CN106624461A - Composition, preparation method and application of composition in field of soldering flux - Google Patents
Composition, preparation method and application of composition in field of soldering flux Download PDFInfo
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- CN106624461A CN106624461A CN201610969271.7A CN201610969271A CN106624461A CN 106624461 A CN106624461 A CN 106624461A CN 201610969271 A CN201610969271 A CN 201610969271A CN 106624461 A CN106624461 A CN 106624461A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
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- Engineering & Computer Science (AREA)
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- Preventing Corrosion Or Incrustation Of Metals (AREA)
Abstract
The invention belongs to the technical field of surface mounting of electronic circuits, and particularly relates to a composition, a preparation method and application thereof in the field of soldering flux. The invention provides a composition, which comprises the following raw materials: film formers, solvents, active agents, thixotropic agents, corrosion inhibitors and additives; the active agent comprises the following components by taking the total weight of the active agent as 100 percent: 30-35% of succinic acid, 12-15% of citric acid and 50-58% of adipic acid, wherein the pH value of the active agent is 6.0-6.8. The invention also provides a preparation method of the composition, and the application of the composition or a product obtained by the preparation method in the field of soldering flux. According to the technical scheme provided by the invention, the composition does not contain halogen elements, the content of the organic acid active agent is low, the corrosion effect on the circuit board is reduced after the welding is finished, and the service life of the circuit board is effectively prolonged. The detection proves that the composition provided by the invention can achieve good use effect when being used as the soldering flux.
Description
Technical field
The invention belongs to electronic circuit surface mounting technology field, more particularly to a kind of composition, preparation method and its
The application in scaling powder field.
Background technology
Due to the demand of environmental protection, unleaded decree has been promulgated successively in countries in the world, and people are to the unleaded of electronic product
Change also has more strict requirements.Wherein, eutectic alloy Sn96.5Ag3Cu0.5As tin-lead substitute, in electronics industry
Use in a large number as solder, however, Sn96.5Ag3Cu0.5In the amount containing Ag it is high, Ag is noble metal, almost accounts for Sn96.5Ag3Cu0.5Alloy
1/2 in cost, the lead-free of electronic welding and the development of technology are constrained.
In newest research anxiety, due to hypoeutectic solder silver content it is low, with good cost performance, as
Sn96.5Ag3Cu0.5Substitute and receive significant attention.However, hypoeutectic solder solid-liquid phase line interval larger (8～10 DEG C), alloy
Tissue is containing the nascent β Sn phases of dendroid and sheet Ag3Sn metallic compounds, cause solder wettability, mechanical property and the solder joint can
It is poor by property, it is therefore desirable to which that suitable scaling powder is equipped with and uses, and could improve the wettability and solderability of low silver solder.It is existing
In technology, scaling powder improves low silver solder wetability by being added with the organic acid of high-load as active material, due to doing
Organic acid and/or halogen element too high levels for activating agent, causes meeting open circuit potential plate after the completion of welding, shortens making for circuit board
Use the life-span.
Therefore, a kind of composition, preparation method and its application in scaling powder field are developed, for solving prior art
In, as the organic acid and/or the technological deficiency of halogen element too high levels of activating agent in scaling powder, causing can be rotten after the completion of welding
Erosion circuit board, shortens the service life of circuit board, becomes those skilled in the art's problem demanding prompt solution.
The content of the invention
In view of this, the invention provides a kind of composition, preparation method and its application in scaling powder field, for solving
Certainly in prior art, as the organic acid and/or the technological deficiency of halogen element too high levels of activating agent in scaling powder, welding is completed
The corrosiveness for circuit board is reduced afterwards, effectively extends the service life of circuit board.
The invention provides a kind of composition, the raw material of the composition includes：Film forming agent, solvent, activating agent, thixotroping
Agent, corrosion inhibiter and additive；
Counted with total surfactant weight as 100%, the activating agent includes：Succinic acid 30～35%, citric acid 12～15%
With adipic acid 50～58%, the pH of the activating agent is 6.0～6.8.
Preferably, in terms of mass parts, the raw material of the composition includes：30～45 parts of film forming agent, 45～55 parts of solvent, work
Property 2～4.5 parts of 2～6.5 parts of agent, 0.5～2 part of thixotropic agent, 1.5～2 parts of corrosion inhibiter and additive.
Preferably, counted with film forming agent gross weight as 100%, the film forming agent includes：Water-white rosin 20～40%, hydrogenation pine
Perfume 30～40% and scaling powder type rosin 30～40%.
Preferably, counted with solvent gross weight as 100%, the solvent includes：Tetrahydrofurfuryl alcohol 30%～45%, ethylene glycol
15%～35% and diethylene glycol (DEG) 35%～45%.
Preferably, the thixotropic agent is castor oil and/or rilanit special, and the corrosion inhibiter is BTA.
Preferably, counted with additive gross mass as 100%, the additive includes：Triethanolamine is 40～60%, ethyl
Phenyl polyethylene glycol 20%～30% and NPE are 20%～30%.
Present invention also offers a kind of preparation method of the composition including described in any of the above one, the preparation method
For：
The mixing of step one, solvent and film forming agent, stirs for the first time, obtains the first product；
Step 2, first product and activating agent mixing, second stirring, obtains the second product；
Step 3, second product and thixotropic agent mixing, third time is stirred, and obtains third product；
Step 4, the third product and corrosion inhibiter, additive mixing, after the 4th stirring, Jing coolings and grinding successively,
Obtain product.
Preferably, the temperature of first time stirring is 65～80 DEG C, time of the first time stirring is 30～
40min；The temperature of second stirring is 65～80 DEG C, and the time of second stirring is 20～30min；Described 3rd
The temperature of secondary stirring is 65～80 DEG C, and the time of the third time stirring is 5～10min.
Preferably, the 4th stirring is vacuum stirring；
The temperature of the vacuum stirring is 65～80 DEG C, and the time of the vacuum stirring is 4～6min.
Present invention also offers the system described in a kind of composition including described in any of the above one or more any one
Application of the product that Preparation Method is obtained in scaling powder field.
In sum, the invention provides a kind of composition, the raw material of the composition includes：Film forming agent, solvent, activity
Agent, thixotropic agent, corrosion inhibiter and additive；Counted with total surfactant weight as 100%, the activating agent includes：Succinic acid 30～
35%th, citric acid 12～15% and adipic acid 50～58%, the pH of the activating agent is 6.0～6.8.Present invention also offers one
The preparation method of above-mentioned composition is planted, present invention also offers the product that a kind of above-mentioned composition or above-mentioned preparation method are obtained exists
The application in scaling powder field.In the technical scheme that the present invention is provided, composition without halogens, and organic acid activator contains
Amount is few, and the corrosiveness for circuit board is reduced after the completion of welding, effectively extends the service life of circuit board.After testing may be used
, when the composition that the present invention is provided is as flux application, can reach good using effect.
Specific embodiment
The invention provides a kind of composition, preparation method and its application in scaling powder field, for solving existing skill
In art, the technological deficiency of the organic acid of activating agent and/or halogen element too high levels, reduces for electricity after the completion of welding in scaling powder
The corrosiveness of road plate, effectively extends the service life of circuit board.
The technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described enforcement
Example is only a part of embodiment of the invention, rather than the embodiment of whole.Based on the embodiment in the present invention, this area is common
The every other embodiment that technical staff is obtained under the premise of creative work is not made, belongs to the model of present invention protection
Enclose.
In order to the present invention is described in more detail, with reference to a kind of composition, preparation method that embodiment is provided the present invention
And its in the application in scaling powder field, be specifically described.
Embodiment 1
Weigh the mixing of water-white rosin 6g (20%), hydrogenated rosin 12g (40%) and scaling powder type rosin 12g (40%), system
Obtain film forming agent 1.Weigh tetrahydrofurfuryl alcohol 24.75g (45%), ethylene glycol 8.25g (15%) and diethylene glycol (DEG) 22g (40%) mixing, system
Obtain solvent 1.Solvent 1 and film forming agent 1 mix, and 30min is stirred with the rotating speed of 100rpm under 65 DEG C of condition of water bath heating, obtain the first product
Thing 1.
Activating agent includes：Weigh succinic acid 1.95g (30%), citric acid 0.78g (12%) and adipic acid 3.77g (58%)
Mixing, is obtained activating agent 1；In the present embodiment, the pH of activating agent 1 is 6.3.The first products of 85g 1 and 6.5g activating agents 1 mix, and 65
30min is stirred with the rotating speed of 100rpm under DEG C condition of water bath heating, the second product 1 is obtained.
The second products of 91.5g 1 and 2g thixotropic agent 1 mix, and are stirred with the rotating speed of 100rpm under 65 DEG C of condition of water bath heating
20min, obtains third product 1.In the present embodiment, thixotropic agent 1 is rilanit special.
Weigh triethanolamine 1.8g (40%), Nonidet P40 1.35g (30%) and NPE
1.35g (30%) mixes, and additive 1 is obtained.93.5g third products 1 and 2g corrosion inhibiter 1,4.5g additives 1 mix, and vacuumize
Afterwards, 4min is stirred with the rotating speed of 100rpm under 65 DEG C of condition of water bath heating, successively Jing coolings and grinding, obtain product 1.This enforcement
In example, corrosion inhibiter is BTA.
Embodiment 2
Weigh water-white rosin 18g (40%), hydrogenated rosin 13.5g (30%) and scaling powder type rosin 13.5g (30%) to mix
Close, film forming agent 2 is obtained.Weigh tetrahydrofurfuryl alcohol 15.75g (35%), ethylene glycol 9g (20%) and diethylene glycol (DEG) 20.25g (45%) to mix
Close, solvent 2 is obtained.Solvent 2 and film forming agent 2 mix, and 40min is stirred with the rotating speed of 100rpm under 70 DEG C of condition of water bath heating, obtain
First product 2.
Activating agent includes：Succinic acid 0.7g (35%), citric acid 0.3g (15%) and adipic acid 1g (50%) mixing are weighed,
Prepared activating agent 2；In the present embodiment, the pH of activating agent 2 is 6.0.The first products of 90g 2 and 2g activating agents 2 mix, 70 DEG C of water-baths
20min is stirred with the rotating speed of 100rpm under heating condition, the second product 2 is obtained.
The second products of 92g 2 and 2g thixotropic agent 2 mix, and are stirred with the rotating speed of 100rpm under 70 DEG C of condition of water bath heating
15min, obtains third product 2.In the present embodiment, thixotropic agent 2 is rilanit special.
Weigh triethanolamine 1.2g (60%), Nonidet P40 0.4g (20%) and NPE
0.4g (20%) mixes, and additive 2 is obtained.94g third products 2 and 1.5g corrosion inhibiter 2,2g additives 2 mix, after vacuumizing,
8min is stirred with the rotating speed of 100rpm under 70 DEG C of condition of water bath heating, successively Jing coolings and grinding, obtain product 2.The present embodiment
In, corrosion inhibiter is BTA.
Embodiment 3
Weigh the mixing of water-white rosin 12g (30%), hydrogenated rosin 16g (40%) and scaling powder type rosin 12g (30%), system
Obtain film forming agent 3.Tetrahydrofurfuryl alcohol 15g (30%), ethylene glycol 17.5g (35%) and diethylene glycol (DEG) 17.5g (35%) mixing are weighed, is obtained
Solvent 3.Solvent 3 and film forming agent 3 mix, and 35min is stirred with the rotating speed of 100rpm under 80 DEG C of condition of water bath heating, obtain the first product
3。
Activating agent includes：Weigh succinic acid 1.44g (32%), citric acid 0.585g (13%) and adipic acid 2.475g
(55%) mix, activating agent 3 is obtained；In the present embodiment, the pH of activating agent 3 is 6.8.The first products of 90g 3 and 4.5g activating agents 3
Mixing, 23min is stirred under 80 DEG C of condition of water bath heating with the rotating speed of 100rpm, obtains the second product 3.
The second products of 94.5g 3 and 1.5g thixotropic agent 3 mix, and are stirred with the rotating speed of 100rpm under 80 DEG C of condition of water bath heating
10min, obtains third product 3.In the present embodiment, thixotropic agent 3 is castor oil.
Weigh triethanolamine 1.5g (50%), Nonidet P40 0.75g (25%) and NPE
0.75g (25%) mixes, and additive 3 is obtained.96g third products 3 and 2g corrosion inhibiter 3,3g additives 3 mix, after vacuumizing,
5min is stirred with the rotating speed of 100rpm under 80 DEG C of condition of water bath heating, successively Jing coolings and grinding, obtain product 3.In the present embodiment,
Corrosion inhibiter is BTA.
Embodiment 4
The present embodiment is, by the use of 1～product of product 3 as scaling powder, with SAC0307 welding powders low-silver leadless electronic tin to be prepared
The specific embodiment of cream.
In the present embodiment, in the SAC0307 welding powders for being used, Ag contents be 0.3%, Cu contents 0.7%, balance of Sn.
5g products 1 (10%) and 45gSAC0307 welding powders (90%) mix, and in vacuum mixer, stirring exhaust is obtained low
Silver leadless electronic tin cream 1.Speed of agitator is 60rpm, mixing time 15min.
5g products 2 (10%) and 45gSAC0307 welding powders (90%) mix, and in vacuum mixer, stirring exhaust is obtained low
Silver leadless electronic tin cream 2.Speed of agitator is 60rpm, mixing time 15min.
5g products 3 (10%) and 45gSAC0307 welding powders (90%) mix, and in vacuum mixer, stirring exhaust is obtained low
Silver leadless electronic tin cream 3.Speed of agitator is 60rpm, mixing time 15min.
Low-silver leadless electronic 1～low-silver leadless electronic of tin cream tin cream 3 is printed on on copper base reflow soldering, the process of carrying out
Produce without splashing, solder joint is full, and surface-brightening is mellow and full, sprawl well, compound layer thickness is 3 μm or so between weld metal, weldering
Good metallurgical binding is defined between tin and copper coin.
Embodiment 5
The present embodiment is to count all well known professional standard of personnel according to this area, determines 1～product of product 3 and low silver
The performance of leadless electronic 1～low-silver leadless electronic of tin cream tin cream 3.
5.1 outward appearances and physical stability are detected
1～product of 50g products 3 is weighed respectively, in being placed in three different test tubes, after test tube is added a cover, is placed in 5 ± 2 DEG C
Refrigerate 3 months in refrigerator, whether 1～the product of product 3 in continuous observation test tube substantially layering occurs or crystallize showing for precipitation
As occurring.
Weigh 1～product of 50g products 3 respectively, in being placed in three different test tubes, be placed in 45 ± 2 DEG C without air circulation
Baking oven in 60min, whether 1～the product of product 3 in continuous observation test tube there is substantially layering or crystallize the phenomenon for separating out
Occur.
1～product of product 3 is in slightly yellow clear viscous liquids in refrigeration and baking oven, and physical stability is good.
5.2 acid-base values are determined
Respectively 1～product of product 3 is dipped with glass bar, with precision test paper the pH of 1～product of product 3 is determined.
5.3 non-volatile contents are determined
50g products 1 are put into crucible, alcolhol burner heating crucible is complete to solvent volatilization.Then, will be remaining in crucible
Material is put into the ventilated drying oven of (110 ± 2) DEG C and is dried 4h, then takes out, and is cooled to room temperature, weighs, and is dried repeatedly and weighs,
When weighing error is maintained within ± 0.05g, final mass M is weighed2.According to formula：Non-volatile content=(M1-
M2)/M1× 100%, determine the non-volatile content of product 1.Wherein, M1For initial weight, M2For final weight.
In the same manner, the non-volatile content of product 2 and product 3 is determined in aforementioned manners, be will not be described here.
5.4 halide contents are determined
The silver nitrate solution of 10mL is added in test tube, then adds 2 to drip product 1 in test tube, keep 30min, observation examination
Whether muddiness is occurred in pipe and/or by Precipitation.
In the same manner, the halide content of product 2 and product 3 is determined in aforementioned manners, be will not be described here.
5.5 determination of corrosion
Step one, from the standards of GB/T 2040 the T2 trades mark copper sheet, specification be 100mm × 100mm × 0.5mm, at it
Center position extrudes a diameter of 40mm grooves, and depth of groove is 1-2mm., then with 600 mesh sand papering surface oxide layers, with nothing
Water-ethanol wiped clean.
Step 2, in copper sheet groove drop 2g product 1, and the copper sheet that drop has product 1 is placed in into 80 DEG C of drying box 2
Hour, take out cooling.
Step 3, put into 240 hours in salt-mist corrosion tester, etching condition is：Temperature 60 C, relative humidity 93%,
Corrosive liquid is the Na of the NaCl and 0.1mol/L of 0.1mol/L2SO4Mixed liquor.Whether the observation boundary of product 1 there is bluish-green color spot
Point or white dot；If occurring, illustrate that product 1 there occurs corrosion on copper coin；If there is not corrosion pit, show to produce
The corrosivity very little of product 1 or no corrosivity.
In the same manner, the corrosivity content of product 2 and product 3 is determined in aforementioned manners, be will not be described here.
5.6 spreading ratios are determined
Step one, use meet the anaerobic copper sheet (TU1) of GB5231 as substrate, and specification is 25mm × 25mm × 0.2mm；With
Acetone cleans 15min in supersonic wave cleaning machine, and water soaks to be put into after 30min in drying box in alcohol and is dried after rinsing.
Step 2, selection 0.2gSAC0307 welding powders, welding powder is 9 with the mass ratio of product 1:1, product 1 is covered and complete
Welding powder surface is coated on, is put into 250 DEG C of reflow soldering and is heated 4 minutes.
The calculating of spreading ratio：
Wherein, S-spreading ratio %；The height (mm) of the rear welding powder of H-sprawl；D-will test welding powder used when regarding spheroid as
Diameter (mm), D=1.24V1/3；The mass/density of welding powder sample used by V-test.
In the same manner, the spreading ratio of product 2 and product 3 is determined in aforementioned manners, be will not be described here.
5.7 cave in performance measurement
According to professional standard, print pad (0.6mm × 2.03mm) with 0.2mm thickness wire mark templates and print low-silver leadless electronic
Tin cream, it is 50% ± 10% with relative humidity that the low-silver leadless electronic tin cream figure for producing is positioned over into temperature for 25 ± 5 DEG C
Environment in stop 10～20min after, check whether bridging；Then sample is placed under conditions of 150 ± 10 DEG C, placement 10～
15min, after being cooled to room temperature, checks whether there is bridging.
Cave in performance test, low-silver leadless electronic tin cream 1～3 does not occur bridging.Embodiment 5 determines the knot for obtaining
Really, table 1 is referred to.
Table 1：Properties of product
Can draw from above-mentioned technical proposal, the technical scheme that the present invention is provided, with advantages below：
(1) scaling powder described in does not contain halogens, and organic acid activator content is few, corrosion of the postwelding to circuit board
It is weak, be conducive to extending the service life of circuit board.
(2) poor for low silver solder solderability, the characteristics of wettability is bad, the scaling powder is with low silver soldering powder according to one
The tin cream that fixed ratio is mixed to form, modest viscosity, printing effect is good, collapse resistance can it is good, postwelding without defects such as bridging tin sweat(ing)s,
The full light of solder joint, spreading property is good, and intensity is high.
(3) manufacture craft of the electronics tin cream described in is simple, and Costco Wholesale is low, and the temperature needed for preparing is relatively low, can reduce
The volatilization of organic matter in production process, improves the working environment of workshop.
In sum, the invention provides a kind of composition, the raw material of the composition includes：Film forming agent, solvent, activity
Agent, thixotropic agent, corrosion inhibiter and additive；Counted with total surfactant weight as 100%, the activating agent includes：Succinic acid 30～
35%th, citric acid 12～15% and adipic acid 50～58%, the pH of the activating agent is 6.0～6.8.Present invention also offers one
The preparation method of above-mentioned composition is planted, present invention also offers the product that a kind of above-mentioned composition or above-mentioned preparation method are obtained exists
The application in scaling powder field.In the technical scheme that the present invention is provided, composition without halogens, and organic acid activator contains
Amount is few, and the corrosiveness for circuit board is reduced after the completion of welding, effectively extends the service life of circuit board.After testing may be used
, when the composition that the present invention is provided is as flux application, can reach good using effect.
The above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (10)
1. a kind of composition, it is characterised in that the raw material of the composition includes：It is film forming agent, solvent, activating agent, thixotropic agent, slow
Erosion agent and additive；
Counted with total surfactant weight as 100%, the activating agent includes：Succinic acid 30～35%, citric acid 12～15% and oneself
Diacid 50～58%, the pH of the activating agent is 6.0～6.8.
2. composition according to claim 1, it is characterised in that in terms of mass parts, the raw material of the composition includes：Into
30～45 parts of film, 45～55 parts of solvent, 2～6.5 parts of activating agent, 0.5～2 part of thixotropic agent, 1.5～2 parts of corrosion inhibiter and addition
2～4.5 parts of agent.
3. composition according to claim 1, it is characterised in that counted with film forming agent gross weight as 100%, the film forming agent
Including：Water-white rosin 20～40%, hydrogenated rosin 30～40% and scaling powder type rosin 30～40%.
4. composition according to claim 1, it is characterised in that counted with solvent gross weight as 100%, the solvent bag
Include：Tetrahydrofurfuryl alcohol 30%～45%, ethylene glycol 15%～35% and diethylene glycol (DEG) 35%～45%.
5. composition according to claim 1, it is characterised in that the thixotropic agent is castor oil and/or rilanit special,
The corrosion inhibiter is BTA.
6. composition according to claim 1, it is characterised in that counted with additive gross mass as 100%, the additive
Including：Triethanolamine be 40～60%, Nonidet P40 20%～30% and NPE be 20%～
30%.
7. a kind of preparation method of the composition including described in claim 1 to 6 any one, it is characterised in that the preparation
Method is：
The mixing of step one, solvent and film forming agent, stirs for the first time, obtains the first product；
Step 2, first product and activating agent mixing, second stirring, obtains the second product；
Step 3, second product and thixotropic agent mixing, third time is stirred, and obtains third product；
Step 4, the third product and corrosion inhibiter, additive mixing, after the 4th stirring, successively Jing coolings and grinding, must produce
Product.
8. preparation method according to claim 7, it is characterised in that the temperature of the first time stirring is 65～80 DEG C,
The time of the first time stirring is 30～40min；The temperature of second stirring is 65～80 DEG C, second stirring
Time be 20～30min；The temperature of third time stirring is 65～80 DEG C, time of the third time stirring is 10～
20min。
9. preparation method according to claim 7, it is characterised in that the 4th stirring is vacuum stirring；
The temperature of the vacuum stirring is 65～80 DEG C, and the time of the vacuum stirring is 4～8min.
10. the system described in a kind of composition or claim 7 to 9 any one including described in claim 1 to 6 any one
Application of the product that Preparation Method is obtained in scaling powder field.
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| CN201610969271.7A CN106624461B (en) | 2016-10-28 | 2016-10-28 | Composition, preparation method and application of composition in field of soldering flux |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109570814A (en) * | 2019-01-14 | 2019-04-05 | 哈尔滨理工大学 | A kind of composite solder paste adding micro-nano granules |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU891289A1 (en) * | 1980-04-10 | 1981-12-23 | Предприятие П/Я А-1624 | Flux for low-temperature soldering |
| US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
-
2016
- 2016-10-28 CN CN201610969271.7A patent/CN106624461B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU891289A1 (en) * | 1980-04-10 | 1981-12-23 | Предприятие П/Я А-1624 | Flux for low-temperature soldering |
| US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
| CN101564805A (en) * | 2009-05-27 | 2009-10-28 | 北京工业大学 | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN104400257A (en) * | 2014-10-29 | 2015-03-11 | 重庆理工大学 | Scaling powder for no-clean lead-free low-silver welding paste |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109570814A (en) * | 2019-01-14 | 2019-04-05 | 哈尔滨理工大学 | A kind of composite solder paste adding micro-nano granules |
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