CN101992361B - Air pressure spot coating soldering paste for connector - Google Patents
Air pressure spot coating soldering paste for connector Download PDFInfo
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- CN101992361B CN101992361B CN 200910172863 CN200910172863A CN101992361B CN 101992361 B CN101992361 B CN 101992361B CN 200910172863 CN200910172863 CN 200910172863 CN 200910172863 A CN200910172863 A CN 200910172863A CN 101992361 B CN101992361 B CN 101992361B
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- soldering paste
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Abstract
The invention relates to a soldering paste for a connector and an air pressure spot coating mode. In order that the liquidity of the soldering paste is good, the liquidity can be kept for long time during use and a needle tube is not plugged, a lubricating agent is added based on a common soldering paste formula; and in order that the collapse resistance of the soldering paste is not affected at the same time of improving the liquidity of the soldering paste, a nucleation transparent agent is added based on the original soldering paste formula. The soldering paste consists of lead-free alloy powder and flux paste, wherein the flux paste comprises the following components in percentage by mass: lubricating agent, nucleation transparent agent, rosin, active agent, solvent, thixotropic agent and antioxidant.
Description
Technical field
The present invention relates to a kind of material for Electronic Packaging, especially relate to a kind of no-clean solder paste that can distribute by the air pressure spot printing continuously for the connector welding.
Background technology
As a kind of electronic material, soldering paste is a kind of old material, also is a kind of new material.Along with computer, communication apparatus, household electrical appliance etc. develop to microminiaturization, high-performance, multipurpose, Reflow Soldering becomes unique initial approach to become a Buddhist believer of making these products, so soldering paste also just arises at the historic moment.
Soldering paste, namely solder(ing) paste is a kind of body of paste that is evenly mixed according to a certain percentage by solder powder and scaling powder system, can form the alloy connection when welding.In reflow soldering, this material is used to being connected between the pin of surface mount assembly or electrode terminal and the pad.
The plasticity of soldering paste is very strong, the scope of application is wide, both can weld the workpiece position that many solid solders can't weld, also be well suited for the welding at metal position in the pure mechanical part, in dynamo-electric field, soldering paste is applied to circuit and is connected intensive etc. with cable assembly welding, cable, in electric utility, be mainly used in printed circuit board and components and parts manufacturing, contain all electronic products.
Communication is a system engineering, the performance of each parts that use all can influence the performance of whole network, wherein communications connector belongs to the Network Transfer Media InterWorking Equipment, the connector performance that adopts may influence whole communication system, connector is because the used soldering paste of the particularity of its technology is used the syringe deposit, in use, except requiring postwelding not have tin sweat(ing), wetability is good, and thixotropy is good, also require soldering paste to have good flowability, make soldering paste in use not stop up syringe needle, can use swimmingly that simultaneously connector also has very high requirement with soldering paste for the heat resistanceheat resistant performance of caving in, it requires indeformable under the high temperature of soldering paste, yet mobile and caving in property of heat resistanceheat resistant is two contradictory elements, and when improving liquidity, the performance that heat resistanceheat resistant is caved in descends.Particularity owing to its technology in producing the connector process uses common soldering paste can not satisfy its performance requirement.
The development of soldering paste is also more and more ripe, and the patent of being sent out with regard to the soldering paste direction also has a lot, and still the soldering paste at the characteristic of connector does not also have so far, so to develop a novel soldering paste that is applicable to connector that can solve both contradictions be necessary.
Summary of the invention
The purpose of this invention is to provide a connector point coating type solder(ing) paste, especially provide to be used in the unleaded no-clean solder paste that connector air pressure point coating technique is used, overcome the defective that exists when common soldering paste is used for the connector welding.The objective of the invention is to be achieved through the following technical solutions:
A kind of connector air pressure point coating type soldering paste, comprise following mass percent: alloy powder 82% ~ 88%, weld-aiding cream 12% ~ 18%, described alloyed powder are a kind of among SnAgCu, SnAg, the SnAgCuBi, and the composition of described weld-aiding cream and mass percent are: lubricant 8 ~ 12%, transparent nucleator 0.1% ~ 1%, rosin 20 ~ 40%, activating agent 10 ~ 15%, solvent 20% ~ 30%, thixotropic agent 2 ~ 5%, antioxidant 2 ~ 5%.
Described lubricant is preferably a kind of in polyisobutene, polyglycols, silicone oil, many hydrocarbon pentamethylene and the polyphenylene oxide.
Described rosin is preferably two kinds of combinations in water-white rosin, Foral, newtrex, gum rosin and the disproportionated rosin.
Described transparent nucleator is preferably a kind of in two (benzal) sorbierite and two (right-methyl-two benzylidenei sorbierites).
Described organic active agent is preferably the compound of organic acid and organic amine.
Described organic acid is preferably a kind of in binary acid, citric acid, oleic acid, the benzoic acid.
Described organic amine is preferably a kind of in MEA, triethanolamine and the fatty amine.
Described solvent is preferably two kinds in ethanol, ethylene glycol, glycerine, diethylene glycol (DEG), triethylene glycol, the tetraethylene glycol.
Described thixotropic agent is preferably a kind of in dehydrated castor oil fatty acid, ricinoleic acid, polymerization dehydrated castor oil, ten dihydroxystearic acids and the oleamide.
Described antioxidant is preferably a kind of in L-ascorbyl palmitate, benzimidazole, the vitamin C.
Raw material among the present invention all can be bought in market.
Connector of the present invention has the following advantages with air pressure point coating type soldering paste:
1, connector of the present invention can be used for the connector assembling with air pressure point coating type soldering paste, and in use soldering paste can not stop up syringe needle, can use glibly for a long time.
2, connector of the present invention has overcome common SMT soldering paste with air pressure point coating type soldering paste and has been used for the defective that the connector assembling can not be satisfied the performance requirement that caves in, through still reaching good welding performance requirement after the high-temperature baking.
2, connector of the present invention can satisfy IPC soldering paste standard-required with air pressure point coating type soldering paste, thereby has that wetability is good, tin sweat(ing) is few, no rosin joint, at high temperature indeformable the and postwelding of soldering paste need not clean the advantage of saving cost.
The specific embodiment
Embodiment 1
Earlier by following proportioning configuration weld-aiding cream A, and then alloy powder and weld-aiding cream A stirred with certain proportioning it is mixed, draw finished product, prepared product is placed syringe, and with air pressure spot printing mode prepared product is detected, observe its long-time mobile performance of using; Get about 5 minutes of the baking ovens that the part soldering paste is printed on the pcb board and places 180 degree simultaneously, observe whether slump of soldering paste, distortion.
1. the composition of weld-aiding cream A
Polyisobutene 8%
Two (benzal) sorbierite 0.5%
Water-white rosin 25%
Newtrex 25%
Succinic acid 7%
Triethanolamine 7%
Ethylene glycol 7%
Triethylene glycol 15%
Dehydrated castor oil fatty acid 2%
L-ascorbyl palmitate 3%
2. the composition of soldering paste
Weld-aiding cream A 12%
Alloy powder SnAgCu 88%
By air pressure spot printing mode soldering paste is detected, this kind of soldering paste mobile fine in 8 hours do not stopped up syringe needle, needle tubing surface inadhesion tin cream.Should brush in the soldering paste on the pcb board is placed 5 minutes in the baking ovens of 180 degree after indeformable, not slump.
Embodiment 2
Earlier by following proportioning configuration weld-aiding cream B, and then alloy powder and weld-aiding cream B stirred with certain proportioning it is mixed, draw finished product, prepared product is placed syringe, and with air pressure spot printing mode prepared product is detected, observe its long-time mobile performance of using; Get about 5 minutes of the baking ovens that the part soldering paste is printed on the pcb board and places 180 degree simultaneously, observe whether slump of soldering paste, distortion.
1. the composition of weld-aiding cream B
Polyglycols 12%
Two (right-methyl-two benzylidenei sorbierites) 1%
Foral 14%
Gum rosin 20%
Citric acid 5%
MEA 10%
Ethylene glycol 20%
Glycerine 10%
Ricinoleic acid 3%
L-ascorbyl palmitate 5%
2. the composition of soldering paste
Weld-aiding cream B 14%
Alloy powder SnAg 86%
By air pressure spot printing mode soldering paste is detected, this kind of soldering paste mobile fine in 8 hours do not stopped up syringe needle, needle tubing surface inadhesion tin cream.Should brush in the soldering paste on the pcb board is placed 5 minutes in the baking ovens of 180 degree after indeformable, not slump.
Embodiment 3
Earlier by following proportioning configuration weld-aiding cream C, and then alloy powder and weld-aiding cream C stirred with certain proportioning it is mixed, draw finished product, prepared product is placed syringe, and with air pressure spot printing mode prepared product is detected, observe its long-time mobile performance of using; Get about 5 minutes of the baking ovens that the part soldering paste is printed on the pcb board and places 180 degree simultaneously, observe whether slump of soldering paste, distortion.
1. the composition of weld-aiding cream C and mass percent
Silicone oil 10%
Two (benzal) sorbierite 0.1%
Newtrex 14.9%
Disproportionated rosin 30%
Oleic acid 4%
MEA 6%
Ethylene glycol 20%
Glycerine 15%
Ten dihydroxystearic acids 2.5%
L-ascorbyl palmitate 2%
2. the composition of soldering paste
Weld-aiding cream C 18%
Alloy powder SnAgCuBi 82%
By air pressure spot printing mode soldering paste is detected, this kind of soldering paste mobile fine in 8 hours do not stopped up syringe needle, needle tubing surface inadhesion tin cream.Should brush in the soldering paste on the pcb board is placed 5 minutes in the baking ovens of 180 degree after indeformable, not slump.But activity descends to some extent with respect to preceding two examples.
Embodiment 4
Earlier by following proportioning configuration weld-aiding cream D, and then alloy powder and weld-aiding cream D stirred with certain proportioning it is mixed, draw finished product, prepared product is placed syringe, and with air pressure spot printing mode prepared product is detected, observe its long-time mobile performance of using; Get about 5 minutes of the baking ovens that the part soldering paste is printed on the pcb board and places 180 degree simultaneously, observe whether slump of soldering paste, distortion.
1. the composition of weld-aiding cream D
Many hydrocarbon pentamethylene 10%
Two (right-methyl-two benzylidenei sorbierites) 0.8%
Foral 15%
Disproportionated rosin 15%
Benzoic acid 5%
Dodecyl primary amine 10%
Diethylene glycol (DEG) 15%
Tetraethylene glycol 20%
Polymerization dehydrated castor oil 5%
Vitamin C 4.2%
2. the composition of soldering paste
Weld-aiding cream D 12%
Alloy powder SnAgCu 88%
By air pressure spot printing mode soldering paste is detected, this kind of soldering paste mobile fine in 8 hours do not stopped up syringe needle, needle tubing surface inadhesion tin cream.Should brush in the soldering paste on the pcb board is placed 5 minutes in the baking ovens of 180 degree after slump and metaboly is arranged.
Embodiment 5
Earlier by following proportioning configuration weld-aiding cream E, and then alloy powder and weld-aiding cream E stirred with certain proportioning it is mixed, draw finished product, prepared product is placed syringe, and with air pressure spot printing mode prepared product is detected, observe its long-time mobile performance of using; Get about 5 minutes of the baking ovens that the part soldering paste is printed on the pcb board and places 180 degree simultaneously, observe whether slump of soldering paste, distortion.
1. the composition of weld-aiding cream E
Polyphenylene oxide 12%
Two (right-methyl-two benzylidenei sorbierites) 0.5%
Gum rosin 22%
Disproportionated rosin 19.5%
Benzoic acid 5%
Triethanolamine 10%
Triethylene glycol 10%
Glycerine 15%
Oleamide 2%
Benzimidazole 4%
2. the composition of soldering paste and mass percent thereof
Weld-aiding cream E 13%
Alloy powder SnAgCuBi 87%
By air pressure spot printing mode soldering paste is detected, this kind of soldering paste mobile fine in 8 hours do not stopped up syringe needle, needle tubing surface inadhesion tin cream.Should brush in the soldering paste on the pcb board is placed 5 minutes in the baking ovens of 180 degree after indeformable, not slump.
Claims (8)
1. a connector is with air pressure point coating type soldering paste, it is characterized in that: this soldering paste is made up of lead-free alloy powder and weld-aiding cream, its mass percent is: alloy powder 82%～88%, weld-aiding cream 12%～18%, the composition of weld-aiding cream and mass percent are: lubricant 8～12%, transparent nucleator 0.1%～2%, rosin 30～50%, activating agent 10～15%, solvent 20%～35%, thixotropic agent 2～5%, antioxidant 3～5%, lubricant wherein is polyisobutene, polyglycols, silicone oil, a kind of in many hydrocarbon pentamethylene and the polyphenylene oxide, transparent nucleator is a kind of in two (benzal) sorbierite and two (right-methyl-two benzylidenei sorbierites).
2. connector as claimed in claim 1 is with air pressure point coating type soldering paste, it is characterized in that alloy powder is a kind of among SnAgCu, SnAg, the SnAgCuBi.
3. connector as claimed in claim 1 is characterized in that with air pressure point coating type soldering paste rosin is two kinds of combinations in water-white rosin, Foral, newtrex, gum rosin and the disproportionated rosin.
4. connector as claimed in claim 1 is characterized in that with air pressure point coating type soldering paste activating agent is the composite product of organic acid and organic amine, and wherein organic acid is a kind of in binary acid, citric acid, oleic acid, the benzoic acid.
5. connector as claimed in claim 4 is with air pressure point coating type soldering paste, it is characterized in that used organic amine in the activating agent is a kind of in MEA, triethanolamine and the fatty amine.
6. connector as claimed in claim 1 is characterized in that with air pressure point coating type soldering paste solvent is two kinds in ethylene glycol, glycerine, diethylene glycol (DEG), triethylene glycol, the tetraethylene glycol.
7. connector as claimed in claim 1 is with air pressure point coating type soldering paste, it is characterized in that thixotropic agent is a kind of in dehydrated castor oil fatty acid, ricinoleic acid, polymerization dehydrated castor oil, ten dihydroxystearic acids and the oleamide.
8. connector as claimed in claim 1 is with air pressure point coating type soldering paste, it is characterized in that antioxidant is a kind of in L-ascorbyl palmitate, benzimidazole, the vitamin C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910172863 CN101992361B (en) | 2009-08-27 | 2009-08-27 | Air pressure spot coating soldering paste for connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN 200910172863 CN101992361B (en) | 2009-08-27 | 2009-08-27 | Air pressure spot coating soldering paste for connector |
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| CN101992361A CN101992361A (en) | 2011-03-30 |
| CN101992361B true CN101992361B (en) | 2013-07-17 |
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| CN 200910172863 Active CN101992361B (en) | 2009-08-27 | 2009-08-27 | Air pressure spot coating soldering paste for connector |
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102179644B (en) * | 2011-04-29 | 2012-12-26 | 东莞永安科技有限公司 | Soldering flux |
| CN106001997A (en) * | 2016-06-05 | 2016-10-12 | 丘以明 | Lead-free soldering paste and preparation method thereof |
| CN106001998A (en) * | 2016-06-11 | 2016-10-12 | 丘以明 | Flux paste special for unleaded tin-bismuth solder and preparation method thereof |
| CN107350592B (en) * | 2017-06-23 | 2024-02-20 | 芜湖美奥机械科技有限公司 | Soldering paste smearing device for front end welding procedure of exhaust pipe of upper shell of air conditioner compressor |
| CN107150190B (en) * | 2017-07-20 | 2019-04-23 | 合肥安力电力工程有限公司 | A kind of scaling powder and preparation method thereof |
| CN107363436A (en) * | 2017-08-01 | 2017-11-21 | 合肥安力电力工程有限公司 | A kind of efficient scaling powder of used in electronic industry and preparation method thereof |
| CN108213772A (en) * | 2018-02-06 | 2018-06-29 | 合肥东恒锐电子科技有限公司 | A kind of circuit board soldering low smoke and non-toxic scaling powder |
| JP6674120B1 (en) * | 2019-05-27 | 2020-04-01 | 千住金属工業株式会社 | Solder paste and flux for solder paste |
| CN112756845A (en) * | 2021-01-15 | 2021-05-07 | 杭州华光焊接新材料股份有限公司 | Silver soldering paste and preparation method thereof |
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| CN101992361A (en) | 2011-03-30 |
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Denomination of invention: Air pressure spot coating solder paste for connectors Effective date of registration: 20210622 Granted publication date: 20130717 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN JISSYU SOLDER Co.,Ltd. Registration number: Y2021980005049 |
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Date of cancellation: 20230529 Granted publication date: 20130717 Pledgee: Xiamen finance Company limited by guarantee Pledgor: XIAMEN JISSYU SOLDER Co.,Ltd. Registration number: Y2021980005049 |
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Denomination of invention: Pneumatic point coating solder paste for connectors Effective date of registration: 20230922 Granted publication date: 20130717 Pledgee: Agricultural Bank of China Limited by Share Ltd. Xiamen Xiangan branch Pledgor: XIAMEN JISSYU SOLDER Co.,Ltd. Registration number: Y2023980058236 |
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