JPS57127596A - Metallic solder - Google Patents

Metallic solder

Info

Publication number
JPS57127596A
JPS57127596A JP20651881A JP20651881A JPS57127596A JP S57127596 A JPS57127596 A JP S57127596A JP 20651881 A JP20651881 A JP 20651881A JP 20651881 A JP20651881 A JP 20651881A JP S57127596 A JPS57127596 A JP S57127596A
Authority
JP
Japan
Prior art keywords
solder
metallic
oxidation
metallic solder
total
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20651881A
Other languages
Japanese (ja)
Other versions
JPS5812117B2 (en
Inventor
Ichikazu Kasai
Tsuyoshi Kitabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP20651881A priority Critical patent/JPS5812117B2/en
Publication of JPS57127596A publication Critical patent/JPS57127596A/en
Publication of JPS5812117B2 publication Critical patent/JPS5812117B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3033—Ni as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To prevent the discoloration of a metallic solder owing to oxidation during soldering and to facilitate soldering by forming a metal or alloy film of oxidation resistance higher than that of the metallic solder specified of component composition on the surface of said solder to prescribed thicknesses. CONSTITUTION:A metallic solder consisting, by weight, of 3-18% Cr, 2-25% Cu, 20-40% Sn, and, if necessary, 0.2-10% in total of >=1 kind selected from Mo, Fo, Ti, Co, and likewise, 0.1-10% in total of >=1 kind selected from Si, Ce, P, In, B, Zn and the balance >=30% Ni, and impurities is produced. A metallic or alloy plating film of oxidation resistance higher than that of the metallic solder is formed to >=20mu on the surface of said solder. Thereby, the oxidation of the solder is prevented during soldering with heating.
JP20651881A 1981-12-21 1981-12-21 metal wax Expired JPS5812117B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20651881A JPS5812117B2 (en) 1981-12-21 1981-12-21 metal wax

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20651881A JPS5812117B2 (en) 1981-12-21 1981-12-21 metal wax

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP3596677A Division JPS53120658A (en) 1977-03-30 1977-03-30 Improved brazing filler metal

Publications (2)

Publication Number Publication Date
JPS57127596A true JPS57127596A (en) 1982-08-07
JPS5812117B2 JPS5812117B2 (en) 1983-03-07

Family

ID=16524687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20651881A Expired JPS5812117B2 (en) 1981-12-21 1981-12-21 metal wax

Country Status (1)

Country Link
JP (1) JPS5812117B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6367683B1 (en) * 1997-07-10 2002-04-09 Materials Resources International Solder braze alloy
US7022282B2 (en) 2000-08-07 2006-04-04 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
US7806994B2 (en) 2004-05-04 2010-10-05 S-Bond Technologies, Llc Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
WO2015079845A1 (en) * 2013-11-29 2015-06-04 株式会社村田製作所 Method for generating intermetallic compound, and method for connecting articles to be connected by using intermetallic compound

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6367683B1 (en) * 1997-07-10 2002-04-09 Materials Resources International Solder braze alloy
US7022282B2 (en) 2000-08-07 2006-04-04 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
US7422721B2 (en) 2000-08-07 2008-09-09 Murata Manufacturing Co., Ltd Lead-free solder and soldered article
US7488445B2 (en) 2000-08-07 2009-02-10 Murata Manufacturing Co., Ltd. Lead-free solder and soldered article
US7806994B2 (en) 2004-05-04 2010-10-05 S-Bond Technologies, Llc Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
WO2015079845A1 (en) * 2013-11-29 2015-06-04 株式会社村田製作所 Method for generating intermetallic compound, and method for connecting articles to be connected by using intermetallic compound

Also Published As

Publication number Publication date
JPS5812117B2 (en) 1983-03-07

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