CN116475620A - Precision preformed soldering lug and preparation method thereof - Google Patents
Precision preformed soldering lug and preparation method thereof Download PDFInfo
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- CN116475620A CN116475620A CN202310351115.4A CN202310351115A CN116475620A CN 116475620 A CN116475620 A CN 116475620A CN 202310351115 A CN202310351115 A CN 202310351115A CN 116475620 A CN116475620 A CN 116475620A
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- soldering lug
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- preformed soldering
- welding
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- 238000005476 soldering Methods 0.000 title claims abstract description 95
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 51
- XMWRBQBLMFGWIX-UHFFFAOYSA-N C60 fullerene Chemical compound C12=C3C(C4=C56)=C7C8=C5C5=C9C%10=C6C6=C4C1=C1C4=C6C6=C%10C%10=C9C9=C%11C5=C8C5=C8C7=C3C3=C7C2=C1C1=C2C4=C6C4=C%10C6=C9C9=C%11C5=C5C8=C3C3=C7C1=C1C2=C4C6=C2C9=C5C3=C12 XMWRBQBLMFGWIX-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910003472 fullerene Inorganic materials 0.000 claims abstract description 24
- 230000004907 flux Effects 0.000 claims abstract description 23
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 18
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 229910052761 rare earth metal Inorganic materials 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000002156 mixing Methods 0.000 claims description 12
- 238000001035 drying Methods 0.000 claims description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 10
- 238000003723 Smelting Methods 0.000 claims description 7
- 239000003963 antioxidant agent Substances 0.000 claims description 7
- 230000003078 antioxidant effect Effects 0.000 claims description 7
- 239000004094 surface-active agent Substances 0.000 claims description 7
- 239000013008 thixotropic agent Substances 0.000 claims description 7
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000004512 die casting Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 239000000725 suspension Substances 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 229910052684 Cerium Inorganic materials 0.000 claims description 5
- 235000019270 ammonium chloride Nutrition 0.000 claims description 5
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 5
- VYLVYHXQOHJDJL-UHFFFAOYSA-K cerium trichloride Chemical compound Cl[Ce](Cl)Cl VYLVYHXQOHJDJL-UHFFFAOYSA-K 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 5
- YHBDIEWMOMLKOO-UHFFFAOYSA-I pentachloroniobium Chemical compound Cl[Nb](Cl)(Cl)(Cl)Cl YHBDIEWMOMLKOO-UHFFFAOYSA-I 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- 239000012190 activator Substances 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- -1 rare earth chloride Chemical class 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 4
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims description 3
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 230000003213 activating effect Effects 0.000 claims description 3
- 239000004359 castor oil Substances 0.000 claims description 3
- 235000019438 castor oil Nutrition 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 claims description 3
- 239000011259 mixed solution Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- AZJQQNWSSLCLJN-UHFFFAOYSA-N 2-ethoxyquinoline Chemical compound C1=CC=CC2=NC(OCC)=CC=C21 AZJQQNWSSLCLJN-UHFFFAOYSA-N 0.000 claims description 2
- 239000003093 cationic surfactant Substances 0.000 claims description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical group [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 2
- MJBLPLSQNGPUJA-UHFFFAOYSA-N ethoxyethane;1h-pyrrole Chemical compound CCOCC.C=1C=CNC=1 MJBLPLSQNGPUJA-UHFFFAOYSA-N 0.000 claims description 2
- WGWKNMLSVLOQJB-UHFFFAOYSA-N propan-2-ylazanium;bromide Chemical compound Br.CC(C)N WGWKNMLSVLOQJB-UHFFFAOYSA-N 0.000 claims description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- 238000009210 therapy by ultrasound Methods 0.000 claims description 2
- UKKLUBWWAGMMAG-UHFFFAOYSA-N tris(2-hydroxyethyl)azanium;bromide Chemical compound Br.OCCN(CCO)CCO UKKLUBWWAGMMAG-UHFFFAOYSA-N 0.000 claims description 2
- 238000001132 ultrasonic dispersion Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 abstract description 45
- 239000011800 void material Substances 0.000 abstract description 19
- 230000001976 improved effect Effects 0.000 abstract description 18
- 230000003647 oxidation Effects 0.000 abstract description 11
- 238000007254 oxidation reaction Methods 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 8
- 238000005265 energy consumption Methods 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000003912 environmental pollution Methods 0.000 abstract description 4
- 150000002910 rare earth metals Chemical class 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 4
- 230000008646 thermal stress Effects 0.000 abstract description 4
- 238000013021 overheating Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 229940051841 polyoxyethylene ether Drugs 0.000 description 4
- 229920000056 polyoxyethylene ether Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- NFAOATPOYUWEHM-UHFFFAOYSA-N 2-(6-methylheptyl)phenol Chemical compound CC(C)CCCCCC1=CC=CC=C1O NFAOATPOYUWEHM-UHFFFAOYSA-N 0.000 description 1
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
According to the precise preformed soldering lug and the preparation method thereof, the graphene layer is arranged between the preformed soldering lug and the soldering flux layer, so that the welding quality and efficiency can be improved, meanwhile, the energy consumption and the environmental pollution in the welding process can be reduced, the welding strength and corrosion resistance can be improved, meanwhile, the oxidation and the thermal stress in the welding process can be reduced, the generation of void ratio can be reduced, the precision is improved, the fullerene is added in the alloy raw material, the fullerene has extremely high chemical stability and strong mechanical property, strong bonding property can be formed between the fullerene and rare earth metal, the thermal conductivity is also high, the heat can be effectively dissipated, the void ratio can be remarkably reduced due to failure caused by overheating of a welding part, the welding precision is improved, the energy consumption can be reduced, the welding temperature required by the preformed soldering lug is reduced, the excellent oxidation resistance can be further provided, and the oxidation of the metal surface can be effectively prevented.
Description
Technical Field
The invention relates to the technical field of preformed soldering lugs, in particular to a precise preformed soldering lug and a preparation method thereof.
Background
In the field of electronic packaging, as the integration level of components is continuously improved, the density between devices is higher and the lead wire spacing is thinner (especially, the soldering of network connectors in 5G communication, the dense components and the irregular shape layout of the solder points, and the ultra-high transmission efficiency requirement) lead to the damage of heat-sensitive electronic components caused by the traditional soldering mode, so that the soldering is closer to the preformed soldering lug with higher selection precision.
The preformed soldering lug has a specific processing shape, is a common product in the current solder, has the characteristics of accurate welding positioning and accurate quantitative use, and is generally used in occasions with higher requirements on the shape and quality of the solder. The soldering lug is generally small in size (in mm) and light in weight (in mg), and has a very good effect on controlling the soldering size, particularly for specific plug-in soldering and module connection. The soldering lug ensures the quality and consistency of soldering by pre-calculating the metal content, and realizes high-precision soldering by precisely controlling the metal content of the solder in the electronic packaging process, but the preformed soldering lug has high void ratio, is difficult to eliminate and cannot realize higher-precision soldering, so that a high-precision preformed soldering lug capable of improving the precision of soldering, reducing the void ratio, stabilizing the solder and having high uniformity is needed to meet the high-precision requirements of the current market on the preformed soldering lug.
Disclosure of Invention
The invention provides a high-precision preformed soldering lug which can improve the welding precision, reduce the void ratio, stabilize the solder and have high uniformity, and aims to solve the technical problems that the void ratio is high, the elimination is difficult, and the welding with higher precision cannot be realized in the prior art.
A second object of the present invention is to provide a method of making a precision preform tab.
In order to achieve the first object, the present invention adopts the following technical scheme:
the precise preformed soldering lug comprises a preformed soldering lug, and a modified graphene layer and a soldering flux layer which are sequentially coated on the preformed soldering lug;
alloy raw materials of the preformed soldering lug comprise the following components in percentage by weight: 90.5 to 95.2 percent of tin, 1.0 to 2.8 percent of silver, 0.1 to 1.2 percent of copper, 0.1 to 0.2 percent of cerium, 0.5 to 1.4 percent of yttrium, 0.2 to 0.7 percent of gallium, 0.5 to 1.0 percent of antimony and 2.3 to 3.0 percent of fullerene;
the welding flux comprises 75-80wt% of rosin, 10-15wt% of activating agent, 2-3wt% of surfactant, 4-6wt% of thixotropic agent and 3-6wt% of antioxidant, wherein a graphene layer is arranged between a preformed welding plate and the soldering flux layer, so that the welding quality and efficiency can be improved, meanwhile, the energy consumption and environmental pollution in the welding process can be reduced, the welding strength and corrosion resistance can be improved, meanwhile, the oxidation and thermal stress in the welding process can be reduced, the generation of void ratio can be reduced, the precision can be improved, in addition, the electric conductivity and the thermal conductivity of welding can be improved, the welded material has better electric conductivity and thermal conductivity, the fullerene has extremely high chemical stability and strong mechanical property, can form very strong bonding property with rare earth metals, has very high heat dissipation performance, can effectively prevent the welding position from being overheated and leading to failure, can obviously reduce the void ratio, improve the welding precision, can also reduce the pre-forming temperature of the energy consumption and reduce the required welding plate, and has excellent oxidation resistance of the surface of the welded metal.
Preferably, the preparation method of the modified graphene layer comprises the following steps:
heating a mixed solution containing ammonium chloride and rare earth chloride in a water bath at 40-50 ℃, adding graphene oxide, carrying out ultrasonic treatment for 30-90min at a power of 200-325W, washing and vacuum drying to obtain modified graphene oxide, ultrasonically dispersing the obtained modified graphene oxide in deionized water to prepare graphene suspension, adding a cationic surfactant into the graphene suspension, uniformly stirring to obtain modified graphene treatment liquid, coating the modified graphene treatment liquid onto a preformed soldering lug, namely, adding rare earth element modified graphene, so that the compatibility of the modified graphene with the preformed soldering lug is higher, the flexibility and the elasticity are good, the stress is small when the temperature is subjected to severe change, the wetting spreading speed of the soldering flux on the surface of the preformed soldering lug and the spreading uniformity are improved, a uniformly-formed coating is formed after curing, the heating uniformity of the coating is improved, the residue of the soldering flux is reduced, the cavity rate is reduced, the uniform dispersion degree of the modified graphene treatment liquid on the surface layer is improved, the modified graphene treatment liquid is more preferably, the modified graphene treatment liquid is octyl phenol ether, the polyoxyethylene ether is a polyoxyethylene ether which has good dispersing effect, the good dispersing effect of the polyoxyethylene ether is not good enough to prevent the occurrence of the welding effect of the welding flux, and the problem is not good in the welding effect of the surface of the welding flux can be solved, and the agglomeration effect is solved;
preferably, the rare earth chloride is a mixture of cerium chloride, niobium chloride and palladium chloride, and three elements of cerium, niobium and palladium are adopted to form coordination bonds with oxygen-containing functional groups of the graphene oxide, so that the interface energy and the surface energy of the graphene oxide are reduced, the graphene oxide is functionally modified, the heating uniformity of a soldering flux coating is favorably improved, the residue of the soldering flux is reduced, and the void ratio is reduced.
Preferably, the ratio of the ammonium chloride, the cerium chloride, the niobium chloride and the palladium chloride is 2:2:3:1.
Preferably, the activator is any one of isopropylamine hydrobromide, triethanolamine hydrobromide and monoisopropanolamine, and more preferably, the activator is monoisopropanolamine.
Preferably, the thixotropic agent is a mixture of hydroquinone, dodecahydroxystearic acid and modified hydrogenated castor oil according to a mass ratio of 2:1:3, and the hydroquinone, the dodecahydroxystearic acid and the modified hydrogenated castor oil are matched with each other to prevent the soldering lug from collapsing and play a role in preventing the phenomena of tailing, adhesion, collapse and the like in brazing.
Preferably, the antioxidant is any one of ethoxyquinoline, 2-ethyl ether azole and methyl benzotriazole, and more preferably, the antioxidant is methyl benzotriazole.
Preferably, the surfactant is sodium dodecyl benzene sulfonate.
Preferably, the whole shape of the precision preformed soldering lug is square, round, arc-shaped, annular, frame-shaped or strip-shaped.
In order to achieve the second object, the present invention adopts the following technical scheme:
the method for preparing the precision preformed soldering lug according to any one of the above, comprising the following steps:
s1, weighing the alloy components according to the weight percentage, smelting and mixing, cooling to 800 ℃, adding fullerene, continuously heating to 1600 ℃, mixing for 3-5min, cooling, and die casting to form;
s2, preparing a modified graphene oxide treatment solution;
s3, uniformly coating the modified graphene oxide treatment liquid obtained in the step S2 on the surface of the preformed soldering lug substrate, and drying to obtain a pretreated preformed soldering lug;
s4, uniformly spraying the soldering flux on the surface of the pretreated preformed soldering lug obtained in the step S3, and drying to obtain the precise preformed soldering lug, wherein the soldering lug base material is prepared by smelting the alloy and then adding fullerene.
Compared with the prior art, the invention has the following advantages:
1. according to the precise preformed soldering lug, the graphene layer is arranged between the preformed soldering lug and the soldering flux layer, so that welding quality and efficiency can be improved, meanwhile, energy consumption and environmental pollution in a welding process can be reduced, welding strength and corrosion resistance can be improved, oxidation and thermal stress in the welding process can be reduced, so that void ratio is reduced, precision is improved, in addition, the graphene can improve welding conductivity and thermal conductivity, a welded material has better conductivity and thermal conductivity, fullerene has extremely high chemical stability and strong mechanical property through adding the fullerene into an alloy raw material, strong bonding property can be formed between the fullerene and rare earth metal, high heat conducting property can be achieved, heat dissipation can be effectively achieved, failure caused by overheating of a welding part can be remarkably reduced, welding precision is improved, welding temperature required by the preformed soldering lug can be reduced, excellent oxidation resistance can be achieved, and oxidation of a metal surface can be effectively prevented.
2. According to the preparation method of the precision preformed soldering lug, the alloy is smelted firstly, then the fullerene is added, the soldering lug base material is prepared, then the modified graphene layer and the scaling powder layer are coated, the operation method is simple, the prepared fullerene soldering lug has higher connection strength and oxidation resistance, the void ratio of a welding spot can be obviously reduced, and the service life and safety of a post-welding material can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below.
FIG. 1 is a cross-sectional structural view of a precision preform lug of the present application.
Detailed Description
The following describes the specific technical scheme of the present invention in connection with specific examples 1 to 3:
a precision preformed soldering lug comprises a preformed soldering lug 1, and a modified graphene layer 2 and a soldering flux layer 3 which are sequentially coated on the preformed soldering lug 1;
alloy raw materials of the preformed soldering lug 1 comprise the following components in percentage by weight: 90.5 to 95.2 percent of tin, 1.0 to 2.8 percent of silver, 0.1 to 1.2 percent of copper, 0.1 to 0.2 percent of cerium, 0.5 to 1.4 percent of yttrium, 0.2 to 0.7 percent of gallium, 0.5 to 1.0 percent of antimony and 2.3 to 3.0 percent of fullerene;
75-80wt% of rosin, 10-15wt% of activating agent, 2-3wt% of surfactant, 4-6wt% of thixotropic agent and 3-6wt% of antioxidant of the soldering flux layer 3.
(1) Preparation of modified graphene oxide
Heating a mixed solution containing ammonium chloride, cerium chloride, niobium chloride and palladium chloride in a volume ratio of 2:2:3:1 in a water bath at 40-50 ℃, adding graphene oxide, ultrasonically treating for 60min at a power of 200-325W, washing and vacuum drying to obtain modified graphene oxide, ultrasonically dispersing the obtained modified graphene oxide in deionized water to prepare graphene suspension, adding isooctylphenol polyoxyethylene ether into the graphene suspension, uniformly stirring to obtain modified graphene treatment liquid, and coating the modified graphene treatment liquid on a preformed soldering lug to obtain the modified graphene.
(2) Preparation of soldering flux
Adding 75wt% of rosin into a container, heating to 120-140 ℃, adding 2wt% of surfactant after dissolving, and stirring until the surfactant is completely dissolved; maintaining the temperature at 120-140 ℃, adding 5wt% of thixotropic agent, and stirring until the thixotropic agent is completely dissolved; cooling to 60-80deg.C, adding 3wt% of antioxidant and 15wt% of activator, and stirring for 40-60min to obtain liquid soldering flux.
Example 1:
s1, weighing the alloy components according to the weight percentage, smelting and mixing, cooling to 800 ℃, adding fullerene, continuously heating to 1600 ℃, mixing for 3min, cooling, and die casting to form;
s2, uniformly coating the modified graphene oxide treatment liquid obtained in the step 1 on the surface of the preformed soldering lug substrate, and drying to obtain a pretreated preformed soldering lug;
and S3, uniformly spraying the soldering flux obtained in the step 2 on the surface of the pretreated preformed soldering lug obtained in the step 2, and drying to obtain the precise preformed soldering lug.
Example 2:
s1, weighing the alloy components according to the weight percentage, smelting and mixing, cooling to 800 ℃, adding fullerene, continuously heating to 1600 ℃, mixing for 4min, cooling, and die casting to form;
s2, uniformly coating the modified graphene oxide treatment liquid obtained in the step 1 on the surface of the preformed soldering lug substrate, and drying to obtain a pretreated preformed soldering lug;
and S3, uniformly spraying the soldering flux obtained in the step 2 on the surface of the pretreated preformed soldering lug obtained in the step 2, and drying to obtain the precise preformed soldering lug.
Example 3:
s1, weighing the alloy components according to the weight percentage, smelting and mixing, cooling to 800 ℃, adding fullerene, continuously heating to 1600 ℃, mixing for 5min, cooling, and die casting to form;
s2, uniformly coating the modified graphene oxide treatment liquid obtained in the step 1 on the surface of the preformed soldering lug substrate, and drying to obtain a pretreated preformed soldering lug;
and S3, uniformly spraying the soldering flux obtained in the step 2 on the surface of the pretreated preformed soldering lug obtained in the step 2, and drying to obtain the precise preformed soldering lug.
Comparative example 1
The difference from example 1 is that no fullerene was added to the alloy solder, and the remaining preparation method and procedure remain the same as in example 1.
Comparative example 2
S1, weighing the alloy components according to the weight percentage, smelting and mixing, cooling to 800 ℃, adding fullerene, continuously heating to 1600 ℃, mixing for 5min, cooling, and die casting to form;
s2, uniformly spraying the soldering flux obtained in the step (2) on the surface of the preformed soldering lug obtained in the step S1, and drying to obtain the preformed soldering lug.
Table 1: examples 1-3 and comparative examples 1-2, the weight percentages of the components of the solder alloy powders
| Alloy composition | Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 |
| Tin (Sn) | 90.5 | 92.3 | 95.2 | 93.5 | 90.5 |
| Silver (Ag) | 2.1 | 2.8 | 1 | 2.1 | 2.1 |
| Copper (Cu) | 1.2 | 0.5 | 0.1 | 1.2 | 1.2 |
| Cerium (Ce) | 0.1 | 0.2 | 0.1 | 0.1 | 0.1 |
| Yttrium | 1.4 | 0.9 | 0.5 | 1.4 | 1.4 |
| Gallium | 0.7 | 0.3 | 0.2 | 0.7 | 0.7 |
| Antimony (Sb) | 1 | 0.5 | 0.6 | 1 | 1 |
| Fullerene (Fullerene) | 3 | 2.5 | 2.3 | - | 3 |
The preformed tabs obtained in examples 1-3 and comparative examples 1-2 were solder reflowed to the chip and tested for void fraction using X-ray probing, wherein void fraction= (S) 1 -S 2 )/S 1 S in the formula 1 Is the area of a chip solderable area S 2 The void fraction test results are shown in table 2 for the actual die bonding area:
table 2: results of the void fraction test of examples 1-3 and comparative examples 1-2
| Test item | Example 1 | Example 2 | Example 3 | Comparative example 1 | Comparative example 2 |
| Cavitation Rate (%) | 0.33 | 0.36 | 0.32 | 1.92 | 1.00 |
As can be seen from table 2, the comparative example 1 is free from fullerene, resulting in a great increase in void fraction, the comparative example 2 is free from coating the modified graphene layer, and the void fraction is also increased, so that the precision preformed soldering lug provided by the application can improve the quality and efficiency of welding, and can also reduce energy consumption and environmental pollution in the welding process, and can also improve the strength and corrosion resistance of welding, and can also reduce oxidation and thermal stress in the welding process, thereby reducing the generation of void fraction, improving the precision, and in addition, graphene can also improve the electrical conductivity and thermal conductivity of welding, so that the welded material has better electrical conductivity and thermal conductivity, and can also have very high chemical stability and strong mechanical property with rare earth metals by adding the fullerene in alloy raw materials, and can also have very high thermal conductivity, can also effectively dissipate heat, avoid the failure caused by overheating of the welding part, can also obviously reduce the void fraction, and can also improve the welding performance, can also reduce the welding strength, and can also reduce the temperature of welding, and can also reduce the required temperature of the welding material, and can also have the oxidation resistance, and thermal conductivity of welding material after the graphene is coated with high-grade, and the preparation of the alloy raw materials.
The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.
Claims (10)
1. Precision preformed soldering lug, its characterized in that: comprises a preformed soldering lug (1), a modified graphene layer (2) and a soldering flux layer (3) which are sequentially coated on the preformed soldering lug (1);
alloy raw materials of the preformed soldering lug (1) comprise the following components in percentage by weight: 90.5 to 95.2 percent of tin, 1.0 to 2.8 percent of silver, 0.1 to 1.2 percent of copper, 0.1 to 0.2 percent of cerium, 0.5 to 1.4 percent of yttrium, 0.2 to 0.7 percent of gallium, 0.5 to 1.0 percent of antimony and 2.3 to 3.0 percent of fullerene;
75-80wt% of rosin, 10-15wt% of activating agent, 2-3wt% of surfactant, 4-6wt% of thixotropic agent and 3-6wt% of antioxidant of the soldering flux layer (3).
2. The precision preform tab of claim 1, wherein: the preparation method of the modified graphene layer (2) comprises the following steps:
heating a mixed solution containing ammonium chloride and rare earth chloride in a water bath at 40-50 ℃, adding graphene oxide, performing ultrasonic treatment for 30-90min at a power of 200-325W, washing and vacuum drying to obtain modified graphene oxide, performing ultrasonic dispersion on the obtained modified graphene oxide in deionized water to prepare graphene suspension, adding a cationic surfactant into the graphene suspension, stirring uniformly to obtain modified graphene treatment liquid, and coating the modified graphene treatment liquid on a preformed soldering lug.
3. The precision preform tab of claim 2, wherein: the rare earth chloride is a mixture of cerium chloride, niobium chloride and palladium chloride.
4. A precision preform lug as claimed in claim 3, wherein: the volume ratio of the ammonium chloride to the cerium chloride to the niobium chloride to the palladium chloride is 2:2:3:1.
5. The precision preform tab of claim 1, wherein: the activator is any one of isopropylamine hydrobromide, triethanolamine hydrobromide and monoisopropanolamine.
6. The precision preform tab of claim 1, wherein: the thixotropic agent is a plurality of combinations of hydroquinone, dodecahydroxystearic acid and modified hydrogenated castor oil.
7. The precision preform tab of claim 1, wherein: the antioxidant is any one of ethoxyquinoline, 2-ethyl ether azole and methyl benzotriazole.
8. The precision preform tab of claim 1, wherein: the surfactant is sodium dodecyl benzene sulfonate.
9. The precision preform tab of claim 1, wherein: the whole shape of the precise preformed soldering lug is square, round, arc-shaped, annular, frame-shaped or strip-shaped.
10. A method of preparing a precision preform tab as claimed in any one of claims 1 to 9, comprising the steps of:
s1, weighing the alloy components according to the weight percentage, smelting and mixing, cooling to 800 ℃, adding fullerene, continuously heating to 1600 ℃, mixing for 3-5min, cooling, and die casting to form;
s2, preparing a modified graphene oxide treatment solution;
s3, uniformly coating the modified graphene oxide treatment liquid obtained in the step S2 on the surface of the preformed soldering lug substrate, and drying to obtain a pretreated preformed soldering lug;
and S4, uniformly spraying the soldering flux on the surface of the pretreated preformed soldering lug obtained in the step S3, and drying to obtain the precise preformed soldering lug.
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