JPS6453591A - Manufacture of flexible circuit board - Google Patents
Manufacture of flexible circuit boardInfo
- Publication number
- JPS6453591A JPS6453591A JP21191987A JP21191987A JPS6453591A JP S6453591 A JPS6453591 A JP S6453591A JP 21191987 A JP21191987 A JP 21191987A JP 21191987 A JP21191987 A JP 21191987A JP S6453591 A JPS6453591 A JP S6453591A
- Authority
- JP
- Japan
- Prior art keywords
- cured
- thin films
- coating solution
- layer
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE:To provide a uniform covering with an organic insulating film easily by a method wherein metal thin films are coated with polyimide precursor solution and, after the solution is semi-cured, the metal thin films are laminated and the coating solution layer is pre-cured and then the metal thin films are patterned to form conductor circuits and the coating solution layer is cured by heat. CONSTITUTION:Metal thin films 2 are coated with polyimide or polyimide or polyimide precursor solution and the coating solution layers 1a are semi-cured. The metal thin films 2 are laminated with the coating solution layer 16 between and the coating solution layer 1b is pre-cured and conductor circuits 3 are formed. Then the coating solution layer 1c is cured by heat to form a polyimide layer 4. Polyamide carbonic acid solution is applied to two rolled copper thin films by making the solution flow on the copper films and semi-cured by heat. Then the respective coating solution layers are laminated with each other and pressed to pre-cure to form a flexible circuit board. Then the copper thin films are etched by dipping them into etchant. The resist is peeled off and removed and conductor circuits are formed to produce a circuit board and, at the same time, heat is applied to obtain a flexible circuit board composed of the copper foils laminated with the polyimide layer in between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21191987A JPS6453591A (en) | 1987-08-25 | 1987-08-25 | Manufacture of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21191987A JPS6453591A (en) | 1987-08-25 | 1987-08-25 | Manufacture of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6453591A true JPS6453591A (en) | 1989-03-01 |
Family
ID=16613837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21191987A Pending JPS6453591A (en) | 1987-08-25 | 1987-08-25 | Manufacture of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6453591A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03244184A (en) * | 1990-02-21 | 1991-10-30 | Sumitomo Electric Ind Ltd | Manufacture of flexible wiring substrate |
| US5144742A (en) * | 1991-02-27 | 1992-09-08 | Zycon Corporation | Method of making rigid-flex printed circuit boards |
| EP1017258A2 (en) * | 1998-12-28 | 2000-07-05 | Sony Chemicals Corp. | Method for manufacturing double-sided flexible printed board |
| US6737588B1 (en) | 1999-08-26 | 2004-05-18 | Sony Chemicals Corporation | Processes for manufacturing flexible wiring boards and the resulting flexible wiring board |
| CN111012290A (en) * | 2019-12-20 | 2020-04-17 | 浙江清华柔性电子技术研究院 | Conformal capsule antenna structure, preparation method and wireless capsule endoscope system |
-
1987
- 1987-08-25 JP JP21191987A patent/JPS6453591A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03244184A (en) * | 1990-02-21 | 1991-10-30 | Sumitomo Electric Ind Ltd | Manufacture of flexible wiring substrate |
| US5144742A (en) * | 1991-02-27 | 1992-09-08 | Zycon Corporation | Method of making rigid-flex printed circuit boards |
| EP1017258A2 (en) * | 1998-12-28 | 2000-07-05 | Sony Chemicals Corp. | Method for manufacturing double-sided flexible printed board |
| EP1017258A3 (en) * | 1998-12-28 | 2002-06-12 | Sony Chemicals Corp. | Method for manufacturing double-sided flexible printed board |
| US6705007B1 (en) | 1998-12-28 | 2004-03-16 | Sony Chemicals Corp. | Method for manufacturing double-sided flexible printed board |
| US7213334B2 (en) | 1998-12-28 | 2007-05-08 | Sony Corporation | Method for manufacturing double-sided flexible printed board |
| US6737588B1 (en) | 1999-08-26 | 2004-05-18 | Sony Chemicals Corporation | Processes for manufacturing flexible wiring boards and the resulting flexible wiring board |
| CN111012290A (en) * | 2019-12-20 | 2020-04-17 | 浙江清华柔性电子技术研究院 | Conformal capsule antenna structure, preparation method and wireless capsule endoscope system |
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