JPS6447097A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6447097A
JPS6447097A JP20547687A JP20547687A JPS6447097A JP S6447097 A JPS6447097 A JP S6447097A JP 20547687 A JP20547687 A JP 20547687A JP 20547687 A JP20547687 A JP 20547687A JP S6447097 A JPS6447097 A JP S6447097A
Authority
JP
Japan
Prior art keywords
layer
substrate
conductive layer
hole
photosensitive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20547687A
Other languages
Japanese (ja)
Inventor
Osamu Hirai
Sadao Noguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20547687A priority Critical patent/JPS6447097A/en
Publication of JPS6447097A publication Critical patent/JPS6447097A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To make it possible to use an inexpensive etchant without braking the corner of a through hole, by forming an etching resist layer on a photosensitive resin layer and, using this layer as a mask, selectively etching away an exposed part of a conductive layer. CONSTITUTION:A hole 3 is made on an insulating substrate 1 having copper foils 2 attached to both main surfaces. A through hole 3a is formed by attaching a conductive layer 4 plated with copper to the inner surface of the hole 3 and the main surface of the substrate 1. The substrate 1 is soaked in electrodeposition coating resin solution and a resin layer 5 is formed on the conductive layer 4. The resin layer 5 is ground away and the substrate 1 is soaked in a negative type photosensitive resin solution. Then, a photosensitive resin layer 6 is formed on the conductive layer 4 on the main surface of the substrate 1 by DC electrolysis and the photosensitive resin layer 6 is exposed to light. Then, an etching resist layer 6a is formed. The exposed part of the conductive layer 4 and the copper foil 2 beneath it are etched away to obtain a desired circuit pattern on the substrate.
JP20547687A 1987-08-18 1987-08-18 Manufacture of printed wiring board Pending JPS6447097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20547687A JPS6447097A (en) 1987-08-18 1987-08-18 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20547687A JPS6447097A (en) 1987-08-18 1987-08-18 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6447097A true JPS6447097A (en) 1989-02-21

Family

ID=16507488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20547687A Pending JPS6447097A (en) 1987-08-18 1987-08-18 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6447097A (en)

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