GB1194853A - A Method of Forming Printed Circuits - Google Patents
A Method of Forming Printed CircuitsInfo
- Publication number
- GB1194853A GB1194853A GB743767A GB743767A GB1194853A GB 1194853 A GB1194853 A GB 1194853A GB 743767 A GB743767 A GB 743767A GB 743767 A GB743767 A GB 743767A GB 1194853 A GB1194853 A GB 1194853A
- Authority
- GB
- United Kingdom
- Prior art keywords
- printed
- copper
- circuits
- conductor pattern
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
Abstract
1,194,853. Printed circuits. B.T.R. INDUSTRIES Ltd. 19 Jan., 1968 [16 Feb., 1967], No. 7437/67. Heading H1R. A printed circuit is formed on a copper clad panel 8 (Fig. 1) having copper foil 14 bonded to an insulating substrate 10, drilled holes 12, copper-plating 16 on the hole walls and foil, as follows:-Hole 12 is filled with viscous cellulose black printing ink 18 (Fig. 2). The sequined conductor pattern is then printed with etch resistant ink 20 (Fig. 3) and panel 8 is etched in known manner leaving the conductor pattern as shown in Fig. 4. The inks are then removed leaving the printed circuit board Fig. 5. The circuits are then given a final surface of gold by a known immersion process.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB743767A GB1194853A (en) | 1967-02-16 | 1967-02-16 | A Method of Forming Printed Circuits |
NL6801988A NL6801988A (en) | 1967-02-16 | 1968-02-12 | |
DE19681615853 DE1615853A1 (en) | 1967-02-16 | 1968-02-13 | Process for the production of printed circuits |
FR1559157D FR1559157A (en) | 1967-02-16 | 1968-02-15 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB743767A GB1194853A (en) | 1967-02-16 | 1967-02-16 | A Method of Forming Printed Circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1194853A true GB1194853A (en) | 1970-06-17 |
Family
ID=9833088
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB743767A Expired GB1194853A (en) | 1967-02-16 | 1967-02-16 | A Method of Forming Printed Circuits |
Country Status (4)
Country | Link |
---|---|
DE (1) | DE1615853A1 (en) |
FR (1) | FR1559157A (en) |
GB (1) | GB1194853A (en) |
NL (1) | NL6801988A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2120017A (en) * | 1982-05-13 | 1983-11-23 | Kollmorgen Tech Corp | Making printed circuit boards having plated through-holes |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS556833A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Cirucit board and method of manufacturing same |
JPS56129394A (en) * | 1980-03-14 | 1981-10-09 | Dainippon Screen Mfg | Method of producing through hole of printed board |
US4690833A (en) * | 1986-03-28 | 1987-09-01 | International Business Machines Corporation | Providing circuit lines on a substrate |
US4994349A (en) * | 1988-06-27 | 1991-02-19 | At&T Bell Laboratories | Printed wiring board fabrication method |
-
1967
- 1967-02-16 GB GB743767A patent/GB1194853A/en not_active Expired
-
1968
- 1968-02-12 NL NL6801988A patent/NL6801988A/xx unknown
- 1968-02-13 DE DE19681615853 patent/DE1615853A1/en active Pending
- 1968-02-15 FR FR1559157D patent/FR1559157A/fr not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2120017A (en) * | 1982-05-13 | 1983-11-23 | Kollmorgen Tech Corp | Making printed circuit boards having plated through-holes |
Also Published As
Publication number | Publication date |
---|---|
DE1615853A1 (en) | 1970-05-21 |
NL6801988A (en) | 1968-08-19 |
FR1559157A (en) | 1969-03-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS57168540A (en) | Noise preventing device and its production for electronic controller | |
GB1111088A (en) | Improvements in or relating to multi-layer circuit boards | |
GB911718A (en) | Multiplanar printed circuits and methods for their manufacture | |
GB1408916A (en) | Printed circuit boards and methods of manufacturing such boards | |
EP0028657A4 (en) | Hollow multilayer printed wiring board, and method of fabricating same. | |
GB1266000A (en) | ||
GB1269592A (en) | Sub-element for electronic circuit board | |
GB1268317A (en) | Improvements in or relating to the manufacture of conductor plates | |
GB1062636A (en) | Electronic circuit element and method of manufacture | |
GB1101299A (en) | Method of manufacturing an electric circuit unit | |
FR1577883A (en) | ||
GB1194853A (en) | A Method of Forming Printed Circuits | |
ES338303A1 (en) | Method for printing circuit designs | |
GB1262245A (en) | Production of circuit boards | |
GB1396481A (en) | Manufacture of printed circuit boards | |
GB1035327A (en) | Improvements in or relating to printed circuits | |
GB1377682A (en) | Thick film printed circuitry | |
GB1091641A (en) | Printed circuits and methods for producing same | |
GB1042234A (en) | Multilayer printed circuits | |
GB1157618A (en) | Laminate for Use in the Production of Printed Electrical Circuit Elements. | |
GB1124298A (en) | Improvements in or relating to printed circuits | |
ES455373A1 (en) | Multilayer printed wiring board | |
KR950001266B1 (en) | Method of manufacturing aluminum circuit board | |
GB1367601A (en) | Circuit systems | |
GB879395A (en) | Improvements relating to printed circuits |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PLE | Entries relating assignments, transmissions, licences in the register of patents | ||
PCNP | Patent ceased through non-payment of renewal fee |