CN109788661A - The preparation method of flexible circuit board and the flexible circuit board - Google Patents
The preparation method of flexible circuit board and the flexible circuit board Download PDFInfo
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- CN109788661A CN109788661A CN201711106075.8A CN201711106075A CN109788661A CN 109788661 A CN109788661 A CN 109788661A CN 201711106075 A CN201711106075 A CN 201711106075A CN 109788661 A CN109788661 A CN 109788661A
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- base
- layer
- circuit board
- aperture
- flexible circuit
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Abstract
A kind of flexible circuit board, including a base and two conductive circuit layers being formed on opposite two surfaces of the base, it is characterized in that, each conductive circuit layer includes a wiring, each wiring includes an at least scheduled circuit, the base is being formed with aperture positioned at each scheduled circuit at least side, a conducting portion is formed in each aperture, the conducting portion is for being electrically connected two conductive circuit layers, the conducting portion does not form orifice ring, and the surface of each conductive circuit layer is successively covered with an insulating layer and a soldermask layer.
Description
Technical field
The present invention relates to a kind of flexible circuit boards and preparation method thereof.
Background technique
It for the processing procedure of double-sided PCB, is all based on laser drill/machine drilling and forms through-hole, using plating copper
Journey obtains via hole to realize electrically conducting for dual platen.Traditional flexible circuit plate technique production method is long-standing, technology
It is mature, however, being capable of providing more various to user it is still necessary to provide a kind of new flexible circuit board and preparation method thereof
The selection of change.
Summary of the invention
A kind of preparation method of flexible circuit board, comprising: provide a copper-clad base plate, base and formation including an insulation
Two copper foil layers on opposite two surfaces of the base；Each copper foil layer is etched to form wiring, wherein each circuit
Wiring includes an at least scheduled circuit；A photosensitive layer is covered on the surface of each wiring；Each photosensitive layer is etched, thus
Pattern openings, the pattern openings exposure scheduled circuit and each scheduled circuit at least side are formed in each photosensitive layer
Part, to define an area to be connected in each scheduled circuit at least side；The area to be connected is removed to form aperture；
The scheduled circuit copper coating to form two conductive circuit layers on two opposite surfaces of the base, and in institute
Stating copper facing in aperture, to form conducting portion, the conducting portion is used to be electrically connected described two conductive circuit layers, the conducting portion
Do not form orifice ring；Remove each photosensitive layer；And an insulating layer and one anti-is successively covered on the surface of each conductive circuit layer
Layer, so that the flexible circuit board be made.
A kind of flexible circuit board, including a base and two conducting wires being formed on opposite two surfaces of the base
Layer, each conductive circuit layer include a wiring, and each wiring includes an at least scheduled circuit, and the base is being located at
Each scheduled circuit at least side is formed with aperture, a conducting portion is formed in each aperture, the conducting portion is for electrically connecting
Two conductive circuit layers are connect, the conducting portion does not form orifice ring, and the surface of each conductive circuit layer is successively covered with an insulating layer
An and soldermask layer.
In above flexible circuit board and preparation method thereof, circuit cloth is first made on two surfaces of the base using native copper
Then line opens up method by exposure development processing procedure or laser and opens up out in at least side that the base is located at scheduled circuit
Hole, and copper facing is in the aperture to form the conducting portions of two conductive circuit layers of connection, to realize conducting, furthermore, due to
The position (the i.e. described area to be connected) that conducting is defined using the pattern openings position for the photosensitive layer being located above wiring, can make
The aperture for obtaining aperture is smaller, to be more conducive to production high-density circuit board.
Detailed description of the invention
The cross-sectional view for the copper-clad base plate that Fig. 1 first embodiment of the invention provides.
Fig. 2 is to etch the copper foil layer of copper-clad base plate shown in FIG. 1 to form the cross-sectional view after wiring.
Fig. 3 is that the cross-sectional view after photosensitive layer is covered on wiring shown in Fig. 2.
Fig. 4 is the cross-sectional view that is exposed that treated to photosensitive layer shown in Fig. 3.
Fig. 5 is the cross-sectional view carried out after development treatment to photosensitive layer shown in Fig. 4.
Fig. 6 is the cross-sectional view that is exposed that treated to base shown in fig. 5.
Fig. 7 is after carrying out development treatment to base shown in fig. 6 to form the cross-sectional view after aperture.
Fig. 8 is that the cross-sectional view after conductive layer is formed on the inner wall of aperture shown in Fig. 7.
Fig. 9 is to form conducting portion in aperture shown in Fig. 8 and remove the cross-sectional view after photosensitive layer.
Figure 10 is to form conducting portion in aperture shown in Fig. 9 and remove the top view after photosensitive layer.
Figure 11 is the section view that the flexible circuit board obtained after insulating layer and soldermask layer is covered on wiring shown in Fig. 9
Figure.
Figure 12 is the cross-sectional view for the flexible circuit board that another embodiment of the present invention provides.
Figure 13 is the cross-sectional view for the flexible circuit board that a further embodiment of this invention provides.
Symbol description
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Fig. 1 to Figure 10 is please referred to, a better embodiment of the invention provides a kind of preparation method of flexible circuit board 100,
Include the following steps:
Step 1, referring to Fig. 1, providing a copper-clad base plate 10.The copper-clad base plate 10 include one insulation base 11 and
Two copper foil layers 12 being respectively formed on opposite two surfaces of the base 11.
Step 2, referring to Fig. 2, image transfer technology is used to etch each copper foil layer 12 to form required wiring
20.Wherein, it (includes two preset lines Fig. 2 shows each circuit line 20 that each wiring 20, which includes an at least scheduled circuit 21,
Road 21), 21 position of scheduled circuit of two wirings 20 is corresponding.
Step 3 referring to Fig. 3, covering a photosensitive layer 30 on the surface of each wiring 20, and makes the photosensitive layer
30 flow and fill to the wiring 20 and be formed by gap.
Step 4 please refers to Fig. 4 and Fig. 5, each photosensitive layer 30 is etched using exposure development processing procedure, thus each photosensitive
Pattern openings 31 are formed in layer 30, the pattern openings 31 expose the scheduled circuit 21 and are located at 21 liang of each scheduled circuit
The part of side defines area 110 to be connected to be formed in each 21 two sides of scheduled circuit.
Specifically, each photosensitive layer 30 is a negative photosensitive film.
As shown in figure 4, being exposed processing to each photosensitive layer 30: first in the photosensitive layer 30 and the scheduled circuit 21
Then overlay pattern (not shown) on corresponding position carries out ultraviolet lighting processing to the photosensitive layer 30, makes the photosensitive layer
30 uncovered regions (i.e. exposure area) solidify due to by ultraviolet light, and the region that the photosensitive layer 30 is capped
(i.e. unexposed area) then because not by ultraviolet light without being cured.
As shown in figure 5, carrying out development treatment to each photosensitive layer 30 after exposure: the photosensitive layer 30 is immersed in development
In liquid, to make the unexposed area be removed because reacting with developer solution, thus described in being formed in the photosensitive layer 30
Pattern openings 31.Specifically, the developer solution use concentration for 1% NaCO3。
Step 5 please refers to Fig. 6 and Fig. 7, removes the area 110 to be connected of the base 11 to form aperture 40.
In the present embodiment, being positive property of the material light sensitive polyimide (polyimide, PI) of the base 11, this
When, the aperture 40 is formed using exposure development processing procedure.
Specifically, as shown in fig. 6, being exposed processing to the base 11: first carrying out ultraviolet lighting to the base 11
Processing, the region for keeping the base 11 uncovered (i.e. described area 110 namely exposure area to be connected) by light due to being irradiated
Solidification, and region (part of the i.e. described base 11 in addition to the area 110 to be connected, the Ye Jiwei that the base 11 is capped
Exposure area) then because not irradiated by light without being cured.
As shown in fig. 7, carrying out development treatment to the base 11 after exposure: the base 11 is immersed in developer solution
In, to make the exposure area be removed because reacting with developer solution, to form the aperture 40.
In another embodiment, the material of the base 11 can also be negative photosensitive type polyimides.At this point, institute
When stating photosensitive layer 30 and being exposed, the area 110 to be connected as described in the base 11 is similarly positioned in unexposed area,
When the photosensitive layer 30 is developed, excessively development can remove area 110 to be connected described in the base 11, that is, be not required to
In addition processing is exposed to the base 11 again.
In other embodiments, the base 11 can also be non-photo-sensing profile matter.Such as, the material of the base 11 can
For polyimides (polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET)
And one of polyethylene naphthalate (Polyethylene Naphthalate, PEN) etc..At this point, using laser
The mode of punching forms the aperture 40.
Step 6, referring to Fig. 8, forming a conductive layer 50 on the inner wall of each aperture 40.
In the present embodiment, the conductive layer 50 can be conductive seed, chemical plating copper layer or organic conductive film layer.
Certainly, the conductive layer 50 can also omit.
Step 7 please refers to Fig. 9 and Figure 10, the scheduled circuit 21 copper coating with opposite in the base 11
On two surfaces formed two conductive circuit layers 60, and in the aperture 40 for being formed with the conductive layer 50 copper facing to be formed
Conducting portion 61.The conducting portion 61 is coated on 21 two sides of scheduled circuit, for being electrically connected described two conductive circuit layers
60 and realize double-side conduction.The conducting portion 61 does not form orifice ring.Then, each photosensitive layer 30 is removed.
Step 8 please refers to Figure 11, and it is anti-successively to cover an insulating layer 70 and one on the surface of each conductive circuit layer 60
Layer 80, so that the flexible circuit board 100 be made.
In the present embodiment, the material of the insulating layer 70 is the tackifying resin of insulation, and the tackifying resin can be selected from
Polypropylene (PP), epoxy resin, polyurethane, phenolic resin, Lauxite, melamine formaldehyde resin and polyimides are viscous
At least one of property resin.
Figure 11 is please referred to, a better embodiment of the invention provides a kind of flexible circuit board 100.The flexible circuit board
100 include a base 11 and the conductive circuit layer 60 being formed on each surface of the base 11.Each conducting wire
Layer 60 includes a wiring 20.Each wiring 20 includes an at least scheduled circuit 21, two wirings 20 it is predetermined
21 position of route is corresponding.
The base 11 is located at each 21 two sides of scheduled circuit and is formed with aperture 40.It is formed on the inner wall of each aperture 40
One conductive layer 50.It is formed in the aperture 40 of the conductive layer 50 and is formed with a conducting portion 61, the conducting portion 61 coats
In 21 two sides of scheduled circuit, for being electrically connected two conductive circuit layers 60 and realizing double-side conduction.The conducting portion 61
Do not form orifice ring.
The surface of each conductive circuit layer 60 is successively covered with an insulating layer 70 and a soldermask layer 80.
In above flexible circuit board 100 and preparation method thereof, first made of native copper on two surfaces of the base 11
Then wiring 20 opens up the two sides that method is located in the base 11 scheduled circuit 21 by exposure development processing procedure or laser
Aperture 40 is opened up, and copper facing to be formed is coated on 21 two sides of scheduled circuit to connect two conductor wires in the aperture 40
The conducting portion 61 of road floor 60.In this way, not only realizing double-side conduction, signaling rate is improved, and there is the native copper system of using
Make the advantage (e.g., can get fine rule road (L/S </=25/25 μm)) of conducting wire.Furthermore it also can avoid due to caused by orifice ring
Many bad problems such as orifice ring broken string, online, the orifice ring deviation of orifice ring.
Further, due to defining conducting using 31 position of pattern openings for the photosensitive layer 30 for being located at 20 top of wiring
Position (i.e. described area 110 to be connected), may make the aperture of aperture 40 smaller, to be more conducive to production high-density circuit board.
Figure 12 is please referred to, another embodiment of the present invention also provides a kind of flexible circuit board 200, with above-mentioned flexible circuit board
Unlike 100: in the flexible circuit board 200, since exposure left avertence occurring in Tapping procedures, the base 11 is only being located at
The left side of each scheduled circuit 21 is formed with the aperture 40.That is, the conducting portion 61 is only coated on the scheduled circuit 21
Left side, to realize that single side is connected.
Figure 13 is please referred to, other embodiment of the present invention also provides a kind of flexible circuit board 300, with above-mentioned flexible circuit board
100, unlike 200: in the flexible circuit board 300, since exposure right avertence occurring in Tapping procedures, the base 11 only exists
The aperture 40 is formed with positioned at the right side of each scheduled circuit 21.That is, the conducting portion 61 is only coated on the scheduled circuit
21 right side, to realize that single side is connected.
Therefore, even if exposure deviation occurs in Tapping procedures, it also can be realized conducting, be conducive to avoid existing because of circuit
Plate expose deviation and caused by it is bad.
It is understood that above embodiments are only used to illustrate the present invention, it is not used as limitation of the invention.For this
For the those of ordinary skill in field, the various other changes and modifications made in accordance with the technical idea of the present invention, all
It falls within the scope of protection of the claims of the present invention.
Claims (9)
1. a kind of preparation method of flexible circuit board, comprising:
A copper-clad base plate is provided, the base insulated including one and two copper foils being formed on opposite two surfaces of the base
Layer；
Each copper foil layer is etched to form wiring, wherein each wiring includes an at least scheduled circuit；
A photosensitive layer is covered on the surface of each wiring；
Each photosensitive layer is etched, so that pattern openings are formed in each photosensitive layer, the pattern openings exposure preset lines
The part of road and each scheduled circuit at least side, to define an area to be connected in each scheduled circuit at least side；
The area to be connected is removed to form aperture；
In the copper coating of the scheduled circuit to form two conductive circuit layers on two opposite surfaces of the base, and
To form conducting portion, the conducting portion is described to lead for being electrically connected described two conductive circuit layers for copper facing in the aperture
Logical portion does not form orifice ring；
Remove each photosensitive layer；And
An insulating layer and a soldermask layer are successively covered on the surface of each conductive circuit layer, so that the flexible circuit be made
Plate.
2. the preparation method of flexible circuit board as described in claim 1, it is characterised in that: the material of the base is photosensitive type
Polyimides, step " removing the area to be connected to form aperture " further comprises:
Ultraviolet lighting processing is carried out to the base, wherein the area to be connected forms exposure area；And
The base after exposure is impregnated in developer solution to remove the exposure area, to form the aperture.
3. the preparation method of flexible circuit board as described in claim 1, it is characterised in that: the material of the base is non-photo-sensing
Type polyimides forms the aperture by the way of laser boring.
4. the preparation method of flexible circuit board as described in claim 1, it is characterised in that: the base is being located at each make a reservation for
The part of route two sides is respectively formed the area to be connected, thus, the conducting portion is coated on the two sides of each scheduled circuit, thus
Realize double-side conduction.
5. the preparation method of flexible circuit board as described in claim 1, it is characterised in that: before the copper facing further include:
A conductive layer is formed on the inner wall of each aperture.
6. a kind of flexible circuit board, including a base and two conducting wires being formed on opposite two surfaces of the base
Layer, which is characterized in that each conductive circuit layer includes a wiring, and each wiring includes an at least scheduled circuit, institute
It states base and is being formed with aperture positioned at each scheduled circuit at least side, a conducting portion, the conducting are formed in each aperture
Portion does not form orifice ring for being electrically connected two conductive circuit layers, the conducting portion, and the surface of each conductive circuit layer is successively covered
It is stamped an insulating layer and a soldermask layer.
7. flexible circuit board as claimed in claim 6, which is characterized in that be positive sexy light type polyamides of the material of the base is sub-
Amine.
8. flexible circuit board as claimed in claim 6, which is characterized in that the base is being located at each scheduled circuit two sides
Part is respectively formed the area to be connected, thus, the conducting portion is coated on the two sides of each scheduled circuit, to realize two-sided lead
It is logical.
9. flexible circuit board as claimed in claim 6, which is characterized in that be formed with a conductive layer on the inner wall of each aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711106075.8A CN109788661B (en) | 2017-11-10 | 2017-11-10 | Flexible circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711106075.8A CN109788661B (en) | 2017-11-10 | 2017-11-10 | Flexible circuit board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109788661A true CN109788661A (en) | 2019-05-21 |
| CN109788661B CN109788661B (en) | 2021-08-24 |
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ID=66484487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711106075.8A Active CN109788661B (en) | 2017-11-10 | 2017-11-10 | Flexible circuit board and preparation method thereof |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI782651B (en) * | 2021-06-25 | 2022-11-01 | 大陸商宏啟勝精密電子（秦皇島）有限公司 | Circuit board and method of manufacturing the same |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442898A (en) * | 1987-08-11 | 1989-02-15 | Nec Corp | Manufacture of landless through-hole printed wiring board |
| JP2004146668A (en) * | 2002-10-25 | 2004-05-20 | Sharp Corp | Multilayer printed circuit board and manufacturing method thereof |
| CN1585594A (en) * | 2003-08-22 | 2005-02-23 | 日东电工株式会社 | Double-sided wiring circuit board and process for producing the same |
| CN105657988A (en) * | 2014-11-21 | 2016-06-08 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN106163102A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
-
2017
- 2017-11-10 CN CN201711106075.8A patent/CN109788661B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6442898A (en) * | 1987-08-11 | 1989-02-15 | Nec Corp | Manufacture of landless through-hole printed wiring board |
| JP2004146668A (en) * | 2002-10-25 | 2004-05-20 | Sharp Corp | Multilayer printed circuit board and manufacturing method thereof |
| CN1585594A (en) * | 2003-08-22 | 2005-02-23 | 日东电工株式会社 | Double-sided wiring circuit board and process for producing the same |
| CN105657988A (en) * | 2014-11-21 | 2016-06-08 | 宏启胜精密电子(秦皇岛)有限公司 | Flexible circuit board and manufacturing method thereof |
| CN106163102A (en) * | 2015-04-02 | 2016-11-23 | 富葵精密组件(深圳)有限公司 | Flexible PCB and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI782651B (en) * | 2021-06-25 | 2022-11-01 | 大陸商宏啟勝精密電子（秦皇島）有限公司 | Circuit board and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN109788661B (en) | 2021-08-24 |
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