GB1013608A - Improvements in or relating to processes for the manufacture of printed circuits - Google Patents

Improvements in or relating to processes for the manufacture of printed circuits

Info

Publication number
GB1013608A
GB1013608A GB3840864A GB3840864A GB1013608A GB 1013608 A GB1013608 A GB 1013608A GB 3840864 A GB3840864 A GB 3840864A GB 3840864 A GB3840864 A GB 3840864A GB 1013608 A GB1013608 A GB 1013608A
Authority
GB
United Kingdom
Prior art keywords
stencil
layer
conductors
protective layer
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3840864A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens and Halske AG
Siemens AG
Original Assignee
Siemens and Halske AG
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens and Halske AG, Siemens AG filed Critical Siemens and Halske AG
Publication of GB1013608A publication Critical patent/GB1013608A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H19/00—Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand
    • H01H19/54—Switches operated by an operating part which is rotatable about a longitudinal axis thereof and which is acted upon directly by a solid body external to the switch, e.g. by a hand the operating part having at least five or an unspecified number of operative positions
    • H01H19/56—Angularly-movable actuating part carrying contacts, e.g. drum switch
    • H01H19/58—Angularly-movable actuating part carrying contacts, e.g. drum switch having only axial contact pressure, e.g. disc switch, wafer switch
    • H01H19/585—Angularly-movable actuating part carrying contacts, e.g. drum switch having only axial contact pressure, e.g. disc switch, wafer switch provided with printed circuit contacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0582—Coating by resist, i.e. resist used as mask for application of insulating coating or of second resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

1,013,608. Printed circuits. SIEMENS & HALSKE A.G. Sept. 21, 1964 [Sept. 19, 1963], No. 38408/64. Heading H1R. In a process for making a printed circuit, an insulating plate 1, Fig. 3, is provided with an adhesive layer 3, a basic metal layer 4, and a negative stencil 5; the exposed portions of the metal layer 4 are electrolytically thickened to form conductors 2, and the conductors 2 and stencil 5 are covered with a protective layer 6 which is insoluble in the solvent to be used to remove the stencil. The stencil 5 is dissolved away (a portion of the protective layer being uncovered to allow the solvent access), and the parts of the protective layer 6 covering the stencil are removed at the same time or subsequently. The unthickened parts of the metal layer 4 are etched away to form a printed circuit, Fig. 6, having conductors 2 protected by layer 6; alternatively, layer 6 may be removed from the conductors 2 after the etching step. The initial metal-clad insulating plate maybe formed by the process of Specification 1,013,606, or a copper-clad laminate or an insulating plate sprayed with metal may be used. The stencil 5, which may be applied by screen printing, may have a base of colophony- . modified linseed oil, and the protective layer 6 may be shellac applied by spraying, brushing or printing. Conductors 2 may be of copper, and may be covered, with silver or a tin-lead alloy.
GB3840864A 1963-09-19 1964-09-21 Improvements in or relating to processes for the manufacture of printed circuits Expired GB1013608A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DES87402A DE1206976B (en) 1963-09-19 1963-09-19 Process for producing printed circuits according to the build-up method

Publications (1)

Publication Number Publication Date
GB1013608A true GB1013608A (en) 1965-12-15

Family

ID=7513727

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3840864A Expired GB1013608A (en) 1963-09-19 1964-09-21 Improvements in or relating to processes for the manufacture of printed circuits

Country Status (3)

Country Link
CH (1) CH413021A (en)
DE (1) DE1206976B (en)
GB (1) GB1013608A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528892A (en) * 1968-04-08 1970-09-15 Joseph J Mazur Plating method
GB2258087A (en) * 1991-07-24 1993-01-27 Nippon Cmk Kk A method of manufacturing a printed wiring board

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1690224B1 (en) * 1967-08-29 1971-03-25 Standard Elek K Lorenz Ag BATHROOM FOR ELECTRONIC COPPER PLATING OF PLASTIC PANELS
DE1690152B1 (en) * 1968-03-07 1971-04-22 Siemens Ag Process for the production of printed circuit boards provided with finished configurations
DE2239829C2 (en) * 1972-08-12 1982-06-03 Aeg Isolier- Und Kunststoff Gmbh, 3500 Kassel Base material for PCB mfr. - using a non-stick agent on the aluminium cover foil
DE3110528A1 (en) * 1981-03-18 1982-10-07 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt METHOD FOR PRODUCING PRINTED CIRCUITS
DE3110415C2 (en) * 1981-03-18 1983-08-18 Ruwel-Werke Spezialfabrik für Leiterplatten GmbH, 4170 Geldern Process for the manufacture of printed circuit boards

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2728693A (en) * 1953-08-24 1955-12-27 Motorola Inc Method of forming electrical conductor upon an insulating base

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3528892A (en) * 1968-04-08 1970-09-15 Joseph J Mazur Plating method
GB2258087A (en) * 1991-07-24 1993-01-27 Nippon Cmk Kk A method of manufacturing a printed wiring board

Also Published As

Publication number Publication date
DE1206976B (en) 1965-12-16
CH413021A (en) 1966-05-15

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