CN104096990A - Novel soldering flux - Google Patents
Novel soldering flux Download PDFInfo
- Publication number
- CN104096990A CN104096990A CN201410278315.2A CN201410278315A CN104096990A CN 104096990 A CN104096990 A CN 104096990A CN 201410278315 A CN201410278315 A CN 201410278315A CN 104096990 A CN104096990 A CN 104096990A
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- CN
- China
- Prior art keywords
- new flux
- accounts
- flux
- new
- isobutyl ketone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
The invention discloses a novel soldering flux, comprising the following components in percentage by weight: 35-40% of methyl isobutyl ketone, 31-36% of gum rosin, 3-8% of fatty alcohol-polyoxyethlene ether, 5-10% of malic acid and 6-11% of antirust oil. Through the mode, a mixed solution is made by adopting multiple raw materials and is applied to the surface of a welded object, the surface is cleaned, the welding performance is improved, residuals are extremely less, the welding production efficiency is improved and the cost is relatively low.
Description
Technical field
The present invention relates to formulations of solder flux field, particularly relate to a kind of New Flux.
Background technology
In the production process of electronic product, it is many that welding procedure is used.In order to improve the quality of welding, reduce the phenomenon that soldered body surface is oxidized, gets rusty, in the process of welding, often can use scaling powder.In addition, the tension force that the scaling powder of high-quality can also reduce the rear body surface of welding is to improve whole welding performance.
General solid soldering flux easily produces residue after welding finishes, if residue is not thoroughly removed, can produce certain impact to the insulating properties of product, and even short circuit has affected the quality stability of product.Therefore, after use scaling powder welds, need thorough cleaning, increased the time of production and processing and the cost of washing, operating efficiency is low, and easily product structure is caused to damage in washing process, and a large amount of washing agent also pollute the environment.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of New Flux, can improve welding performance, and residue is few, without cleaning.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: a kind of New Flux is provided, comprise: toluene isobutyl ketone, gum rosin, AEO, malic acid and antirust oil, described toluene isobutyl ketone accounts for 35% ~ 40% in New Flux, described gum rosin accounts for 31% ~ 36% in New Flux, described AEO accounts for 3% ~ 8% in New Flux, described malic acid accounts for 5% ~ 10% in New Flux, described antirust oil accounts for 6% ~ 11% in New Flux.
In a preferred embodiment of the present invention, described toluene isobutyl ketone accounts for 39% in New Flux.
In a preferred embodiment of the present invention, described gum rosin accounts for 35% in New Flux.
In a preferred embodiment of the present invention, described AEO accounts for 8% in New Flux.
In a preferred embodiment of the present invention, described malic acid accounts for 8% in New Flux.
In a preferred embodiment of the present invention, described antirust oil accounts for 10% in New Flux.
The invention has the beneficial effects as follows: a kind of New Flux that the present invention points out, adopt plurality of raw materials to make mixed solvent, be coated in the surface of welded article, can clean surface, improve welding performance, and residue is few, improve welding production efficiency, cost is relatively cheap.
The specific embodiment
Below the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making all other embodiment that obtain under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of New Flux, comprise: toluene isobutyl ketone, gum rosin, AEO, malic acid and antirust oil, described toluene isobutyl ketone accounts for 35% ~ 40% in New Flux, described gum rosin accounts for 31% ~ 36% in New Flux, described AEO accounts for 3% ~ 8% in New Flux, described malic acid accounts for 5% ~ 10% in New Flux, and described antirust oil accounts for 6% ~ 11% in New Flux.
A kind of New Flux of the present invention be take toluene isobutyl ketone as solvent, and described toluene isobutyl ketone accounts for 39% in New Flux.
Further, described gum rosin accounts for 35% in New Flux.The output of China's gum rosin occupies first place in the world, and uses the form of tapping to collect rosin reprocessing refinement and forms, and is conducive to the sustainable development of resource.
Further, described AEO accounts for 8% in New Flux, and the cleaning function of AEO is good.
Further, described malic acid accounts for 8% in New Flux.
Further, described antirust oil accounts for 10% in New Flux.
In sum, a kind of New Flux that the present invention points out, compares with common solid soldering flux, and the residue producing after welding is few, therefore without cleaning, has improved the efficiency of welding and whole performance, and operating efficiency is high.
The foregoing is only embodiments of the invention; not thereby limit the scope of the claims of the present invention; every equivalent structure or conversion of equivalent flow process that utilizes description of the present invention to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (6)
1. a New Flux, it is characterized in that, comprise: toluene isobutyl ketone, gum rosin, AEO, malic acid and antirust oil, described toluene isobutyl ketone accounts for 35% ~ 40% in New Flux, described gum rosin accounts for 31% ~ 36% in New Flux, described AEO accounts for 3% ~ 8% in New Flux, described malic acid accounts for 5% ~ 10% in New Flux, described antirust oil accounts for 6% ~ 11% in New Flux.
2. New Flux according to claim 1, is characterized in that, described toluene isobutyl ketone accounts for 39% in New Flux.
3. New Flux according to claim 2, is characterized in that, described gum rosin accounts for 35% in New Flux.
4. New Flux according to claim 3, is characterized in that, described AEO accounts for 8% in New Flux.
5. New Flux according to claim 4, is characterized in that, described malic acid accounts for 8% in New Flux.
6. New Flux according to claim 5, is characterized in that, described antirust oil accounts for 10% in New Flux.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410278315.2A CN104096990A (en) | 2014-06-20 | 2014-06-20 | Novel soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410278315.2A CN104096990A (en) | 2014-06-20 | 2014-06-20 | Novel soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104096990A true CN104096990A (en) | 2014-10-15 |
Family
ID=51665740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410278315.2A Pending CN104096990A (en) | 2014-06-20 | 2014-06-20 | Novel soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104096990A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041367A (en) * | 2016-07-14 | 2016-10-26 | 四川美亚达光电科技有限公司 | Soldering flux for light-emitting diode |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4523712A (en) * | 1984-03-12 | 1985-06-18 | At&T Technologies, Inc. | Soldering composition and method of soldering therewith |
| CN101462209A (en) * | 2009-01-16 | 2009-06-24 | 深圳市唯特偶化工开发实业有限公司 | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN103111773A (en) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder paste |
| CN103212923A (en) * | 2013-05-07 | 2013-07-24 | 浙江省冶金研究院有限公司 | High temperature resistant rosinyl scaling powder |
-
2014
- 2014-06-20 CN CN201410278315.2A patent/CN104096990A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4523712A (en) * | 1984-03-12 | 1985-06-18 | At&T Technologies, Inc. | Soldering composition and method of soldering therewith |
| CN101462209A (en) * | 2009-01-16 | 2009-06-24 | 深圳市唯特偶化工开发实业有限公司 | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| CN102990242A (en) * | 2011-09-13 | 2013-03-27 | 郴州金箭焊料有限公司 | Low-temperature halogen-free lead-free solder paste |
| CN103111773A (en) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder paste |
| CN103212923A (en) * | 2013-05-07 | 2013-07-24 | 浙江省冶金研究院有限公司 | High temperature resistant rosinyl scaling powder |
Non-Patent Citations (1)
| Title |
|---|
| 张康夫等: "《暂时防锈手册》", 31 August 2011 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106041367A (en) * | 2016-07-14 | 2016-10-26 | 四川美亚达光电科技有限公司 | Soldering flux for light-emitting diode |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141015 |