JPS57139945A - Forming method for solder bump electrode - Google Patents

Forming method for solder bump electrode

Info

Publication number
JPS57139945A
JPS57139945A JP56025187A JP2518781A JPS57139945A JP S57139945 A JPS57139945 A JP S57139945A JP 56025187 A JP56025187 A JP 56025187A JP 2518781 A JP2518781 A JP 2518781A JP S57139945 A JPS57139945 A JP S57139945A
Authority
JP
Japan
Prior art keywords
film
layer
bump electrode
plating
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56025187A
Other languages
Japanese (ja)
Inventor
Misao Saga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FUJI DENKI SOUGOU KENKYUSHO KK
Fuji Electric Co Ltd
Original Assignee
FUJI DENKI SOUGOU KENKYUSHO KK
Fuji Electric Corporate Research and Development Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FUJI DENKI SOUGOU KENKYUSHO KK, Fuji Electric Corporate Research and Development Ltd filed Critical FUJI DENKI SOUGOU KENKYUSHO KK
Priority to JP56025187A priority Critical patent/JPS57139945A/en
Publication of JPS57139945A publication Critical patent/JPS57139945A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01022—Titanium [Ti]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the erosion of Al wiring due to a plating liquid, and to improve reliability by evaporating a Ni layer as the uppermost layer of a bump electrode foundation metal, strike-plating the surface with Ni, activating the surface and fast sticking a solder layer. CONSTITUTION:An Al wiring film 3 and a nitride film 4 are formed onto a substrate 1 with an oxide film 2. A window 10 is shaped by a resist 9, and the whole surface is coated with a Ti film 5, a copper film 6 and the Ni layer 71. The Cu film 6 and the Ni film 7 are etching using a resist film 14 as a mask, the resist film 14 is exfoliated, and the surface is strike-plated with Ni. The plating is plated with a tin layer 12 forming the solder layer and a lead layer 13 in order, and the bump electrode 18 is shaped. Accordingly, the erosion of the Al wiring due to the plating liquid is prevented, and the bump electrode having high reliability is formed.
JP56025187A 1981-02-23 1981-02-23 Forming method for solder bump electrode Pending JPS57139945A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56025187A JPS57139945A (en) 1981-02-23 1981-02-23 Forming method for solder bump electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56025187A JPS57139945A (en) 1981-02-23 1981-02-23 Forming method for solder bump electrode

Publications (1)

Publication Number Publication Date
JPS57139945A true JPS57139945A (en) 1982-08-30

Family

ID=12158964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56025187A Pending JPS57139945A (en) 1981-02-23 1981-02-23 Forming method for solder bump electrode

Country Status (1)

Country Link
JP (1) JPS57139945A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02229434A (en) * 1989-03-02 1990-09-12 Fujitsu Ltd Formation of solder bump
US10577202B2 (en) 2016-01-27 2020-03-03 Sharp Kabushiki Kaisha Sheet feed device and image forming apparatus including the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460557A (en) * 1977-10-24 1979-05-16 Hitachi Ltd Solder electrode forming method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5460557A (en) * 1977-10-24 1979-05-16 Hitachi Ltd Solder electrode forming method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02229434A (en) * 1989-03-02 1990-09-12 Fujitsu Ltd Formation of solder bump
US10577202B2 (en) 2016-01-27 2020-03-03 Sharp Kabushiki Kaisha Sheet feed device and image forming apparatus including the same

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