CN107363436A - A kind of efficient scaling powder of used in electronic industry and preparation method thereof - Google Patents
A kind of efficient scaling powder of used in electronic industry and preparation method thereof Download PDFInfo
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- CN107363436A CN107363436A CN201710648046.8A CN201710648046A CN107363436A CN 107363436 A CN107363436 A CN 107363436A CN 201710648046 A CN201710648046 A CN 201710648046A CN 107363436 A CN107363436 A CN 107363436A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3615—N-compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a kind of efficient scaling powder of used in electronic industry, include the component of following weight proportion：38 parts of 40 60 parts of modified rosin, 30 40 parts of polyisobutene, 20 30 parts of octyl epoxy stearate, 10 30 parts of PETO, 10 20 parts of Lauryl Alcohol ester, 5 15 parts of 2 methylimidazole, 15 25 parts of benzimidazole, 5 10 parts of lactic acid, 28 parts of salicylic acid, 5 15 parts of benzoic acid, 38 parts of succinic acid, 5 15 parts of solvent, 4 10 parts of thixotropic agent, 3 10 parts of stabilizer, 15 parts of activator and surfactant.The present invention provides a kind of efficient scaling powder of used in electronic industry and preparation method thereof, to improve the defects of solder performance is undesirable, welding performance effect is bad, improves wetability, oxygen-proof property and the welding performance of solder.
Description
Technical field
The present invention relates to electronic welding field of material technology, and in particular to a kind of efficient scaling powder of used in electronic industry and its system
Preparation Method.
Background technology
In welding process, the dirts such as oxide, dust are had by weldering surface of workpiece, hinder workpiece substrate metal and
With state of atom phase counterdiffusion between solder, it is therefore necessary to remove oxide etc. so that surface cleaning exposes metallic matrix, still
The atom of the metal base surface cleaned is oxidized in an atmosphere and at once, and under welding temperature, oxidation rate is faster.So
Scaling powder is added in welding process, for assisting to provide the metal surface of no oxide layer, and keeps the anaerobic on these surfaces
Compound state, until scolding tin and metal surface complete welding process.Simultaneously by the chemical action of solder flux, with being welded metal surface
Oxide compound, under welding temperature formed liquefied platform thing, make to be welded the metallic atom and fusion weld of metal portion faces
The atom phase counterdiffusion of material, to reach the purpose of soldering connection.Scaling powder can also reduce liquid solder and quilt in welding process
Surface tension between wlding material, liquid solder flowing, the performance of infiltration are improved, enable solder alloy well with being soldered
Material combines and forms reliable solder joint.
The needs of requirement and the development of microelectronic component Highgrade integration based on environmental protection, high-performance Pb-free solder are ground
Study carefully and be developed into the focus of electronics industry circle.The application of lead-free solder proposes higher requirement, its matter to the performance of scaling powder
Amount directly affects the quality level of weld horizontal or even integral product.Therefore research and development new help with what lead-free solder matched
Solder flux is significant in the application of electronics industry for promoting lead-free solder.
At present, the scaling powder generally existing improvement lead-free solder wetability of domestic-developed is insufficient, solderability is not strong, anti-block
Change and improve the defects of welding performance effect is undesirable, it is impossible to meet existing electronic product to high-performance, multilead, diversification
The demand developed with thin space direction.
The content of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, there is provided a kind of efficient scaling powder of used in electronic industry and
Its preparation method, to improve the defects of solder performance is undesirable, welding performance effect is bad, improve solder wetability,
Oxygen-proof property and welding performance.
The present invention is in order to solve the above technical problems, adopt the following technical scheme that：
A kind of efficient scaling powder of used in electronic industry, include the component of following weight proportion：Modified rosin 40-60 parts, polyisobutene
30-40 parts, octyl epoxy stearate 20-30 parts, PETO 10-30 parts, Lauryl Alcohol ester 10-20 parts, 2- methyl
It is imidazoles 5-15 parts, benzimidazole 15-25 parts, lactic acid 5-10 parts, salicylic acid 2-8 parts, benzoic acid 5-15 parts, succinic acid 3-8 parts, molten
Agent 5-15 parts, thixotropic agent 4-10 parts, stabilizer 3-10 parts, activator 1-5 parts and surfactant 3-8 parts.
Preferably, 50 parts of the modified rosin, 35 parts of polyisobutene, 25 parts of octyl epoxy stearate, pentaerythrite oleic acid
20 parts of ester, 15 parts of Lauryl Alcohol ester, 10 parts of 2-methylimidazole, 20 parts of benzimidazole, 7.5 parts of lactic acid, 5 parts of salicylic acid, benzoic acid
5.5 parts of 10 parts, 5.5 parts of succinic acid, 10 parts of solvent, 7 parts of thixotropic agent, 6.5 parts of stabilizer, 3 parts of activator and surfactant.
Preferably, the modified rosin is any ratio of one or both of hydrogenated rosin, newtrex and disproportionated rosin
The combination of example.
Preferably, the solvent is one in polyethylene glycol, triethylene glycol list ether, ethyl acetate and diethylene glycol monobutyl ether
The combination of kind or two kinds or two or more of arbitrary proportion.
Preferably, the thixotropic agent is in Tissuemat E, fatty acid amide, formamide, castor oil and rilanit special
One or two kinds of or two or more arbitrary proportions combination.
Preferably, the stabilizer is to tert-butyl group p tertButylcalixarene, to phenyl cup [6] aromatic hydrocarbons or to tert-butyl-calix [8] virtue
Hydrocarbon.
Preferably, the activator is one in adipic acid, decanedioic acid, dibromo butene glycol, isopropylamine and triethanolamine
The combination of kind or two or more arbitrary proportion.
Preferably, the surfactant is that OPEO, AEO or isooctylphenol gather
Oxygen vinethene.
A kind of preparation method of the efficient scaling powder of used in electronic industry, comprises the following steps：
（1）In parts by weight, modified rosin, polyisobutene, octyl epoxy stearate, pentaerythrite oleic acid are weighed respectively
Ester, Lauryl Alcohol ester, 2-methylimidazole, benzimidazole, lactic acid, salicylic acid, benzoic acid, succinic acid are added in container and heated not
Disconnected stirring to material is completely dissolved, and thixotropic agent, stabilizer, activator, surfactant and molten are added at a temperature of 150-250 DEG C
10-20min is stirred in agent；
（2）It is cooled to container closure after room temperature, and is placed in the refrigerating chamber of 1-5 DEG C of temperature, refrigerates 40-50h, produce electronics
Industrial efficient scaling powder.
Compared with prior art, the present invention has following beneficial effect：It is efficient that the present invention provides a kind of used in electronic industry
Scaling powder and preparation method thereof, to improve the defects of solder performance is undesirable, welding performance effect is bad, improve solder
Wetability, oxygen-proof property and welding performance, concrete condition are as follows：
（1）The efficient scaling powder of used in electronic industry of the present invention, with modified rosin, polyisobutene, octyl epoxy stearate, Ji Wusi
Alcohol oleate, Lauryl Alcohol ester, 2-methylimidazole, benzimidazole, lactic acid, salicylic acid, benzoic acid, succinic acid are main component,
And using thixotropic agent, stabilizer, activator, surfactant, solvent as auxiliary element, it is aided with heating stirring, cooling, refrigeration shaping
Etc. technique so that the efficient scaling powder stable performance of used in electronic industry of preparation, there is preferable wetability, oxygen-proof property and welding
Performance, the requirement of industry is disclosure satisfy that, there is preferable application prospect；
（2）The modified rosin of the present invention is selected from hydrogenated rosin, newtrex and disproportionated rosin, and it is in solid-state at normal temperatures, not electric
From good, the transparent organic film of formation air-tightness, can wrap up bump after soldering, completely cut off air and other corrosion
The contact of property medium, has good protective value, the active and corrosive contradiction for solving scaling powder well；Add in addition
The polyisobutene entered cooperates with modified rosin, can reduce the usage amount of rosin, reduces rosin residual, meanwhile, it can soften
Harder rosin residual, improve the welding quality of electronic product；
（3）The present invention can be in modified rosin tree by adding octyl epoxy stearate, PETO, Lauryl Alcohol ester
Fat surface forms film forming agent, is forming protective layer by weldering matrix surface, is preventing to be welded the further oxidation of intrinsic silicon, improve weldering
The reliability of point；Meanwhile the 2-methylimidazole and benzimidazole of addition can prevent metal with forming layer protecting film by weldering metal
Continue to aoxidize, so as to improve Weldability；
（4）The present invention can be such that solder flux has well by adding the auxiliary agents such as thixotropic agent, stabilizer, activator, surfactant
The rate of spread, postwelding residual corrosivity is small, good insulation preformance.
Embodiment
With reference to specific embodiment, the present invention is expanded on further.These embodiments are merely to illustrate the present invention and not had to
In limitation the scope of the present invention.
Embodiment 1
A kind of efficient scaling powder of used in electronic industry, include the component of following weight proportion：50 parts of modified rosin, polyisobutene 35
Part, 25 parts of octyl epoxy stearate, 20 parts of PETO, 15 parts of Lauryl Alcohol ester, 10 parts of 2-methylimidazole, benzo miaow
20 parts of azoles, 7.5 parts of lactic acid, 5 parts of salicylic acid, 10 parts of benzoic acid, 5.5 parts of succinic acid, 10 parts of solvent, 7 parts of thixotropic agent, stabilizer
5.5 parts of 6.5 parts, 3 parts of activator and surfactant.
Wherein, the modified rosin is one or both of hydrogenated rosin, newtrex and disproportionated rosin arbitrary proportion
Combination.
Wherein, the solvent is one kind in polyethylene glycol, triethylene glycol list ether, ethyl acetate and diethylene glycol monobutyl ether
Or the combination of two kinds or two or more of arbitrary proportion.
Wherein, the thixotropic agent is in Tissuemat E, fatty acid amide, formamide, castor oil and rilanit special
The combination of one or two kinds of or two or more arbitrary proportions.
Wherein, the stabilizer is to tert-butyl group p tertButylcalixarene, to phenyl cup [6] aromatic hydrocarbons or to tert-butyl-calix [8] virtue
Hydrocarbon.
Wherein, the activator is one kind in adipic acid, decanedioic acid, dibromo butene glycol, isopropylamine and triethanolamine
Or the combination of two or more arbitrary proportion.
Wherein, the surfactant is OPEO, AEO or isooctylphenol polyoxy
Vinethene.
A kind of preparation method of the efficient scaling powder of used in electronic industry, comprises the following steps：
（1）In parts by weight, modified rosin, polyisobutene, octyl epoxy stearate, pentaerythrite oleic acid are weighed respectively
Ester, Lauryl Alcohol ester, 2-methylimidazole, benzimidazole, lactic acid, salicylic acid, benzoic acid, succinic acid are added in container and heated not
Disconnected stirring to material is completely dissolved, and thixotropic agent, stabilizer, activator, surfactant and solvent are added at a temperature of 200 DEG C and is stirred
Mix 15min；
（2）It is cooled to container closure after room temperature, and is placed in the refrigerating chamber of 3 DEG C of temperature, refrigerates 45h, produce electronics industry
With efficient scaling powder.
Embodiment 2
A kind of efficient scaling powder of used in electronic industry, include the component of following weight proportion：40 parts of modified rosin, polyisobutene 30
Part, 20 parts of octyl epoxy stearate, 10 parts of PETO, 10 parts of Lauryl Alcohol ester, 5 parts of 2-methylimidazole, benzo miaow
15 parts of azoles, 5 parts of lactic acid, 2 parts of salicylic acid, 5 parts of benzoic acid, 3 parts of succinic acid, 5 parts of solvent, 4 parts of thixotropic agent, 3 parts of stabilizer, activation
3 parts of 1 part of agent and surfactant.
Wherein, the modified rosin is one or both of hydrogenated rosin, newtrex and disproportionated rosin arbitrary proportion
Combination.
Wherein, the solvent is one kind in polyethylene glycol, triethylene glycol list ether, ethyl acetate and diethylene glycol monobutyl ether
Or the combination of two kinds or two or more of arbitrary proportion.
Wherein, the thixotropic agent is in Tissuemat E, fatty acid amide, formamide, castor oil and rilanit special
The combination of one or two kinds of or two or more arbitrary proportions.
Wherein, the stabilizer is to tert-butyl group p tertButylcalixarene, to phenyl cup [6] aromatic hydrocarbons or to tert-butyl-calix [8] virtue
Hydrocarbon.
Wherein, the activator is one kind in adipic acid, decanedioic acid, dibromo butene glycol, isopropylamine and triethanolamine
Or the combination of two or more arbitrary proportion.
Wherein, the surfactant is OPEO, AEO or isooctylphenol polyoxy
Vinethene.
A kind of preparation method of the efficient scaling powder of used in electronic industry, comprises the following steps：
（1）In parts by weight, modified rosin, polyisobutene, octyl epoxy stearate, pentaerythrite oleic acid are weighed respectively
Ester, Lauryl Alcohol ester, 2-methylimidazole, benzimidazole, lactic acid, salicylic acid, benzoic acid, succinic acid are added in container and heated not
Disconnected stirring to material is completely dissolved, and thixotropic agent, stabilizer, activator, surfactant and solvent are added at a temperature of 150 DEG C and is stirred
Mix 10min；
（2）It is cooled to container closure after room temperature, and is placed in the refrigerating chamber of 1 DEG C of temperature, refrigerates 40h, produce electronics industry
With efficient scaling powder.
Embodiment 3
A kind of efficient scaling powder of used in electronic industry, include the component of following weight proportion：60 parts of modified rosin, polyisobutene 40
Part, 30 parts of octyl epoxy stearate, 30 parts of PETO, 20 parts of Lauryl Alcohol ester, 15 parts of 2-methylimidazole, benzo miaow
25 parts of azoles, 10 parts of lactic acid, 8 parts of salicylic acid, 15 parts of benzoic acid, 8 parts of succinic acid, 15 parts of solvent, 10 parts of thixotropic agent, stabilizer 10
8 parts of part, 5 parts of activator and surfactant.
Wherein, the modified rosin is one or both of hydrogenated rosin, newtrex and disproportionated rosin arbitrary proportion
Combination.
Wherein, the solvent is one kind in polyethylene glycol, triethylene glycol list ether, ethyl acetate and diethylene glycol monobutyl ether
Or the combination of two kinds or two or more of arbitrary proportion.
Wherein, the thixotropic agent is in Tissuemat E, fatty acid amide, formamide, castor oil and rilanit special
The combination of one or two kinds of or two or more arbitrary proportions.
Wherein, the stabilizer is to tert-butyl group p tertButylcalixarene, to phenyl cup [6] aromatic hydrocarbons or to tert-butyl-calix [8] virtue
Hydrocarbon.
Wherein, the activator is one kind in adipic acid, decanedioic acid, dibromo butene glycol, isopropylamine and triethanolamine
Or the combination of two or more arbitrary proportion.
Wherein, the surfactant is OPEO, AEO or isooctylphenol polyoxy
Vinethene.
A kind of preparation method of the efficient scaling powder of used in electronic industry, comprises the following steps：
（1）In parts by weight, modified rosin, polyisobutene, octyl epoxy stearate, pentaerythrite oleic acid are weighed respectively
Ester, Lauryl Alcohol ester, 2-methylimidazole, benzimidazole, lactic acid, salicylic acid, benzoic acid, succinic acid are added in container and heated not
Disconnected stirring to material is completely dissolved, and thixotropic agent, stabilizer, activator, surfactant and solvent are added at a temperature of 250 DEG C and is stirred
Mix 20min；
（2）It is cooled to container closure after room temperature, and is placed in the refrigerating chamber of 5 DEG C of temperature, refrigerates 50h, produce electronics industry
With efficient scaling powder.
Described above is only the preferred embodiment of the present invention, and protection scope of the present invention is not limited merely to above-mentioned implementation
Example, all technical schemes belonged under thinking of the present invention belong to protection scope of the present invention.It should be pointed out that for the art
Those of ordinary skill for, some improvements and modifications without departing from the principles of the present invention, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (9)
1. a kind of efficient scaling powder of used in electronic industry, it is characterised in that include the component of following weight proportion：Modified rosin 40-
60 parts, polyisobutene 30-40 parts, octyl epoxy stearate 20-30 parts, PETO 10-30 parts, Lauryl Alcohol ester
10-20 parts, 2-methylimidazole 5-15 parts, benzimidazole 15-25 parts, lactic acid 5-10 parts, salicylic acid 2-8 parts, benzoic acid 5-15 parts,
Succinic acid 3-8 parts, solvent 5-15 parts, thixotropic agent 4-10 parts, stabilizer 3-10 parts, activator 1-5 parts and surfactant 3-8
Part.
2. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that 50 parts of the modified rosin, gather
35 parts of isobutene, 25 parts of octyl epoxy stearate, 20 parts of PETO, 15 parts of Lauryl Alcohol ester, 2-methylimidazole 10
Part, 20 parts of benzimidazole, 7.5 parts of lactic acid, 5 parts of salicylic acid, 10 parts of benzoic acid, 5.5 parts of succinic acid, 10 parts of solvent, thixotropic agent 7
Part, 6.5 parts of stabilizer, 3 parts of activator and 5.5 parts of surfactant.
3. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that the modified rosin is hydrogenation pine
The combination of one or both of fragrant, newtrex and disproportionated rosin arbitrary proportion.
4. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that the solvent be polyethylene glycol,
Triethylene glycol list ether, ethyl acetate and one kind or the group of two kinds or two or more of arbitrary proportion in diethylene glycol monobutyl ether
Close.
5. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that the thixotropic agent is selected from polyethylene
The group of one or both of wax, fatty acid amide, formamide, castor oil and rilanit special or two or more arbitrary proportions
Close.
6. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that the stabilizer is to the tert-butyl group
Cup [4] aromatic hydrocarbons, to phenyl cup [6] aromatic hydrocarbons or to tert-butyl-calix [8] aromatic hydrocarbons.
7. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that the activator be adipic acid,
The combination of one or both of decanedioic acid, dibromo butene glycol, isopropylamine and triethanolamine or two or more arbitrary proportions.
8. the efficient scaling powder of used in electronic industry according to claim 1, it is characterised in that the surfactant is octyl group
Phenol polyethenoxy ether, AEO or isooctyl phenol polyethoxylate.
9. a kind of preparation method of efficient scaling powder of used in electronic industry according to claim any one of 1-8, its feature exist
In comprising the following steps：
（1）In parts by weight, modified rosin, polyisobutene, octyl epoxy stearate, pentaerythrite oleic acid are weighed respectively
Ester, Lauryl Alcohol ester, 2-methylimidazole, benzimidazole, lactic acid, salicylic acid, benzoic acid, succinic acid are added in container and heated not
Disconnected stirring to material is completely dissolved, and thixotropic agent, stabilizer, activator, surfactant and molten are added at a temperature of 150-250 DEG C
10-20min is stirred in agent；
（2）It is cooled to container closure after room temperature, and is placed in the refrigerating chamber of 1-5 DEG C of temperature, refrigerates 40-50h, produce electronics
Industrial efficient scaling powder.
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| CN110524139A (en) * | 2019-08-06 | 2019-12-03 | 界首市南都华宇电源有限公司 | A kind of scaling powder of low-corrosiveness |
| CN112262013A (en) * | 2018-06-01 | 2021-01-22 | 千住金属工业株式会社 | Flux for solder paste and solder paste |
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| CN105537803A (en) * | 2016-02-24 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | Protective anti-corrosion no-clean flux |
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| CN112262013A (en) * | 2018-06-01 | 2021-01-22 | 千住金属工业株式会社 | Flux for solder paste and solder paste |
| CN112262013B (en) * | 2018-06-01 | 2021-10-26 | 千住金属工业株式会社 | Flux for solder paste and solder paste |
| US11167380B2 (en) * | 2018-06-01 | 2021-11-09 | Senju Metal Industry Co., Ltd. | Flux for solder paste and solder paste |
| CN109079365A (en) * | 2018-08-29 | 2018-12-25 | 李少伟 | A kind of wiring board electronics scaling powder and preparation method thereof |
| CN110524139A (en) * | 2019-08-06 | 2019-12-03 | 界首市南都华宇电源有限公司 | A kind of scaling powder of low-corrosiveness |
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