CN104084714A - Rosin scaling powder - Google Patents
Rosin scaling powder Download PDFInfo
- Publication number
- CN104084714A CN104084714A CN201410368985.3A CN201410368985A CN104084714A CN 104084714 A CN104084714 A CN 104084714A CN 201410368985 A CN201410368985 A CN 201410368985A CN 104084714 A CN104084714 A CN 104084714A
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- CN
- China
- Prior art keywords
- parts
- rosin
- scaling powder
- acid
- film forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses rosin scaling powder. The rosin scaling powder comprises, by weight, 10 parts to 20 parts of rosin modified phenolic resin, 5 parts to 10 parts of rosin glyceride, 70 parts to 80 parts of organic solvents, 2 parts to 5 parts of surfactants, 1 part to 3 parts of activators and 1 part to 2 parts of film forming agents, wherein the organic solvents are one kind of ethyl alcohol, propyl alcohol, butanol, acetic ether and butyl acetate, the surfactants are sodium dodecyl benzene sulfonate or fatty glyceride, the activators are one kind of glutaric acid, itaconic acid, o-hydroxybenzoic acid, malic acid and succinic acid, and the film forming agents are nitrocellulose. Residues of the rosin scaling powder are easy to remove, and injuries to the human body and environment pollution can be avoided.
Description
Technical field
The present invention relates to solder technology field, especially a kind of rosin scaling powder.
Background technology
The kind of scaling powder is a lot, can be divided into substantially the organic and inorganic and large series of resin three; Resin solder flux normally extracts from the secretion of trees, belongs to natural products, does not have corrosivity, and rosin is the representative of this class solder flux, so also referred to as rosin based solder flux; Scaling powder normally be take the mixture that rosin is main component, the auxiliary material that guarantee that welding process is carried out smoothly, the Main Function of scaling powder is the oxide of removing scolder and welded mother metal surface, make metal surface reach necessary cleannes, the oxidation again on surface when it prevents from welding, reduces solder surface tension force, improves welding performance, the quality of scaling powder performance, directly has influence on the quality of electronic product.And along with the development of electronics industry and the enforcement that bans use of freon policy, the direction that electronics will clean is from now on the Novel free cleaning scaling powder of not halide activating agent, after welding, without cleaning, removes the cleaning of freon from, can save cleaning equipment and solvent, reduce environmental pollution.
Summary of the invention
The object of this invention is to provide a kind of rosin scaling powder, this rosin scaling powder can solve the problem that existing scaling powder postwelding need clean.
In order to address the above problem, the technical solution used in the present invention is: a kind of rosin scaling powder, raw material by following parts by weight is prepared from: 10 parts～20 parts of rosin modified phenolic resins, 5 parts～10 parts of rosin glycerides, 70 parts～80 parts of organic solvents, 2 parts～5 parts, surfactant, 1 part～3 parts, activator, 1 part～2 parts of film forming agents; Wherein, described organic solvent is ethanol, propyl alcohol, butanols, a kind of in ethyl acetate and butyl acetate; Described surfactant is neopelex or fatty glyceride; Described activator is glutaric acid, itaconic acid, septichen, a kind of in malic acid and butanedioic acid; Described film forming agent is cellulose nitrate.
Owing to having adopted technique scheme, the present invention compared with prior art has following beneficial effect:
This rosin scaling powder help weldering active high, quality of welding spot is high, fault rate is low, smog is few, flux residue is easily removed, and can not produce toxic gas and stink simultaneously, can not work the mischief and environmental pollution to human body.
The specific embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment 1
Rosin scaling powder is prepared from by following raw material: 100 grams of rosin modified phenolic resins, 100 grams of rosin glycerides, 700 grams of ethanol, 35 grams of fatty glycerides, 10 grams of septichens, 15 grams of cellulose nitrates.
Embodiment 2
Rosin scaling powder is prepared from by following raw material: 2 kilograms of rosin modified phenolic resins, 0.5 kilogram of rosin glyceride, 7.5 kilograms of ethyl acetates, 0.2 kilogram of fatty glyceride, 0.3 gram of glutaric acid, 0.2 kilogram of cellulose nitrate.
Embodiment 3
Rosin scaling powder is prepared from by following raw material: 15 kilograms of rosin modified phenolic resins, 7.5 kilograms of rosin glycerides, 80 kilograms, butanols, 5 kilograms of neopelexes, 2 kilograms of malic acid, 1 kilogram of cellulose nitrate.
Claims (1)
1. a rosin scaling powder, is characterized in that, is prepared from: 10 parts～20 parts of rosin modified phenolic resins by the raw material of following parts by weight, 5 parts～10 parts of rosin glycerides, 70 parts～80 parts of organic solvents, 2 parts～5 parts, surfactant, 1 part～3 parts, activator, 1 part～2 parts of film forming agents; Wherein, described organic solvent is ethanol, propyl alcohol, butanols, a kind of in ethyl acetate and butyl acetate; Described surfactant is neopelex or fatty glyceride; Described activator is glutaric acid, itaconic acid, septichen, a kind of in malic acid and butanedioic acid; Described film forming agent is cellulose nitrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410368985.3A CN104084714B (en) | 2014-07-30 | 2014-07-30 | Rosin flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410368985.3A CN104084714B (en) | 2014-07-30 | 2014-07-30 | Rosin flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104084714A true CN104084714A (en) | 2014-10-08 |
| CN104084714B CN104084714B (en) | 2016-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410368985.3A Active CN104084714B (en) | 2014-07-30 | 2014-07-30 | Rosin flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104084714B (en) |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625288A (en) * | 2014-12-23 | 2015-05-20 | 常熟高嘉能源科技有限公司 | Solar cell welding process |
| CN104772581A (en) * | 2015-04-28 | 2015-07-15 | 苏州永创达电子有限公司 | Flux |
| CN105033508A (en) * | 2015-07-31 | 2015-11-11 | 安徽江威精密制造有限公司 | Soldering flux material composite and soldering flux preparing method |
| CN105728986A (en) * | 2016-04-27 | 2016-07-06 | 谭钰良 | No-wash flux |
| CN105855750A (en) * | 2016-06-15 | 2016-08-17 | 傅兴琴 | Anti-oxidation flux and preparation method thereof |
| CN106238968A (en) * | 2016-08-05 | 2016-12-21 | 雷春生 | A kind of preparation method of wear-resisting Halogen delustring solder |
| CN107097019A (en) * | 2017-06-08 | 2017-08-29 | 苏州龙腾万里化工科技有限公司 | A kind of organic cleaning-free scaling powder |
| CN107127473A (en) * | 2017-06-16 | 2017-09-05 | 东莞市锡达焊锡制品有限公司 | A kind of unleaded solder of nickel plating |
| CN108526757A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder not will produce toxic gas |
| CN109048121A (en) * | 2018-09-08 | 2018-12-21 | 佛山皖和新能源科技有限公司 | A kind of photovoltaic module scaling powder |
| CN112676733A (en) * | 2020-12-16 | 2021-04-20 | 湖北省哈福生物化学有限公司 | Soldering flux composition and improved method for efficiently preparing soldering flux |
| CN117342886A (en) * | 2023-12-05 | 2024-01-05 | 长春黄金研究院有限公司 | Noble metal slurry applied to ceramic surface decoration and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102604A (en) * | 1985-04-06 | 1985-12-20 | 福建师范大学 | Resina-type flux of brazing |
| JPH1177376A (en) * | 1997-09-03 | 1999-03-23 | Nippon Handa Kk | Flux |
| KR20030028803A (en) * | 2002-09-26 | 2003-04-10 | 주식회사 스카이닉스 | Flux and Solder Comprising Such a Flux |
| CN102284810A (en) * | 2011-07-28 | 2011-12-21 | 常州佳讯光电产业发展有限公司 | Soldering flux for diode |
| CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
-
2014
- 2014-07-30 CN CN201410368985.3A patent/CN104084714B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85102604A (en) * | 1985-04-06 | 1985-12-20 | 福建师范大学 | Resina-type flux of brazing |
| JPH1177376A (en) * | 1997-09-03 | 1999-03-23 | Nippon Handa Kk | Flux |
| KR20030028803A (en) * | 2002-09-26 | 2003-04-10 | 주식회사 스카이닉스 | Flux and Solder Comprising Such a Flux |
| CN102284810A (en) * | 2011-07-28 | 2011-12-21 | 常州佳讯光电产业发展有限公司 | Soldering flux for diode |
| CN103008920A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Leadless rosin core no-clean scaling powder |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104625288A (en) * | 2014-12-23 | 2015-05-20 | 常熟高嘉能源科技有限公司 | Solar cell welding process |
| CN104772581A (en) * | 2015-04-28 | 2015-07-15 | 苏州永创达电子有限公司 | Flux |
| CN104772581B (en) * | 2015-04-28 | 2016-07-06 | 苏州永创达电子有限公司 | A kind of scaling powder |
| CN105033508A (en) * | 2015-07-31 | 2015-11-11 | 安徽江威精密制造有限公司 | Soldering flux material composite and soldering flux preparing method |
| CN105728986B (en) * | 2016-04-27 | 2018-08-03 | 广州市铠特电子材料有限公司 | A kind of leave scaling powder |
| CN105728986A (en) * | 2016-04-27 | 2016-07-06 | 谭钰良 | No-wash flux |
| CN105855750A (en) * | 2016-06-15 | 2016-08-17 | 傅兴琴 | Anti-oxidation flux and preparation method thereof |
| CN106238968A (en) * | 2016-08-05 | 2016-12-21 | 雷春生 | A kind of preparation method of wear-resisting Halogen delustring solder |
| CN107097019A (en) * | 2017-06-08 | 2017-08-29 | 苏州龙腾万里化工科技有限公司 | A kind of organic cleaning-free scaling powder |
| CN107127473A (en) * | 2017-06-16 | 2017-09-05 | 东莞市锡达焊锡制品有限公司 | A kind of unleaded solder of nickel plating |
| CN108526757A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder not will produce toxic gas |
| CN109048121A (en) * | 2018-09-08 | 2018-12-21 | 佛山皖和新能源科技有限公司 | A kind of photovoltaic module scaling powder |
| CN112676733A (en) * | 2020-12-16 | 2021-04-20 | 湖北省哈福生物化学有限公司 | Soldering flux composition and improved method for efficiently preparing soldering flux |
| CN117342886A (en) * | 2023-12-05 | 2024-01-05 | 长春黄金研究院有限公司 | Noble metal slurry applied to ceramic surface decoration and preparation method thereof |
| CN117342886B (en) * | 2023-12-05 | 2024-03-01 | 长春黄金研究院有限公司 | Noble metal slurry applied to ceramic surface decoration and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104084714B (en) | 2016-08-24 |
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