JPS5812117B2 - metal wax - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the improvement of a metal solder for joining metals, and provides a metal solder that has excellent corrosion resistance, exhibits a white color, and has excellent oxidation resistance and improves the wettability of base materials. It is something.

Among the so-called welding methods for joining similar or dissimilar metals, brazing does not cause any change to the base metal and is easy to operate.

It is also widely used due to its wide range of applications.

Brazing is a technology that involves melting and adding solder to join base materials through the wetting phenomenon of solid and liquid.

The brazing material melts due to heating and fills the gap between the abutting surfaces due to capillary action.

Therefore, the properties of the base material, the properties of the brazing filler metal, the shape of the joint surface, the melting heating conditions, etc. are factors that influence the quality of brazing.

Brazing work is carried out ■ in a vacuum, ■ in a reducing atmosphere such as hydrogen or ammonia decomposition gas, ■ in an inert gas such as argon or nitrogen, ■ in an oxidizing atmosphere such as air, especially in the cases of ■ and ■. Since there is little surface oxidation in the process, wetting of the welding material and the brazing material is good, and a strong bond can be easily obtained.

In addition, flux or the like is often used to prevent oxidation of the joints.

However, heating the brazing filler metal to its melting point in a completely non-oxidized state is difficult in mass production, even if it is
This heating method is also difficult.

In particular, in brazing materials containing copper, chromium, etc., these oxides deteriorate the flowability and bendability of the wax during melting and flow, and even after melting, they tend to remain as residue on the surface in a discolored state.

The object of the present invention is to improve the above-mentioned drawbacks, to obtain excellent soldering strength even with a brazing material having poor oxidation resistance, and to enable soldering that completely flows into the gap without leaving any oxidized residue. It was developed.

That is, the present invention forms an oxidation-resistant film on the surface of the soldering material in advance to prevent the oxidation of the soldering material during heating, thereby improving and improving the wettability with the soldering material to be covered, resulting in a solder with excellent strength. The purpose is to obtain bonding.

The present invention has developed an alloy with the following composition (1) as a metal solder suitable for joining stainless steel and corrosion-resistant alloys, and has previously filed a patent application.

The present invention is particularly effective in metal solders containing Cu, Cr, Fe, Mo, etc.

(1) Cr3-18%, Cu2-25%, 5n20-4
0%, if necessary, select one or more from Mo, Fe, Ti, and Co for a total of 02 to 10%, similarly Si
, Ge, P, In, B, and Zn for a total of 0.1 to 10% (however, one type of each of P and B is 5%
% or less) A metal solder consisting of Ni with the balance being 30% or more and unavoidable impurities.

In the present invention, it is necessary that the oxidation resistance is superior to that of the metal solder in the severe range below the soldering heat, and that it is easily compatible with the metal solder or the covering solder material when melted, and is not alloyed with them. It is necessary not to significantly lower the melting point or cause brittleness.

In order to protect the surface oxidation of the brazing filler metal during heating and to prevent it from remaining as an insoluble substance when the brazing filler metal melts, it is desirable that the film be as thin as possible, but if it is approximately 20μ or less, the above conditions can be satisfied. Confirmed by experiment.

The material of the oxidation-resistant film is Ni or Ni alloy, Sn
Or Sn-based alloy, Au or An alloy is suitable;
Although Ag or Ag alloys are also monooxidized, they are easily decomposed by the melt diameter and are therefore suitable for the purpose of the present invention.

Next, the film can be formed by electroplating, electroless plating, vapor deposition, dipping, or any other method.

Powder, wire rod, plate material, etc. are all effective forms of metal solder, and even if the powder is processed into a sheet shape with plastic resin, if a film is created when it is powdered, plastic will not be used for hot soldering entertainment. It exerts the effect of preventing oxidation until the melting temperature of the brazing filler metal is reached after evaporation.

Next, an example will be described.

Example (1) A metal solder consisting of 6% Cr, 18% Cu, 34% 5N, and 42% Ni was melted and made into 100 mesh powder.

This metal solder was used as a soldering material as it was, (B) electroless Ni plating coated with approximately 1μ coating, and covered with 304 stainless steel as a soldering material in ammonia decomposition gas (dew point -20°C).
Brazing was performed in a furnace at 150°C for 15 minutes.

As a result, in (3), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.

In addition, the strong dust of the brazed joints of both samples is (A)
(B) 52 kg/mm'.

Example (2) 7% Cr, 22% Cu, 28% 5n, 35% Ni, Co
A metal solder consisting of 8% was melted and made into 80 mesh powder.

This metal solder was heated at 1160°C in ammonia decomposition gas (dew point -20°C) using (3) as it is, (B) electroless Ni plating with 3μ coating, and 304 funeless steel as a soldering material. Brazing was carried out in a furnace for 10 minutes.

As a result, in (A) a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B) a completely stainless steel-colored joint surface was obtained.

In addition, the strong dust of the brazed joints of both samples is (A)
54 kg/mm', (B) 60 kg/mm'
Met.

Example (3) Cr8%, Cu15%, 5n25%, Ni50%, P2
% was melted into a powder of 50 mesh.

This metal solder was used as a soldering material (A) as it is, (B) electroless Ni plating coated with approximately 8μ, and covered with 304 stainless steel, and ammonia decomposition gas (dew point -20°C) was applied.
Brazing was carried out in a furnace at 1150° C. for 10 minutes.

As a result, in (5), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.

In addition, the strong dust of the brazed joints of both samples is (A)
(B) 55 kg/mm'.

Example (4) Cr 15%, Cu 20%, Sn 25%, Ni30
%, 8% Fe, and 2% Ti.
It was made into a powder of 0 mesh.

This metal solder was used as a soldering material (5) as it is, (B) electroless Ni plating coated with approximately 05μ coating, and covered with 304 stainless steel, using ammonia decomposition gas (dew point -20°C).
) Brazing was carried out in a furnace at 1150°C for 10 minutes.

As a result, in (3), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.

In addition, the strong dust of the brazed joints of both samples is (A)
(B) 62 kg/mm'.

Example (5) Cr10%, Cu 14%, 5n23.5%, Ni45
%, Si2%, Ge2%, In2%, 8015%, Zn
A metal solder consisting of 1% was melted and made into 100 mesh powder.

This metal solder was used as a soldering material (A) as it is, (B) coated with electroless Ni plating of about 1μ, and covered with 304 stainless steel, and ammonia decomposition gas (dew point -20°C) was applied.
Brazing was performed in a furnace at 1150°C for 10 minutes.

As a result, in (A) a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B) a completely stainless steel-colored joint surface was obtained.

In addition, the strong dust of the brazed joints of both samples is (A)
40 kg/mm', (B) 44 kg/mm'
Met.

Example (6) Cr 11%, Cu 10%, 5n 30%, Ni 40%
, 5% Fe, 3% Mo, and 21% were welded into powder of 40 meshes.

This metal solder was used as a soldering material (a) as it is, (B) electroless Ni plating coated with approximately 12 μm coating, and covered with 304 stainless steel and ammonia decomposition gas (dew point -20°C).
) Brazing was carried out in a furnace at 1150° C. for 10 minutes.

As a result, a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.

Also, the brazed joint strength of both samples is (A)
50 kg/mm', (B) 54 kg/mm'.

Example (7) Cr10%, Cu2O%, Sn 25%, Ni31%,
A metal solder consisting of 5% Si, 8% Co, and 1% Zn was melted and made into 100 mesh powder.

This metal solder was used as a soldering material (a) as is, (B) electroless Ni plating coated with approx.
) Brazing was carried out in a furnace at 1150° C. for 10 minutes.

As a result, in case 8), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in case 8), a completely stainless steel-colored joint surface was obtained.

Also, the brazed joint strength of both samples is (A)
47 kg/mm', (B) 50 kg/mm'.

Example (8) Corrosion resistance tests were carried out on the brazing fillers coated with oxidation-resistant coatings of Examples) to (7) by immersing them in 15% saline and artificial sweat for 120 hours (3).
5°C), but no rusting was observed.

As explained above, the present invention prevents the discoloration of the wax liquid and the decrease in soldering strength due to oxidation of the metal solder in an insufficient non-oxidizing atmosphere during the soldering work, and facilitates the soldering work. In particular, it facilitates work management such as vacuum soldering and reducing atmosphere soldering in the mass production process.

In addition, regarding the characteristics of the metal solder itself, there is a great advantage in that even if the oxidation resistance is somewhat inferior, it is possible to select a composition that focuses on the soldering strength, corrosion resistance, color tone, etc., and in this sense, new metal solders can be created. This also applies to this.

Claims (1)

[Claims] 1Cr3 to 18% (weight percent, same hereinafter) Cu2
~25%, 5n20~40%, Mo, Fe, if necessary
Select one or more types from Ti and Co and total 0.2
~10%, as well as Si, Ge, P, In. Select one or more types from B, Zn and total 0.1 to 10
% (however, each type of P and B is 5% or less), the remainder is 3
A metal solder characterized by forming a metal or alloy plating film with a thickness of 20 μm or less with superior oxidation resistance on the surface of a metal solder body containing 0% or more Ni and unavoidable impurities.