GB1396481A - Manufacture of printed circuit boards - Google Patents

Manufacture of printed circuit boards

Info

Publication number
GB1396481A
GB1396481A GB754473A GB754473A GB1396481A GB 1396481 A GB1396481 A GB 1396481A GB 754473 A GB754473 A GB 754473A GB 754473 A GB754473 A GB 754473A GB 1396481 A GB1396481 A GB 1396481A
Authority
GB
United Kingdom
Prior art keywords
solution
metal
printed circuit
immersion
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB754473A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to GB754473A priority Critical patent/GB1396481A/en
Publication of GB1396481A publication Critical patent/GB1396481A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1841—Multistep pretreatment with use of metal first
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09581—Applying an insulating coating on the walls of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1423—Applying catalyst before etching, e.g. plating catalyst in holes before etching circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

1396481 Printed circuits MATSUSHITA ELECTRIC INDUSTRIAL CO Ltd 15 Feb 1973 7544/73 Heading H1R A printed circuit board is fabricated by drilling or punching holes 13 in a metal coated board with, e.g. Cu (11, 12), e.g. on glass epoxy resin, or paper epoxy resin or phenol resin paper laminate 10; and sensitizing the hole walls with Pd deposited by immersion in SnCl 2 solution, washing, and immersion in PdCl 2 solution. An ink or photodeposited etch resist 15 is applied to the foil surface to define a desired circuit (Fig. 4) and the unprotected metal is etched off in ammonium persulphate solution. After removal of the remaining resist with, e.g. sodium hydroxide, a metal, e.g. copper is electrolessly plated on the surface of the foil at 16 and on the inner surface of the holes. A production example is quoted in detail.
GB754473A 1973-02-15 1973-02-15 Manufacture of printed circuit boards Expired GB1396481A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB754473A GB1396481A (en) 1973-02-15 1973-02-15 Manufacture of printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB754473A GB1396481A (en) 1973-02-15 1973-02-15 Manufacture of printed circuit boards

Publications (1)

Publication Number Publication Date
GB1396481A true GB1396481A (en) 1975-06-04

Family

ID=9835159

Family Applications (1)

Application Number Title Priority Date Filing Date
GB754473A Expired GB1396481A (en) 1973-02-15 1973-02-15 Manufacture of printed circuit boards

Country Status (1)

Country Link
GB (1) GB1396481A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0090900A1 (en) * 1982-04-05 1983-10-12 Kanto Kasei Co., Ltd. Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
GB2118369A (en) * 1982-04-06 1983-10-26 Kanto Kasei Company Limited Making printed circuit boards
US4487828A (en) * 1983-06-03 1984-12-11 At&T Technologies, Inc. Method of manufacturing printed circuit boards
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
US5218761A (en) * 1991-04-08 1993-06-15 Nec Corporation Process for manufacturing printed wiring boards
WO1996015651A1 (en) * 1994-11-09 1996-05-23 Blaupunkt-Werke Gmbh Method of producing a feedthrough on a circuit board
EP0762814A1 (en) * 1995-08-22 1997-03-12 Macdermid Incorporated Method for the manufacture of printed circuit boards
CN1316515C (en) * 2004-02-18 2007-05-16 嘉得隆科技股份有限公司 Manufacturing method of conducting resin film and its product

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0090900A1 (en) * 1982-04-05 1983-10-12 Kanto Kasei Co., Ltd. Process of manufacturing printed wiring boards and printed wiring boards manufactured by the same
GB2118369A (en) * 1982-04-06 1983-10-26 Kanto Kasei Company Limited Making printed circuit boards
US4487828A (en) * 1983-06-03 1984-12-11 At&T Technologies, Inc. Method of manufacturing printed circuit boards
GB2207558A (en) * 1987-07-11 1989-02-01 Abdul Hamed Perforated printed circuit boards
GB2207558B (en) * 1987-07-11 1991-10-30 Abdul Hamed Printed circuit boards
US5218761A (en) * 1991-04-08 1993-06-15 Nec Corporation Process for manufacturing printed wiring boards
WO1996015651A1 (en) * 1994-11-09 1996-05-23 Blaupunkt-Werke Gmbh Method of producing a feedthrough on a circuit board
US5799393A (en) * 1994-11-09 1998-09-01 Blaupunkt-Werke Gmbh Method for producing a plated-through hole on a printed-circuit board
EP0762814A1 (en) * 1995-08-22 1997-03-12 Macdermid Incorporated Method for the manufacture of printed circuit boards
JPH09102676A (en) * 1995-08-22 1997-04-15 Macdermid Inc Manufacture of printed circuit board
CN1316515C (en) * 2004-02-18 2007-05-16 嘉得隆科技股份有限公司 Manufacturing method of conducting resin film and its product

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Legal Events

Date Code Title Description
PS Patent sealed
746 Register noted 'licences of right' (sect. 46/1977)
PE20 Patent expired after termination of 20 years

Effective date: 19930213