GB1134632A - Improvements in or relating to the production of printed circuits - Google Patents

Improvements in or relating to the production of printed circuits

Info

Publication number
GB1134632A
GB1134632A GB633065A GB633065A GB1134632A GB 1134632 A GB1134632 A GB 1134632A GB 633065 A GB633065 A GB 633065A GB 633065 A GB633065 A GB 633065A GB 1134632 A GB1134632 A GB 1134632A
Authority
GB
United Kingdom
Prior art keywords
substrate
holes
etching
etchant
overhanging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB633065A
Inventor
David Charles Shepherd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Allard Way Holdings Ltd
Original Assignee
Elliott Brothers London Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Elliott Brothers London Ltd filed Critical Elliott Brothers London Ltd
Priority to GB633065A priority Critical patent/GB1134632A/en
Priority to FR49285A priority patent/FR1469676A/en
Priority to NL6601794A priority patent/NL6601794A/xx
Publication of GB1134632A publication Critical patent/GB1134632A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

1,134,632. Printed circuits. ELLIOTT BROS. (LONDON) Ltd. 10 Feb., 1966 [13 Feb., 1965], No. 6330/65. Heading H1R. In a printed circuit arrangement, holes in or through an insulating substrate are formed by chemical etching of the substrate material. The substrate may comprise a polyimide film or sheet, and may be etched by alternate treatment at at least 80‹ C. with cone. H 2 SO 4 and NaOH; alternatively the substrate may be of glass fibre impregnated with epoxy resin or a polyester. The invention is described with reference to printed circuits formed from double-sided Cuclad laminates, although Ni, "Kovar" (Registered Trade Mark), or stainless steel may replace Cu. Holes are etched in the Cu cladding on one or both sides of the laminate at the sites of the substrate holes; the desired circuit pattern is photo-deposited in negative form on the cladding in a plating resist material; the exposed areas of the Cu are electroplated with an etchant resist, e.g. Au; the plating resist is removed and the substrate holes etched out; finally, the exposed Cu is removed by etching. If the Cucladding is bonded to the substrate by a resin adhesive, this is removed with an aqueous solution of chromic trioxide and acetic acid. In an alternative embodiment, the plating step is omitted, the circuit pattern being photo-printed in positive form in an etchant-resist material on the Cu, followed by etching. Single- and double-sided circuits may be formed. The formation of holes with overhanging conductors is described; when electroplating is employed the plated layer may be thickened so that the underlying Cu of the overhanging portions may be removed in the etching step; otherwise, the underside of the overhanging portion is protected by an etchant resist. Use may be made of the lateral etching tendency of the substrate etchant to produce overhanging conductors. Holes in multilayer printed circuit assemblies may be formed by the method of the invention.
GB633065A 1965-02-13 1965-02-13 Improvements in or relating to the production of printed circuits Expired GB1134632A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB633065A GB1134632A (en) 1965-02-13 1965-02-13 Improvements in or relating to the production of printed circuits
FR49285A FR1469676A (en) 1965-02-13 1966-02-11 Method of manufacturing a printed circuit board
NL6601794A NL6601794A (en) 1965-02-13 1966-02-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB633065A GB1134632A (en) 1965-02-13 1965-02-13 Improvements in or relating to the production of printed circuits

Publications (1)

Publication Number Publication Date
GB1134632A true GB1134632A (en) 1968-11-27

Family

ID=9812535

Family Applications (1)

Application Number Title Priority Date Filing Date
GB633065A Expired GB1134632A (en) 1965-02-13 1965-02-13 Improvements in or relating to the production of printed circuits

Country Status (2)

Country Link
GB (1) GB1134632A (en)
NL (1) NL6601794A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2188401A1 (en) * 1972-06-14 1974-01-18 Westinghouse Electric Corp
WO1987003773A1 (en) * 1985-12-09 1987-06-18 Hughes Aircraft Company Method for selectively removing adhesives from polyimide substrates
FR2618631A1 (en) * 1987-07-24 1989-01-27 Thomson Csf Method of producing electrical connections between sides of printed-circuit boards withstanding thermal stresses, in particular three-board circuits
WO1993026144A1 (en) * 1992-06-15 1993-12-23 Dyconex Patente Ag Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
FR2834180A1 (en) * 2001-12-20 2003-06-27 Org Europeene De Rech Production of a multi layer module for high-density printed circuits comprises anisotropically etching micro holes through a metal-coated polyimide film
EP1517599A1 (en) * 2000-02-28 2005-03-23 Sts Atl Corporation A method of interconnecting opposite sides of an electronic component interconnection device
US11134575B2 (en) * 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2188401A1 (en) * 1972-06-14 1974-01-18 Westinghouse Electric Corp
WO1987003773A1 (en) * 1985-12-09 1987-06-18 Hughes Aircraft Company Method for selectively removing adhesives from polyimide substrates
FR2618631A1 (en) * 1987-07-24 1989-01-27 Thomson Csf Method of producing electrical connections between sides of printed-circuit boards withstanding thermal stresses, in particular three-board circuits
WO1993026144A1 (en) * 1992-06-15 1993-12-23 Dyconex Patente Ag Process for producing subsequently conditionable contact points on circuit substrates and circuit substrates with such contact points
EP1517599A1 (en) * 2000-02-28 2005-03-23 Sts Atl Corporation A method of interconnecting opposite sides of an electronic component interconnection device
FR2834180A1 (en) * 2001-12-20 2003-06-27 Org Europeene De Rech Production of a multi layer module for high-density printed circuits comprises anisotropically etching micro holes through a metal-coated polyimide film
WO2003055288A1 (en) * 2001-12-20 2003-07-03 Organisation Europeenne Pour La Recherche Nucleaire Method for making a multilayer module with high-density printed circuits
US7135119B2 (en) 2001-12-20 2006-11-14 Organisation Europeenne Pour La Recherche Nucleaire Method for making a multilayer module with high-density printed circuits
US11134575B2 (en) * 2019-09-30 2021-09-28 Gentherm Gmbh Dual conductor laminated substrate
US11744023B2 (en) 2019-09-30 2023-08-29 Gentherm Gmbh Dual conductor laminated substrate

Also Published As

Publication number Publication date
NL6601794A (en) 1966-08-15

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