JPS5812117B2 - metal wax - Google Patents
metal waxInfo
- Publication number
- JPS5812117B2 JPS5812117B2 JP20651881A JP20651881A JPS5812117B2 JP S5812117 B2 JPS5812117 B2 JP S5812117B2 JP 20651881 A JP20651881 A JP 20651881A JP 20651881 A JP20651881 A JP 20651881A JP S5812117 B2 JPS5812117 B2 JP S5812117B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- metal
- metal solder
- soldering
- stainless steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
- Chemically Coating (AREA)
Description
【発明の詳細な説明】
本願発明は金属を接合するための金属ろうの改良に係わ
り、耐蝕性に秀れ白色を呈し、且つ耐酸化性に優れ母材
のぬれ性を向上せしめる金属ろうをもたらすものである
。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the improvement of a metal solder for joining metals, and provides a metal solder that has excellent corrosion resistance, exhibits a white color, and has excellent oxidation resistance and improves the wettability of base materials. It is something.
同種金属や異種金属を接合するいわゆる溶接の中でもろ
う接方式は母材に変化を与えない、操作が容易である。Among the so-called welding methods for joining similar or dissimilar metals, brazing does not cause any change to the base metal and is easy to operate.
また応用範囲が広いことなどから非常に広く用いられて
いる。It is also widely used due to its wide range of applications.
ろう接はろうを溶融添加して固体と液体のぬれ現象によ
って母材を接合する技術である。Brazing is a technology that involves melting and adding solder to join base materials through the wetting phenomenon of solid and liquid.
加熱によりろう材は溶融し突き合さった接合面のすき間
に毛管現象により充填される。The brazing material melts due to heating and fills the gap between the abutting surfaces due to capillary action.
従って母材の性質、ろう材の性質、接合面形状、溶融加
熱条件などがろう接の良否を左右する因子となる。Therefore, the properties of the base material, the properties of the brazing filler metal, the shape of the joint surface, the melting heating conditions, etc. are factors that influence the quality of brazing.
ろう接作業は■真空中、■水素或いはアンモニア分解ガ
スなどの還元性雰囲気中、■アルゴン、窒素などの不活
性気体中、■大気などの酸化性雰囲気中で行われ、特に
■、■の場合において表面酸化が少ないので被接合材と
ろう材とのぬれも良く強固な接合が得られ易い。Brazing work is carried out ■ in a vacuum, ■ in a reducing atmosphere such as hydrogen or ammonia decomposition gas, ■ in an inert gas such as argon or nitrogen, ■ in an oxidizing atmosphere such as air, especially in the cases of ■ and ■. Since there is little surface oxidation in the process, wetting of the welding material and the brazing material is good, and a strong bond can be easily obtained.
またフラックス等を用いて接合部の酸化を防止する場合
も多い。In addition, flux or the like is often used to prevent oxidation of the joints.
しかしながらろう材を完全に無酸化の状態で溶融点まで
加熱することは、量産方式においてはたとえ前記■、■
の加熱方式においてもむずかしい。However, heating the brazing filler metal to its melting point in a completely non-oxidized state is difficult in mass production, even if it is
This heating method is also difficult.
とりわけ銅、クロム等を含有するろう材においては、こ
れらの酸化物がろうの溶融流動時に流れ性、ねれ性を劣
化させ、また溶融後も残留物として表面部に変色した状
態で残り易い。In particular, in brazing materials containing copper, chromium, etc., these oxides deteriorate the flowability and bendability of the wax during melting and flow, and even after melting, they tend to remain as residue on the surface in a discolored state.
本願発明は前記欠点を改良せしめて耐酸化性の劣るろう
材においても秀れたろう接強度が得られ、また酸化残留
物を残さず完全にすきまに流れ込んだろう接を可能にす
ることを目的として開発されたものである。The object of the present invention is to improve the above-mentioned drawbacks, to obtain excellent soldering strength even with a brazing material having poor oxidation resistance, and to enable soldering that completely flows into the gap without leaving any oxidized residue. It was developed.
即ち、本願発明はあらかじめろう材料の表面に耐酸化性
皮膜を形成し、加熱時におけるろう材料の酸化を防止し
、よって被ろう接材料とのぬれ性を改良、向上せしめて
強度に秀れたろう接合を得ようとするものである。That is, the present invention forms an oxidation-resistant film on the surface of the soldering material in advance to prevent the oxidation of the soldering material during heating, thereby improving and improving the wettability with the soldering material to be covered, resulting in a solder with excellent strength. The purpose is to obtain bonding.
本発明はステンレス鋼や耐蝕合金の接合に適した金属ろ
うとして、次に示す(1)の組成合金を開発し、先に特
許出願した。The present invention has developed an alloy with the following composition (1) as a metal solder suitable for joining stainless steel and corrosion-resistant alloys, and has previously filed a patent application.
本願発明はこのようなCu、Cr 、Fe、Mo等を含
有する金属ろうにおいて特にその効果を発揮するもので
ある。The present invention is particularly effective in metal solders containing Cu, Cr, Fe, Mo, etc.
(1)Cr3〜18%、Cu2〜25%、5n20〜4
0%、必要によりMo、Fe 、Ti 、Coの中から
1種以上を選択して合計で02〜10%、同様にSi
、Ge、P、In、B、Znの中から1種以上を選んで
合計で0.1〜10%(但しP・Bはそれぞれ1種が5
%以下)残部が30%以上のNiと不可避的な不純物か
らなる金属ろう。(1) Cr3-18%, Cu2-25%, 5n20-4
0%, if necessary, select one or more from Mo, Fe, Ti, and Co for a total of 02 to 10%, similarly Si
, Ge, P, In, B, and Zn for a total of 0.1 to 10% (however, one type of each of P and B is 5%
% or less) A metal solder consisting of Ni with the balance being 30% or more and unavoidable impurities.
本発明はろう接加熱以下の重度範囲において金属ろうよ
り耐酸化性が秀れていることが必要であり、また溶融時
に金属ろう或いは被ろう接材に相溶し易く、その上これ
らと合金して著しく融点を低下せしめたり、また脆性を
与えたりしないことが必要である。In the present invention, it is necessary that the oxidation resistance is superior to that of the metal solder in the severe range below the soldering heat, and that it is easily compatible with the metal solder or the covering solder material when melted, and is not alloyed with them. It is necessary not to significantly lower the melting point or cause brittleness.
加熱途中でろう材の表面酸化を保護し、またろう材溶融
時には不溶物として残留しないためには、その皮膜はで
きるだけ薄いことが望ましいが、およそ20μ程度以下
であれば前記条件を満足することが実験により確認され
た。In order to protect the surface oxidation of the brazing filler metal during heating and to prevent it from remaining as an insoluble substance when the brazing filler metal melts, it is desirable that the film be as thin as possible, but if it is approximately 20μ or less, the above conditions can be satisfied. Confirmed by experiment.
耐酸化性皮膜の材質としてはNiまたはNi合金、Sn
またはSn系合金、AuまたはAn合金が適切であり、
またAgまたはAg合金も一且酸化されるが、溶融径分
解され易いので本願目的に適合する。The material of the oxidation-resistant film is Ni or Ni alloy, Sn
Or Sn-based alloy, Au or An alloy is suitable;
Although Ag or Ag alloys are also monooxidized, they are easily decomposed by the melt diameter and are therefore suitable for the purpose of the present invention.
、次に皮膜の形成手段は電気メッキ、無電解メッキ或い
は蒸着、浸漬等の方法が可能であり手段を選ばない。Next, the film can be formed by electroplating, electroless plating, vapor deposition, dipping, or any other method.
金属ろうの形態については粉末、線材、板材、等いずれ
も有効であり、粉末をプラスチック樹脂等でシート状に
加工したろう材においても粉末時に皮膜を作成しておけ
ば、加熱ろう接待にプラスチックが溶融蒸発揮発後ろう
材の溶融温度に達するまでの酸化防止の効果を発揮する
。Powder, wire rod, plate material, etc. are all effective forms of metal solder, and even if the powder is processed into a sheet shape with plastic resin, if a film is created when it is powdered, plastic will not be used for hot soldering entertainment. It exerts the effect of preventing oxidation until the melting temperature of the brazing filler metal is reached after evaporation.
次に実施例について説明する。Next, an example will be described.
実施例 (1)
Cr6%、Cu18%、5n34%、Ni42%からな
る金属ろうを溶製し100メツシユの粉末とした。Example (1) A metal solder consisting of 6% Cr, 18% Cu, 34% 5N, and 42% Ni was melted and made into 100 mesh powder.
この金属ろうを囚そのまま、(B)無電解Niメッキ約
1μ被覆の2種として、304ステンレス鋼を被ろう接
材にしてアンモニア分解ガス(露点−20°C)中で1
150℃、15分の炉中ろう接を行なった。This metal solder was used as a soldering material as it was, (B) electroless Ni plating coated with approximately 1μ coating, and covered with 304 stainless steel as a soldering material in ammonia decomposition gas (dew point -20°C).
Brazing was performed in a furnace at 150°C for 15 minutes.
その結果、(3)はろうを置いた部分に黒褐色の変色残
留物が少し残ったが、(B)は全くステンレス色の接合
面が得られた。As a result, in (3), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強塵は、(A)
48kg/mm’、(B) 52kg/mm’であった
。In addition, the strong dust of the brazed joints of both samples is (A)
(B) 52 kg/mm'.
実施例 (2)
Cr7%、Cu22%、5n28%、Ni35%、Co
8%からなる金属ろうを溶製し80メツシユの粉末とし
た。Example (2) 7% Cr, 22% Cu, 28% 5n, 35% Ni, Co
A metal solder consisting of 8% was melted and made into 80 mesh powder.
この金属ろうを、(3)そのまま、(B)無電解Niメ
ッキ3μ被覆の2種として、304スフンレス鋼を被ろ
う接材にしてアンモニア分解ガス(露点−20°C)中
で、1160℃、10分の炉中ろう接を行なった。This metal solder was heated at 1160°C in ammonia decomposition gas (dew point -20°C) using (3) as it is, (B) electroless Ni plating with 3μ coating, and 304 funeless steel as a soldering material. Brazing was carried out in a furnace for 10 minutes.
その結果、(A)はろうを置いた部分に黒褐色の変色残
留物が少し残ったが、(B)は全くステンレス色の接合
面が得られた。As a result, in (A) a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B) a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強塵は、(A)
54 kg/mm’、 (B) 60 kg/mm’
であった。In addition, the strong dust of the brazed joints of both samples is (A)
54 kg/mm', (B) 60 kg/mm'
Met.
実施例 (3)
Cr8%、Cu15%、5n25%、Ni50%、P2
%からなる金属ろうを溶製し50メツシユの粉末とした
。Example (3) Cr8%, Cu15%, 5n25%, Ni50%, P2
% was melted into a powder of 50 mesh.
この金属ろうを、(A)そのまま、(B)無電解Niメ
ッキ約8μ被覆の2種として、304ステンレス鋼を被
ろう接材にしてアンモニア分解ガス(露点−20°C)
中で1150℃、10分の炉中ろう接を行なった。This metal solder was used as a soldering material (A) as it is, (B) electroless Ni plating coated with approximately 8μ, and covered with 304 stainless steel, and ammonia decomposition gas (dew point -20°C) was applied.
Brazing was carried out in a furnace at 1150° C. for 10 minutes.
その結果、(5)はろうを置いた部分に黒褐色の変色残
留物が少し残ったが、(B)は全くステンレス色の接合
面が得られた。As a result, in (5), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強塵は、(A)
52kg/mm’、(B)55kg/mm’であった。In addition, the strong dust of the brazed joints of both samples is (A)
(B) 55 kg/mm'.
実施例 (4)
Cr 15%、Cu 20%、Sn 25%、Ni30
%、Fe8%、Ti2%からなる金属ろうを溶製し12
0メツシユの粉末とした。Example (4) Cr 15%, Cu 20%, Sn 25%, Ni30
%, 8% Fe, and 2% Ti.
It was made into a powder of 0 mesh.
この金属ろうを、(5)そのまま、(B)無電解Niメ
ッキ約05μ被覆の2種として、304ステンレス鋼を
被ろう接材にしてアンモニア分解ガス(露点−20°C
)中で1150℃、10分の炉中ろう接を行った。This metal solder was used as a soldering material (5) as it is, (B) electroless Ni plating coated with approximately 05μ coating, and covered with 304 stainless steel, using ammonia decomposition gas (dew point -20°C).
) Brazing was carried out in a furnace at 1150°C for 10 minutes.
その結果、(3)はろうを置いた部分に黒褐色の変色残
留物が少し残ったが、(B)は全くステンレス色の接合
面が得られた。As a result, in (3), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強塵は、(A)
58 kg/mm’、(B) 62 kg/mm’で
あった。In addition, the strong dust of the brazed joints of both samples is (A)
(B) 62 kg/mm'.
実施例 (5)
Cr10%、Cu 14%、5n23.5%、Ni45
%、Si2%、Ge2%、In2%、8015%、Zn
1%からなる金属ろうを溶製し100メツシユの粉末
とした。Example (5) Cr10%, Cu 14%, 5n23.5%, Ni45
%, Si2%, Ge2%, In2%, 8015%, Zn
A metal solder consisting of 1% was melted and made into 100 mesh powder.
この金属ろうを、(A)そのまま、(B)無電解Niメ
ッキ約1μ被覆の2種として、304ステンレス鋼を被
ろう接材にしてアンモニア分解ガス(露点−20°C)
中で1150℃、10分の炉中ろうを行なった。This metal solder was used as a soldering material (A) as it is, (B) coated with electroless Ni plating of about 1μ, and covered with 304 stainless steel, and ammonia decomposition gas (dew point -20°C) was applied.
Brazing was performed in a furnace at 1150°C for 10 minutes.
その結果、(A)はろうを置いた部分に黒褐色の変色残
留物が少し残ったが、(B)は全くステンレス色の接合
面が得られた。As a result, in (A) a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B) a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強塵は、(A)
40 kg/mm’、 (B) 44 kg/mm’
であった。In addition, the strong dust of the brazed joints of both samples is (A)
40 kg/mm', (B) 44 kg/mm'
Met.
実施例 (6)
Cr 11%、Cu 10%、5n30%、Ni40%
、Fe5%、Mo3%、21%、からなる金属ろうを溶
接し40メツシユの粉末とした。Example (6) Cr 11%, Cu 10%, 5n 30%, Ni 40%
, 5% Fe, 3% Mo, and 21% were welded into powder of 40 meshes.
この金属ろうを、(イ)そのまま、(B)無電解Niメ
ッキ約12μ被覆の2種として、304ステンレス鋼を
被ろう接材にしてアンモニア分解ガス(露点−20°C
)中で1150℃、10分の炉中ろう接を行なった。This metal solder was used as a soldering material (a) as it is, (B) electroless Ni plating coated with approximately 12 μm coating, and covered with 304 stainless steel and ammonia decomposition gas (dew point -20°C).
) Brazing was carried out in a furnace at 1150° C. for 10 minutes.
その結果、囚はろうを置いた部分に黒褐色の変色残留物
が少し残ったが、(B)は全くステンレス色の接合面が
得られた。As a result, a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in (B), a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強度は、(A)
50 kg/mm’、(B)54kg/mm’であっ
た。Also, the brazed joint strength of both samples is (A)
50 kg/mm', (B) 54 kg/mm'.
実施例 (7)
Cr10%、Cu2O%、Sn 25%、Ni31%、
Si5%、Co8%、Zn 1%からなる金属ろうを溶
製し、100メツシユの粉末とした。Example (7) Cr10%, Cu2O%, Sn 25%, Ni31%,
A metal solder consisting of 5% Si, 8% Co, and 1% Zn was melted and made into 100 mesh powder.
この金属ろうを、(イ)そのまま、(B)無電解Niメ
ッキ約0.5μ被覆の2種として、304ステンレス鋼
を被ろう接材にしてアンモニア分解ガス(露点−20℃
)中で1150℃、10分の炉中ろう接を行なった。This metal solder was used as a soldering material (a) as is, (B) electroless Ni plating coated with approx.
) Brazing was carried out in a furnace at 1150° C. for 10 minutes.
その結果、八)はろうを置いた部分に黒褐色の変色残留
物が少し残ったが、(B)は全くステンレス色の接合面
が得られた。As a result, in case 8), a small amount of blackish brown discolored residue remained on the part where the wax was placed, but in case 8), a completely stainless steel-colored joint surface was obtained.
また、この双方のサンプルのろう接継手強度は、(A)
47 kg/mm’、(B)50kg/mm’であっ
た。Also, the brazed joint strength of both samples is (A)
47 kg/mm', (B) 50 kg/mm'.
実施例 (8)
実施例口)〜(7)の耐酸化被膜を施したロウ材の耐蝕
性試験を、15%食塩水と人工汗に120時間浸漬(3
5℃)で行なったが、何ら発銹を認めなかった。Example (8) Corrosion resistance tests were carried out on the brazing fillers coated with oxidation-resistant coatings of Examples) to (7) by immersing them in 15% saline and artificial sweat for 120 hours (3).
5°C), but no rusting was observed.
以上説明した如く、本発明はろう接作業における不充分
な非酸化性雰囲気における金属ろうの酸化によるろう液
分の変色やろう接強度の低下を防止し、ろう接作業を容
易にするもので、特に量産過程における真空ろう接や還
元性雰囲気ろう接等の作業管理を容易にする。As explained above, the present invention prevents the discoloration of the wax liquid and the decrease in soldering strength due to oxidation of the metal solder in an insufficient non-oxidizing atmosphere during the soldering work, and facilitates the soldering work. In particular, it facilitates work management such as vacuum soldering and reducing atmosphere soldering in the mass production process.
また金属ろう自体の特性に関しても耐酸化性が多少劣っ
てもろう接強度や耐蝕性、色調等に重点を置いた組成を
選択し得る点で大きなメリットがあり、その意味から新
しい金属ろうを生み出すことにも通ずるものである。In addition, regarding the characteristics of the metal solder itself, there is a great advantage in that even if the oxidation resistance is somewhat inferior, it is possible to select a composition that focuses on the soldering strength, corrosion resistance, color tone, etc., and in this sense, new metal solders can be created. This also applies to this.
Claims (1)
〜25%、5n20〜40%、必要によりMo、Fe、
Ti 、Co の中から1種以上を選んで合計で0.2
〜10%、同様に、Si、Ge、P、In。 B、Znの中から1種以上を選んで合計で0.1〜10
%(但しP、Bはそれぞれ1種が5%以下)、残部が3
0%以上のNiと不可避的な不純物である金属ろう本体
の表面に、それより耐酸化性の優れた金属或いは合金メ
ッキ被膜を20μ以下形成したことを特徴とする金属ろ
う。[Claims] 1Cr3 to 18% (weight percent, same hereinafter) Cu2
~25%, 5n20~40%, Mo, Fe, if necessary
Select one or more types from Ti and Co and total 0.2
~10%, as well as Si, Ge, P, In. Select one or more types from B, Zn and total 0.1 to 10
% (however, each type of P and B is 5% or less), the remainder is 3
A metal solder characterized by forming a metal or alloy plating film with a thickness of 20 μm or less with superior oxidation resistance on the surface of a metal solder body containing 0% or more Ni and unavoidable impurities.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20651881A JPS5812117B2 (en) | 1981-12-21 | 1981-12-21 | metal wax |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20651881A JPS5812117B2 (en) | 1981-12-21 | 1981-12-21 | metal wax |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3596677A Division JPS53120658A (en) | 1977-03-30 | 1977-03-30 | Improved brazing filler metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57127596A JPS57127596A (en) | 1982-08-07 |
JPS5812117B2 true JPS5812117B2 (en) | 1983-03-07 |
Family
ID=16524687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20651881A Expired JPS5812117B2 (en) | 1981-12-21 | 1981-12-21 | metal wax |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5812117B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19729545A1 (en) * | 1997-07-10 | 1999-01-14 | Euromat Gmbh | Solder alloy |
US6660226B1 (en) | 2000-08-07 | 2003-12-09 | Murata Manufacturing Co., Ltd. | Lead free solder and soldered article |
JP2007536088A (en) | 2004-05-04 | 2007-12-13 | エス−ボンド テクノロジーズ、エルエルシー | Electronic package formed using low-temperature active solder containing indium, bismuth and / or cadmium |
WO2015079845A1 (en) * | 2013-11-29 | 2015-06-04 | 株式会社村田製作所 | Method for generating intermetallic compound, and method for connecting articles to be connected by using intermetallic compound |
-
1981
- 1981-12-21 JP JP20651881A patent/JPS5812117B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57127596A (en) | 1982-08-07 |
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