CN106624461B - Composition, preparation method and application of composition in field of soldering flux - Google Patents
Composition, preparation method and application of composition in field of soldering flux Download PDFInfo
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- CN106624461B CN106624461B CN201610969271.7A CN201610969271A CN106624461B CN 106624461 B CN106624461 B CN 106624461B CN 201610969271 A CN201610969271 A CN 201610969271A CN 106624461 B CN106624461 B CN 106624461B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The invention belongs to the technical field of surface mounting of electronic circuits, and particularly relates to a composition, a preparation method and application thereof in the field of soldering flux. The invention provides a composition, which comprises the following raw materials: film formers, solvents, active agents, thixotropic agents, corrosion inhibitors and additives; the active agent comprises the following components by taking the total weight of the active agent as 100 percent: 30-35% of succinic acid, 12-15% of citric acid and 50-58% of adipic acid, wherein the pH value of the active agent is 6.0-6.8. The invention also provides a preparation method of the composition, and the application of the composition or a product obtained by the preparation method in the field of soldering flux. According to the technical scheme provided by the invention, the composition does not contain halogen elements, the content of the organic acid active agent is low, the corrosion effect on the circuit board is reduced after the welding is finished, and the service life of the circuit board is effectively prolonged. The detection proves that the composition provided by the invention can achieve good use effect when being used as the soldering flux.
Description
Technical field
The invention belongs to electronic circuit surface mounting technology field more particularly to a kind of composition, preparation method and its
The application in scaling powder field.
Background technique
Due to the demand of environmental protection, unleaded decree has been promulgated in countries in the world successively, and people are to the unleaded of electronic product
Change also has more strict requirements.Wherein, eutectic alloy Sn96.5Ag3Cu0.5As tin-lead substitute, in electronics industry
It is largely used as solder, however, Sn96.5Ag3Cu0.5In amount containing Ag it is high, Ag is noble metal, almost accounts for Sn96.5Ag3Cu0.5Alloy
1/2 in cost, the development of the lead-free and technology of electronic welding is constrained.
In newest research anxiety, since hypoeutectic solder silver content is low, there is good cost performance, as
Sn96.5Ag3Cu0.5Substitute and receive significant attention.However, hypoeutectic solder solid-liquid phase line section is larger (8~10 DEG C), alloy
Tissue is containing the nascent β Sn phase of dendroid and sheet Ag3Sn metallic compound causes solder wettability, mechanical property and solder joint can
It is poor by property, it is therefore desirable to which that suitable scaling powder is equipped with use, could improve the wettability and solderability of low silver solder.It is existing
In technology, scaling powder improves low silver solder wetability as active material by the organic acid added with high-content, due to doing
For the organic acid and/or halogen element too high levels of activating agent, leads to meeting open circuit potential plate after the completion of welding, shorten making for circuit board
Use the service life.
Therefore, a kind of composition, preparation method and its application in scaling powder field are developed, for solving the prior art
In, as the organic acid of activating agent and/or the technological deficiency of halogen element too high levels in scaling powder, cause meeting after the completion of welding rotten
Circuit board is lost, shortens the service life of circuit board, becomes those skilled in the art's urgent problem to be solved.
Summary of the invention
In view of this, the present invention provides a kind of composition, preparation method and its applications in scaling powder field, for solving
Certainly in the prior art, as the organic acid of activating agent and/or the technological deficiency of halogen element too high levels in scaling powder, welding is completed
The corrosiveness for circuit board is reduced afterwards, effectively extends the service life of circuit board.
The present invention provides a kind of composition, the raw material of the composition includes: film forming agent, solvent, activating agent, thixotroping
Agent, corrosion inhibiter and additive；
It is in terms of 100% by total surfactant weight, the activating agent includes: succinic acid 30~35%, citric acid 12~15%
With adipic acid 50~58%, the pH of the activating agent is 6.0~6.8.
Preferably, in terms of mass parts, the raw material of the composition includes: 30~45 parts of film forming agent, 45~55 parts of solvent, lives
2~6.5 parts of agent of property, 0.5~2 part of thixotropic agent, 1.5~2 parts of corrosion inhibiter and 2~4.5 parts of additive.
It preferably, is in terms of 100% by film forming agent total weight, the film forming agent includes: water-white rosin 20~40%, hydrogenation pine
Perfume 30~40% and scaling powder type rosin 30~40%.
It preferably, is in terms of 100% by solvent total weight, the solvent includes: tetrahydrofurfuryl alcohol 30%~45%, ethylene glycol
15%~35% and diethylene glycol (DEG) 35%~45%.
Preferably, the thixotropic agent is castor oil and/or rilanit special, and the corrosion inhibiter is benzotriazole.
It preferably, is in terms of 100% by additive gross mass, the additive includes: that triethanolamine is 40~60%, ethyl
Phenyl polyethylene glycol 20%~30% and nonylphenol polyoxyethylene ether are 20%~30%.
The present invention also provides a kind of preparation method including composition described in any of the above one, the preparation methods
Are as follows:
Step 1: solvent and film forming agent mixing, stir for the first time, obtain the first product；
Step 2: first product and activating agent mixing, second of stirring obtain the second product；
Step 3: second product and thixotropic agent mixing, third time stir, third product is obtained；
Step 4: the third product and corrosion inhibiter, additive mixing, after the 4th stirring, are successively cooled down and are ground,
Obtain product.
Preferably, the temperature of first time stirring is 65~80 DEG C, the time of the first time stirring is 30~
40min；The temperature of second of stirring is 65~80 DEG C, and the time of second of stirring is 20~30min；The third
The temperature of secondary stirring is 65~80 DEG C, and the time of the third time stirring is 5~10min.
Preferably, the 4th stirring is vacuum stirring；
The temperature of the vacuum stirring is 65~80 DEG C, and the time of the vacuum stirring is 4~6min.
The present invention also provides a kind of including system described in composition described in any of the above one or any of the above one
Application of the product that Preparation Method obtains in scaling powder field.
In conclusion the raw material of the composition includes: film forming agent, solvent, activity the present invention provides a kind of composition
Agent, thixotropic agent, corrosion inhibiter and additive；By total surfactant weight be 100% in terms of, the activating agent include: succinic acid 30~
35%, citric acid 12~15% and adipic acid 50~58%, the pH of the activating agent are 6.0~6.8.The present invention also provides one
The preparation method of kind above-mentioned composition, the product obtained the present invention also provides a kind of above-mentioned composition or above-mentioned preparation method exist
The application in scaling powder field.In technical solution provided by the invention, composition is halogen-free element, and organic acid activator contains
Amount is few, and the corrosiveness for circuit board is reduced after the completion of welding, effectively extends the service life of circuit board.It can through detection
, when composition provided by the invention is as flux application, it can reach good using effect.
Specific embodiment
The present invention provides a kind of composition, preparation method and its applications in scaling powder field, for solving existing skill
In art, the technological deficiency of the organic acid of activating agent and/or halogen element too high levels in scaling powder is reduced after the completion of welding for electricity
The corrosiveness of road plate effectively extends the service life of circuit board.
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
In order to which the present invention is described in more detail, below with reference to embodiment to a kind of composition provided by the invention, preparation method
And its application in scaling powder field, it is specifically described.
Embodiment 1
Weigh water-white rosin 6g (20%), hydrogenated rosin 12g (40%) and scaling powder type rosin 12g (40%) mixing, system
Obtain film forming agent 1.Weigh tetrahydrofurfuryl alcohol 24.75g (45%), ethylene glycol 8.25g (15%) and diethylene glycol (DEG) 22g (40%) mixing, system
Obtain solvent 1.Solvent 1 and film forming agent 1 mix, and stir 30min under 65 DEG C of condition of water bath heating with the revolving speed of 100rpm, obtain the first production
Object 1.
Activating agent includes: to weigh succinic acid 1.95g (30%), citric acid 0.78g (12%) and adipic acid 3.77g (58%)
Activating agent 1 is made in mixing；In the present embodiment, the pH of activating agent 1 is 6.3.The first product of 85g 1 and 6.5g activating agent 1 mix, and 65
30min is stirred with the revolving speed of 100rpm under DEG C condition of water bath heating, obtains the second product 1.
The second product of 91.5g 1 and 2g thixotropic agent 1 mix, and are stirred under 65 DEG C of condition of water bath heating with the revolving speed of 100rpm
20min obtains third product 1.In the present embodiment, thixotropic agent 1 is rilanit special.
Weigh triethanolamine 1.8g (40%), Nonidet P40 1.35g (30%) and nonylphenol polyoxyethylene ether
1.35g (30%) mixing, is made additive 1.93.5g third product 1 and 2g corrosion inhibiter 1,4.5g additive 1 mix, and vacuumize
Afterwards, 4min is stirred with the revolving speed of 100rpm under 65 DEG C of condition of water bath heating, successively through cooling and grinding, obtains product 1.This implementation
In example, corrosion inhibiter is benzotriazole.
Embodiment 2
It is mixed to weigh water-white rosin 18g (40%), hydrogenated rosin 13.5g (30%) and scaling powder type rosin 13.5g (30%)
It closes, film forming agent 2 is made.It weighs tetrahydrofurfuryl alcohol 15.75g (35%), ethylene glycol 9g (20%) and diethylene glycol (DEG) 20.25g (45%) is mixed
It closes, solvent 2 is made.Solvent 2 and film forming agent 2 mix, and stir 40min under 70 DEG C of condition of water bath heating with the revolving speed of 100rpm, obtain
First product 2.
Activating agent includes: to weigh succinic acid 0.7g (35%), citric acid 0.3g (15%) and adipic acid 1g (50%) mixing,
Activating agent 2 is made；In the present embodiment, the pH of activating agent 2 is 6.0.The first product of 90g 2 and 2g activating agent 2 mix, 70 DEG C of water-baths
20min is stirred with the revolving speed of 100rpm under heating condition, obtains the second product 2.
The second product of 92g 2 and 2g thixotropic agent 2 mix, and are stirred under 70 DEG C of condition of water bath heating with the revolving speed of 100rpm
15min obtains third product 2.In the present embodiment, thixotropic agent 2 is rilanit special.
Weigh triethanolamine 1.2g (60%), Nonidet P40 0.4g (20%) and nonylphenol polyoxyethylene ether
0.4g (20%) mixing, is made additive 2.94g third product 2 and 1.5g corrosion inhibiter 2,2g additive 2 mix, after vacuumizing,
8min is stirred with the revolving speed of 100rpm under 70 DEG C of condition of water bath heating, successively through cooling and grinding, obtains product 2.The present embodiment
In, corrosion inhibiter is benzotriazole.
Embodiment 3
Weigh water-white rosin 12g (30%), hydrogenated rosin 16g (40%) and scaling powder type rosin 12g (30%) mixing, system
Obtain film forming agent 3.Tetrahydrofurfuryl alcohol 15g (30%), ethylene glycol 17.5g (35%) and diethylene glycol (DEG) 17.5g (35%) mixing are weighed, is made
Solvent 3.Solvent 3 and film forming agent 3 mix, and stir 35min under 80 DEG C of condition of water bath heating with the revolving speed of 100rpm, obtain the first product
3。
Activating agent includes: to weigh succinic acid 1.44g (32%), citric acid 0.585g (13%) and adipic acid 2.475g
(55%) it mixes, activating agent 3 is made；In the present embodiment, the pH of activating agent 3 is 6.8.The first product of 90g 3 and 4.5g activating agent 3
It mixes, 23min is stirred with the revolving speed of 100rpm under 80 DEG C of condition of water bath heating, obtains the second product 3.
The second product of 94.5g 3 and 1.5g thixotropic agent 3 mix, and are stirred under 80 DEG C of condition of water bath heating with the revolving speed of 100rpm
10min obtains third product 3.In the present embodiment, thixotropic agent 3 is castor oil.
Weigh triethanolamine 1.5g (50%), Nonidet P40 0.75g (25%) and nonylphenol polyoxyethylene ether
0.75g (25%) mixing, is made additive 3.96g third product 3 and 2g corrosion inhibiter 3,3g additive 3 mix, after vacuumizing,
5min is stirred with the revolving speed of 100rpm under 80 DEG C of condition of water bath heating, successively through cooling and grinding, obtains product 3.In the present embodiment,
Corrosion inhibiter is benzotriazole.
Embodiment 4
The present embodiment is to prepare low-silver leadless electronic tin with SAC0307 welding powder using 1~product of product 3 as scaling powder
The specific embodiment of cream.
In the present embodiment, in used SAC0307 welding powder, Ag content is 0.3%, Cu content 0.7%, surplus Sn.
5g product 1 (10%) and 45gSAC0307 welding powder (90%) mix, and in vacuum mixer, stirring exhaust is made low
Silver leadless electronic tin cream 1.Speed of agitator is 60rpm, mixing time 15min.
5g product 2 (10%) and 45gSAC0307 welding powder (90%) mix, and in vacuum mixer, stirring exhaust is made low
Silver leadless electronic tin cream 2.Speed of agitator is 60rpm, mixing time 15min.
5g product 3 (10%) and 45gSAC0307 welding powder (90%) mix, and in vacuum mixer, stirring exhaust is made low
Silver leadless electronic tin cream 3.Speed of agitator is 60rpm, mixing time 15min.
Low-silver leadless electronic 1~low-silver leadless electronic of tin cream tin cream 3 is printed on copper base and carries out reflow soldering, process
It is generated without splashing, solder joint is full, and surface-brightening is mellow and full, sprawls well, and compound layer thickness is 3 μm or so between weld metal, weldering
Good metallurgical bonding is formd between tin and copper sheet.
Embodiment 5
The present embodiment is that all well known professional standard of personnel is counted according to this field, measures 1~product of product 3 and low silver
The performance of leadless electronic 1~low-silver leadless electronic of tin cream tin cream 3.
5.1 appearances and physical stability detection
1~product of 50g product 3 is weighed respectively, is placed in three different test tubes, after test tube covers, is placed in 5 ± 2 DEG C
It is refrigerated 3 months in refrigerator, whether 1~product of product 3 in continuous observation test tube occurs obviously being layered or what crystallization was precipitated shows
As occurring.
Weigh 1~product of 50g product 3 respectively, be placed in three different test tubes, be placed in 45 ± 2 DEG C without air circulation
Baking oven in 60min, the phenomenon that whether 1~product of product 3 in continuous observation test tube occurs obviously being layered or crystallization is precipitated
Occur.
1~product of product 3 is in yellowish clear viscous liquids in refrigeration and baking oven, and physical stability is good.
The measurement of 5.2 pH values
1~product of product 3 is dipped with glass bar respectively, with the pH of precision test paper measurement 1~product of product 3.
The measurement of 5.3 non-volatile contents
50g product 1 is put into crucible, alcolhol burner heating crucible is complete to solvent volatilization.It then, will be remaining in crucible
Substance is put into dry 4h in the ventilated drying oven of (110 ± 2) DEG C, then takes out, is cooled to room temperature, weighs, repeatedly dry and weigh,
When weighing error is maintained within ± 0.05g, final mass M is weighed2.According to formula: non-volatile content=(M1?
M2)/M1× 100%, measure the non-volatile content of product 1.Wherein, M1For initial weight, M2For final weight.
Similarly, the non-volatile content of product 2 and product 3 is measured in aforementioned manners, and details are not described herein.
The measurement of 5.4 halide contents
The silver nitrate solution of 10mL is added in test tube, then 2 drop products 1 are added into test tube, keeps 30min, observation examination
Whether muddiness is occurred in pipe and/or by Precipitation.
Similarly, the halide content of product 2 and product 3 is measured in aforementioned manners, and details are not described herein.
5.5 determination of corrosion
Step 1: selecting the copper sheet of the T2 trade mark of 2040 standard of GB/T, specification is 100mm × 100mm × 0.5mm, at it
Center position extrude diameter be 40mm groove, depth of groove 1-2mm., then with 600 mesh sand paper polishing surface oxide layer, with nothing
Water-ethanol wiped clean.
Step 2: dripping the product 1 of upper 2g in copper sheet groove, and the copper sheet that drop has product 1 is placed in 80 DEG C of drying box 2
Hour, take out cooling.
Step 3: putting into salt-mist corrosion tester 240 hours, etching condition are as follows: temperature 60 C, relative humidity 93%,
Corrosive liquid is the Na of the NaCl and 0.1mol/L of 0.1mol/L2SO4Mixed liquor.Whether observation 1 boundary of product there is bluish-green color spot
Point or white dot；If occurring, illustrate that product 1 is corroded on copper sheet；If there is not corrosion pit, show to produce
The corrosivity very little or no corrosivity of product 1.
Similarly, the corrosivity content of product 2 and product 3 is measured in aforementioned manners, and details are not described herein.
The measurement of 5.6 spreading ratios
Step 1: using the anaerobic copper sheet (TU1) for meeting GB5231 as substrate, specification is 25mm × 25mm × 0.2mm；With
Acetone cleans 15min in supersonic wave cleaning machine, and water is put into drying in drying box after impregnating 30min after rinsing in alcohol.
Step 2: choosing 0.2gSAC0307 welding powder, the mass ratio of welding powder and product 1 is 9:1, and product 1 is covered and complete
It is coated on welding powder surface, is put into 250 DEG C of reflow soldering and heats 4 minutes.
The calculating of spreading ratio:
Wherein, S-spreading ratio %；H-sprawls the height (mm) of rear welding powder；When D-will test welding powder used and regard sphere as
Diameter (mm), D=1.24V1/3；The mass/density of welding powder sample used in V-test.
Similarly, the spreading ratio of product 2 and product 3 is measured in aforementioned manners, and details are not described herein.
5.7 collapsing performance measurements
According to professional standard, low-silver leadless electronic is printed with 0.2mm thickness wire mark template printing pad (0.6mm × 2.03mm)
The low-silver leadless electronic tin cream figure produced, is placed in that temperature is 25 ± 5 DEG C and relative humidity is 50% ± 10% by tin cream
Environment in stop 10~20min after, check whether bridging；Then under conditions of sample being placed in 150 ± 10 DEG C, placement 10~
15min after being cooled to room temperature, checks whether there is bridging.
In collapsing performance test, bridging does not occur for low-silver leadless electronic tin cream 1~3.The knot that embodiment 5 measures
Fruit please refers to table 1.
Table 1: properties of product
From above-mentioned technical proposal, it can be concluded that, technical solution provided by the invention is had the advantage that
(1) scaling powder described in is halogen-free element, and organic acid activator content is few, corrosion of the postwelding to circuit board
It is weak, it is conducive to extend the service life of circuit board.
(2) poor for low silver solder solderability, the bad feature of wettability, the scaling powder and low silver soldering powder are according to one
The defects of tin cream that fixed ratio is mixed to form, modest viscosity, printing effect is good, and collapse resistance can be good, and postwelding is without bridging tin sweat(ing),
The full light of solder joint, spreading property is good, and intensity is high.
(3) manufacture craft of the electronics tin cream described in is simple, and Costco Wholesale is low, and it is lower to prepare required temperature, can reduce
The volatilization of organic matter in production process, improves the working environment of workshop.
In conclusion the raw material of the composition includes: film forming agent, solvent, activity the present invention provides a kind of composition
Agent, thixotropic agent, corrosion inhibiter and additive；By total surfactant weight be 100% in terms of, the activating agent include: succinic acid 30~
35%, citric acid 12~15% and adipic acid 50~58%, the pH of the activating agent are 6.0~6.8.The present invention also provides one
The preparation method of kind above-mentioned composition, the product obtained the present invention also provides a kind of above-mentioned composition or above-mentioned preparation method exist
The application in scaling powder field.In technical solution provided by the invention, composition is halogen-free element, and organic acid activator contains
Amount is few, and the corrosiveness for circuit board is reduced after the completion of welding, effectively extends the service life of circuit board.It can through detection
, when composition provided by the invention is as flux application, it can reach good using effect.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of composition, which is characterized in that the raw material of the composition includes: film forming agent, solvent, activating agent, thixotropic agent, delays
Lose agent and additive；
By total surfactant weight be 100% in terms of, the activating agent include: succinic acid 30~35%, citric acid 12~15% and oneself
Diacid 50~58%, the pH of the activating agent are 6.0~6.8.
2. composition according to claim 1, which is characterized in that in terms of mass parts, the raw material of the composition includes: into
30~45 parts of film, 45~55 parts of solvent, 2~6.5 parts of activating agent, 0.5~2 part of thixotropic agent, 1.5~2 parts of corrosion inhibiter and addition
2~4.5 parts of agent.
3. composition according to claim 1, which is characterized in that by film forming agent total weight be 100% in terms of, the film forming agent
It include: water-white rosin 20~40%, hydrogenated rosin 30~40% and scaling powder type rosin 30~40%.
4. composition according to claim 1, which is characterized in that by solvent total weight be 100% in terms of, the solvent packet
It includes: tetrahydrofurfuryl alcohol 30%~45%, ethylene glycol 15%~35% and diethylene glycol (DEG) 35%~45%.
5. composition according to claim 1, which is characterized in that the thixotropic agent be castor oil and/or rilanit special,
The corrosion inhibiter is benzotriazole.
6. composition according to claim 1, which is characterized in that by additive gross mass be 100% in terms of, the additive
Include: triethanolamine be 40~60%, Nonidet P40 20%~30% and nonylphenol polyoxyethylene ether be 20%~
30%.
7. a kind of preparation method including composition described in claim 1 to 6 any one, which is characterized in that the preparation
Method are as follows:
Step 1: solvent and film forming agent mixing, stir for the first time, obtain the first product；
Step 2: first product and activating agent mixing, second of stirring obtain the second product；
Step 3: second product and thixotropic agent mixing, third time stir, third product is obtained；
Step 4: the third product and corrosion inhibiter, additive mixing, after the 4th stirring, successively through cooling and grinding, must produce
Product.
8. preparation method according to claim 7, which is characterized in that the temperature of the first time stirring is 65~80 DEG C,
The time of the first time stirring is 30~40min；The temperature of second of stirring is 65~80 DEG C, second of stirring
Time be 20~30min；The temperature of third time stirring is 65~80 DEG C, the time of the third time stirring is 10~
20min。
9. preparation method according to claim 7, which is characterized in that the 4th stirring is vacuum stirring；
The temperature of the vacuum stirring is 65~80 DEG C, and the time of the vacuum stirring is 4~8min.
10. a kind of including system described in composition described in claim 1 to 6 any one or claim 7 to 9 any one
Application of the product that Preparation Method obtains in scaling powder field.
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| CN201610969271.7A CN106624461B (en) | 2016-10-28 | 2016-10-28 | Composition, preparation method and application of composition in field of soldering flux |
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| US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
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|---|---|---|---|---|
| SU891289A1 (en) * | 1980-04-10 | 1981-12-23 | Предприятие П/Я А-1624 | Flux for low-temperature soldering |
| US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
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Effective date of registration: 20220427 Address after: 518000 first floor, building 12, Bantian Jinpeng Industrial Zone, Jihua Road, Bantian, Longgang District, Shenzhen, Guangdong Patentee after: SHENZHEN JUFENG SOLDER CO.,LTD. Address before: 510062 courtyard 729, Dongfeng East Road, Yuexiu District, Guangzhou, Guangdong Patentee before: GUANGDONG University OF TECHNOLOGY |