JPS6476794A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6476794A
JPS6476794A JP23430787A JP23430787A JPS6476794A JP S6476794 A JPS6476794 A JP S6476794A JP 23430787 A JP23430787 A JP 23430787A JP 23430787 A JP23430787 A JP 23430787A JP S6476794 A JPS6476794 A JP S6476794A
Authority
JP
Japan
Prior art keywords
board
hole
electroless
printed wiring
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23430787A
Other languages
English (en)
Inventor
Keisuke Okada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23430787A priority Critical patent/JPS6476794A/ja
Publication of JPS6476794A publication Critical patent/JPS6476794A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP23430787A 1987-09-17 1987-09-17 Manufacture of printed wiring board Pending JPS6476794A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23430787A JPS6476794A (en) 1987-09-17 1987-09-17 Manufacture of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23430787A JPS6476794A (en) 1987-09-17 1987-09-17 Manufacture of printed wiring board

Publications (1)

Publication Number Publication Date
JPS6476794A true JPS6476794A (en) 1989-03-22

Family

ID=16968949

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23430787A Pending JPS6476794A (en) 1987-09-17 1987-09-17 Manufacture of printed wiring board

Country Status (1)

Country Link
JP (1) JPS6476794A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100771352B1 (ko) * 2006-09-19 2007-10-29 삼성전기주식회사 인쇄회로기판의 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100771352B1 (ko) * 2006-09-19 2007-10-29 삼성전기주식회사 인쇄회로기판의 제조방법

Similar Documents

Publication Publication Date Title
US4336100A (en) Method of production of electrically conductive panels and insulating base materials
JPS6476794A (en) Manufacture of printed wiring board
GB1207444A (en) Method of manufacturing printed circuits having metallised holes
JPS6336598A (ja) 配線板の製造方法
JPS6437079A (en) Manufacture of through-hole printed wiring board
GB2017416A (en) Circuit board manufacturing method
JPS6489585A (en) Multilayer wiring board
JPS6442898A (en) Manufacture of landless through-hole printed wiring board
JPS6467995A (en) Manufacture of printed circuit board with side face electrode
JPS61288488A (ja) 成形回路基板の製造方法
JPS6437084A (en) Multilayer printed wiring board
GB1261578A (en) Method of producing a circuit board having conductor patterns and metallised holes through the board
GB1357661A (en) Printed circuit boards
JPH0296389A (ja) 両面プリント回路基板
JPS6420696A (en) Manufacture of film carrier board
JPS61245599A (ja) 印刷配線板の製造方法
JPH0523075B2 (ja)
JPH0634443B2 (ja) プリント配線板の製造方法
JPH04287395A (ja) 多層プリント基板の電解メッキ方法
JPS6482692A (en) Manufacture of through hole printed wiring board
Vidal Preparation of Multilayer Circuit Boards Before Metallization With a Thick Electroless Copper Deposit
JPH0544199B2 (ja)
JPS63188976U (ja)
JPS6453498A (en) Multilayer interconnection board
JPS6387787A (ja) 印刷配線板の製造方法