GB2207558B - Printed circuit boards - Google Patents
Printed circuit boardsInfo
- Publication number
- GB2207558B GB2207558B GB8716406A GB8716406A GB2207558B GB 2207558 B GB2207558 B GB 2207558B GB 8716406 A GB8716406 A GB 8716406A GB 8716406 A GB8716406 A GB 8716406A GB 2207558 B GB2207558 B GB 2207558B
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed circuit
- circuit boards
- boards
- printed
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8716406A GB2207558B (en) | 1987-07-11 | 1987-07-11 | Printed circuit boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8716406A GB2207558B (en) | 1987-07-11 | 1987-07-11 | Printed circuit boards |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8716406D0 GB8716406D0 (en) | 1987-08-19 |
GB2207558A GB2207558A (en) | 1989-02-01 |
GB2207558B true GB2207558B (en) | 1991-10-30 |
Family
ID=10620537
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8716406A Expired - Lifetime GB2207558B (en) | 1987-07-11 | 1987-07-11 | Printed circuit boards |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2207558B (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ATE171307T1 (en) * | 1989-05-22 | 1998-10-15 | Advanced Micro Devices Inc | CONDUCTOR STRUCTURE FOR AN INTEGRATED CIRCUIT |
DE19900912A1 (en) * | 1999-01-13 | 2000-07-20 | Christian Gaertner | Board, for electronic circuit board manufacture, comprises a pre-stamped board having holes filled with a soft filler or having an applied thin substrate to eliminate the need for drilling |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB964557A (en) * | 1962-07-02 | 1964-07-22 | Marconi Co Ltd | Improvements in or relating to printed circuits and methods of manufacturing the same |
GB1120583A (en) * | 1965-05-19 | 1968-07-17 | British Aircraft Corp Ltd | Improvements relating to printed circuits |
GB1124298A (en) * | 1964-11-04 | 1968-08-21 | Btr Industries Ltd | Improvements in or relating to printed circuits |
GB1174043A (en) * | 1966-03-01 | 1969-12-10 | British Aircraft Corp Ltd | Improvements relating to the manufacture of Printed Circuits |
GB1396481A (en) * | 1973-02-15 | 1975-06-04 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit boards |
GB1410780A (en) * | 1972-09-29 | 1975-10-22 | Exacta Circuits Ltd | Through-hole plated printed circuits |
GB1468065A (en) * | 1973-03-24 | 1977-03-23 | Sumitomo Bakelite Co | Electrically insulating board |
GB2145574A (en) * | 1983-08-20 | 1985-03-27 | Int Computers Ltd | Multi-layer printed circuit boards |
US4644130A (en) * | 1984-05-18 | 1987-02-17 | Siemens Aktiengesellschaft | Method for creating blind holes in a laminated structure |
-
1987
- 1987-07-11 GB GB8716406A patent/GB2207558B/en not_active Expired - Lifetime
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB964557A (en) * | 1962-07-02 | 1964-07-22 | Marconi Co Ltd | Improvements in or relating to printed circuits and methods of manufacturing the same |
GB1124298A (en) * | 1964-11-04 | 1968-08-21 | Btr Industries Ltd | Improvements in or relating to printed circuits |
GB1120583A (en) * | 1965-05-19 | 1968-07-17 | British Aircraft Corp Ltd | Improvements relating to printed circuits |
GB1174043A (en) * | 1966-03-01 | 1969-12-10 | British Aircraft Corp Ltd | Improvements relating to the manufacture of Printed Circuits |
GB1410780A (en) * | 1972-09-29 | 1975-10-22 | Exacta Circuits Ltd | Through-hole plated printed circuits |
GB1396481A (en) * | 1973-02-15 | 1975-06-04 | Matsushita Electric Ind Co Ltd | Manufacture of printed circuit boards |
GB1468065A (en) * | 1973-03-24 | 1977-03-23 | Sumitomo Bakelite Co | Electrically insulating board |
GB2145574A (en) * | 1983-08-20 | 1985-03-27 | Int Computers Ltd | Multi-layer printed circuit boards |
US4644130A (en) * | 1984-05-18 | 1987-02-17 | Siemens Aktiengesellschaft | Method for creating blind holes in a laminated structure |
Also Published As
Publication number | Publication date |
---|---|
GB2207558A (en) | 1989-02-01 |
GB8716406D0 (en) | 1987-08-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19950711 |