GB795822A - Improvements in or relating to the production of printed electric circuits - Google Patents

Improvements in or relating to the production of printed electric circuits

Info

Publication number
GB795822A
GB795822A GB1463055A GB1463055A GB795822A GB 795822 A GB795822 A GB 795822A GB 1463055 A GB1463055 A GB 1463055A GB 1463055 A GB1463055 A GB 1463055A GB 795822 A GB795822 A GB 795822A
Authority
GB
United Kingdom
Prior art keywords
foil
laminate
pattern
resistant layer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1463055A
Inventor
Maurice Holley
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Masson Seeley and Co Ltd
Original Assignee
Masson Seeley and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Masson Seeley and Co Ltd filed Critical Masson Seeley and Co Ltd
Priority to GB1463055A priority Critical patent/GB795822A/en
Publication of GB795822A publication Critical patent/GB795822A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Abstract

795,822. Printed circuits; etching. MASSON SEELEY & CO., Ltd. May 17, 1956 [May 20, 1955], No. 14630/55. Class 100(2) [Also in Group XXXVI] A method of producing a printed circuit comprises the steps of coating a laminate, comprising a thin metal foil secured to a heat-stable insulating base, with a resistant layer in the pattern of the desired circuit by transferring the layer by heat and pressure from a foil upon which it is carried to the laminate, etching the metal foil away from those parts of the laminate not protected by the resistant layer and finally stripping the resistant layer from the remaining metal foil. The laminate preferably comprises a thermosetting resin base (e.g. a phenol-formaldehyde or a polyester resin) having a thin copper foil secured thereto. The resistant layer, which may comprise polyvinyl chloride and may be pigmented is provided upon a foil of e.g. regenerated cellulose. In one way of carrying out the invention the resist-bearing foil is laid upon the metal surface of the laminate and-subjected to heat and pressure by a press supporting a die having the desired circuit pattern formed thereon so that the resistant layer adheres to the copper foil over the area of the desired circuit. pattern. The exposed area of the foil is then etched away, for example, in a ferric chloride etching bath. After the etching is complete the laminate is washed and the resistant coating then removed with a suitable solvent. In order to increase the thickness of the metal layer upon the insulating base a subsequent plating operation in which the copper is plated with tin and/or lead may be carried out. In an alternative arrangement the pattern on the die is the negative of the desired circuit configuration and the die is used to transfer the negative of the circuit pattern from the resistbearing foil to a piece of paper which is then discarded. The resist-bearing foil is then placed over the laminate and heat and pressure applied to transfer the remaining positive pattern to the laminate. The exposed foil is then etched away and the resistant coating removed as in the previously described arrangement. The invention may be applied to the production of printed circuits on both sides of the insulating base.
GB1463055A 1955-05-20 1955-05-20 Improvements in or relating to the production of printed electric circuits Expired GB795822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1463055A GB795822A (en) 1955-05-20 1955-05-20 Improvements in or relating to the production of printed electric circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1463055A GB795822A (en) 1955-05-20 1955-05-20 Improvements in or relating to the production of printed electric circuits

Publications (1)

Publication Number Publication Date
GB795822A true GB795822A (en) 1958-05-28

Family

ID=10044724

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1463055A Expired GB795822A (en) 1955-05-20 1955-05-20 Improvements in or relating to the production of printed electric circuits

Country Status (1)

Country Link
GB (1) GB795822A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0192377A2 (en) * 1985-02-19 1986-08-27 Minnesota Mining And Manufacturing Company Non-photosensitive transfer resist
EP1104017A2 (en) * 1999-11-24 2001-05-30 Omron Corporation Method of flip-chip mounting a semiconductor chip to a circuit board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0192377A2 (en) * 1985-02-19 1986-08-27 Minnesota Mining And Manufacturing Company Non-photosensitive transfer resist
EP0192377A3 (en) * 1985-02-19 1988-04-20 Minnesota Mining And Manufacturing Company Non-photosensitive transfer resist
EP1104017A2 (en) * 1999-11-24 2001-05-30 Omron Corporation Method of flip-chip mounting a semiconductor chip to a circuit board
EP1104017A3 (en) * 1999-11-24 2003-11-12 Omron Corporation Method of flip-chip mounting a semiconductor chip to a circuit board
EP1801867A3 (en) * 1999-11-24 2007-08-29 Omron Corporation Method of flip-chip mounting a semiconductor chip to a circuit board, circuit board for flip-chip connection and method of manufacturing the same
CN100473255C (en) * 1999-11-24 2009-03-25 欧姆龙株式会社 Circuit board for flip-chip connection and manufacturing method thereof

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