CN106041367A - Soldering flux for light-emitting diode - Google Patents

Soldering flux for light-emitting diode Download PDF

Info

Publication number
CN106041367A
CN106041367A CN201610554352.0A CN201610554352A CN106041367A CN 106041367 A CN106041367 A CN 106041367A CN 201610554352 A CN201610554352 A CN 201610554352A CN 106041367 A CN106041367 A CN 106041367A
Authority
CN
China
Prior art keywords
parts
mesh
light
emitting diodes
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610554352.0A
Other languages
Chinese (zh)
Inventor
王植
高文华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sichuan Meiyada Photoelectric Technology Co Ltd
Original Assignee
Sichuan Meiyada Photoelectric Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sichuan Meiyada Photoelectric Technology Co Ltd filed Critical Sichuan Meiyada Photoelectric Technology Co Ltd
Priority to CN201610554352.0A priority Critical patent/CN106041367A/en
Publication of CN106041367A publication Critical patent/CN106041367A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362Selection of compositions of fluxes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The invention relates to soldering flux for a light-emitting diode. The soldering flux consists of the following components in parts by mass: 16-20 parts of PC, 18-22 parts of sorbitol anhydride mono-oleic acid ester, 14-18 parts of sodium tungstate, 12-16 parts of phosphated castor oil, 18-22 parts of dialkenyl succinimide, 14-18 parts of succinimide, 12-16 parts of acrylate emulsion, 18-22 parts of dibutyl phthalate, 14-18 parts of inositol hexaphosphate, 12-16 parts of zinc borate, 18-22 parts of urea, 14-18 parts of pentaerythritol octahydrogen tetraphosphate, 14-18 parts of molybdenum disulfide, 12-16 parts of disodium stannous citrate, 18-22 parts of bronze powder, 14-18 parts of magnesium oxide, 12-16 parts of dibutyltin dilaurate, 18-22 parts of halogenated butyl rubber, 14-18 parts of gum rosin and 12-16 parts of sodium aluminate. The soldering flux is applied to welding in a production process of the light-emitting diode, so that welding effect is better, a welding defect rate is low, and the light-emitting diode obtained by welding is good in quality.

Description

A kind of effective scaling powder of light-emitting diodes
Technical field
The present invention relates to a kind of effective scaling powder of light-emitting diodes, belong to LED technology field.
Background technology
In recent years, along with the continuous progress of science and technology, China's light emitting diode industry quickly grows.Life at light emitting diode During production. art, welding is main processing step.The adjuvant used when scaling powder is welding, the Main Function of scaling powder is Remove solder and the oxide by weldering mother metal surface, make metal surface reach necessary cleannes, thus surface when preventing welding Reoxidation, reduce solder surface tension, improve welding effect, it may be said that the quality of scaling powder performance directly influences luminescence The welding quality of diode.
Summary of the invention
It is an object of the invention to provide a kind of effective scaling powder of light-emitting diodes, in order to light-emitting diodes is better achieved effective The auxiliary welding function of scaling powder.
To achieve these goals, technical scheme is as follows.
A kind of effective scaling powder of light-emitting diodes, is made up of the component of following mass fraction: PC16~20 parts, sorbitol anhydride list Oleate 18~22 parts, sodium tungstate 14~18 parts, phosphorylation Oleum Ricini 12~16 parts, diene base succimide 18~22 parts, Butanimide 14~18 parts, acrylic acid ester emulsion 12~16 parts, dibutyl phthalate 18~22 parts, inositol hexaphosphate 14~18 parts, Firebrake ZB 12~16 parts, carbamide 18~22 parts, pentaerythritol phosphate 14~18 parts, molybdenum bisuphide 14~18 parts, Distannous citrate 12~16 parts, bronze powder 18~22 parts, magnesium oxide 14~18 parts, dibutyl tin laurate 12~16 Part, halogenated butyl rubber 18~22 parts, gum rosin 14~18 parts, sodium aluminate 12~16 parts.
Further, the effective scaling powder of above-mentioned light-emitting diodes, it is made up of the component of following mass fraction: PC16 part, Pyrusussuriensis Alcohol acid anhydride monoleate 18 parts, sodium tungstate 14 parts, phosphorylation Oleum Ricini 12 parts, diene base succimide 18 parts, butanimide 14 parts, acrylic acid ester emulsion 12 parts, dibutyl phthalate 18 parts, inositol hexaphosphate 14 parts, Firebrake ZB 12 parts, carbamide 18 Part, pentaerythritol phosphate 14 parts, molybdenum bisuphide 14 parts, distannous citrate 12 parts, bronze powder 18 parts, magnesium oxide 14 parts, Dibutyl tin laurate 12 parts, halogenated butyl rubber 18 parts, gum rosin 14 parts, sodium aluminate 12 parts.
Further, the effective scaling powder of above-mentioned light-emitting diodes, it is made up of the component of following mass fraction: PC18 part, Pyrusussuriensis Alcohol acid anhydride monoleate 20 parts, sodium tungstate 16 parts, phosphorylation Oleum Ricini 14 parts, diene base succimide 20 parts, butanimide 16 parts, acrylic acid ester emulsion 14 parts, dibutyl phthalate 20 parts, inositol hexaphosphate 16 parts, Firebrake ZB 14 parts, carbamide 20 Part, pentaerythritol phosphate 16 parts, molybdenum bisuphide 16 parts, distannous citrate 14 parts, bronze powder 20 parts, magnesium oxide 16 parts, Dibutyl tin laurate 14 parts, halogenated butyl rubber 20 parts, gum rosin 16 parts, sodium aluminate 14 parts.
Further, the effective scaling powder of above-mentioned light-emitting diodes, it is made up of the component of following mass fraction: PC20 part, Pyrusussuriensis Alcohol acid anhydride monoleate 22 parts, sodium tungstate 18 parts, phosphorylation Oleum Ricini 16 parts, diene base succimide 22 parts, butanimide 18 parts, acrylic acid ester emulsion 16 parts, dibutyl phthalate 22 parts, inositol hexaphosphate 18 parts, Firebrake ZB 16 parts, carbamide 22 Part, pentaerythritol phosphate 18 parts, molybdenum bisuphide 18 parts, distannous citrate 16 parts, bronze powder 22 parts, magnesium oxide 18 parts, Dibutyl tin laurate 16 parts, halogenated butyl rubber 22 parts, gum rosin 18 parts, sodium aluminate 16 parts.
Further, described bronze powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 3~7:4~8:1.
Further, described magnesium oxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 3~8:2~8:1.
Further, the viscosity of described acrylic acid ester emulsion is 12000~14000mpa.s at 25 DEG C.
Further, described sodium aluminate is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20~50 mesh, 50~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 2~4:3~5:1.
Further, the viscosity of described sorbitan mono-oleic acid ester is 8000~10000mpa.s at 25 DEG C.
Further, above-mentioned light-emitting diodes effective scaling powder preparation method step is as follows:
(1) by the PC of described mass fraction, sorbitan mono-oleic acid ester, sodium tungstate, phosphorylation Oleum Ricini, double allyl butyrate two Acid imide, butanimide, acrylic acid ester emulsion, carbamide, pentaerythritol phosphate, molybdenum bisuphide, dibutyl tin laurate, Halogenated butyl rubber, gum rosin, sodium aluminate are mixed, ultrasonic high speed dispersion, and ultrasonic frequency is 20~40KHz, dispersion speed Degree 5000~about 5400r/min, jitter time is 30~60min;
(2) distannous citrate of described mass fraction, bronze powder, magnesium oxide are added, ultrasonic high speed dispersion, ultrasound wave Frequency is 20~35KHz, rate of dispersion 4800~about 5200r/min, and jitter time is 30~50min;
(3) adding the dibutyl phthalate of described mass fraction, inositol hexaphosphate, Firebrake ZB, ultrasonic high speed is divided Dissipating, ultrasonic frequency is 20~30KHz, rate of dispersion 4600~about 4800r/min, and jitter time is 20~40min;Mixing This product is prepared after uniformly.
This beneficial effect of the invention is: by the weldering in flux application of the present invention to light emitting diode production process In connecing, welding effect can be made more preferable, welding fault rate is low, and the light emitting diode quality that welding obtains is good.
Detailed description of the invention
Below in conjunction with embodiment, the detailed description of the invention of the present invention is described, in order to be better understood from the present invention.
Embodiment 1
The effective scaling powder of light-emitting diodes in the present embodiment, is made up of the component of following mass fraction: PC16 part, sorbitol Acid anhydride monoleate 18 parts, sodium tungstate 14 parts, phosphorylation Oleum Ricini 12 parts, diene base succimide 18 parts, butanimide 14 Part, acrylic acid ester emulsion 12 parts, dibutyl phthalate 18 parts, inositol hexaphosphate 14 parts, Firebrake ZB 12 parts, carbamide 18 Part, pentaerythritol phosphate 14 parts, molybdenum bisuphide 14 parts, distannous citrate 12 parts, bronze powder 18 parts, magnesium oxide 14 parts, Dibutyl tin laurate 12 parts, halogenated butyl rubber 18 parts, gum rosin 14 parts, sodium aluminate 12 parts.
Described bronze powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 3:4:1.
Described magnesium oxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 3:2:1.
The viscosity of described acrylic acid ester emulsion is 12000mpa.s at 25 DEG C.
Described sodium aluminate is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20~50 mesh, 50~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 2:3:1.
The viscosity of described sorbitan mono-oleic acid ester is 8000mpa.s at 25 DEG C.
Above-mentioned light-emitting diodes effective scaling powder preparation method step is as follows:
(1) by the PC of described mass fraction, sorbitan mono-oleic acid ester, sodium tungstate, phosphorylation Oleum Ricini, double allyl butyrate two Acid imide, butanimide, acrylic acid ester emulsion, carbamide, pentaerythritol phosphate, molybdenum bisuphide, dibutyl tin laurate, Halogenated butyl rubber, gum rosin, sodium aluminate are mixed, ultrasonic high speed dispersion, and ultrasonic frequency is 20kHz, rate of dispersion About 5400r/min, jitter time is 60min;
(2) distannous citrate of described mass fraction, bronze powder, magnesium oxide are added, ultrasonic high speed dispersion, ultrasound wave Frequency is 20kHz, rate of dispersion about 5200r/min, and jitter time is 50min;
(3) adding the dibutyl phthalate of described mass fraction, inositol hexaphosphate, Firebrake ZB, ultrasonic high speed is divided Dissipating, ultrasonic frequency is 20kHz, rate of dispersion about 4800r/min, and jitter time is 40min;This is prepared after mix homogeneously Product.
By the present embodiment prepare scaling powder, be used for welding light emitting diode, in welding process, do not produce unpleasant or Poisonous gas, after welding terminates, welding effect is good, and its face of weld is clean, is not required to be carried out.
Embodiment 2
The effective scaling powder of light-emitting diodes in the present embodiment, is made up of the component of following mass fraction: PC18 part, sorbitol Acid anhydride monoleate 20 parts, sodium tungstate 16 parts, phosphorylation Oleum Ricini 14 parts, diene base succimide 20 parts, butanimide 16 Part, acrylic acid ester emulsion 14 parts, dibutyl phthalate 20 parts, inositol hexaphosphate 16 parts, Firebrake ZB 14 parts, carbamide 20 Part, pentaerythritol phosphate 16 parts, molybdenum bisuphide 16 parts, distannous citrate 14 parts, bronze powder 20 parts, magnesium oxide 16 parts, Dibutyl tin laurate 14 parts, halogenated butyl rubber 20 parts, gum rosin 16 parts, sodium aluminate 14 parts.
Described bronze powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 5:6:1.
Described magnesium oxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 5:5:1.
The viscosity of described acrylic acid ester emulsion is 13000mpa.s at 25 DEG C.
Described sodium aluminate is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20~50 mesh, 50~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 3:4:1.
The viscosity of described sorbitan mono-oleic acid ester is 9000mpa.s at 25 DEG C.
Above-mentioned light-emitting diodes effective scaling powder preparation method step is as follows:
(1) by the PC of described mass fraction, sorbitan mono-oleic acid ester, sodium tungstate, phosphorylation Oleum Ricini, double allyl butyrate two Acid imide, butanimide, acrylic acid ester emulsion, carbamide, pentaerythritol phosphate, molybdenum bisuphide, dibutyl tin laurate, Halogenated butyl rubber, gum rosin, sodium aluminate are mixed, ultrasonic high speed dispersion, and ultrasonic frequency is 30kHz, rate of dispersion About 5200r/min, jitter time is 45min;
(2) distannous citrate of described mass fraction, bronze powder, magnesium oxide are added, ultrasonic high speed dispersion, ultrasound wave Frequency is 27kHz, rate of dispersion about 5000r/min, and jitter time is 40min;
(3) adding the dibutyl phthalate of described mass fraction, inositol hexaphosphate, Firebrake ZB, ultrasonic high speed is divided Dissipating, ultrasonic frequency is 25kHz, rate of dispersion about 4700r/min, and jitter time is 30min;This is prepared after mix homogeneously Product.
Embodiment 3
The effective scaling powder of light-emitting diodes in the present embodiment, is made up of the component of following mass fraction: PC20 part, sorbitol Acid anhydride monoleate 22 parts, sodium tungstate 18 parts, phosphorylation Oleum Ricini 16 parts, diene base succimide 22 parts, butanimide 18 Part, acrylic acid ester emulsion 16 parts, dibutyl phthalate 22 parts, inositol hexaphosphate 18 parts, Firebrake ZB 16 parts, carbamide 22 Part, pentaerythritol phosphate 18 parts, molybdenum bisuphide 18 parts, distannous citrate 16 parts, bronze powder 22 parts, magnesium oxide 18 parts, Dibutyl tin laurate 16 parts, halogenated butyl rubber 22 parts, gum rosin 18 parts, sodium aluminate 16 parts.
Described bronze powder is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 7:8:1.
Described magnesium oxide is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 8:8:1.
The viscosity of described acrylic acid ester emulsion is 14000mpa.s at 25 DEG C.
Described sodium aluminate is made up of the powder body of three kinds of particle diameter mesh numbers, its particle diameter mesh number be respectively 20~50 mesh, 50~70 mesh, 70~90 mesh, the mixing quality ratio of above-mentioned three kinds of powder body is 4:5:1.
The viscosity of described sorbitan mono-oleic acid ester is 10000mpa.s at 25 DEG C.
Above-mentioned light-emitting diodes effective scaling powder preparation method step is as follows:
(1) by the PC of described mass fraction, sorbitan mono-oleic acid ester, sodium tungstate, phosphorylation Oleum Ricini, double allyl butyrate two Acid imide, butanimide, acrylic acid ester emulsion, carbamide, pentaerythritol phosphate, molybdenum bisuphide, dibutyl tin laurate, Halogenated butyl rubber, gum rosin, sodium aluminate are mixed, ultrasonic high speed dispersion, and ultrasonic frequency is 40kHz, rate of dispersion 5000r/min, jitter time is 30min;
(2) distannous citrate of described mass fraction, bronze powder, magnesium oxide are added, ultrasonic high speed dispersion, ultrasound wave Frequency is 35kHz, rate of dispersion 4800r/min, and jitter time is 30min;
(3) adding the dibutyl phthalate of described mass fraction, inositol hexaphosphate, Firebrake ZB, ultrasonic high speed is divided Dissipating, ultrasonic frequency is 30kHz, rate of dispersion about 4600r/min, and jitter time is 20min;This is prepared after mix homogeneously Product.
By the present embodiment prepare scaling powder, be used for welding light emitting diode, in welding process, do not produce unpleasant or Poisonous gas, after welding terminates, welding effect is good, and its face of weld is clean, is not required to be carried out.
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art For, under the premise without departing from the principles of the invention, it is also possible to make some improvements and modifications, these improvements and modifications are also considered as Protection scope of the present invention.

Claims (10)

1. the effective scaling powder of light-emitting diodes, it is characterised in that: it is made up of the component of following mass fraction: PC16~20 parts, Sorbitan mono-oleic acid ester 18~22 parts, sodium tungstate 14~18 parts, phosphorylation Oleum Ricini 12~16 parts, diene base succimide 18~22 parts, butanimide 14~18 parts, acrylic acid ester emulsion 12~16 parts, dibutyl phthalate 18~22 parts, flesh Alcohol six phosphate ester 14~18 parts, Firebrake ZB 12~16 parts, carbamide 18~22 parts, pentaerythritol phosphate 14~18 parts, curing Molybdenum 14~18 parts, distannous citrate 12~16 parts, bronze powder 18~22 parts, magnesium oxide 14~18 parts, tin dilaurate two fourth Base stannum 12~16 parts, halogenated butyl rubber 18~22 parts, gum rosin 14~18 parts, sodium aluminate 12~16 parts.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: the effective scaling powder of described light-emitting diodes It is made up of the component of following mass fraction: PC16 part, sorbitan mono-oleic acid ester 18 parts, sodium tungstate 14 parts, phosphorylation Oleum Ricini 12 parts, diene base succimide 18 parts, butanimide 14 parts, acrylic acid ester emulsion 12 parts, dibutyl phthalate 18 Part, inositol hexaphosphate 14 parts, Firebrake ZB 12 parts, 18 parts of carbamide, pentaerythritol phosphate 14 parts, molybdenum bisuphide 14 parts, Fructus Citri Limoniae Distannous 12 parts of acid, bronze powder 18 parts, magnesium oxide 14 parts, dibutyl tin laurate 12 parts, halogenated butyl rubber 18 parts, fat Colophonium 14 parts, sodium aluminate 12 parts.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: the effective scaling powder of described light-emitting diodes It is made up of the component of following mass fraction: PC18 part, sorbitan mono-oleic acid ester 20 parts, sodium tungstate 16 parts, phosphorylation Oleum Ricini 14 parts, diene base succimide 20 parts, butanimide 16 parts, acrylic acid ester emulsion 14 parts, dibutyl phthalate 20 Part, inositol hexaphosphate 16 parts, Firebrake ZB 14 parts, 20 parts of carbamide, pentaerythritol phosphate 16 parts, molybdenum bisuphide 16 parts, Fructus Citri Limoniae Distannous 14 parts of acid, bronze powder 20 parts, magnesium oxide 16 parts, dibutyl tin laurate 14 parts, halogenated butyl rubber 20 parts, fat Colophonium 16 parts, sodium aluminate 14 parts.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: the effective scaling powder of described light-emitting diodes It is made up of the component of following mass fraction: PC20 part, sorbitan mono-oleic acid ester 22 parts, sodium tungstate 18 parts, phosphorylation Oleum Ricini 16 parts, diene base succimide 22 parts, butanimide 18 parts, acrylic acid ester emulsion 16 parts, dibutyl phthalate 22 Part, inositol hexaphosphate 18 parts, Firebrake ZB 16 parts, 22 parts of carbamide, pentaerythritol phosphate 18 parts, molybdenum bisuphide 18 parts, Fructus Citri Limoniae Distannous 16 parts of acid, bronze powder 22 parts, magnesium oxide 18 parts, dibutyl tin laurate 16 parts, halogenated butyl rubber 22 parts, fat Colophonium 18 parts, sodium aluminate 16 parts.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: described bronze powder is by three kinds of particle diameter mesh The powder body composition of number, its particle diameter mesh number is respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mictoplasm of above-mentioned three kinds of powder body Amount ratio is 3~7:4~8:1.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: described magnesium oxide is by three kinds of particle diameter mesh The powder body composition of number, its particle diameter mesh number is respectively 30~50 mesh, 50~80 mesh, 80~100 mesh, the mictoplasm of above-mentioned three kinds of powder body Amount ratio is 3~8:2~8:1.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: the viscosity of described acrylic acid ester emulsion It is 12000~14000mpa.s at 25 DEG C.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: described sodium aluminate is by three kinds of particle diameter mesh The powder body composition of number, its particle diameter mesh number is respectively 20~50 mesh, 50~70 mesh, 70~90 mesh, the mictoplasm of above-mentioned three kinds of powder body Amount ratio is 2~4:3~5:1.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: described sorbitan mono-oleic acid ester Viscosity is 8000~10000mpa.s at 25 DEG C.
The effective scaling powder of light-emitting diodes the most according to claim 1, it is characterised in that: described light-emitting diodes is effective helps weldering Agent preparation method step is as follows:
(1) by the PC of described mass fraction, sorbitan mono-oleic acid ester, sodium tungstate, phosphorylation Oleum Ricini, diene base succinyl Asia Amine, butanimide, acrylic acid ester emulsion, carbamide, pentaerythritol phosphate, molybdenum bisuphide, dibutyl tin laurate, halogenation Butyl rubber, gum rosin, sodium aluminate are mixed, ultrasonic high speed dispersion, and ultrasonic frequency is 20~40KHz, rate of dispersion 5000~5400r/min, jitter time is 30~60min;
(2) distannous citrate of described mass fraction, bronze powder, magnesium oxide are added, ultrasonic high speed dispersion, ultrasonic frequency Being 20~35KHz, rate of dispersion 4800~5200r/min, jitter time is 30~50min;
(3) dibutyl phthalate of described mass fraction, inositol hexaphosphate, Firebrake ZB are added, ultrasonic high speed dispersion is super Frequency of sound wave is 20~30KHz, rate of dispersion 4600~4800r/min, and jitter time is 20~40min;Make after mix homogeneously Obtain this product.
CN201610554352.0A 2016-07-14 2016-07-14 Soldering flux for light-emitting diode Pending CN106041367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610554352.0A CN106041367A (en) 2016-07-14 2016-07-14 Soldering flux for light-emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610554352.0A CN106041367A (en) 2016-07-14 2016-07-14 Soldering flux for light-emitting diode

Publications (1)

Publication Number Publication Date
CN106041367A true CN106041367A (en) 2016-10-26

Family

ID=57186548

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610554352.0A Pending CN106041367A (en) 2016-07-14 2016-07-14 Soldering flux for light-emitting diode

Country Status (1)

Country Link
CN (1) CN106041367A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108326471A (en) * 2017-12-11 2018-07-27 安徽宝辰机电设备科技有限公司 A kind of scaling powder additive

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104231A (en) * 2007-08-11 2008-01-16 厦门大学 Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth
CN101934437A (en) * 2010-09-30 2011-01-05 常州市亚太微电子材料有限公司 Unleaded solder paste and preparation method thereof
CN101966632A (en) * 2010-09-29 2011-02-09 广州瀚源电子科技有限公司 Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof
CN104096990A (en) * 2014-06-20 2014-10-15 苏州锐耐洁电子科技新材料有限公司 Novel soldering flux
CN104117787A (en) * 2014-07-31 2014-10-29 宁国新博能电子有限公司 Environment-friendly no-clean soldering flux
CN104923975A (en) * 2015-06-19 2015-09-23 青岛恩高运动控制技术有限公司 High-performance soldering flux

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101104231A (en) * 2007-08-11 2008-01-16 厦门大学 Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth
CN101966632A (en) * 2010-09-29 2011-02-09 广州瀚源电子科技有限公司 Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof
CN101934437A (en) * 2010-09-30 2011-01-05 常州市亚太微电子材料有限公司 Unleaded solder paste and preparation method thereof
CN104096990A (en) * 2014-06-20 2014-10-15 苏州锐耐洁电子科技新材料有限公司 Novel soldering flux
CN104117787A (en) * 2014-07-31 2014-10-29 宁国新博能电子有限公司 Environment-friendly no-clean soldering flux
CN104923975A (en) * 2015-06-19 2015-09-23 青岛恩高运动控制技术有限公司 High-performance soldering flux

Non-Patent Citations (9)

* Cited by examiner, † Cited by third party
Title
俞蕙 等: "《古陶瓷修复基础》", 30 September 2012, 复旦大学出版社 *
化学工业出版社组织: "《化工和石油产品目录》", 31 May 1999, 化学工业出版社组织 *
吕晓华: "《合理饮食与健康》", 31 August 2015, 四川教育出版社 *
张秀梅 等: "《涂料工业用原材料技术标准手册 第二版》", 31 January 2004, 化学工业出版社 *
温辉梁: "《化工助剂》", 31 December 2009, 江西科学技术出版社 *
王广生: "《石油化工原料与产品安全手册 第二版》", 31 January 2016, 中国石化出版社 *
窦杰贵: "《食品卫生与健康》", 31 October 1997, 新疆大学出版社 *
范光松: "《设备润滑与防腐》", 31 January 2011, 机械工业出版社 *
韦军: "《高分子合成工艺学》", 28 February 2011, 华东理工大学出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108326471A (en) * 2017-12-11 2018-07-27 安徽宝辰机电设备科技有限公司 A kind of scaling powder additive

Similar Documents

Publication Publication Date Title
MY151120A (en) Solder pastes with resin-free fluxing agent
CN1709638A (en) Rosin halogen-free scaling powder for lead-free soldering paste
CN101073862A (en) Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease
CN111299896B (en) Soldering paste and preparation method thereof
CN103882446B (en) A kind of room temperature iron and steel degreaser and preparation method thereof
CN106041367A (en) Soldering flux for light-emitting diode
CN102528327B (en) High-temperature lead-free solder paste and preparation method
CN1315895A (en) Solder powder and method for preparing same and solder paste
CN102513735A (en) Flux paste for high-bismuth content solder paste and preparation method thereof
CN106493487A (en) Water-based scaling powder and preparation method and application
CN110628386A (en) Composite moisturizing dust suppressant and preparation method thereof
CN104722957A (en) Environment-friendly spraying type welding anti-splattering agent and preparation method thereof
AU2003211107A1 (en) Method for curing cyanoacrylate adhesives
CN105733420A (en) Nanometer attapulgite modified valve coating and preparation method thereof
CN105925101A (en) Solar photovoltaic cell panel assembly aluminum alloy frame protection coating layer
CN105728086A (en) Rice processing method
CN104588917A (en) Resin type welding flux capable of improving welding effect
CN105506637A (en) Metal polishing agent material composition and preparation method and application of metal polishing agent
CN105419663A (en) High-temperature-resistant pressure sensitive adhesive tape and preparation method thereof
CN105624683A (en) Polishing agent and preparation method thereof
CN105858743A (en) Preparation method of water treatment agent
CN112300869A (en) Electronic product cleaning agent and preparation method thereof
CN106233463A (en) Semiconductor chip adhesive film with through electrode
CN106271226B (en) A kind of flux coated brazingrod
CN106554734A (en) A kind of deodorant and smell removing container aqueous sealant and preparation method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20161026

RJ01 Rejection of invention patent application after publication