JPS6442898A - Manufacture of landless through-hole printed wiring board - Google Patents

Manufacture of landless through-hole printed wiring board

Info

Publication number
JPS6442898A
JPS6442898A JP20040587A JP20040587A JPS6442898A JP S6442898 A JPS6442898 A JP S6442898A JP 20040587 A JP20040587 A JP 20040587A JP 20040587 A JP20040587 A JP 20040587A JP S6442898 A JPS6442898 A JP S6442898A
Authority
JP
Japan
Prior art keywords
hole
plating
laminated plate
printed wiring
land
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20040587A
Other languages
Japanese (ja)
Inventor
Shinichi Mitsui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20040587A priority Critical patent/JPS6442898A/en
Publication of JPS6442898A publication Critical patent/JPS6442898A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To form a printed wiring plate which can completely dispense with a land by a method wherein first of all a pattern is formed on a copper plated laminated plate, plating-resistant resist is applied to the whole face, and then the formation of a through-hole and plating are performed. CONSTITUTION:A pattern is formed on a copper foil 2 of a copper plated laminated plate 11 through etching and a plating-resistant resist 6 is applied on the whole face except a part of the laminated plate 11 to be a land for the formation of a plating-resistant layer. Next, a through-hole 7 is bored at the prescribed position on the laminated plate 11, the inner wall of the through-hole 7 is made to be hydrophilic, and then the laminated plate 11 is dipped into the electroless plating catalyst water solution of non-precious metal colloid water solution so as to precipitate the catalyst on the face and the inner wall of the through-hole. Next, the catalyst on the plating-resistant resist 6 is removed and electroless plating is performed onto the inner wall of the through- hole 7 and a land-to-be section for the formation of a conductive circuit. By these processes, a complete landless through-hole printed wiring plate can be obtained.
JP20040587A 1987-08-11 1987-08-11 Manufacture of landless through-hole printed wiring board Pending JPS6442898A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20040587A JPS6442898A (en) 1987-08-11 1987-08-11 Manufacture of landless through-hole printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20040587A JPS6442898A (en) 1987-08-11 1987-08-11 Manufacture of landless through-hole printed wiring board

Publications (1)

Publication Number Publication Date
JPS6442898A true JPS6442898A (en) 1989-02-15

Family

ID=16423770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20040587A Pending JPS6442898A (en) 1987-08-11 1987-08-11 Manufacture of landless through-hole printed wiring board

Country Status (1)

Country Link
JP (1) JPS6442898A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109788661A (en) * 2017-11-10 2019-05-21 宏启胜精密电子(秦皇岛)有限公司 The preparation method of flexible circuit board and the flexible circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109788661A (en) * 2017-11-10 2019-05-21 宏启胜精密电子(秦皇岛)有限公司 The preparation method of flexible circuit board and the flexible circuit board
CN109788661B (en) * 2017-11-10 2021-08-24 宏启胜精密电子(秦皇岛)有限公司 Flexible circuit board and preparation method thereof

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