GB999183A - A process for manufacturing printed circuits - Google Patents

A process for manufacturing printed circuits

Info

Publication number
GB999183A
GB999183A GB1851858A GB1851858A GB999183A GB 999183 A GB999183 A GB 999183A GB 1851858 A GB1851858 A GB 1851858A GB 1851858 A GB1851858 A GB 1851858A GB 999183 A GB999183 A GB 999183A
Authority
GB
United Kingdom
Prior art keywords
mask
support
circuit
deposited
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1851858A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB1851858A priority Critical patent/GB999183A/en
Publication of GB999183A publication Critical patent/GB999183A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/26—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback
    • H03K3/28—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback
    • H03K3/281—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback using at least two transistors so coupled that the input of one is derived from the output of another, e.g. multivibrator
    • H03K3/286—Generators characterised by the type of circuit or by the means used for producing pulses by the use, as active elements, of bipolar transistors with internal or external positive feedback using means other than a transformer for feedback using at least two transistors so coupled that the input of one is derived from the output of another, e.g. multivibrator bistable
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/205—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a pattern electroplated or electroformed on a metallic carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0376—Etching temporary metallic carrier substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

999,183. Printed circuits. J. MICHEL. March 9, 1962, No. 18518/58. Drawings to Specification. Heading H1R. A printed circuit is made by forming a circuit pattern, including components, on an auxiliary conductive support, bonding the support on its circuit side to an insulating support and then chemically removing unwanted parts of the auxiliary support. The remaining parts of the support form an electrical screen and a reinforcement. The construction of a plug-in transistorized bi-stable circuit is described. Gold or silver contacts are first deposited through apertures in a mask formed on a thin aluminium sheet or foil. The mask is then removed and conductors of gold, silver, nickel, cadmium, chromium, rhodium, tin or alloys are next deposited electrolytically through a second mask. After removal of the second mask, further gold or silver contacts are electrolytically deposited through a third mask to form resistor terminals and capacitor electrodes. Dielectric films are now applied to form parts of capacitors. A fourth mask is now applied and resistive coatings of constantan, carbon, graphite or metallic oxides are deposited by precipitation, vaporization or fritting. A sheet or plate of phenolic or epoxy resin, melamine, or ceramic material is next attached by adhesive to the circuit side. A mask is now applied to the exposed surface of the aluminium so that unwanted parts may be etched away in a 10% sodium hydroxide solution. Modifications.-The auxiliary conductive foil may be reinforced by a detachable backing sheet. The electrolytic circuit printing may be replaced by first coating the aluminium with iron by treatment in a solution of iron perchloride, then displacing copper from a solution of copper sulphate.
GB1851858A 1962-03-09 1962-03-09 A process for manufacturing printed circuits Expired GB999183A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1851858A GB999183A (en) 1962-03-09 1962-03-09 A process for manufacturing printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1851858A GB999183A (en) 1962-03-09 1962-03-09 A process for manufacturing printed circuits

Publications (1)

Publication Number Publication Date
GB999183A true GB999183A (en) 1965-07-21

Family

ID=10113810

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1851858A Expired GB999183A (en) 1962-03-09 1962-03-09 A process for manufacturing printed circuits

Country Status (1)

Country Link
GB (1) GB999183A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073904A2 (en) * 1981-09-08 1983-03-16 PREH, Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. Method of manufacturing printed circuits
EP0409668A2 (en) * 1989-07-21 1991-01-23 Omron Corporation Mixed circuit boards and a method for manufacture thereof
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
EP1267594A3 (en) * 2000-02-09 2003-01-02 Matsushita Electric Industrial Co., Ltd. Transfer material, method for producing the same and wiring substrate produced by using the same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0073904A2 (en) * 1981-09-08 1983-03-16 PREH, Elektrofeinmechanische Werke Jakob Preh Nachf. GmbH & Co. Method of manufacturing printed circuits
EP0073904A3 (en) * 1981-09-08 1984-06-13 Preh, Elektrofeinmechanische Werke Jakob Preh Nachf. Gmbh & Co. Method of manufacturing printed circuits
EP0409668A2 (en) * 1989-07-21 1991-01-23 Omron Corporation Mixed circuit boards and a method for manufacture thereof
EP0409668A3 (en) * 1989-07-21 1991-11-21 Omron Corporation Mixed circuit boards and a method for manufacture thereof
GB2246476A (en) * 1990-04-17 1992-01-29 Nippon Cmk Kk Forming carbon resistance on P.C.B.
GB2246476B (en) * 1990-04-17 1993-11-17 Nippon Cmk Kk A method of forming a carbon resistance on a printed wiring board
EP1267594A3 (en) * 2000-02-09 2003-01-02 Matsushita Electric Industrial Co., Ltd. Transfer material, method for producing the same and wiring substrate produced by using the same
US6871396B2 (en) 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
EP1482543A3 (en) * 2000-02-09 2005-06-08 Matsushita Electric Industrial Co., Ltd. Transfer material, method for producing the same and wiring substrate produced by using the same
US6936774B2 (en) 2000-02-09 2005-08-30 Matsushita Electric Industrial Co., Ltd. Wiring substrate produced by transfer material method
US7888789B2 (en) 2000-02-09 2011-02-15 Panasonic Corporation Transfer material used for producing a wiring substrate

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