kind of novel welding material to come into being along with SMT.Solder(ing) paste is one
The system of a complexity is the lotion as made of solder powder, scaling powder and other additives mixeds.Solder(ing) paste has at normal temperature
Electronic component just can be sticked to commitment positions, under welding temperature, with waving for solvent and portions additive by certain viscosity
Hair, will be formed together with printed circuit pad solder permanently connected by weldering component.
Conventional cryogenic environment-protection soldering tin paste contains halogen activating agent, cause welding after be easy to produce verdigris, cause welding can
Declining by property, influences using effect, while distinctive atrament can be generated after the welding of existing low temperature solder(ing) paste, i.e. bismuth is black,
Influence welding quality.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provide a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module and its
Preparation method is Halogen formula, and welding effect is good, and is not in that bismuth is black after welding.
The present invention provides a kind of residual heat cure solder(ing) paste, including glass putty and scaling powder, the ratio of the scaling powder and glass putty
Weight is 9.5 ~ 12%, and the combustion adjuvant includes 30 ~ 45 parts of rosin, 6 ~ 9 parts of thixotropic agent, 5 ~ 8 parts of short chain organic acid, 25 ~ 40
The tripropylene glycol butyl ether, 6 ~ 10 parts of imidazoles and 5 ~ 6 parts of long chain organic acid of part.
The present invention is further arranged to collocation Sn42Bi58 alloy and uses.
It is succinic acid or dimethyl succinic acid or pyridine carboxylic acid or third that the present invention, which is further arranged to the short chain organic acid,
Diacid or adipic acid or decanedioic acid or azelaic acid.
It is hexacosene dicarboxylic acid or eicosenoic acid that the present invention, which is further arranged to the long chain organic acid,.
It is 2- ethyl imidazol(e) or phenylimidazole or 2- benzylimidazoline or benzo that the present invention, which is further arranged to the imidazoles,
Imidazoles.
The invention also discloses a kind of methods for preparing the Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module, including help weldering
The mixing of the preparation of agent and glass putty and scaling powder, the preparation of the scaling powder the following steps are included: step 1, rosin, thixotropic agent,
Blender is added in diethylene glycol (DEG) hexyl ether, long chain organic acid, is heated to 130 ~ 140 DEG C and keeps, until material is completely dissolved；Step
Two, short chain organic acid and imidazoles are added at 135 ~ 145 DEG C, 10min is sufficiently stirred, is completely dissolved material；Step 3, it is cold
But completely after, be fully ground obtain flux powder it is stand-by；
The mixing of the glass putty and scaling powder includes being mixed and added into flux powder and glass putty by 9.5 ~ 12% specific gravity
Blender, and under conditions of -0.08Mpa, to stir 20min under the revolving speed of 15rpm/min.
This method is further arranged in the preparation step four of the scaling powder, and solidification material is carried out using three-roll grinder
Grinding.
The beneficial effect being arranged in this way is: this Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module is Halogen formula,
Verdigris will not be generated after welding, and welding effect is more preferable, while it is black to generate bismuth, guarantees welding quality, promotes solder(ing) paste
Using effect, long chain organic acid here refer to organic enedioic acid that carbon chain lengths are greater than 24, and collocation here uses, and refer to
It is that scaling powder and corresponding alloy powder need physical mixed uniform, to prepare uniform creamy product.
It is described further With reference to embodiment.
Specific embodiment
Embodiment one, a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module, including glass putty and scaling powder, it is described to help
The specific gravity of solder flux and glass putty be 9.6%, the combustion adjuvant include 34 parts of rosin, 9 parts of thixotropic agent, 6 parts of dimethyl succinic acid,
38 parts of tripropylene glycol butyl ether, 8 parts of benzimidazole and 5 parts of hexacosene dicarboxylic acid.
Sn42Bi58 alloy of arranging in pairs or groups uses.
The solder(ing) paste based on embodiment one provides a kind of preparation method, preparation and glass putty and scaling powder including scaling powder
Mixing, the preparation of the scaling powder is the following steps are included: step 1, rosin, thixotropic agent, diethylene glycol (DEG) hexyl ether, two octadecenes
Blender is added in diacid, is heated to 130 DEG C and keeps, until material is completely dissolved；Methyl fourth is added in step 2 at 137 DEG C
Diacid and benzimidazole, are sufficiently stirred 10min, are completely dissolved material；Step 3 after cooling completely, is ground using three rollers
It is stand-by that machine is fully ground acquisition flux powder.Flux powder and glass putty are carried out being mixed and added into stirring by 9.6% specific gravity
Machine, and under conditions of -0.08Mpa, to stir 20min under the revolving speed of 15rpm/min.
The sample of acquisition is tested, after the completion of welding, solder joint is bright, regular edges without sawtooth, solder joint alloy with it is residual
Stay edge without atrament；And under 25 DEG C, 85% relative humidity, place 30 days, solder joint residual covering position does not have verdigris production
It is raw, i.e. the outlet of green corrosion phenomenon, while pad surface is smooth, edge is neat, and residue is transparent.
Embodiment two, a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module, including glass putty and scaling powder, it is described to help
The specific gravity of solder flux and glass putty is 10.2%, and the combustion adjuvant includes 38 parts of rosin, 7 parts of thixotropic agent, 8 parts of azelaic acid, 32 parts
Tripropylene glycol butyl ether, 9 parts of 2- ethyl imidazol(e) and 6 parts of hexacosene dicarboxylic acid.
The solder(ing) paste based on embodiment two provides a kind of preparation method, preparation and glass putty and scaling powder including scaling powder
Mixing, the preparation of the scaling powder is the following steps are included: step 1, rosin, thixotropic agent, diethylene glycol (DEG) hexyl ether, two octadecenes
Blender is added in diacid, is heated to 138 DEG C and keeps, until material is completely dissolved；Azelaic acid is added at 136 DEG C in step 2
And 2- ethyl imidazol(e), 10min is sufficiently stirred, is completely dissolved material；Step 3, after cooling completely, using three-roll grinder
It is stand-by to be fully ground acquisition flux powder；Flux powder and glass putty are carried out being mixed and added into stirring by 10.2% specific gravity
Machine, and under conditions of -0.08Mpa, to stir 20min under the revolving speed of 15rpm/min.
The sample of acquisition is tested, after the completion of welding, solder joint is bright, regular edges without sawtooth, solder joint alloy with it is residual
Stay edge without atrament；And under 25 DEG C, 85% relative humidity, place 30 days, solder joint residual covering position does not have verdigris production
It is raw, i.e. the outlet of green corrosion phenomenon, while pad surface is smooth, edge is neat, and residue is transparent.
Embodiment three, a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module, including glass putty and scaling powder, it is described to help
The specific gravity of solder flux and glass putty be 10.8%, the combustion adjuvant include 41 parts of rosin, 9 parts of thixotropic agent, 5 parts of dimethyl succinic acid,
30 parts of tripropylene glycol butyl ether, 9 parts of 2- benzylimidazoline and 6 parts of hexacosene dicarboxylic acid.
Sn42Bi58 alloy of arranging in pairs or groups uses.
The solder(ing) paste based on embodiment three provides a kind of preparation method, preparation and glass putty and scaling powder including scaling powder
Mixing, the preparation of the scaling powder is the following steps are included: step 1, rosin, thixotropic agent, diethylene glycol (DEG) hexyl ether, two octadecenes
Blender is added in diacid, is heated to 136 DEG C and keeps, until material is completely dissolved；Methyl fourth is added in step 2 at 141 DEG C
Diacid and 2- benzylimidazoline, are sufficiently stirred 10min, are completely dissolved material；Step 3, after cooling completely, using three rollers
It is stand-by that grinder is fully ground acquisition flux powder；Flux powder is mixed and added by 10.8% specific gravity with glass putty
Enter blender, and under conditions of -0.08Mpa, to stir 20min under the revolving speed of 15rpm/min.
The sample of acquisition is tested, after the completion of welding, solder joint is bright, regular edges without sawtooth, solder joint alloy with it is residual
Stay edge without atrament；And under 25 DEG C, 85% relative humidity, place 30 days, solder joint residual covering position does not have verdigris production
It is raw, i.e. the outlet of green corrosion phenomenon, while pad surface is smooth, edge is neat, and residue is transparent.
Example IV, a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module, including glass putty and scaling powder, it is described to help
The specific gravity of solder flux and glass putty is 12%, and the combustion adjuvant includes 44 parts of rosin, 6 parts of thixotropic agent, 5 parts of azelaic acid, 34 parts
Tripropylene glycol butyl ether, 10 parts of phenylimidazole and 6 parts of eicosenoic acid.
The solder(ing) paste based on example IV provides a kind of preparation method, preparation and glass putty and scaling powder including scaling powder
Mixing, the preparation of the scaling powder is the following steps are included: step 1, rosin, thixotropic agent, diethylene glycol (DEG) hexyl ether, eicosenoic acid
Blender is added, is heated to 140 DEG C and keeps, until material is completely dissolved；Step 2, at 144 DEG C be added azelaic acid and
10min is sufficiently stirred in phenylimidazole, is completely dissolved material；Step 3 is sufficiently ground after cooling completely using three-roll grinder
It is stand-by that mill obtains flux powder；Flux powder and glass putty be mixed and added into blender by 12% specific gravity, and-
Under conditions of 0.08Mpa, to stir 20min under the revolving speed of 15rpm/min.
The sample of acquisition is tested, after the completion of welding, solder joint is bright, regular edges without sawtooth, solder joint alloy with it is residual
Stay edge without atrament；And under 25 DEG C, 85% relative humidity, place 30 days, solder joint residual covering position does not have verdigris production
It is raw, i.e. the outlet of green corrosion phenomenon, while pad surface is smooth, edge is neat, and residue is transparent.
The above embodiments are merely a preferred embodiment of the present invention, and cannot limit interest field of the invention with this, because
This, is still belonged to according to equivalent variations made by scope of the present invention patent, such as using similar technique, the equivalent product of similar structures
The range that the present invention is covered.
Claims (7)
1. a kind of Halogen-free low-temperature environment-protection soldering tin paste for heat radiation module, it is characterised in that: described to help including glass putty and scaling powder
The specific gravity of solder flux and glass putty is 9.5 ~ 12%, and the combustion adjuvant includes 30 ~ 45 parts of rosin, 6 ~ 9 parts of thixotropic agent, 5 ~ 8 parts short
Chain organic acid, 25 ~ 40 parts of tripropylene glycol butyl ether, 6 ~ 10 parts of imidazoles and 5 ~ 6 parts of long chain organic acid.
2. the Halogen-free low-temperature environment-protection soldering tin paste according to claim 1 for heat radiation module, it is characterised in that: collocation
Sn42Bi58 alloy uses.
3. being used for the Halogen-free low-temperature environment-protection soldering tin paste of heat radiation module according to claim 1, it is characterised in that: the short chain has
Machine acid is succinic acid or dimethyl succinic acid or pyridine carboxylic acid or malonic acid or adipic acid or decanedioic acid or azelaic acid.
4. being used for the Halogen-free low-temperature environment-protection soldering tin paste of heat radiation module according to claim 1, it is characterised in that: the long-chain has
Machine acid is hexacosene dicarboxylic acid or eicosenoic acid.
5. being used for the Halogen-free low-temperature environment-protection soldering tin paste of heat radiation module according to claim 1, it is characterised in that: the imidazoles is
2- ethyl imidazol(e) or phenylimidazole or 2- benzylimidazoline or benzimidazole.
6. a kind of side for preparing the Halogen-free low-temperature environment-protection soldering tin paste according to claim 1 or 2 or 3 for heat radiation module
Method, it is characterised in that: the mixing of preparation and glass putty and scaling powder including scaling powder, the preparation of the scaling powder include following step
Rapid: step 1, rosin, thixotropic agent, diethylene glycol (DEG) hexyl ether, long chain organic acid are added blender, are heated to 130 ~ 140 DEG C and keep,
Until material is completely dissolved；Short chain organic acid and imidazoles are added at 135 ~ 145 DEG C, 10min is sufficiently stirred, makes for step 2
Material is completely dissolved；After cooling completely, it is stand-by to be fully ground acquisition flux powder for step 3；
The mixing of the glass putty and scaling powder includes being mixed and added into flux powder and glass putty by 9.5 ~ 12% specific gravity
Blender, and under conditions of -0.08Mpa, to stir 20min under the revolving speed of 15rpm/min.
7. the method for Halogen-free low-temperature environment-protection soldering tin paste of the preparation according to claim 4 for heat radiation module, feature exist
In: in the preparation step four of the scaling powder, solidification material is ground using three-roll grinder.
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| CN201910560792.0A CN110303273A (en) | 2019-06-26 | 2019-06-26 | Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module |
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| CN201910560792.0A CN110303273A (en) | 2019-06-26 | 2019-06-26 | Halogen-free low-temperature environment-protection soldering tin paste and preparation method thereof for heat radiation module |
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| CN102770233A (en) * | 2009-12-08 | 2012-11-07 | 荒川化学工业株式会社 | Solder paste |
| CN102785039A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Solder paste and preparation method thereof |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN104175023A (en) * | 2014-04-30 | 2014-12-03 | 江苏博迁新材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| CN107160052A (en) * | 2017-04-12 | 2017-09-15 | 华南理工大学 | A kind of high performance low temperature solder lead-free tin cream and preparation method thereof |
| CN107855680A (en) * | 2017-10-12 | 2018-03-30 | 浙江强力控股有限公司 | A kind of scaling powder and the solder(ing) paste comprising the scaling powder |
| JP2018161674A (en) * | 2017-03-27 | 2018-10-18 | 株式会社タムラ製作所 | Solder composition and electronic substrate |
-
2019
- 2019-06-26 CN CN201910560792.0A patent/CN110303273A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102770233A (en) * | 2009-12-08 | 2012-11-07 | 荒川化学工业株式会社 | Solder paste |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN102785039A (en) * | 2012-07-30 | 2012-11-21 | 东莞永安科技有限公司 | Solder paste and preparation method thereof |
| CN104175023A (en) * | 2014-04-30 | 2014-12-03 | 江苏博迁新材料有限公司 | Halogen-free soldering flux for lead-free solder paste |
| JP2018161674A (en) * | 2017-03-27 | 2018-10-18 | 株式会社タムラ製作所 | Solder composition and electronic substrate |
| CN107160052A (en) * | 2017-04-12 | 2017-09-15 | 华南理工大学 | A kind of high performance low temperature solder lead-free tin cream and preparation method thereof |
| CN107855680A (en) * | 2017-10-12 | 2018-03-30 | 浙江强力控股有限公司 | A kind of scaling powder and the solder(ing) paste comprising the scaling powder |
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