JPS6476794A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6476794A
JPS6476794A JP23430787A JP23430787A JPS6476794A JP S6476794 A JPS6476794 A JP S6476794A JP 23430787 A JP23430787 A JP 23430787A JP 23430787 A JP23430787 A JP 23430787A JP S6476794 A JPS6476794 A JP S6476794A
Authority
JP
Japan
Prior art keywords
board
hole
electroless
printed wiring
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23430787A
Other languages
Japanese (ja)
Inventor
Keisuke Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23430787A priority Critical patent/JPS6476794A/en
Publication of JPS6476794A publication Critical patent/JPS6476794A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To realize sufficiently reliable connection through a through hole, by forming an electroless plated layer on the surface of a printed circuit board and on the sidewall of the through hole while rotating the board and circulating a plating solution through the through hole. CONSTITUTION:A printed wiring board 2 including an insulating board whose top and rear faces are coated with copper foil 6 is prepared. A through hole 1 is formed in the printed circuit board by means of a drill. The board is then dipped in an aqueous solution of electroless plating catalyst consisting of acid colloidal solution containing stannous chloride, palladium chloride and sodium chloride, so that the electroless plating catalyst 7 is deposited on the surface of the copper foils 6 on the board 2 and on the sidewalls of the through hole 1. The board is then dipped in an electroless copper plating solution, so that an electroless plated copper layer 8 is formed. Subsequently, a predetermined conductor circuit 9 is provided thereon by the photoetching process to complete the printed wiring board. In this manner, the uniformity in thickness of the plated layers can be improved substantially.
JP23430787A 1987-09-17 1987-09-17 Manufacture of printed wiring board Pending JPS6476794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23430787A JPS6476794A (en) 1987-09-17 1987-09-17 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23430787A JPS6476794A (en) 1987-09-17 1987-09-17 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6476794A true JPS6476794A (en) 1989-03-22

Family

ID=16968949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23430787A Pending JPS6476794A (en) 1987-09-17 1987-09-17 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6476794A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100771352B1 (en) * 2006-09-19 2007-10-29 삼성전기주식회사 Fabricating method of printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100771352B1 (en) * 2006-09-19 2007-10-29 삼성전기주식회사 Fabricating method of printed circuit board

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