JPS6489594A - Manufacture of wiring board - Google Patents

Manufacture of wiring board

Info

Publication number
JPS6489594A
JPS6489594A JP24712787A JP24712787A JPS6489594A JP S6489594 A JPS6489594 A JP S6489594A JP 24712787 A JP24712787 A JP 24712787A JP 24712787 A JP24712787 A JP 24712787A JP S6489594 A JPS6489594 A JP S6489594A
Authority
JP
Japan
Prior art keywords
layer
copper
peeled
polyimide
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24712787A
Other languages
Japanese (ja)
Other versions
JPH081987B2 (en
Inventor
Akinari Kida
Naoki Fukutomi
Yoshiaki Tsubomatsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP24712787A priority Critical patent/JPH081987B2/en
Publication of JPS6489594A publication Critical patent/JPS6489594A/en
Publication of JPH081987B2 publication Critical patent/JPH081987B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To enable a support substrate to be peeled off easily, by forming a metal layer highly adhesive with glass in the outer periphery of the support substrate vitreous at least in the surface, by providing a copper layer, and by forming thereon a multilayer wiring consisting of wiring conductor and insulating resin. CONSTITUTION:A chromium layer 2 is deposited at the end of a glass substrate 1 using a metal mask open at a desired part. Next, a copper layer 3 is formed on the surfaces of the glass substrate and the chromium. Photoresist is laminated or applied on the surface of the copper layer 3 to form a resist layer, and a resist pattern is formed by exposure and development; then, the resist is peeled off by copper plating to form an interlayer connection metal column 4. After a polyimide layer 5 is provided, the polyimide is flattened to allow the interlayer connection metal column 4 to be exposed. Next, wiring conductor 6 is formed. such steps are repeated required times to allow a multilayer structure. A part finally forming the product is peeled off from the glass substrate, thus obtaining a single-copper-clad polyimide multilayer wiring board 7.
JP24712787A 1987-09-30 1987-09-30 Manufacturing method of wiring board Expired - Lifetime JPH081987B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24712787A JPH081987B2 (en) 1987-09-30 1987-09-30 Manufacturing method of wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24712787A JPH081987B2 (en) 1987-09-30 1987-09-30 Manufacturing method of wiring board

Publications (2)

Publication Number Publication Date
JPS6489594A true JPS6489594A (en) 1989-04-04
JPH081987B2 JPH081987B2 (en) 1996-01-10

Family

ID=17158833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24712787A Expired - Lifetime JPH081987B2 (en) 1987-09-30 1987-09-30 Manufacturing method of wiring board

Country Status (1)

Country Link
JP (1) JPH081987B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290092A (en) * 1989-02-21 1990-11-29 Tatsuta Electric Wire & Cable Co Ltd Printed wiring substrate
US5092032A (en) * 1990-05-28 1992-03-03 International Business Machines Corp. Manufacturing method for a multilayer printed circuit board
JPH0677651A (en) * 1992-08-28 1994-03-18 Kyocera Corp Circuit board
JP2003204152A (en) * 1999-05-27 2003-07-18 Hoya Corp Manufacturing method for double-sided wiring board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02290092A (en) * 1989-02-21 1990-11-29 Tatsuta Electric Wire & Cable Co Ltd Printed wiring substrate
US5092032A (en) * 1990-05-28 1992-03-03 International Business Machines Corp. Manufacturing method for a multilayer printed circuit board
JPH0677651A (en) * 1992-08-28 1994-03-18 Kyocera Corp Circuit board
JP2003204152A (en) * 1999-05-27 2003-07-18 Hoya Corp Manufacturing method for double-sided wiring board

Also Published As

Publication number Publication date
JPH081987B2 (en) 1996-01-10

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