GB825495A - Improvements in or relating to printed electric circuits - Google Patents

Improvements in or relating to printed electric circuits

Info

Publication number
GB825495A
GB825495A GB22903/57A GB2290357A GB825495A GB 825495 A GB825495 A GB 825495A GB 22903/57 A GB22903/57 A GB 22903/57A GB 2290357 A GB2290357 A GB 2290357A GB 825495 A GB825495 A GB 825495A
Authority
GB
United Kingdom
Prior art keywords
base plate
stack
circuit pattern
copper
pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB22903/57A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motors Liquidation Co
Original Assignee
Motors Liquidation Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motors Liquidation Co filed Critical Motors Liquidation Co
Publication of GB825495A publication Critical patent/GB825495A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

825,495. Transfers. GENERAL MOTORS CORPORATION. July 19, 1957 [Aug. 8, 1956], No. 22903/57. Class 100(2) [Also in Group XXXVI] A transfer for use in forming a printed circuit is made by a process involving the steps of coating a stainless steel base plate 2 with a resist ink leaving the plate uncovered over an area corresponding to the desired circuit pattern, electroplating a copper deposit on to the exposed surface of the base plate and removing the resist ink from the base plate to leave a pattern as shown in Fig. 3. On placing the plated surface of the base plate in contact with one surface of a stack, Fig. 4, of insulating sheets impregnated with uncured thermosetting resin, applying heat and pressure to the stack and to the base plate and finally removing the base plate, the copper circuit pattern is transferred to and left embedded in the surface of the cured impregnated stack. The resist ink may be applied in the desired pattern by a silk-screen process. The copper circuit pattern, Fig. 3, is treated with an oxidizing solution after the removal of the resist to produce a black copper-oxide coating thereon. This is stated to assist the adhesion of the circuit pattern to the insulating stack. An adhesive layer 16 is placed between the base plate 2 and the stack, Fig. 4, which is itself placed upon an aluminium foil sheet 12 standing upon analuminium base plate.
GB22903/57A 1956-08-08 1957-07-19 Improvements in or relating to printed electric circuits Expired GB825495A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US825495XA 1956-08-08 1956-08-08

Publications (1)

Publication Number Publication Date
GB825495A true GB825495A (en) 1959-12-16

Family

ID=22171893

Family Applications (1)

Application Number Title Priority Date Filing Date
GB22903/57A Expired GB825495A (en) 1956-08-08 1957-07-19 Improvements in or relating to printed electric circuits

Country Status (1)

Country Link
GB (1) GB825495A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498412A1 (en) * 1981-01-16 1982-07-23 Delair Michel METHOD OF MANUFACTURING PRINTED CIRCUITS BASED ON THE PRINCIPLE OF THE DEPOSITION OF THE CONDUCTIVE NETWORK ON A REUSABLE SPECIFIC TOOLING AND THE TRANSFER OF THIS DEPOSITION ON THE INSULATING SUPPORT
GB2126529A (en) * 1982-07-16 1984-03-28 Oudensha Co Ltd Forming and applying indicia
WO2008034312A1 (en) * 2006-09-15 2008-03-27 Dongming Li Fabrication method of a printed circuit board

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2498412A1 (en) * 1981-01-16 1982-07-23 Delair Michel METHOD OF MANUFACTURING PRINTED CIRCUITS BASED ON THE PRINCIPLE OF THE DEPOSITION OF THE CONDUCTIVE NETWORK ON A REUSABLE SPECIFIC TOOLING AND THE TRANSFER OF THIS DEPOSITION ON THE INSULATING SUPPORT
GB2126529A (en) * 1982-07-16 1984-03-28 Oudensha Co Ltd Forming and applying indicia
WO2008034312A1 (en) * 2006-09-15 2008-03-27 Dongming Li Fabrication method of a printed circuit board

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