JPS5641397A - Copper-group material excellent in resistance to corrosion - Google Patents
Copper-group material excellent in resistance to corrosionInfo
- Publication number
- JPS5641397A JPS5641397A JP11609979A JP11609979A JPS5641397A JP S5641397 A JPS5641397 A JP S5641397A JP 11609979 A JP11609979 A JP 11609979A JP 11609979 A JP11609979 A JP 11609979A JP S5641397 A JPS5641397 A JP S5641397A
- Authority
- JP
- Japan
- Prior art keywords
- plated layer
- copper
- group material
- tin
- alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title abstract 5
- 238000005260 corrosion Methods 0.000 title abstract 3
- 230000007797 corrosion Effects 0.000 title abstract 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 3
- 229910045601 alloy Inorganic materials 0.000 abstract 3
- 239000000956 alloy Substances 0.000 abstract 3
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 2
- 229910052793 cadmium Inorganic materials 0.000 abstract 2
- 238000009713 electroplating Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Coating With Molten Metal (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11609979A JPS5641397A (en) | 1979-09-12 | 1979-09-12 | Copper-group material excellent in resistance to corrosion |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11609979A JPS5641397A (en) | 1979-09-12 | 1979-09-12 | Copper-group material excellent in resistance to corrosion |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5641397A true JPS5641397A (en) | 1981-04-18 |
Family
ID=14678670
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11609979A Pending JPS5641397A (en) | 1979-09-12 | 1979-09-12 | Copper-group material excellent in resistance to corrosion |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5641397A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116787A (en) * | 1983-11-30 | 1985-06-24 | Mitsubishi Heavy Ind Ltd | Method and device for plating |
JPS60169589A (en) * | 1984-02-13 | 1985-09-03 | Furukawa Electric Co Ltd:The | Copper alloy material containing phosphorus coated with tin or tin alloy |
JPS6342393A (en) * | 1986-08-06 | 1988-02-23 | Kobe Steel Ltd | Method for tin or tin alloy plating copper or copper alloy wire |
JPH01259194A (en) * | 1988-04-11 | 1989-10-16 | Hitachi Metals Ltd | Corrosion resistant piping parts |
JPH02301546A (en) * | 1989-05-15 | 1990-12-13 | Furukawa Electric Co Ltd:The | Sn or sn alloy coating material |
US5759379A (en) * | 1996-04-26 | 1998-06-02 | International Business Machines Corporation | Solder method |
US6584040B1 (en) | 1997-04-25 | 2003-06-24 | Seiko Instruments Inc. | Electronic timepiece |
JP2006322014A (en) * | 2005-05-17 | 2006-11-30 | Univ Waseda | Plating liquid, plating film, and method for producing the same |
WO2009008526A1 (en) * | 2007-07-06 | 2009-01-15 | Ddk Ltd. | Process for producing electronic component, and electronic component produced by the process |
EP3705606A4 (en) * | 2017-10-30 | 2021-10-13 | Mitsubishi Materials Corporation | Anticorrosive terminal material, anticorrosive terminal, and electric wire end structure |
-
1979
- 1979-09-12 JP JP11609979A patent/JPS5641397A/en active Pending
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60116787A (en) * | 1983-11-30 | 1985-06-24 | Mitsubishi Heavy Ind Ltd | Method and device for plating |
JPS60169589A (en) * | 1984-02-13 | 1985-09-03 | Furukawa Electric Co Ltd:The | Copper alloy material containing phosphorus coated with tin or tin alloy |
JPS6342393A (en) * | 1986-08-06 | 1988-02-23 | Kobe Steel Ltd | Method for tin or tin alloy plating copper or copper alloy wire |
JPH01259194A (en) * | 1988-04-11 | 1989-10-16 | Hitachi Metals Ltd | Corrosion resistant piping parts |
JPH02301546A (en) * | 1989-05-15 | 1990-12-13 | Furukawa Electric Co Ltd:The | Sn or sn alloy coating material |
US5759379A (en) * | 1996-04-26 | 1998-06-02 | International Business Machines Corporation | Solder method |
US6584040B1 (en) | 1997-04-25 | 2003-06-24 | Seiko Instruments Inc. | Electronic timepiece |
JP2006322014A (en) * | 2005-05-17 | 2006-11-30 | Univ Waseda | Plating liquid, plating film, and method for producing the same |
JP4712439B2 (en) * | 2005-05-17 | 2011-06-29 | 学校法人早稲田大学 | Plating solution, plating film and manufacturing method thereof |
WO2009008526A1 (en) * | 2007-07-06 | 2009-01-15 | Ddk Ltd. | Process for producing electronic component, and electronic component produced by the process |
US8092263B2 (en) | 2007-07-06 | 2012-01-10 | Ddk Ltd. | Process for producing connector and connector produced by the same process |
JP5215305B2 (en) * | 2007-07-06 | 2013-06-19 | 第一電子工業株式会社 | Electronic component manufacturing method and electronic component manufactured by the method |
EP3705606A4 (en) * | 2017-10-30 | 2021-10-13 | Mitsubishi Materials Corporation | Anticorrosive terminal material, anticorrosive terminal, and electric wire end structure |
US11661667B2 (en) | 2017-10-30 | 2023-05-30 | Mitsubishi Materials Corporation | Anti-corrosion terminal material, anti-corrosion terminal and electric wire end structure |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5641397A (en) | Copper-group material excellent in resistance to corrosion | |
JPS56127741A (en) | Abrasion resistant copper alloy | |
JPS5767153A (en) | Production of zinc alloy hot dipped steel plate of high resistance to exfoliation of plating with time | |
ES427731A1 (en) | Method of electroplating tubing prior to terne alloy coating | |
JPS5635790A (en) | Surface treated steel sheet | |
JPS56133488A (en) | Plated steel material | |
KR900001885A (en) | Za-Ni alloy plated steel sheet with excellent impact resistance and manufacturing method | |
JPS5728881A (en) | Method of manufacturing sliding surface | |
JPS5481777A (en) | Lead frame structure with intermediate layer | |
JPS54155915A (en) | Copper-coating aluminum alloy conductor | |
JPS6447894A (en) | Double-ply plated steel sheet for soldering | |
JPS56166389A (en) | Zn type alloy coated steel plate of superior corrossion resistant phosphating property having two-layer coating layers | |
JPS5633463A (en) | Hot dipping method | |
JPS574184A (en) | Metallic thin strip for installing semiconductor light-emitting element | |
JPS5550484A (en) | Electric zinc alloy plated steel sheet and production thereof | |
JPS5760097A (en) | Heat resistant silver coated conductor | |
JPS5767195A (en) | Surface treated steel plate with high corrision resistance | |
JPS56105447A (en) | Zinc alloy for hot dipping | |
JPS5747891A (en) | Gold-palladium alloy plating bath | |
JPS5472676A (en) | Lead frame having alloy intermediate layer | |
JPS5550488A (en) | Corrosion-resistant plating method | |
JPS5759369A (en) | Conductor coated heat resisting silver | |
JPS56105446A (en) | Zinc alloy for hot dipping | |
JPS5752590A (en) | Au alloy brazing filler metal of low melting point | |
JPS5367618A (en) | Copper alloy with excellent bending property, stress corrosion crackingresistance and workability |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060130 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20060130 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080415 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081014 |
|
A521 | Written amendment |
Effective date: 20090114 Free format text: JAPANESE INTERMEDIATE CODE: A523 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090310 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Effective date: 20090408 Free format text: JAPANESE INTERMEDIATE CODE: A61 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120417 Year of fee payment: 3 |
|
R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 3 Free format text: PAYMENT UNTIL: 20120417 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130417 Year of fee payment: 4 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 4 Free format text: PAYMENT UNTIL: 20130417 |
|
FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 5 Free format text: PAYMENT UNTIL: 20140417 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |