GB1157618A - Laminate for Use in the Production of Printed Electrical Circuit Elements. - Google Patents

Laminate for Use in the Production of Printed Electrical Circuit Elements.

Info

Publication number
GB1157618A
GB1157618A GB3901765A GB3901765A GB1157618A GB 1157618 A GB1157618 A GB 1157618A GB 3901765 A GB3901765 A GB 3901765A GB 3901765 A GB3901765 A GB 3901765A GB 1157618 A GB1157618 A GB 1157618A
Authority
GB
United Kingdom
Prior art keywords
laminate
film
ink
support
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3901765A
Inventor
Peter Steel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF Catalysts UK Holdings Ltd
Original Assignee
Engelhard Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Industries Ltd filed Critical Engelhard Industries Ltd
Priority to GB3901765A priority Critical patent/GB1157618A/en
Publication of GB1157618A publication Critical patent/GB1157618A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

1,157,618. Laminates. ENGELHARD INDUSTRIES Ltd. 13 Sept., 1966 [13 Sept., 1965], No. 39017/65. Heading B5N. [Also in Division H1] A laminate for making a printed circuit element e.g. a resistor, comprises a film of tinnickel electrical resistance alloy adhered to an electrically insulating base such as a sub-laminate of phenol-aldehyde resin-impregnated paper. The laminate may be made by applying, e.g. by electro-deposition, the alloy film to a flexible support, e.g. of copper foil preferably electrodeposited, coating the film or the base with a phenolic adhesive, contacting the alloy film and the base, and removing the support. When forming a resistor, using a support of copper foil, the copper is removed by etching with ammonium persulphate, except for terminal portions protected by printing with acidresisting ink, the alloy film thus exposed is then printed in a pattern with similar ink, and the unprinted portions etched away with acidified ferric chloride, the ink being finally removed by washing.
GB3901765A 1965-09-13 1965-09-13 Laminate for Use in the Production of Printed Electrical Circuit Elements. Expired GB1157618A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3901765A GB1157618A (en) 1965-09-13 1965-09-13 Laminate for Use in the Production of Printed Electrical Circuit Elements.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3901765A GB1157618A (en) 1965-09-13 1965-09-13 Laminate for Use in the Production of Printed Electrical Circuit Elements.

Publications (1)

Publication Number Publication Date
GB1157618A true GB1157618A (en) 1969-07-09

Family

ID=10407092

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3901765A Expired GB1157618A (en) 1965-09-13 1965-09-13 Laminate for Use in the Production of Printed Electrical Circuit Elements.

Country Status (1)

Country Link
GB (1) GB1157618A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (en) * 1971-08-30 1973-05-24
FR2166347A1 (en) * 1972-01-04 1973-08-17 Mica Corp Printed circuit laminate - with resistive under-cladding
DE2264956A1 (en) * 1971-08-30 1975-10-16 Perstorp Ab Starting laminate for printed circuit production - having a very thin layer of copper or other metal laminated to an insulating substrate
USRE29820E (en) 1971-08-30 1978-10-31 Perstorp, Ab Method for the production of material for printed circuits
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
CN112493639A (en) * 2020-11-26 2021-03-16 上海诗冠印刷有限公司 Preparation method of Buddha statue commemorative coin

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (en) * 1971-08-30 1973-05-24
DE2264956A1 (en) * 1971-08-30 1975-10-16 Perstorp Ab Starting laminate for printed circuit production - having a very thin layer of copper or other metal laminated to an insulating substrate
US3990926A (en) 1971-08-30 1976-11-09 Perstorp Ab Method for the production of material for printed circuits
JPS5143571B2 (en) * 1971-08-30 1976-11-22
USRE29820E (en) 1971-08-30 1978-10-31 Perstorp, Ab Method for the production of material for printed circuits
FR2166347A1 (en) * 1972-01-04 1973-08-17 Mica Corp Printed circuit laminate - with resistive under-cladding
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
GB2246476B (en) * 1990-04-17 1993-11-17 Nippon Cmk Kk A method of forming a carbon resistance on a printed wiring board
CN112493639A (en) * 2020-11-26 2021-03-16 上海诗冠印刷有限公司 Preparation method of Buddha statue commemorative coin
CN112493639B (en) * 2020-11-26 2022-10-21 上海诗冠印刷有限公司 Preparation method of Buddha statue commemorative coin

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Legal Events

Date Code Title Description
PS Patent sealed
PLNP Patent lapsed through nonpayment of renewal fees